JP5600703B2 - 搬送装置及び搬送方法 - Google Patents
搬送装置及び搬送方法 Download PDFInfo
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- 239000000758 substrate Substances 0.000 claims description 166
- 238000012546 transfer Methods 0.000 claims description 73
- 238000001514 detection method Methods 0.000 claims description 44
- 230000008569 process Effects 0.000 claims description 35
- 238000012937 correction Methods 0.000 claims description 14
- 230000032258 transport Effects 0.000 description 200
- 102200048773 rs2224391 Human genes 0.000 description 19
- 238000012545 processing Methods 0.000 description 12
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1602—Programme controls characterised by the control system, structure, architecture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
- B25J9/1664—Programme controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40014—Gripping workpiece to place it in another place
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
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- Microelectronics & Electronic Packaging (AREA)
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- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
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Description
Claims (6)
- 搬送元位置から搬送先位置へ載置された基体を搬送する搬送手段と、
前記搬送元位置と前記搬送先位置との間の位置に設けられた位置検出手段であり、前記搬送手段によって搬送される前記基体の搬送途中における位置を検出する該位置検出手段と、
前記基体の搬送開始時に設定されている初期の搬送先位置に前記基体が搬送されるまでの間に、前記搬送手段の予め定められた位置に前記基体が載置されたときの前記基体の位置を前記搬送手段の駆動状態に基づいて算出するとともに、算出した前記基体の位置と前記位置検出手段によって検出された前記基体の位置とのずれ量に基づいて前記初期の搬送先位置を補正して、前記搬送元位置から前記初期の搬送先位置へ向かう前記基体の初期の搬送経路の途中で該初期の搬送経路から逸れて補正後の搬送先位置に前記基体が搬送されるように前記搬送手段を制御する制御手段と、
を備える、搬送装置。 - 前記制御手段は、前記初期の搬送経路の途中から前記補正後の搬送先位置に向かう前記基体の移動軌跡が、曲線状となるように前記搬送手段を制御する請求項1に記載の搬送装置。
- 前記制御手段は、前記初期の搬送経路の途中から前記補正後の搬送先位置に向かう前記基体の移動軌跡が、滑らかな基体移動軌跡となるように前記搬送手段を制御する請求項2に記載の搬送装置。
- 基体を載置する搬送手段によって搬送元位置から搬送先位置へ前記基体を搬送する搬送方法であって、
前記搬送手段によって搬送される前記基体の搬送途中における位置を検出する位置検出工程と、
前記基体の搬送開始時に設定されている初期の搬送先位置に前記基体が搬送されるまでの間に、前記搬送手段の予め定められた位置に前記基体が載置されたときの前記基体の位置を前記搬送手段の駆動状態に基づいて算出するとともに、算出した前記基体の位置と前記位置検出工程において検出された前記基体の位置とのずれ量に基づいて、前記初期の搬送先位置を補正した補正後の搬送先位置を算出する補正後搬送先位置算出工程と、
前記搬送元位置から前記初期の搬送先位置へ向かう前記基体の初期の搬送経路の途中で該初期の搬送経路から逸れて前記補正後の搬送先位置に前記基体が搬送されるように前記搬送手段を制御する搬送制御工程と、
を含む搬送方法。 - 前記搬送制御工程では、前記初期の搬送経路の途中から前記補正後の搬送先位置に向かう前記基体の移動軌跡が、曲線状となるように前記搬送手段を制御する請求項4に記載の搬送方法。
- 前記搬送制御工程では、前記初期の搬送経路の途中から前記補正後の搬送先位置に向かう前記基体の移動軌跡が、滑らかな基体移動軌跡となるように前記搬送手段を制御する請求項5に記載の搬送方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012079076A JP5600703B2 (ja) | 2012-03-30 | 2012-03-30 | 搬送装置及び搬送方法 |
PCT/JP2013/058829 WO2013146800A1 (ja) | 2012-03-30 | 2013-03-26 | 搬送装置及び搬送方法 |
TW102110738A TW201351548A (zh) | 2012-03-30 | 2013-03-26 | 運送裝置及運送方法 |
US14/499,845 US9227320B2 (en) | 2012-03-30 | 2014-09-29 | Transfer device and transfer method |
Applications Claiming Priority (1)
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JP2012079076A JP5600703B2 (ja) | 2012-03-30 | 2012-03-30 | 搬送装置及び搬送方法 |
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Publication Number | Publication Date |
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JP2013211317A JP2013211317A (ja) | 2013-10-10 |
JP5600703B2 true JP5600703B2 (ja) | 2014-10-01 |
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JP2012079076A Active JP5600703B2 (ja) | 2012-03-30 | 2012-03-30 | 搬送装置及び搬送方法 |
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US (1) | US9227320B2 (ja) |
JP (1) | JP5600703B2 (ja) |
TW (1) | TW201351548A (ja) |
WO (1) | WO2013146800A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11862507B2 (en) | 2020-11-25 | 2024-01-02 | Kawasaki Jukogyo Kabushiki Kaisha | Robot system, and slip determination method |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101686032B1 (ko) * | 2013-03-28 | 2016-12-13 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치, 반도체 장치의 제조 방법 및 기록 매체 |
JP6298109B2 (ja) * | 2016-07-08 | 2018-03-20 | キヤノントッキ株式会社 | 基板処理装置及びアライメント方法 |
JP2019021747A (ja) * | 2017-07-14 | 2019-02-07 | 東京エレクトロン株式会社 | 基板位置調整方法、記憶媒体及び基板処理システム |
US20190110674A1 (en) * | 2017-10-18 | 2019-04-18 | Douglas P. Allen | Surgical access device incorporating scope cleaner |
JP7158238B2 (ja) * | 2018-10-10 | 2022-10-21 | 東京エレクトロン株式会社 | 基板処理システム |
JP2022107898A (ja) * | 2021-01-12 | 2022-07-25 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法、および基板処理システム |
KR102274693B1 (ko) * | 2021-02-26 | 2021-07-07 | 강창수 | 웨이퍼 센터링 시스템 및 방법 |
US12002695B2 (en) | 2021-06-10 | 2024-06-04 | Kawasaki Jukogyo Kabushiki Kaisha | Transport system and determination method |
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US5980194A (en) | 1996-07-15 | 1999-11-09 | Applied Materials, Inc. | Wafer position error detection and correction system |
JP3938247B2 (ja) * | 1998-04-16 | 2007-06-27 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2000071190A (ja) * | 1998-08-27 | 2000-03-07 | Komatsu Ltd | ワーク搬送システム |
JP5132904B2 (ja) * | 2006-09-05 | 2013-01-30 | 東京エレクトロン株式会社 | 基板位置決め方法,基板位置検出方法,基板回収方法及び基板位置ずれ補正装置 |
JP2008173744A (ja) * | 2007-01-22 | 2008-07-31 | Tokyo Electron Ltd | 搬送システムの搬送位置合わせ方法 |
JP5439665B2 (ja) * | 2010-02-22 | 2014-03-12 | シンフォニアテクノロジー株式会社 | 搬送装置 |
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2012
- 2012-03-30 JP JP2012079076A patent/JP5600703B2/ja active Active
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2013
- 2013-03-26 WO PCT/JP2013/058829 patent/WO2013146800A1/ja active Application Filing
- 2013-03-26 TW TW102110738A patent/TW201351548A/zh unknown
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11862507B2 (en) | 2020-11-25 | 2024-01-02 | Kawasaki Jukogyo Kabushiki Kaisha | Robot system, and slip determination method |
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Publication number | Publication date |
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WO2013146800A1 (ja) | 2013-10-03 |
TW201351548A (zh) | 2013-12-16 |
US9227320B2 (en) | 2016-01-05 |
JP2013211317A (ja) | 2013-10-10 |
US20150019004A1 (en) | 2015-01-15 |
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