JPWO2021187481A1 - - Google Patents
Info
- Publication number
- JPWO2021187481A1 JPWO2021187481A1 JP2022508378A JP2022508378A JPWO2021187481A1 JP WO2021187481 A1 JPWO2021187481 A1 JP WO2021187481A1 JP 2022508378 A JP2022508378 A JP 2022508378A JP 2022508378 A JP2022508378 A JP 2022508378A JP WO2021187481 A1 JPWO2021187481 A1 JP WO2021187481A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G67/00—Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing oxygen or oxygen and carbon, not provided for in groups C08G2/00 - C08G65/00
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Polyethers (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Formation Of Insulating Films (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020047394 | 2020-03-18 | ||
| JP2020047394 | 2020-03-18 | ||
| PCT/JP2021/010607 WO2021187481A1 (ja) | 2020-03-18 | 2021-03-16 | 感光性絶縁膜形成組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021187481A1 true JPWO2021187481A1 (https=) | 2021-09-23 |
| JPWO2021187481A5 JPWO2021187481A5 (https=) | 2022-11-14 |
| JP7444239B2 JP7444239B2 (ja) | 2024-03-06 |
Family
ID=77768405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022508378A Active JP7444239B2 (ja) | 2020-03-18 | 2021-03-16 | 感光性絶縁膜形成組成物 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7444239B2 (https=) |
| KR (1) | KR102696847B1 (https=) |
| CN (1) | CN115298616B (https=) |
| TW (1) | TWI858239B (https=) |
| WO (1) | WO2021187481A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022210096A1 (ja) * | 2021-04-02 | 2022-10-06 | Jsr株式会社 | 絶縁膜形成用感放射線性組成物、パターンを有する樹脂膜および半導体回路基板 |
| JP2024160416A (ja) * | 2021-09-21 | 2024-11-14 | 日産化学株式会社 | 非感光性絶縁膜形成組成物 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019044874A1 (ja) * | 2017-09-01 | 2019-03-07 | 日産化学株式会社 | 感光性樹脂組成物 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2110262A1 (de) * | 1971-03-04 | 1972-09-14 | Basf Ag | Verfahren zur Herstellung von Copolymerisatlösungen und dispersionen |
| JP6476558B2 (ja) * | 2014-03-07 | 2019-03-06 | Dic株式会社 | 酸基含有（メタ）アクリレート樹脂、酸基含有（メタ）アクリレート樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料 |
| JP6566023B2 (ja) * | 2015-03-11 | 2019-08-28 | Jsr株式会社 | 重合体、樹脂組成物及び樹脂成形体 |
| CN105061754A (zh) * | 2015-09-06 | 2015-11-18 | 吉林大学 | 一种聚芳醚类聚合物及其制备方法 |
| WO2017183461A1 (ja) * | 2016-04-20 | 2017-10-26 | Jsr株式会社 | 重合体、組成物、成形体、硬化物及び積層体 |
| JP6919290B2 (ja) * | 2016-04-27 | 2021-08-18 | Jsr株式会社 | 組成物、硬化物及び積層体 |
| JP7115165B2 (ja) * | 2017-09-15 | 2022-08-09 | Jsr株式会社 | 高周波回路用積層体及びフレキシブルプリント基板 |
| JP7294341B2 (ja) * | 2018-07-25 | 2023-06-20 | Jsr株式会社 | 感光性樹脂組成物、パターンを有する樹脂膜の製造方法、パターンを有する樹脂膜、および半導体回路基板 |
| JP7702778B2 (ja) * | 2020-04-27 | 2025-07-04 | 味の素株式会社 | 樹脂組成物 |
| WO2022210096A1 (ja) * | 2021-04-02 | 2022-10-06 | Jsr株式会社 | 絶縁膜形成用感放射線性組成物、パターンを有する樹脂膜および半導体回路基板 |
-
2021
- 2021-03-16 CN CN202180021724.2A patent/CN115298616B/zh active Active
- 2021-03-16 WO PCT/JP2021/010607 patent/WO2021187481A1/ja not_active Ceased
- 2021-03-16 JP JP2022508378A patent/JP7444239B2/ja active Active
- 2021-03-16 KR KR1020227023703A patent/KR102696847B1/ko active Active
- 2021-03-17 TW TW110109501A patent/TWI858239B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019044874A1 (ja) * | 2017-09-01 | 2019-03-07 | 日産化学株式会社 | 感光性樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI858239B (zh) | 2024-10-11 |
| JP7444239B2 (ja) | 2024-03-06 |
| TW202204472A (zh) | 2022-02-01 |
| CN115298616A (zh) | 2022-11-04 |
| KR20220155258A (ko) | 2022-11-22 |
| CN115298616B (zh) | 2026-01-13 |
| KR102696847B1 (ko) | 2024-08-20 |
| WO2021187481A1 (ja) | 2021-09-23 |
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