CN115298616B - 感光性绝缘膜形成用组合物 - Google Patents

感光性绝缘膜形成用组合物

Info

Publication number
CN115298616B
CN115298616B CN202180021724.2A CN202180021724A CN115298616B CN 115298616 B CN115298616 B CN 115298616B CN 202180021724 A CN202180021724 A CN 202180021724A CN 115298616 B CN115298616 B CN 115298616B
Authority
CN
China
Prior art keywords
group
insulating film
composition
forming
photosensitive insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180021724.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN115298616A (zh
Inventor
远藤雅久
泽田和宏
岸冈高广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of CN115298616A publication Critical patent/CN115298616A/zh
Application granted granted Critical
Publication of CN115298616B publication Critical patent/CN115298616B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G67/00—Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing oxygen or oxygen and carbon, not provided for in groups C08G2/00 - C08G65/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Polyethers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202180021724.2A 2020-03-18 2021-03-16 感光性绝缘膜形成用组合物 Active CN115298616B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-047394 2020-03-18
JP2020047394 2020-03-18
PCT/JP2021/010607 WO2021187481A1 (ja) 2020-03-18 2021-03-16 感光性絶縁膜形成組成物

Publications (2)

Publication Number Publication Date
CN115298616A CN115298616A (zh) 2022-11-04
CN115298616B true CN115298616B (zh) 2026-01-13

Family

ID=77768405

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180021724.2A Active CN115298616B (zh) 2020-03-18 2021-03-16 感光性绝缘膜形成用组合物

Country Status (5)

Country Link
JP (1) JP7444239B2 (https=)
KR (1) KR102696847B1 (https=)
CN (1) CN115298616B (https=)
TW (1) TWI858239B (https=)
WO (1) WO2021187481A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022210096A1 (ja) * 2021-04-02 2022-10-06 Jsr株式会社 絶縁膜形成用感放射線性組成物、パターンを有する樹脂膜および半導体回路基板
JP2024160416A (ja) * 2021-09-21 2024-11-14 日産化学株式会社 非感光性絶縁膜形成組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1379471A (en) * 1971-03-04 1975-01-02 Basf Ag Copolymers of unsaturated pyrimidine derivatives
CN109071804A (zh) * 2016-04-20 2018-12-21 Jsr株式会社 聚合物、组合物、成形体、硬化物以及层叠体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6476558B2 (ja) * 2014-03-07 2019-03-06 Dic株式会社 酸基含有（メタ）アクリレート樹脂、酸基含有（メタ）アクリレート樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料
JP6566023B2 (ja) * 2015-03-11 2019-08-28 Jsr株式会社 重合体、樹脂組成物及び樹脂成形体
CN105061754A (zh) * 2015-09-06 2015-11-18 吉林大学 一种聚芳醚类聚合物及其制备方法
JP6919290B2 (ja) * 2016-04-27 2021-08-18 Jsr株式会社 組成物、硬化物及び積層体
WO2019044874A1 (ja) * 2017-09-01 2019-03-07 日産化学株式会社 感光性樹脂組成物
JP7115165B2 (ja) * 2017-09-15 2022-08-09 Jsr株式会社 高周波回路用積層体及びフレキシブルプリント基板
JP7294341B2 (ja) * 2018-07-25 2023-06-20 Jsr株式会社 感光性樹脂組成物、パターンを有する樹脂膜の製造方法、パターンを有する樹脂膜、および半導体回路基板
JP7702778B2 (ja) * 2020-04-27 2025-07-04 味の素株式会社 樹脂組成物
WO2022210096A1 (ja) * 2021-04-02 2022-10-06 Jsr株式会社 絶縁膜形成用感放射線性組成物、パターンを有する樹脂膜および半導体回路基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1379471A (en) * 1971-03-04 1975-01-02 Basf Ag Copolymers of unsaturated pyrimidine derivatives
CN109071804A (zh) * 2016-04-20 2018-12-21 Jsr株式会社 聚合物、组合物、成形体、硬化物以及层叠体

Also Published As

Publication number Publication date
TWI858239B (zh) 2024-10-11
JP7444239B2 (ja) 2024-03-06
TW202204472A (zh) 2022-02-01
CN115298616A (zh) 2022-11-04
KR20220155258A (ko) 2022-11-22
KR102696847B1 (ko) 2024-08-20
WO2021187481A1 (ja) 2021-09-23
JPWO2021187481A1 (https=) 2021-09-23

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