WO2008155932A1 - 基板搬送方法 - Google Patents

基板搬送方法 Download PDF

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Publication number
WO2008155932A1
WO2008155932A1 PCT/JP2008/053141 JP2008053141W WO2008155932A1 WO 2008155932 A1 WO2008155932 A1 WO 2008155932A1 JP 2008053141 W JP2008053141 W JP 2008053141W WO 2008155932 A1 WO2008155932 A1 WO 2008155932A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrates
hand
mounting portion
processing
carried
Prior art date
Application number
PCT/JP2008/053141
Other languages
English (en)
French (fr)
Inventor
Kenji Agou
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to CN2008800016036A priority Critical patent/CN101584034B/zh
Priority to JP2009520371A priority patent/JP4809478B2/ja
Publication of WO2008155932A1 publication Critical patent/WO2008155932A1/ja
Priority to US12/486,238 priority patent/US7845897B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Abstract

　複数枚の基板を一台のハンドに乗せて正確な位置に搬送する。搬送室内から処理室内に基板(１６ａ，１６ｂ)を搬入する際に、ハンド（２５）の第一の載置部（１５ａ）を処理室に設けられた第一の処理位置（８ａ）の真上に位置させ、第一の載置部（１５ａ）に配置された基板（１６ａ）を持ち上げた後、ハンド（２５）を微小移動させ、第二の載置部（１５ｂ）を第二の処理位置（８ｂ）の真上に位置させる。次に、第二の載置部（１５ｂ）上の基板（１６ｂ）を持ち上げる。基板（１６ａ，１６ｂ）と第一、第二の処理位置（８ａ，８ｂ）の間からハンド（２５）を抜き出し、基板（１６ａ，１６ｂ）を降下させると、基板（１６ａ，１６ｂ）は、第一、第二の処理位置（８ａ，８ｂ）上に正確に配置される。上記と逆の手順で基板（１６ａ，１６ｂ）をハンド（２５）に乗せると、処理室内の基板（１６ａ，１６ｂ）を第一、第二の載置部（１５ａ，１５ｂ）上に正確に乗せて搬出することができる。
PCT/JP2008/053141 2007-06-19 2008-02-25 基板搬送方法 WO2008155932A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800016036A CN101584034B (zh) 2007-06-19 2008-02-25 基板输送方法
JP2009520371A JP4809478B2 (ja) 2007-06-19 2008-02-25 基板搬送方法
US12/486,238 US7845897B2 (en) 2007-06-19 2009-06-17 Method for transporting substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-161010 2007-06-19
JP2007161010 2007-06-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/486,238 Continuation US7845897B2 (en) 2007-06-19 2009-06-17 Method for transporting substrates

Publications (1)

Publication Number Publication Date
WO2008155932A1 true WO2008155932A1 (ja) 2008-12-24

Family

ID=40156094

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053141 WO2008155932A1 (ja) 2007-06-19 2008-02-25 基板搬送方法

Country Status (6)

Country Link
US (1) US7845897B2 (ja)
JP (1) JP4809478B2 (ja)
KR (1) KR101044586B1 (ja)
CN (1) CN101584034B (ja)
TW (1) TWI382904B (ja)
WO (1) WO2008155932A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013082031A (ja) * 2011-10-07 2013-05-09 Ulvac Japan Ltd 搬送ロボット及び真空装置
JP2013546159A (ja) * 2010-09-15 2013-12-26 ユ−ジーン テクノロジー カンパニー．リミテッド 基板処理装置及び基板移送方法
JP2020061472A (ja) * 2018-10-10 2020-04-16 東京エレクトロン株式会社 基板処理システム
JP2022507753A (ja) * 2018-11-19 2022-01-18 マトソン テクノロジー インコーポレイテッド ワークピースを処理するためのシステムおよび方法
WO2024080332A1 (ja) * 2022-10-14 2024-04-18 川崎重工業株式会社 基板搬送ロボットシステム

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130287529A1 (en) * 2012-04-27 2013-10-31 Applied Materials, Inc. Method and apparatus for independent wafer handling
CN103317510A (zh) * 2013-05-09 2013-09-25 京东方科技集团股份有限公司 一种机械手设备
US9548231B2 (en) * 2013-06-05 2017-01-17 Persimmon Technologies, Corp. Robot and adaptive placement system and method

Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH10275848A (ja) * 1996-11-18 1998-10-13 Applied Materials Inc デュアル・ブレード・ロボット
JPH10340940A (ja) * 1997-06-06 1998-12-22 Anelva Corp 基板搬送システム及び半導体製造装置
JPH11163090A (ja) * 1997-12-02 1999-06-18 Mecs Corp 薄型ワークの搬送ロボット
JP2002343844A (ja) * 2001-05-11 2002-11-29 Kaijo Corp ウェーハハンドリング機構

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US5879128A (en) 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
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JP4937459B2 (ja) * 2001-04-06 2012-05-23 東京エレクトロン株式会社 クラスタツールおよび搬送制御方法
US7008802B2 (en) * 2001-05-29 2006-03-07 Asm America, Inc. Method and apparatus to correct water drift
JP2003264214A (ja) * 2002-03-07 2003-09-19 Hitachi High-Technologies Corp 真空処理装置及び真空処理方法
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH10275848A (ja) * 1996-11-18 1998-10-13 Applied Materials Inc デュアル・ブレード・ロボット
JPH10340940A (ja) * 1997-06-06 1998-12-22 Anelva Corp 基板搬送システム及び半導体製造装置
JPH11163090A (ja) * 1997-12-02 1999-06-18 Mecs Corp 薄型ワークの搬送ロボット
JP2002343844A (ja) * 2001-05-11 2002-11-29 Kaijo Corp ウェーハハンドリング機構

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013546159A (ja) * 2010-09-15 2013-12-26 ユ−ジーン テクノロジー カンパニー．リミテッド 基板処理装置及び基板移送方法
JP2013082031A (ja) * 2011-10-07 2013-05-09 Ulvac Japan Ltd 搬送ロボット及び真空装置
JP2020061472A (ja) * 2018-10-10 2020-04-16 東京エレクトロン株式会社 基板処理システム
JP7158238B2 (ja) 2018-10-10 2022-10-21 東京エレクトロン株式会社 基板処理システム
JP2022507753A (ja) * 2018-11-19 2022-01-18 マトソン テクノロジー インコーポレイテッド ワークピースを処理するためのシステムおよび方法
JP7254924B2 (ja) 2018-11-19 2023-04-10 マトソン テクノロジー インコーポレイテッド ワークピースを処理するためのシステムおよび方法
WO2024080332A1 (ja) * 2022-10-14 2024-04-18 川崎重工業株式会社 基板搬送ロボットシステム

Also Published As

Publication number Publication date
CN101584034A (zh) 2009-11-18
US7845897B2 (en) 2010-12-07
TWI382904B (zh) 2013-01-21
KR101044586B1 (ko) 2011-06-29
JPWO2008155932A1 (ja) 2010-08-26
KR20090095607A (ko) 2009-09-09
JP4809478B2 (ja) 2011-11-09
TW200918265A (en) 2009-05-01
CN101584034B (zh) 2011-05-18
US20090317226A1 (en) 2009-12-24

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