TWI858239B - 感光性絕緣膜形成組成物 - Google Patents

感光性絕緣膜形成組成物 Download PDF

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Publication number
TWI858239B
TWI858239B TW110109501A TW110109501A TWI858239B TW I858239 B TWI858239 B TW I858239B TW 110109501 A TW110109501 A TW 110109501A TW 110109501 A TW110109501 A TW 110109501A TW I858239 B TWI858239 B TW I858239B
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TW
Taiwan
Prior art keywords
group
insulating film
forming composition
photosensitive insulating
formula
Prior art date
Application number
TW110109501A
Other languages
English (en)
Chinese (zh)
Other versions
TW202204472A (zh
Inventor
遠藤雅久
澤田和宏
岸岡高広
Original Assignee
日商日產化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商日產化學股份有限公司 filed Critical 日商日產化學股份有限公司
Publication of TW202204472A publication Critical patent/TW202204472A/zh
Application granted granted Critical
Publication of TWI858239B publication Critical patent/TWI858239B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G67/00—Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing oxygen or oxygen and carbon, not provided for in groups C08G2/00 - C08G65/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Polyethers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW110109501A 2020-03-18 2021-03-17 感光性絕緣膜形成組成物 TWI858239B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-047394 2020-03-18
JP2020047394 2020-03-18

Publications (2)

Publication Number Publication Date
TW202204472A TW202204472A (zh) 2022-02-01
TWI858239B true TWI858239B (zh) 2024-10-11

Family

ID=77768405

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110109501A TWI858239B (zh) 2020-03-18 2021-03-17 感光性絕緣膜形成組成物

Country Status (5)

Country Link
JP (1) JP7444239B2 (https=)
KR (1) KR102696847B1 (https=)
CN (1) CN115298616B (https=)
TW (1) TWI858239B (https=)
WO (1) WO2021187481A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022210096A1 (ja) * 2021-04-02 2022-10-06 Jsr株式会社 絶縁膜形成用感放射線性組成物、パターンを有する樹脂膜および半導体回路基板
JP2024160416A (ja) * 2021-09-21 2024-11-14 日産化学株式会社 非感光性絶縁膜形成組成物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015168775A (ja) * 2014-03-07 2015-09-28 Dic株式会社 酸基含有（メタ）アクリレート樹脂、酸基含有（メタ）アクリレート樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料
CN105061754A (zh) * 2015-09-06 2015-11-18 吉林大学 一种聚芳醚类聚合物及其制备方法
CN107250212A (zh) * 2015-03-11 2017-10-13 Jsr株式会社 聚合物、树脂组合物和树脂成型体
TW201807017A (zh) * 2016-04-20 2018-03-01 Jsr股份有限公司 聚合物、組成物、成形體、硬化物以及積層體
TW201921114A (zh) * 2017-09-01 2019-06-01 日商日產化學股份有限公司 感光性樹脂組成物
TW202007708A (zh) * 2018-07-25 2020-02-16 日商Ｊｓｒ股份有限公司 感光性樹脂組成物、具有圖案的樹脂膜的製造方法、具有圖案的樹脂膜、及半導體電路基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2110262A1 (de) * 1971-03-04 1972-09-14 Basf Ag Verfahren zur Herstellung von Copolymerisatlösungen und dispersionen
JP6919290B2 (ja) * 2016-04-27 2021-08-18 Jsr株式会社 組成物、硬化物及び積層体
JP7115165B2 (ja) * 2017-09-15 2022-08-09 Jsr株式会社 高周波回路用積層体及びフレキシブルプリント基板
JP7702778B2 (ja) * 2020-04-27 2025-07-04 味の素株式会社 樹脂組成物
WO2022210096A1 (ja) * 2021-04-02 2022-10-06 Jsr株式会社 絶縁膜形成用感放射線性組成物、パターンを有する樹脂膜および半導体回路基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015168775A (ja) * 2014-03-07 2015-09-28 Dic株式会社 酸基含有（メタ）アクリレート樹脂、酸基含有（メタ）アクリレート樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料
CN107250212A (zh) * 2015-03-11 2017-10-13 Jsr株式会社 聚合物、树脂组合物和树脂成型体
CN105061754A (zh) * 2015-09-06 2015-11-18 吉林大学 一种聚芳醚类聚合物及其制备方法
TW201807017A (zh) * 2016-04-20 2018-03-01 Jsr股份有限公司 聚合物、組成物、成形體、硬化物以及積層體
TW201921114A (zh) * 2017-09-01 2019-06-01 日商日產化學股份有限公司 感光性樹脂組成物
TW202007708A (zh) * 2018-07-25 2020-02-16 日商Ｊｓｒ股份有限公司 感光性樹脂組成物、具有圖案的樹脂膜的製造方法、具有圖案的樹脂膜、及半導體電路基板

Also Published As

Publication number Publication date
JP7444239B2 (ja) 2024-03-06
TW202204472A (zh) 2022-02-01
CN115298616A (zh) 2022-11-04
KR20220155258A (ko) 2022-11-22
CN115298616B (zh) 2026-01-13
KR102696847B1 (ko) 2024-08-20
WO2021187481A1 (ja) 2021-09-23
JPWO2021187481A1 (https=) 2021-09-23

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