JP2022507753A - ワークピースを処理するためのシステムおよび方法 - Google Patents
ワークピースを処理するためのシステムおよび方法 Download PDFInfo
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H01L21/67011—Apparatus for manufacture or treatment
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
Abstract
Description
本出願は、2018年11月19日付けで出願された”Systems and Methods for Workpiece Processing”と題する米国仮出願第62/769,152号の優先権の利益を主張し、参照により本明細書に援用される。
本開示は、一般にワークピースの処理に関し、より詳細には、半導体ワークピース等のワークピースを処理するためのシステムに関する。
Claims (20)
- 半導体ワークピースを処理するためのワークピース処理装置であって、
第1の間隔だけ離された第1の処理ステーションと第2の処理ステーションとを有し、約10Torr未満の圧力で運転可能な第1の処理室と、
前記第1の間隔とは異なる第2の間隔だけ離された第3の処理ステーションと第4の処理ステーションとをまとめて有し、約10Torr未満の圧力で運転可能な1つ以上の第2の処理室と、
処理フローにおいて前記第1の処理室と1つ以上の前記第2の処理室とに連絡しており、約10Torr未満の圧力で運転可能な移送室と、
前記移送室内に配置されており、所定の軸線を中心として回転するように構成されており、第1のワークピースを支持するように動作可能な少なくとも1つのワークピースハンドリングコンポーネントを有する第1のアームと、第2のワークピースを支持するように動作可能な少なくとも1つのワークピースハンドリングコンポーネントを有する第2のアームとを有するワークピースハンドリングロボットと、
を有する、ワークピース処理装置において、
前記ワークピースハンドリングロボットは、前記第1のワークピースと前記第2のワークピースとを前記第1および第2の処理ステーションから取り上げ、前記第1のワークピースと前記第2のワークピースとを、前記第3および第4の処理ステーションに降ろすように構成されている、ワークピース処理装置。 - 前記ワークピースハンドリングロボットは、前記第1のアームと前記第2のアームとの間の横方向の間隔を調整するように構成されている、請求項1記載のワークピース処理装置。
- 前記第1のアームは、前記第2のアームに対して独立して伸長可能である、請求項1記載のワークピース処理装置。
- 前記ワークピースハンドリングロボットは、前記第1のアームおよび前記第2のアームの独立した伸長を用いて、前記第1のワークピースと前記第2のワークピースとを、前記第1の処理室内の前記第1および第2の処理ステーションから、前記第3および第4の処理ステーションに移送するように構成されている、請求項1記載のワークピース処理装置。
- 前記第3の処理ステーションおよび前記第4の処理ステーションは、同じ処理室内に配置されている、請求項1記載のワークピース処理装置。
- 前記第3の処理ステーションおよび前記第4の処理ステーションは、別個の処理室内に配置されている、請求項1記載のワークピース処理装置。
- 第3の処理室および第4の処理室は、それぞれ単一の処理ステーションを有している、請求項1記載のワークピース処理装置。
- 当該ワークピース処理装置は、前記第1のワークピースと前記第2のワークピースとを積み重ねて配置した状態で支持するように動作可能なワークピース支持コラムを備えた移送位置を有している、請求項1記載のワークピース処理装置。
- 前記ワークピースハンドリングロボットは、前記第1のワークピースと前記第2のワークピースとを同時に前記ワークピース支持コラムから取り上げるまたは降ろすように構成されている、請求項8記載のワークピース処理装置。
- 処理フローにおいて前記移送室と連絡しており、該移送室から隔離されて運転可能なロードロック室をさらに有している、請求項1記載のワークピース処理装置。
- 前記ロードロック室は、約10Torr~大気圧までの圧力において運転可能である、請求項10記載のワークピース処理装置。
- 前記第1の処理室は、エッチ処理室、ドライストリップ処理室、堆積処理室、熱処理室、イオン注入処理室、または表面処理室である、請求項1記載のワークピース処理装置。
- 前記第2の処理室は、エッチ処理室、ドライストリップ処理室、堆積処理室、熱処理室、イオン注入処理室、または表面処理室である、請求項1記載のワークピース処理装置。
- 複数の半導体ワークピースを処理するためのシステムであって、
第1の間隔だけ離された第1の処理ステーションと第2の処理ステーションとを有し、約10Torr未満の圧力で運転可能な第1の処理室と、
第3の処理ステーションを有しており、約10Torr未満の圧力で運転可能な第2の処理室と、
前記第3の処理ステーションと、前記第1の間隔とは異なる第2の間隔だけ離された第4の処理ステーションを有しており、約10Torr未満の圧力で運転可能な第3の処理室と、
処理フローにおいて前記第1の処理室と1つ以上の前記第2の処理室とに連絡しており、約10Torr未満の圧力で運転可能な移送室と、
前記移送室内に配置されており、所定の軸線を中心として回転するように構成されており、第1のワークピースを取り上げるように動作可能な少なくとも1つのワークピース支持部を有する第1のアームと、第2のワークピースを取り上げるように動作可能な少なくとも1つのワークピース支持部を有する第2のアームとを有し、前記第1のアームは、前記第2のアームに対して独立して伸長可能である、ワークピースハンドリングロボットと、
を有する、システムにおいて、
前記ワークピースハンドリングロボットは、前記第1のアームおよび前記第2のアームの独立した伸長を用いて、前記第1のワークピースと前記第2のワークピースとを、前記第1の処理室内の前記第1および第2の処理ステーションから、前記第3および第4の処理ステーションに移送するように構成されている、システム。 - 当該システムは、前記第1のワークピースと前記第2のワークピースとを積み重ねて配置した状態で支持するように動作可能なワークピース支持コラムを備えた移送位置を有している、請求項14記載のシステム。
- 前記ワークピースハンドリングロボットは、前記第1のワークピースと前記第2のワークピースとを同時に前記ワークピース支持コラムから取り上げるまたは降ろすように構成されている、請求項15記載のシステム。
- 処理フローにおいて前記移送室と連絡しており、ワークピース支持コラムを有しており、前記移送室から隔離されて運転可能であり、約10Torr~大気圧までの圧力で運転可能なロードロック室をさらに有している、請求項14記載のシステム。
- 前記第1の処理室は、エッチ処理室、ドライストリップ処理室、堆積処理室、熱処理室、イオン注入処理室、または表面処理室である、請求項14記載のシステム。
- 前記第2の処理室は、エッチ処理室、ドライストリップ処理室、堆積処理室、熱処理室、イオン注入処理室、または表面処理室である、請求項14記載のシステム。
- 前記第3の処理室は、エッチ処理室、ドライストリップ処理室、堆積処理室、熱処理室、イオン注入処理室、または表面処理室である、請求項14記載のシステム。
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US201862769152P | 2018-11-19 | 2018-11-19 | |
US62/769,152 | 2018-11-19 | ||
PCT/US2019/058753 WO2020106418A1 (en) | 2018-11-19 | 2019-10-30 | Systems and methods for workpiece processing |
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KR20210119185A (ko) * | 2020-03-24 | 2021-10-05 | 주식회사 원익아이피에스 | 이송로봇 및 이를 포함하는 기판처리시스템 |
WO2022187459A1 (en) * | 2021-03-03 | 2022-09-09 | Beijing E-town Semiconductor Technology Co., Ltd. | Systems and methods for workpiece processing |
CN113488422A (zh) * | 2021-06-30 | 2021-10-08 | 北京屹唐半导体科技股份有限公司 | 传送装置和处理系统 |
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- 2019-10-30 US US16/667,986 patent/US20200161162A1/en active Pending
- 2019-10-30 CN CN201980033767.5A patent/CN112219269A/zh active Pending
- 2019-10-30 WO PCT/US2019/058753 patent/WO2020106418A1/en active Application Filing
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JP7254924B2 (ja) | 2023-04-10 |
TW202036755A (zh) | 2020-10-01 |
CN112219269A (zh) | 2021-01-12 |
WO2020106418A1 (en) | 2020-05-28 |
US20200161162A1 (en) | 2020-05-21 |
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