JP7158238B2 - 基板処理システム - Google Patents
基板処理システム Download PDFInfo
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- JP7158238B2 JP7158238B2 JP2018192025A JP2018192025A JP7158238B2 JP 7158238 B2 JP7158238 B2 JP 7158238B2 JP 2018192025 A JP2018192025 A JP 2018192025A JP 2018192025 A JP2018192025 A JP 2018192025A JP 7158238 B2 JP7158238 B2 JP 7158238B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H01L21/67781—Batch transfer of wafers
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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Description
一実施形態に係る基板処理システムの全体構成の一例について、図1及び図2を用いて説明する。図1及び図2は、一実施形態に係る基板処理システムの一例の構成を示す平面図である。なお、図1は、処理室PM1に半導体ウェハWを搬入している状態を示している。また、図2は、搬送装置ARM1のエンドエフェクタ24が基準位置に位置している状態を示している。また、ウェハWには、ドットのハッチングを付して図示している。
次に、基板処理システムの動作の一例について説明する。ここでは、基板処理システムの動作の一例として、ロードポートLP1に取り付けられたキャリアCに収容されたウェハWを処理室PM1で処理を施し、ロードポートLP3に取り付けられた空のキャリアCに収容する動作に沿って説明する。なお、動作の開始時点において、ゲートバルブGV1~9は閉じており、ロードロック室LLM内は大気雰囲気となっている。
次に、搬送装置ARM1が保持するウェハWを処理室PM1の載置部11~14に載置する動作の一例について図3及び図4を用いてさらに説明する。図3及び図4は、ウェハWを処理室PM1の載置部11~14に載置する動作の一例を説明する斜視図である。なお、図3及び図4において、エンドエフェクタ24、載置部11~14、センサS1、ウェハWのみを図示し、その他の構成は図示を省略している。また、エンドエフェクタ24を処理室PM1に挿入する方向を前進方向とし、エンドエフェクタ24を処理室PM1から抜去する方向を後退方向として説明する。
次に、ウェハWの載置位置を補正する動作について、図5を用いて説明する。図5は、ウェハWの位置補正の一例を説明する平面模式図である。
VTM 搬送室(第1室)
LLM ロードロック室
LM1~2 ローダーモジュール
LP1~4 ロードポート
W ウェハ
GV1~9 ゲートバルブ
S0 センサ
S1~S7 センサ(基板検知部)
ARM1 搬送装置(第1搬送装置)
ARM2,3 搬送装置(第2搬送装置)
11~14 載置部
24 エンドエフェクタ
240 基端部
241,242 ブレード
243~246 保持部
31~34 載置部
51,52 センサユニット
51a,51b,52a,52b センサ素子
100 制御部
Claims (9)
- 複数の基板を載置する載置部を有する第1室と、
複数の基板を載置する載置部を有する第2室と、
長さ方向に複数の基板を保持するブレードを複数有し、前記第1室の載置部に載置された複数の基板を同じ高さで保持して前記第2室の載置部に搬送する第1搬送装置と、
前記ブレードを前記第2室に進入させる経路に設けられ、前記ブレードに保持されている基板の位置を検知する基板検知部と、
前記第1搬送装置を制御する制御部と、を備え、
前記制御部は、
基板が保持された前記ブレードを前記第2室に進入させ、前記基板検知部により基板の位置を検出する工程と、
前記基板検知部の検出結果に基づいて、前記ブレードの位置を補正する工程と、
前記ブレードに保持されている基板を前記第2室の載置部に受け渡す工程と、を実行する、
基板処理システム。 - 複数の基板を載置する載置部を有する第1室と、
複数の基板を載置する載置部を有する第2室と、
長さ方向に複数の基板を保持するブレードを複数有し、前記第1室の載置部に載置された複数の基板を同じ高さで保持して前記第2室の載置部に搬送する第1搬送装置と、
前記ブレードを前記第2室に進入させる経路に設けられ、前記ブレードに保持されている基板の位置を検知する基板検知部と、
前記第1搬送装置を制御する制御部と、を備え、
前記制御部は、
基板が保持された前記ブレードを前記第2室に進入させ、前記基板検知部により基板の位置を検出する工程と、
前記基板検知部の検出結果に基づいて、前記第2室の載置部を複数のクラスタに分ける工程と、
前記クラスタごとに、前記ブレードに保持されている基板を前記第2室の載置部に受け渡す工程と、を実行する、
基板処理システム。 - 前記クラスタごとに妥協値を算出し、前記クラスタごとの前記妥協値に基づいて前記ブレードを移動させて、前記クラスタごとに順次受け渡しを実行する、
請求項2に記載の基板処理システム。 - 前記基板検知部は、前記ブレードごとにセンサユニットを有し、
前記センサユニットは、前記ブレードの幅よりも離間して配置される複数のセンサ素子を有する、
請求項1乃至請求項3のいずれか1項に記載の基板処理システム。 - 前記制御部は、前記センサユニットのうち、一方のセンサ素子が基板を検出し始めたときの前記ブレードの位置、一方のセンサ素子が基板を検出しなくなったときの前記ブレードの位置、他方のセンサ素子が基板を検出し始めたときの前記ブレードの位置、他方のセンサ素子が基板を検出しなくなったときの前記ブレードの位置に基づいて、前記ブレードに保持されている基板の位置を検出する
請求項4に記載の基板処理システム。 - 前記第1室の載置部に基板を載置する第2搬送装置を備え、
前記制御部は、
前記第2搬送装置を制御して、前記第2室の載置部の配置に基づいて、前記第1室の載置部に基板を載置する工程と、
前記第1搬送装置を制御して、前記第1室の載置部に載置された基板の配置を保持したまま前記ブレードに基板を保持し、基板が保持された前記ブレードを前記第2室に進入させる工程と、
前記ブレードに保持されている基板を前記第2室の載置部に受け渡す工程と、を実行する、
請求項1乃至請求項5のいずれか1項に記載の基板処理システム。 - 前記第1搬送装置は、長さ方向に2枚の基板を保持するブレードを2つ有し、4枚の基板を同じ高さで保持する、
請求項1乃至請求項6のいずれか1項に記載の基板処理システム。 - 複数の前記ブレードは、同方向に伸びて形成される、
請求項1乃至請求項7のいずれか1項に記載の基板処理システム。 - 前記第2室の載置部は、前記ブレードに保持された基板を持ち上げる昇降ピンを有し、
前記昇降ピンは、前記ブレードが進入する経路とは異なる位置に設けられる、
請求項1乃至請求項8のいずれか1項に記載の基板処理システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2018192025A JP7158238B2 (ja) | 2018-10-10 | 2018-10-10 | 基板処理システム |
CN201910903877.4A CN111029275B (zh) | 2018-10-10 | 2019-09-24 | 基板处理系统 |
TW108135684A TW202029391A (zh) | 2018-10-10 | 2019-10-02 | 基板處理系統 |
KR1020190124643A KR102701148B1 (ko) | 2018-10-10 | 2019-10-08 | 기판 처리 시스템 |
US16/598,145 US11081377B2 (en) | 2018-10-10 | 2019-10-10 | Substrate processing system |
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JP2018192025A JP7158238B2 (ja) | 2018-10-10 | 2018-10-10 | 基板処理システム |
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JP7105629B2 (ja) * | 2018-06-20 | 2022-07-25 | 東京エレクトロン株式会社 | 自動教示方法及び制御装置 |
KR20230156391A (ko) * | 2021-03-24 | 2023-11-14 | 도쿄엘렉트론가부시키가이샤 | 기판 반송 방법 |
JP2023049784A (ja) | 2021-09-29 | 2023-04-10 | 東京エレクトロン株式会社 | 基板処理システム及び搬送装置のティーチング方法 |
JP2023104358A (ja) | 2022-01-17 | 2023-07-28 | 東京エレクトロン株式会社 | 基板搬送方法及び基板処理システム |
JP2024057943A (ja) | 2022-10-13 | 2024-04-25 | 東京エレクトロン株式会社 | 基板搬送システムの制御方法 |
JP2024067818A (ja) * | 2022-11-07 | 2024-05-17 | 東京エレクトロン株式会社 | 基板搬送システムおよび基板位置調整方法 |
CN117096071B (zh) * | 2023-10-20 | 2024-01-23 | 上海谙邦半导体设备有限公司 | 一种晶圆真空锁系统 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006294786A (ja) | 2005-04-08 | 2006-10-26 | Ulvac Japan Ltd | 基板搬送システム |
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JP4460477B2 (ja) * | 2005-02-25 | 2010-05-12 | セメス株式会社 | 基板移送装置 |
JP5064835B2 (ja) * | 2007-02-28 | 2012-10-31 | 株式会社アルバック | 基板搬送装置 |
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JP2006294786A (ja) | 2005-04-08 | 2006-10-26 | Ulvac Japan Ltd | 基板搬送システム |
WO2008155932A1 (ja) | 2007-06-19 | 2008-12-24 | Ulvac, Inc. | 基板搬送方法 |
JP2012216634A (ja) | 2011-03-31 | 2012-11-08 | Tokyo Electron Ltd | 基板受け渡し装置、基板受け渡し方法及び基板処理装置 |
WO2013088547A1 (ja) | 2011-12-15 | 2013-06-20 | タツモ株式会社 | ウエハ搬送装置 |
US20140064886A1 (en) | 2012-08-30 | 2014-03-06 | Orbotech LT Solar, LLC. | System, architecture and method for simultaneous transfer and process of substrates |
JP2015074039A (ja) | 2013-10-08 | 2015-04-20 | シンフォニアテクノロジー株式会社 | 搬送装置 |
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US20200118851A1 (en) | 2020-04-16 |
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