CN115279815B - (甲基)丙烯酸酯树脂、活性能量射线固化性(甲基)丙烯酸酯树脂组合物、和抗蚀下层膜、以及(甲基)丙烯酸酯树脂的制造方法 - Google Patents

(甲基)丙烯酸酯树脂、活性能量射线固化性(甲基)丙烯酸酯树脂组合物、和抗蚀下层膜、以及(甲基)丙烯酸酯树脂的制造方法 Download PDF

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Publication number
CN115279815B
CN115279815B CN202180020465.1A CN202180020465A CN115279815B CN 115279815 B CN115279815 B CN 115279815B CN 202180020465 A CN202180020465 A CN 202180020465A CN 115279815 B CN115279815 B CN 115279815B
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meth
acrylate
acrylate resin
trihydroxybenzene
resin
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Chinese (zh)
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CN115279815A (zh
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今田知之
长江教夫
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DIC Corp
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DIC Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN202180020465.1A 2020-03-10 2021-02-04 (甲基)丙烯酸酯树脂、活性能量射线固化性(甲基)丙烯酸酯树脂组合物、和抗蚀下层膜、以及(甲基)丙烯酸酯树脂的制造方法 Active CN115279815B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-040778 2020-03-10
JP2020040778 2020-03-10
PCT/JP2021/004013 WO2021181958A1 (ja) 2020-03-10 2021-02-04 （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法

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CN115279815A CN115279815A (zh) 2022-11-01
CN115279815B true CN115279815B (zh) 2024-02-20

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Country Status (5)

Country Link
JP (1) JP7024929B2 (https=)
KR (1) KR102915144B1 (https=)
CN (1) CN115279815B (https=)
TW (1) TWI842976B (https=)
WO (1) WO2021181958A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI884320B (zh) * 2020-12-15 2025-05-21 日商Ｄｉｃ股份有限公司 聚合性化合物、活性能量線硬化性樹脂組成物、硬化物、抗蝕用組成物、及抗蝕膜
JP2023100439A (ja) * 2022-01-06 2023-07-19 Dic株式会社 エポキシ樹脂、エポキシ樹脂組成物、及び、硬化物

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680760A (ja) * 1992-09-02 1994-03-22 Dai Ichi Kogyo Seiyaku Co Ltd 不飽和基含有ポリカルボン酸樹脂の製造方法及び該樹脂を含有するホトソルダーレジスト樹脂組成物
JPH0841146A (ja) * 1994-07-27 1996-02-13 Nippon Kayaku Co Ltd 樹脂組成物、レジストインキ組成物及びその硬化物
JP2003026763A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ樹脂組成物
JP2012528223A (ja) * 2009-05-27 2012-11-12 サントル ナシオナル ドゥ ラ ルシェルシェサイアンティフィク（セエヌエールエス） 熱硬化性エポキシ樹脂の新規な製造方法
CN103865232A (zh) * 2014-02-27 2014-06-18 江苏恒神纤维材料有限公司 一种高韧性阻燃环氧树脂组合物及其制备方法
JP2015010120A (ja) * 2013-06-27 2015-01-19 東レ株式会社 エポキシ樹脂硬化物微粒子、その分散液及びそれらの製造方法
WO2019017013A1 (ja) * 2017-07-21 2019-01-24 Dic株式会社 エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物
JP2020117612A (ja) * 2019-01-23 2020-08-06 Dic株式会社 エポキシ（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品
WO2022130921A1 (ja) * 2020-12-15 2022-06-23 Dic株式会社 重合性化合物、活性エネルギー線硬化性樹脂組成物、硬化物、レジスト用組成物、及びレジスト膜

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285403A (ja) 2009-06-15 2010-12-24 Nissan Chem Ind Ltd 架橋剤及び該架橋剤を含有するレジスト下層膜形成組成物
JP6575838B2 (ja) 2017-07-14 2019-09-18 Dic株式会社 エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680760A (ja) * 1992-09-02 1994-03-22 Dai Ichi Kogyo Seiyaku Co Ltd 不飽和基含有ポリカルボン酸樹脂の製造方法及び該樹脂を含有するホトソルダーレジスト樹脂組成物
JPH0841146A (ja) * 1994-07-27 1996-02-13 Nippon Kayaku Co Ltd 樹脂組成物、レジストインキ組成物及びその硬化物
JP2003026763A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ樹脂組成物
JP2012528223A (ja) * 2009-05-27 2012-11-12 サントル ナシオナル ドゥ ラ ルシェルシェサイアンティフィク（セエヌエールエス） 熱硬化性エポキシ樹脂の新規な製造方法
JP2015010120A (ja) * 2013-06-27 2015-01-19 東レ株式会社 エポキシ樹脂硬化物微粒子、その分散液及びそれらの製造方法
CN103865232A (zh) * 2014-02-27 2014-06-18 江苏恒神纤维材料有限公司 一种高韧性阻燃环氧树脂组合物及其制备方法
WO2019017013A1 (ja) * 2017-07-21 2019-01-24 Dic株式会社 エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物
JP2020117612A (ja) * 2019-01-23 2020-08-06 Dic株式会社 エポキシ（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品
WO2022130921A1 (ja) * 2020-12-15 2022-06-23 Dic株式会社 重合性化合物、活性エネルギー線硬化性樹脂組成物、硬化物、レジスト用組成物、及びレジスト膜

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Publication number Publication date
JPWO2021181958A1 (https=) 2021-09-16
JP7024929B2 (ja) 2022-02-24
CN115279815A (zh) 2022-11-01
WO2021181958A1 (ja) 2021-09-16
TW202136329A (zh) 2021-10-01
TWI842976B (zh) 2024-05-21
KR102915144B1 (ko) 2026-01-20
KR20220152194A (ko) 2022-11-15

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