KR102696847B1 - 감광성 절연막 형성 조성물 - Google Patents

감광성 절연막 형성 조성물 Download PDF

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Publication number
KR102696847B1
KR102696847B1 KR1020227023703A KR20227023703A KR102696847B1 KR 102696847 B1 KR102696847 B1 KR 102696847B1 KR 1020227023703 A KR1020227023703 A KR 1020227023703A KR 20227023703 A KR20227023703 A KR 20227023703A KR 102696847 B1 KR102696847 B1 KR 102696847B1
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South Korea
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group
insulating film
photosensitive insulating
relief pattern
composition
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English (en)
Korean (ko)
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KR20220155258A (ko
Inventor
마사히사 엔도
카즈히로 사와다
타카히로 키시오카
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닛산 가가쿠 가부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G67/00—Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing oxygen or oxygen and carbon, not provided for in groups C08G2/00 - C08G65/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Polyethers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020227023703A 2020-03-18 2021-03-16 감광성 절연막 형성 조성물 Active KR102696847B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-047394 2020-03-18
JP2020047394 2020-03-18
PCT/JP2021/010607 WO2021187481A1 (ja) 2020-03-18 2021-03-16 感光性絶縁膜形成組成物

Publications (2)

Publication Number Publication Date
KR20220155258A KR20220155258A (ko) 2022-11-22
KR102696847B1 true KR102696847B1 (ko) 2024-08-20

Family

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KR1020227023703A Active KR102696847B1 (ko) 2020-03-18 2021-03-16 감광성 절연막 형성 조성물

Country Status (5)

Country Link
JP (1) JP7444239B2 (https=)
KR (1) KR102696847B1 (https=)
CN (1) CN115298616B (https=)
TW (1) TWI858239B (https=)
WO (1) WO2021187481A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022210096A1 (ja) * 2021-04-02 2022-10-06 Jsr株式会社 絶縁膜形成用感放射線性組成物、パターンを有する樹脂膜および半導体回路基板
JP2024160416A (ja) * 2021-09-21 2024-11-14 日産化学株式会社 非感光性絶縁膜形成組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015168775A (ja) 2014-03-07 2015-09-28 Dic株式会社 酸基含有（メタ）アクリレート樹脂、酸基含有（メタ）アクリレート樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料
JP2017200997A (ja) 2016-04-27 2017-11-09 Jsr株式会社 組成物、硬化物及び積層体
WO2019044874A1 (ja) 2017-09-01 2019-03-07 日産化学株式会社 感光性樹脂組成物
JP2019051709A (ja) 2017-09-15 2019-04-04 Jsr株式会社 高周波回路用積層体及びその製造方法、並びにｂステージシート
WO2020021827A1 (ja) 2018-07-25 2020-01-30 Jsr株式会社 感光性樹脂組成物、パターンを有する樹脂膜の製造方法、パターンを有する樹脂膜、および半導体回路基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2110262A1 (de) * 1971-03-04 1972-09-14 Basf Ag Verfahren zur Herstellung von Copolymerisatlösungen und dispersionen
JP6566023B2 (ja) * 2015-03-11 2019-08-28 Jsr株式会社 重合体、樹脂組成物及び樹脂成形体
CN105061754A (zh) * 2015-09-06 2015-11-18 吉林大学 一种聚芳醚类聚合物及其制备方法
WO2017183461A1 (ja) * 2016-04-20 2017-10-26 Jsr株式会社 重合体、組成物、成形体、硬化物及び積層体
JP7702778B2 (ja) * 2020-04-27 2025-07-04 味の素株式会社 樹脂組成物
WO2022210096A1 (ja) * 2021-04-02 2022-10-06 Jsr株式会社 絶縁膜形成用感放射線性組成物、パターンを有する樹脂膜および半導体回路基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015168775A (ja) 2014-03-07 2015-09-28 Dic株式会社 酸基含有（メタ）アクリレート樹脂、酸基含有（メタ）アクリレート樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料
JP2017200997A (ja) 2016-04-27 2017-11-09 Jsr株式会社 組成物、硬化物及び積層体
WO2019044874A1 (ja) 2017-09-01 2019-03-07 日産化学株式会社 感光性樹脂組成物
JP2019051709A (ja) 2017-09-15 2019-04-04 Jsr株式会社 高周波回路用積層体及びその製造方法、並びにｂステージシート
WO2020021827A1 (ja) 2018-07-25 2020-01-30 Jsr株式会社 感光性樹脂組成物、パターンを有する樹脂膜の製造方法、パターンを有する樹脂膜、および半導体回路基板

Also Published As

Publication number Publication date
TWI858239B (zh) 2024-10-11
JP7444239B2 (ja) 2024-03-06
TW202204472A (zh) 2022-02-01
CN115298616A (zh) 2022-11-04
KR20220155258A (ko) 2022-11-22
CN115298616B (zh) 2026-01-13
WO2021187481A1 (ja) 2021-09-23
JPWO2021187481A1 (https=) 2021-09-23

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