TWI822103B - 搬送系統及判定方法 - Google Patents

搬送系統及判定方法 Download PDF

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Publication number
TWI822103B
TWI822103B TW111121547A TW111121547A TWI822103B TW I822103 B TWI822103 B TW I822103B TW 111121547 A TW111121547 A TW 111121547A TW 111121547 A TW111121547 A TW 111121547A TW I822103 B TWI822103 B TW I822103B
Authority
TW
Taiwan
Prior art keywords
wafer
sensor
hand
alignment
positional deviation
Prior art date
Application number
TW111121547A
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English (en)
Chinese (zh)
Other versions
TW202306014A (zh
Inventor
丹治彦
艾藢許 阿修可 巴瓦尼
賽門 賈帕連
Original Assignee
日商川崎重工業股份有限公司
美商川崎機器人（美國）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商川崎重工業股份有限公司, 美商川崎機器人（美國）有限公司 filed Critical 日商川崎重工業股份有限公司
Publication of TW202306014A publication Critical patent/TW202306014A/zh
Application granted granted Critical
Publication of TWI822103B publication Critical patent/TWI822103B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Control Of Conveyors (AREA)
TW111121547A 2021-06-10 2022-06-10 搬送系統及判定方法 TWI822103B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/343,765 US12002695B2 (en) 2021-06-10 2021-06-10 Transport system and determination method
US17/343,765 2021-06-10

Publications (2)

Publication Number Publication Date
TW202306014A TW202306014A (zh) 2023-02-01
TWI822103B true TWI822103B (zh) 2023-11-11

Family

ID=84390496

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111121547A TWI822103B (zh) 2021-06-10 2022-06-10 搬送系統及判定方法

Country Status (6)

Country Link
US (1) US12002695B2 (https=)
JP (2) JP7734744B2 (https=)
KR (1) KR102913489B1 (https=)
CN (1) CN117836923A (https=)
TW (1) TWI822103B (https=)
WO (1) WO2022259948A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI840988B (zh) * 2022-10-06 2024-05-01 盛詮科技股份有限公司 晶圓吸附裝置
JP2025070327A (ja) * 2023-10-19 2025-05-02 川崎重工業株式会社 基板搬送ロボットシステム
CN117878017B (zh) * 2024-01-12 2024-07-26 苏州海通机器人系统有限公司 一种晶圆定位纠偏方法、系统及装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7813542B2 (en) * 2006-02-13 2010-10-12 Samsung Electronics Co., Ltd. Wafer aligning apparatus and related method
US8600150B2 (en) * 2006-02-13 2013-12-03 Samsung Electronics Co., Ltd. Wafer aligning apparatus and related method

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JP5058836B2 (ja) * 2007-05-08 2012-10-24 東京エレクトロン株式会社 処理装置、処理方法、被処理体の認識方法および記憶媒体
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JP2016134526A (ja) * 2015-01-20 2016-07-25 リンテック株式会社 移載装置および移載方法
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US7813542B2 (en) * 2006-02-13 2010-10-12 Samsung Electronics Co., Ltd. Wafer aligning apparatus and related method
US8600150B2 (en) * 2006-02-13 2013-12-03 Samsung Electronics Co., Ltd. Wafer aligning apparatus and related method

Also Published As

Publication number Publication date
KR20240041909A (ko) 2024-04-01
KR102913489B1 (ko) 2026-01-15
JPWO2022259948A1 (https=) 2022-12-15
US20220399218A1 (en) 2022-12-15
WO2022259948A1 (ja) 2022-12-15
TW202306014A (zh) 2023-02-01
US12002695B2 (en) 2024-06-04
JP7734744B2 (ja) 2025-09-05
CN117836923A (zh) 2024-04-05
JP2025176047A (ja) 2025-12-03

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