JPWO2022085374A1 - - Google Patents

Info

Publication number
JPWO2022085374A1
JPWO2022085374A1 JP2022557339A JP2022557339A JPWO2022085374A1 JP WO2022085374 A1 JPWO2022085374 A1 JP WO2022085374A1 JP 2022557339 A JP2022557339 A JP 2022557339A JP 2022557339 A JP2022557339 A JP 2022557339A JP WO2022085374 A1 JPWO2022085374 A1 JP WO2022085374A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022557339A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022085374A1 publication Critical patent/JPWO2022085374A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2022557339A 2020-10-20 2021-09-27 Pending JPWO2022085374A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020176078 2020-10-20
PCT/JP2021/035472 WO2022085374A1 (ja) 2020-10-20 2021-09-27 はんだ濡れ性に優れた導電フィルム

Publications (1)

Publication Number Publication Date
JPWO2022085374A1 true JPWO2022085374A1 (https=) 2022-04-28

Family

ID=81289878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022557339A Pending JPWO2022085374A1 (https=) 2020-10-20 2021-09-27

Country Status (4)

Country Link
JP (1) JPWO2022085374A1 (https=)
KR (1) KR20230091104A (https=)
CN (1) CN116209787A (https=)
WO (1) WO2022085374A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297232A (ja) * 1994-04-19 1995-11-10 Hitachi Cable Ltd Ｔａｂテープの製造方法
WO2005084948A1 (ja) * 2004-03-04 2005-09-15 Toray Industries, Inc. 耐熱性樹脂積層フィルム並びにこれを含む金属層付き積層フィルム及び半導体装置
JP2009105356A (ja) * 2007-10-25 2009-05-14 Horizon Gijutsu Kenkyusho Kk プリント回路板及びプリント回路板の表面処理方法
WO2014156362A1 (ja) * 2013-03-28 2014-10-02 古河電気工業株式会社 表面処理銅箔
JP2017116262A (ja) * 2015-12-21 2017-06-29 住友金属鉱山株式会社 長尺板状体の防錆処理の評価方法及びその評価方法を用いた金属化樹脂フィルムの製造方法
JP2019075503A (ja) * 2017-10-18 2019-05-16 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法
CN110093598A (zh) * 2019-05-18 2019-08-06 深圳市创智成功科技有限公司 用于保护化学锡镀层的锡面保护剂
JP2020505781A (ja) * 2017-01-26 2020-02-20 ヴィシャイ イスラエル リミテッド 可撓性端子を備えた電子部品

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2801793B2 (ja) 1991-04-30 1998-09-21 株式会社神戸製鋼所 錫めっき銅合金材およびその製造方法
JP3286560B2 (ja) * 1997-04-28 2002-05-27 株式会社オートネットワーク技術研究所 嵌合型接続端子
JP4090302B2 (ja) 2001-07-31 2008-05-28 株式会社神戸製鋼所 接続部品成形加工用導電材料板
CN1681373A (zh) * 2001-08-10 2005-10-12 日矿金属加工株式会社 层叠板用铜合金箔
DE102004030930A1 (de) * 2004-06-25 2006-02-23 Ormecon Gmbh Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung
TW201012970A (en) * 2008-08-08 2010-04-01 Uyemura C & Co Ltd Etchant for copper or copper alloy material, pre-plating treatment method, and method for forming member for electronic component
KR20120109544A (ko) * 2009-12-25 2012-10-08 후루카와 덴키 고교 가부시키가이샤 동박 및 동박의 제조 방법
JP5647967B2 (ja) * 2010-11-05 2015-01-07 富士フイルム株式会社 プリント配線基板の製造方法、プリント配線基板
JP5717289B2 (ja) * 2011-06-23 2015-05-13 アキレス株式会社 回路用導電フィルム
JP5286443B1 (ja) * 2012-11-20 2013-09-11 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297232A (ja) * 1994-04-19 1995-11-10 Hitachi Cable Ltd Ｔａｂテープの製造方法
WO2005084948A1 (ja) * 2004-03-04 2005-09-15 Toray Industries, Inc. 耐熱性樹脂積層フィルム並びにこれを含む金属層付き積層フィルム及び半導体装置
JP2009105356A (ja) * 2007-10-25 2009-05-14 Horizon Gijutsu Kenkyusho Kk プリント回路板及びプリント回路板の表面処理方法
WO2014156362A1 (ja) * 2013-03-28 2014-10-02 古河電気工業株式会社 表面処理銅箔
JP2017116262A (ja) * 2015-12-21 2017-06-29 住友金属鉱山株式会社 長尺板状体の防錆処理の評価方法及びその評価方法を用いた金属化樹脂フィルムの製造方法
JP2020505781A (ja) * 2017-01-26 2020-02-20 ヴィシャイ イスラエル リミテッド 可撓性端子を備えた電子部品
JP2019075503A (ja) * 2017-10-18 2019-05-16 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法
CN110093598A (zh) * 2019-05-18 2019-08-06 深圳市创智成功科技有限公司 用于保护化学锡镀层的锡面保护剂

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
KIM, H. K. ET AL.: "Kinetic Analysis of the Soldering Reaction between Eutectic SnPb Alloy and Cu Accompanied by Ripenin", PHYSICAL REVIEW B, vol. 53, no. 23, JPN6025054158, 15 June 1996 (1996-06-15), US, pages 16027 - 16034, ISSN: 0005765013 *
三木武，ほか１名: "表面分析によるCu-CMP工程の評価", ＳＣＡＳ ＮＥＷＳ, vol. ２００１−ＩＩ号（Ｖｏｌ．１４）, JPN6025027364, 26 July 2001 (2001-07-26), JP, pages 7 - 10, ISSN: 0005765011 *
堀正: "ベンゾトリアゾールの性状と用途および使用方法", 防蝕技術, vol. 第１８巻，第９号, JPN6025027366, 15 September 1969 (1969-09-15), JP, pages 393 - 398, ISSN: 0005765012 *
藤井啓道，ほか３名: "CuとSnめっきCuの超音波接合部における微細組織と電気特性", 溶接学会全国大会講演概要（平成２９年度春季全国大会）, JPN6025027365, 30 June 2017 (2017-06-30), JP, pages 148 - 149, ISSN: 0005636710 *

Also Published As

Publication number Publication date
WO2022085374A1 (ja) 2022-04-28
KR20230091104A (ko) 2023-06-22
CN116209787A (zh) 2023-06-02

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