CN116209787A - 焊锡润湿性优异的导电膜 - Google Patents

焊锡润湿性优异的导电膜 Download PDF

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Publication number
CN116209787A
CN116209787A CN202180053398.3A CN202180053398A CN116209787A CN 116209787 A CN116209787 A CN 116209787A CN 202180053398 A CN202180053398 A CN 202180053398A CN 116209787 A CN116209787 A CN 116209787A
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CN
China
Prior art keywords
copper
layer
tin
conductive film
compounds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180053398.3A
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English (en)
Chinese (zh)
Inventor
萨摩英希
野坂敬之
后藤昌利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiren Co Ltd
Original Assignee
Seiren Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiren Co Ltd filed Critical Seiren Co Ltd
Publication of CN116209787A publication Critical patent/CN116209787A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
CN202180053398.3A 2020-10-20 2021-09-27 焊锡润湿性优异的导电膜 Pending CN116209787A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020176078 2020-10-20
JP2020-176078 2020-10-20
PCT/JP2021/035472 WO2022085374A1 (ja) 2020-10-20 2021-09-27 はんだ濡れ性に優れた導電フィルム

Publications (1)

Publication Number Publication Date
CN116209787A true CN116209787A (zh) 2023-06-02

Family

ID=81289878

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180053398.3A Pending CN116209787A (zh) 2020-10-20 2021-09-27 焊锡润湿性优异的导电膜

Country Status (4)

Country Link
JP (1) JPWO2022085374A1 (https=)
KR (1) KR20230091104A (https=)
CN (1) CN116209787A (https=)
WO (1) WO2022085374A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297232A (ja) * 1994-04-19 1995-11-10 Hitachi Cable Ltd Ｔａｂテープの製造方法
CN1198604A (zh) * 1997-04-28 1998-11-11 株式会社哈尼斯系统综合技术研究所 配合型连接端子
CN1681373A (zh) * 2001-08-10 2005-10-12 日矿金属加工株式会社 层叠板用铜合金箔
US20060035105A1 (en) * 2004-06-25 2006-02-16 Ormecon Gmbh Tin-coated printed circuit boards with low tendency to whisker formation
WO2010016562A1 (ja) * 2008-08-08 2010-02-11 上村工業株式会社 銅又は銅合金材用エッチング液、めっき前処理方法、並びに電子部品用部材の形成方法
CN102713006A (zh) * 2009-12-25 2012-10-03 古河电气工业株式会社 铜箔及铜箔的制造方法
CN103202107A (zh) * 2010-11-05 2013-07-10 富士胶片株式会社 印刷配线基板的制造方法以及印刷配线基板
WO2014156362A1 (ja) * 2013-03-28 2014-10-02 古河電気工業株式会社 表面処理銅箔

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2801793B2 (ja) 1991-04-30 1998-09-21 株式会社神戸製鋼所 錫めっき銅合金材およびその製造方法
JP4090302B2 (ja) 2001-07-31 2008-05-28 株式会社神戸製鋼所 接続部品成形加工用導電材料板
WO2005084948A1 (ja) * 2004-03-04 2005-09-15 Toray Industries, Inc. 耐熱性樹脂積層フィルム並びにこれを含む金属層付き積層フィルム及び半導体装置
JP4844842B2 (ja) * 2007-10-25 2011-12-28 ホライゾン技術研究所株式会社 プリント回路板及びプリント回路板の表面処理方法
JP5717289B2 (ja) * 2011-06-23 2015-05-13 アキレス株式会社 回路用導電フィルム
JP5286443B1 (ja) * 2012-11-20 2013-09-11 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔
JP2017116262A (ja) * 2015-12-21 2017-06-29 住友金属鉱山株式会社 長尺板状体の防錆処理の評価方法及びその評価方法を用いた金属化樹脂フィルムの製造方法
IL250305B (en) * 2017-01-26 2021-02-28 Vishay Israel Ltd Electronic component with flexible terminal
JP2019075503A (ja) * 2017-10-18 2019-05-16 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法
CN110093598A (zh) * 2019-05-18 2019-08-06 深圳市创智成功科技有限公司 用于保护化学锡镀层的锡面保护剂

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297232A (ja) * 1994-04-19 1995-11-10 Hitachi Cable Ltd Ｔａｂテープの製造方法
CN1198604A (zh) * 1997-04-28 1998-11-11 株式会社哈尼斯系统综合技术研究所 配合型连接端子
CN1681373A (zh) * 2001-08-10 2005-10-12 日矿金属加工株式会社 层叠板用铜合金箔
US20060035105A1 (en) * 2004-06-25 2006-02-16 Ormecon Gmbh Tin-coated printed circuit boards with low tendency to whisker formation
WO2010016562A1 (ja) * 2008-08-08 2010-02-11 上村工業株式会社 銅又は銅合金材用エッチング液、めっき前処理方法、並びに電子部品用部材の形成方法
CN102713006A (zh) * 2009-12-25 2012-10-03 古河电气工业株式会社 铜箔及铜箔的制造方法
CN103202107A (zh) * 2010-11-05 2013-07-10 富士胶片株式会社 印刷配线基板的制造方法以及印刷配线基板
WO2014156362A1 (ja) * 2013-03-28 2014-10-02 古河電気工業株式会社 表面処理銅箔

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Publication number Publication date
WO2022085374A1 (ja) 2022-04-28
KR20230091104A (ko) 2023-06-22
JPWO2022085374A1 (https=) 2022-04-28

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