KR102913489B1 - 반송 시스템 및 판정 방법 - Google Patents
반송 시스템 및 판정 방법Info
- Publication number
- KR102913489B1 KR102913489B1 KR1020247001040A KR20247001040A KR102913489B1 KR 102913489 B1 KR102913489 B1 KR 102913489B1 KR 1020247001040 A KR1020247001040 A KR 1020247001040A KR 20247001040 A KR20247001040 A KR 20247001040A KR 102913489 B1 KR102913489 B1 KR 102913489B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- sensor
- hand
- aligner
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
- H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3404—Storage means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Control Of Conveyors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/343,765 US12002695B2 (en) | 2021-06-10 | 2021-06-10 | Transport system and determination method |
| US17/343,765 | 2021-06-10 | ||
| PCT/JP2022/022446 WO2022259948A1 (ja) | 2021-06-10 | 2022-06-02 | 搬送システム及び判定方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20240041909A KR20240041909A (ko) | 2024-04-01 |
| KR102913489B1 true KR102913489B1 (ko) | 2026-01-15 |
Family
ID=84390496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247001040A Active KR102913489B1 (ko) | 2021-06-10 | 2022-06-02 | 반송 시스템 및 판정 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12002695B2 (https=) |
| JP (2) | JP7734744B2 (https=) |
| KR (1) | KR102913489B1 (https=) |
| CN (1) | CN117836923A (https=) |
| TW (1) | TWI822103B (https=) |
| WO (1) | WO2022259948A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI840988B (zh) * | 2022-10-06 | 2024-05-01 | 盛詮科技股份有限公司 | 晶圓吸附裝置 |
| JP2025070327A (ja) * | 2023-10-19 | 2025-05-02 | 川崎重工業株式会社 | 基板搬送ロボットシステム |
| CN117878017B (zh) * | 2024-01-12 | 2024-07-26 | 苏州海通机器人系统有限公司 | 一种晶圆定位纠偏方法、系统及装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016134526A (ja) * | 2015-01-20 | 2016-07-25 | リンテック株式会社 | 移載装置および移載方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3808395A (en) * | 1973-05-15 | 1974-04-30 | Gen Electric | Method of metallurgically joining a beryllium-base part and a copper-base part |
| JPH0529441A (ja) * | 1991-07-23 | 1993-02-05 | Oki Electric Ind Co Ltd | ウエハー位置およびオリエンテーシヨンフラツト方向検出方法 |
| US6225012B1 (en) * | 1994-02-22 | 2001-05-01 | Nikon Corporation | Method for positioning substrate |
| JPH07302828A (ja) * | 1995-04-24 | 1995-11-14 | Nikon Corp | 基板搬送装置 |
| JP3624065B2 (ja) * | 1996-11-29 | 2005-02-23 | キヤノン株式会社 | 基板搬送装置、半導体製造装置および露光装置 |
| JPH11106044A (ja) * | 1997-10-08 | 1999-04-20 | Mitsubishi Electric Corp | 基板搬送装置および基板搬送方法 |
| US7315373B2 (en) * | 2001-11-14 | 2008-01-01 | Rorze Corporation | Wafer positioning method and device, wafer process system, and wafer seat rotation axis positioning method for wafer positioning device |
| JP4376116B2 (ja) * | 2003-06-03 | 2009-12-02 | 東京エレクトロン株式会社 | 基板受け渡し位置の調整方法 |
| US8600150B2 (en) * | 2006-02-13 | 2013-12-03 | Samsung Electronics Co., Ltd. | Wafer aligning apparatus and related method |
| KR100772843B1 (ko) * | 2006-02-13 | 2007-11-02 | 삼성전자주식회사 | 웨이퍼 얼라인 장치 및 방법 |
| JP4961895B2 (ja) * | 2006-08-25 | 2012-06-27 | 東京エレクトロン株式会社 | ウェハ搬送装置、ウェハ搬送方法及び記憶媒体 |
| JP5058836B2 (ja) * | 2007-05-08 | 2012-10-24 | 東京エレクトロン株式会社 | 処理装置、処理方法、被処理体の認識方法および記憶媒体 |
| JP2009054933A (ja) * | 2007-08-29 | 2009-03-12 | Ryusyo Industrial Co Ltd | ウエハ搬送システム |
| JP5324231B2 (ja) * | 2009-01-08 | 2013-10-23 | 日東電工株式会社 | 半導体ウエハのアライメント装置 |
| WO2011061912A1 (ja) * | 2009-11-19 | 2011-05-26 | 株式会社アルバック | 基板中心位置の特定方法 |
| JP2011108958A (ja) * | 2009-11-20 | 2011-06-02 | Hitachi High-Tech Control Systems Corp | 半導体ウェーハ搬送装置及びこれを用いた搬送方法 |
| JP5557516B2 (ja) * | 2009-12-09 | 2014-07-23 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
| JP5582152B2 (ja) * | 2012-02-03 | 2014-09-03 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及び記憶媒体 |
| JP5664570B2 (ja) * | 2012-02-09 | 2015-02-04 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| JP5600703B2 (ja) | 2012-03-30 | 2014-10-01 | 東京エレクトロン株式会社 | 搬送装置及び搬送方法 |
| JP6339909B2 (ja) * | 2014-09-17 | 2018-06-06 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| KR101817209B1 (ko) * | 2016-06-24 | 2018-02-22 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
| JP7008573B2 (ja) * | 2018-05-16 | 2022-01-25 | 東京エレクトロン株式会社 | 搬送方法および搬送装置 |
| US11427412B2 (en) * | 2019-05-09 | 2022-08-30 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate conveying robot and substrate conveying method |
| CN115552583B (zh) * | 2020-06-05 | 2025-06-27 | 日商乐华股份有限公司 | 晶圆搬运装置以及晶圆搬运方法 |
| KR102624577B1 (ko) * | 2020-10-28 | 2024-01-15 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| US11862507B2 (en) * | 2020-11-25 | 2024-01-02 | Kawasaki Jukogyo Kabushiki Kaisha | Robot system, and slip determination method |
-
2021
- 2021-06-10 US US17/343,765 patent/US12002695B2/en active Active
-
2022
- 2022-06-02 WO PCT/JP2022/022446 patent/WO2022259948A1/ja not_active Ceased
- 2022-06-02 CN CN202280040528.4A patent/CN117836923A/zh active Pending
- 2022-06-02 KR KR1020247001040A patent/KR102913489B1/ko active Active
- 2022-06-02 JP JP2023527825A patent/JP7734744B2/ja active Active
- 2022-06-10 TW TW111121547A patent/TWI822103B/zh active
-
2025
- 2025-08-25 JP JP2025139588A patent/JP2025176047A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016134526A (ja) * | 2015-01-20 | 2016-07-25 | リンテック株式会社 | 移載装置および移載方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240041909A (ko) | 2024-04-01 |
| JPWO2022259948A1 (https=) | 2022-12-15 |
| US20220399218A1 (en) | 2022-12-15 |
| WO2022259948A1 (ja) | 2022-12-15 |
| TW202306014A (zh) | 2023-02-01 |
| TWI822103B (zh) | 2023-11-11 |
| US12002695B2 (en) | 2024-06-04 |
| JP7734744B2 (ja) | 2025-09-05 |
| CN117836923A (zh) | 2024-04-05 |
| JP2025176047A (ja) | 2025-12-03 |
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Legal Events
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St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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