CN1155913C - 生产芯片卡的方法及芯片卡 - Google Patents
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Abstract
本发明涉及生产芯片卡的方法及芯片卡,其中在获得电连接和机械连接的情况下,把芯片模块上的半导体芯片放入卡载体的开口中。根据本发明,代替迄今为止必须涉及压力连接关系和/或涉及粘结在一起的材料的连接,依靠芯片模块和IC卡之间的电感耦合和/或电容耦合来实现芯片模块和IC卡之间的信号传输。为此,芯片模块和IC卡相应地具有线圈和/或电容耦合面,以便实现信号传输。
Description
技术领域:
本发明涉及一种生产芯片卡的方法,其中在获得适当的电连接和机械连接的情况下,把芯片模块上的半导体芯片放入卡载体的开口中,以及涉及这种类型的芯片卡。
背景技术:
在已知的生产芯片卡,尤其是其中既有不接触数据传输装置,又有电接触平面的芯片卡的方法中,含有半导体芯片的模块被放入卡体中。
最好把该模块插入卡体的开口中,并借助接合或类似方式使之和卡体层叠,从而获得适当的机械连接及电连接。
例如通过在端子位置和/或相应的不接触数据传输装置的连接位置上涂覆各向异性的粘合剂,并把端子位置区域中的粘合剂至少挤压或压实到产生电传导桥路的程度,从而在模块和卡体或者卡体上布置的触点之间提供电传导连接,触点和用于与外界进行不接触通信的线圈接触。
在粘合剂中含有导电微粒的情况下,其结果是导电微粒在端子位置和不接触数据传输装置之间的区域中彼此接触,从而产生导电连接。
芯片卡生产中使用的模块通常使用其上布置有上述的,可能具备ISO-触点的半导体芯片的塑料材料载体。把以这种方式预制的模块和例如可包含聚碳酸酯的卡载体连接。这种连接操作,或者把模块插入卡体上形成的开口(例如通过切削形成)中的步骤,通常是通过使用热的或熔融的粘合剂的粘结方法来实现。
在生产既可不接触使用,又可接触式使用的组合卡,或者生产不接触卡的情况下,必须提供另一个具有用于感应回路的端子位置的接触平面。这些端子位置最好隆起地布置在模块的表面上,和/或布置在卡载体的开口表面或侧面上。在这种类型的结构下,随后可借助产生电传导连接的方法在一个工序中粘结模块和卡载体。但是已发现产生可靠的电连接及机械连接所要求的温度及时间条件的容许偏差较小,从而在加工参数不是最佳参数的情况下,以这种方式生产的芯片卡的长期稳定性被降低,并且由于模块及卡体的尺寸及塑料性能的缘故,在卡中产生遮蔽现象及应力,从而导致分散式电连接,即可靠性较低。
同样的情况适用于力锁连接,例如借助于弹簧元件的力锁连接。无可否认这种情况下,触点弹簧元件能够调节遮蔽或应力,但是会产生触点表面腐蚀问题。
发明内容:
本发明的目的是提供一种生产芯片卡的方法,及一种芯片卡,从而布置在模块上的半导体芯片能够高度可靠地电连接及机械连接到卡体的开口中,所得到的整体结构可确保芯片卡的长期稳定性及可靠性。
本发明方法的基本原理是使要植入卡开口中的模块不是直接地,而是间接地和卡载体,或者卡载体中与外界进行不接触连接的感应线圈相互作用。
在本发明的第一实施例中,要植入卡开口中的模块具有第一线圈,其中该第一线圈和放置在卡载体中的开口中或开口上的第二线圈电感连接。随后第二线圈以已知的方式和嵌入芯片卡的卡载体的外围区域中的第三线圈(天线)连接,以便实现和外界的无线连接。第二线圈和第三线圈也可构成共用线圈。为了使芯片模块与卡载体的开口之间形成机械连接,并且使模块与开口之间形成电气连接,通过下述方式把芯片模块压入到卡载体的开口中,即使第一线圈和第二线圈相互重叠,以实现电感耦合。
在根据本发明的方法的第二实施例中,要植入卡的开口中的模块具有至少一个第一电容耦合面,其中所述第一电容耦合面和卡载体的开口中的第二电容耦合面电相互作用。第二电容耦合面通向本身已知的与外界进行不接触连接的感应线圈。
根据本发明的方法的第三实施例既包含要植入的模块和卡载体之间的电容耦合,也包含电感耦合,从而在模块或半导体芯片和卡载体之间提供最佳的数据及信号传输。
在本发明的一个优选改进中,携带芯片的模块具有呈感应线圈形式的特殊金属化平面。在把模块装入接触面的开口中的装配操作中,使感应线圈和开口中放置的线圈发生联系,实现电感耦合。布置在卡载体开口中的线圈可以是已知的,用于和外界进行电接触的感应线圈部件。
根据本发明,为了增强感应元件,即第一线圈和第二线圈之间的耦合程度,建议至少部分模块和/或卡载体上第二线圈的区域中应具有高渗透性掺杂物质,或者涂覆高渗透性涂层。对此最好使用具有适当粒径的细粒状稀土磁体。已知的钛酸盐及铁氧体材料也适用于增强渗透性。
根据本发明,第一线圈和第二线圈都可以以导线线圈的形式,或者以印刷形式,或者以附加涂覆形式嵌入。另外还可用激光蚀刻出线圈匝,或者用激光从金属化层中烧出线圈匝。
模块中的第一线圈或者第一电容耦合面可应用于相对于卡载体向内的侧面上,或者也可布置在具有适当绝缘的中间层的中间载体上。中间载体用于安放ISO-外部触点。
就包括具有半导体芯片的芯片模块及具有安放该芯片模块的开口的卡载体的芯片卡而论,和半导体芯片的接头或端子电连接的第一线圈形成于模块的插入侧面上或插入侧面中。第二线圈被布置在卡载体的开口处,其中在把芯片模块插入卡载体中的开口中后,在第一线圈和第二线圈之间实现期望的电感耦合。第二线圈和与外界进行不接触连接的第三线圈连接。根据本发明,第二线圈和第三线圈可以是具有不同线匝部分的整体线圈,其中较小的线匝部分被放置在开口的区域中,而较大的线匝部分延伸到卡载体的外缘部分中。
第一线圈的一个特别有利的实施例是第一线圈被安排充当模块外缘上的加劲框架。这样增大了模块的刚性,从而可更好地承受压力,尤其是在把模块层压到卡载体开口中的操作中能够更好地承受压力。
就芯片卡而论,还建议一方面在要植入的模块上提供电容耦合面,另一方面在卡载体的开口中提供电容耦合面。
就芯片卡而论,作为附加特征,还存在组合电感耦合元件和电容耦合元件的可能性,它使得能够在模块和卡载体或卡载体的电感元件之间获得期望的电连接及恰当的信号信息交换。
附图说明:
下面参考附图,借助实施例更详细地说明本发明。
图1是图解说明具有放置芯片模块的开口的卡载体的原理的透视图。
图2表示了形成感应线圈的情况下的芯片模块。
图3表示了具有与外界进行不接触连接的线圈,及和布置在芯片模块上的另一线圈电感耦合的内部线圈的芯片卡的原理。
图4a-c表示了具有电感耦合元件的模块的各种可能形式。
具体实施方式:
图1中表示的视图基于具有安放芯片模块3的开口2的IC卡1。第二线圈4布置在IC卡1的开口2区域中的载体上或载体中,第二线圈4用于和第一线圈5电感耦合(图2)。
已知的层压及粘结技术可用于把模块3插入开口2中,并实现芯片接触。但是和已有技术相反,根据图解说明的实施例,芯片模块3和IC卡1中第二线圈4之间期望的电连接完全是通过感应实现的。机械压力或IC卡1与芯片模块3之间位置关系的细微变化不会影响电连接,例如由于模块与天线之间的连接点的接触电阻的增大而导致的电连接损害。
图2中所示的芯片模块3基于已知的装有所谓的裸芯片的基片载体6。另外,和芯片的相应端子电连接的第一线圈5放置在基片载体上或基片载体中。芯片自身具有一个保护膜层7,例如硅橡胶保护膜层。
在基片载体6与芯片相对的侧面上可设置已知的ISO-触点,用于和外部进行接触式连接。这方面附加说明参见图4b及4c。
下面参考附图3来说明具有和外界进行无线连接的电感耦合线圈的IC卡1的一个有利实施例。
外部电感耦合线圈8具有形成开口2中的第二线圈4的线圈部分9。
另外或另一方面,基片载体6及IC卡1的相对布置区域都可在IC卡1的开口2中彼此相对的表面上设置电容耦合面,以便除了要求的电感耦合作用外,连接结构还可提供电容连接。
图4a表示了具有芯片31、芯片触点32及线圈匝33的芯片模块3的横截面。该芯片模块面朝下插入IC卡1的相应开口2中,尽可能地使线圈匝33和相对布置的第二线圈4的线圈匝绝缘。
在图4b所示的实施例中,基片载体6的向上、向外的侧面上设置有ISO-触点34,ISO-触点34以附图中没有详细表示的方式和芯片31电连接。ISO-触点34用于产生IC卡和外界的接触式连接。图4c中所示的连接结构或芯片模块的实施例基于用来安放线圈匝33和ISO-触点34的中间载体35。可通过,例如层压再使中间载体和基片载体连接。在图4c中图解说明的结构的情况下,由于线圈匝33被嵌入中间载体35中,或者线圈匝33由基片载体6绝缘,因此能够放弃线圈匝33的附加电绝缘。
为了改善基片载体的电感耦合效果,可在中间载体和/或IC卡的开口中的相应部分上提供高渗透性的掺和剂,或者可在第一线圈和第二线圈的区域中涂覆适当的涂层。
根据另一个实施例,要植入的模块的第一线圈可充当加劲框架,这样所述第一线圈可构成芯片载体的一个整体构件,以便易于吸收及承受把芯片模块压入开口中时产生的力,或者能够从开始避免当把芯片模块插入及压入适当位置时发生不期望的变形。
原则上,一般并不需要使第一线圈和第二线圈在空间上一致。相反,最主要的是要确保第一线圈和第二线圈之间充分的电感耦合。
总之,由于芯片和实际的IC卡之间的信号传输依靠电感耦合和/或电容耦合,因此本发明能够消除已知电接触结构的缺点,已知的电接触结构包含有借助力或者借助其粘结在一起的材料而结合在一起的部件。由于避免了昂贵并且复杂的调整操作,从而降低了安装芯片模块时的费用,并且由于可以避免使用价格昂贵的用于提供电连接及机械连接的特种胶,因此可降低生产成本。
附图标记列表
1 IC卡
2 开口
3 芯片模块
4 第二线圈
5 第一线圈
6 基片载体
7 保护膜层
8 外部耦合线圈
9 线圈部分
31 芯片
32 芯片触点
33 线圈匝
34 ISO-触点
35 中间载体
Claims (3)
1.一种生产具有位于芯片模块上的半导体芯片的芯片卡的方法,其中芯片模块具有第一线圈,所述第一线圈和布置在卡载体的开口中的第二线圈通过电感耦合连接,第二线圈连接到嵌入芯片卡的卡载体的外围区域中的第三线圈,以便实现和外界的无线连接,其中第三线圈作为天线线圈,其中第二线圈和第三线圈可以是单个线圈,其特征在于,为了使芯片模块与卡载体的开口之间形成机械连接,并且使芯片模块与卡载体的开口之间形成电气连接,通过下述方式把芯片模块压入到卡载体的开口中,即使第一线圈和第二线圈相互重叠,以实现电感耦合。
2.一种芯片卡,所述芯片卡包括具有半导体芯片的芯片模块,及用于安放该芯片模块的卡载体,其中在芯片模块上形成第一线圈,第一线圈和半导体芯片的端子电连接,第二线圈位于卡载体的开口处,其中在第一线圈和第二线圈之间产生电感耦合,另外第二线圈还形成与嵌入到芯片卡的卡载体的外围区域中的第三线圈的电连接,或者第二线圈是第三线圈的一部分,以便实现与外界的无线连接,其特征在于充当加劲框架的第一线圈被布置在芯片模块的外缘上,并且第一线圈和第二线圈相互重叠。
3.按照权利要求2所述的芯片卡,其特征在于所述的芯片模块由芯片载体和半导体芯片构成,充当加劲框架的第一线圈与芯片载体构成为一个整体,其中芯片载体由一个中间载体和一个基片载体两层共同构成,所述的中间载体和基片载体相互独立并彼此连接,并由塑料材料制成薄片形状,形成第一线圈的线圈匝嵌入到中间载体内。
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DE19641650 | 1996-10-09 | ||
DE19641650.7 | 1996-10-09 | ||
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DE19645067.5 | 1996-10-31 |
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CN1237257A CN1237257A (zh) | 1999-12-01 |
CN1155913C true CN1155913C (zh) | 2004-06-30 |
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CNB971996059A Expired - Lifetime CN1155913C (zh) | 1996-10-09 | 1997-09-22 | 生产芯片卡的方法及芯片卡 |
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US (1) | US6190942B1 (zh) |
EP (1) | EP0931295B1 (zh) |
JP (1) | JP2001505682A (zh) |
KR (1) | KR20000049028A (zh) |
CN (1) | CN1155913C (zh) |
AT (1) | ATE210864T1 (zh) |
AU (1) | AU4705097A (zh) |
BR (1) | BR9711887A (zh) |
WO (1) | WO1998015916A1 (zh) |
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1997
- 1997-09-22 KR KR1019990703095A patent/KR20000049028A/ko active IP Right Grant
- 1997-09-22 CN CNB971996059A patent/CN1155913C/zh not_active Expired - Lifetime
- 1997-09-22 AU AU47050/97A patent/AU4705097A/en not_active Abandoned
- 1997-09-22 EP EP97909306A patent/EP0931295B1/de not_active Expired - Lifetime
- 1997-09-22 BR BR9711887-7A patent/BR9711887A/pt not_active IP Right Cessation
- 1997-09-22 US US09/284,228 patent/US6190942B1/en not_active Expired - Lifetime
- 1997-09-22 AT AT97909306T patent/ATE210864T1/de not_active IP Right Cessation
- 1997-09-22 JP JP51712398A patent/JP2001505682A/ja active Pending
- 1997-09-22 WO PCT/EP1997/005197 patent/WO1998015916A1/de active IP Right Grant
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US11354558B2 (en) | 2013-01-18 | 2022-06-07 | Amatech Group Limited | Contactless smartcards with coupling frames |
Also Published As
Publication number | Publication date |
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BR9711887A (pt) | 2002-01-02 |
WO1998015916A1 (de) | 1998-04-16 |
EP0931295A1 (de) | 1999-07-28 |
EP0931295B1 (de) | 2001-12-12 |
ATE210864T1 (de) | 2001-12-15 |
KR20000049028A (ko) | 2000-07-25 |
CN1237257A (zh) | 1999-12-01 |
JP2001505682A (ja) | 2001-04-24 |
AU4705097A (en) | 1998-05-05 |
US6190942B1 (en) | 2001-02-20 |
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