TWI842976B - (甲基)丙烯酸酯樹脂、活性能量線硬化性(甲基)丙烯酸酯樹脂組成物、及抗蝕下層膜、以及(甲基)丙烯酸酯樹脂之製造方法 - Google Patents

(甲基)丙烯酸酯樹脂、活性能量線硬化性(甲基)丙烯酸酯樹脂組成物、及抗蝕下層膜、以及(甲基)丙烯酸酯樹脂之製造方法 Download PDF

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TWI842976B
TWI842976B TW110104474A TW110104474A TWI842976B TW I842976 B TWI842976 B TW I842976B TW 110104474 A TW110104474 A TW 110104474A TW 110104474 A TW110104474 A TW 110104474A TW I842976 B TWI842976 B TW I842976B
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Taiwan
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meth
acrylate
acrylate resin
resin
trihydroxybenzene
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TW110104474A
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English (en)
Chinese (zh)
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TW202136329A (zh
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今田知之
長江教夫
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日商Ｄｉｃ股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW110104474A 2020-03-10 2021-02-05 (甲基)丙烯酸酯樹脂、活性能量線硬化性(甲基)丙烯酸酯樹脂組成物、及抗蝕下層膜、以及(甲基)丙烯酸酯樹脂之製造方法 TWI842976B (zh)

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JPJP2020-040778 2020-03-10
JP2020040778 2020-03-10

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TW202136329A TW202136329A (zh) 2021-10-01
TWI842976B true TWI842976B (zh) 2024-05-21

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TW110104474A TWI842976B (zh) 2020-03-10 2021-02-05 (甲基)丙烯酸酯樹脂、活性能量線硬化性(甲基)丙烯酸酯樹脂組成物、及抗蝕下層膜、以及(甲基)丙烯酸酯樹脂之製造方法

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JP (1) JP7024929B2 (https=)
KR (1) KR102915144B1 (https=)
CN (1) CN115279815B (https=)
TW (1) TWI842976B (https=)
WO (1) WO2021181958A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI884320B (zh) * 2020-12-15 2025-05-21 日商Ｄｉｃ股份有限公司 聚合性化合物、活性能量線硬化性樹脂組成物、硬化物、抗蝕用組成物、及抗蝕膜
JP2023100439A (ja) * 2022-01-06 2023-07-19 Dic株式会社 エポキシ樹脂、エポキシ樹脂組成物、及び、硬化物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0841146A (ja) * 1994-07-27 1996-02-13 Nippon Kayaku Co Ltd 樹脂組成物、レジストインキ組成物及びその硬化物
JP2012528223A (ja) * 2009-05-27 2012-11-12 サントル ナシオナル ドゥ ラ ルシェルシェサイアンティフィク（セエヌエールエス） 熱硬化性エポキシ樹脂の新規な製造方法
TW201908360A (zh) * 2017-07-21 2019-03-01 日商迪愛生股份有限公司 環氧樹脂、及含有其之環氧樹脂組成物、以及使用該環氧樹脂組成物之硬化物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680760A (ja) * 1992-09-02 1994-03-22 Dai Ichi Kogyo Seiyaku Co Ltd 不飽和基含有ポリカルボン酸樹脂の製造方法及び該樹脂を含有するホトソルダーレジスト樹脂組成物
JP2003026763A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ樹脂組成物
JP2010285403A (ja) 2009-06-15 2010-12-24 Nissan Chem Ind Ltd 架橋剤及び該架橋剤を含有するレジスト下層膜形成組成物
JP2015010120A (ja) * 2013-06-27 2015-01-19 東レ株式会社 エポキシ樹脂硬化物微粒子、その分散液及びそれらの製造方法
CN103865232A (zh) * 2014-02-27 2014-06-18 江苏恒神纤维材料有限公司 一种高韧性阻燃环氧树脂组合物及其制备方法
JP6575838B2 (ja) 2017-07-14 2019-09-18 Dic株式会社 エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物
JP7192520B2 (ja) * 2019-01-23 2022-12-20 Dic株式会社 エポキシ（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品
TWI884320B (zh) * 2020-12-15 2025-05-21 日商Ｄｉｃ股份有限公司 聚合性化合物、活性能量線硬化性樹脂組成物、硬化物、抗蝕用組成物、及抗蝕膜

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0841146A (ja) * 1994-07-27 1996-02-13 Nippon Kayaku Co Ltd 樹脂組成物、レジストインキ組成物及びその硬化物
JP2012528223A (ja) * 2009-05-27 2012-11-12 サントル ナシオナル ドゥ ラ ルシェルシェサイアンティフィク（セエヌエールエス） 熱硬化性エポキシ樹脂の新規な製造方法
TW201908360A (zh) * 2017-07-21 2019-03-01 日商迪愛生股份有限公司 環氧樹脂、及含有其之環氧樹脂組成物、以及使用該環氧樹脂組成物之硬化物

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Publication number Publication date
CN115279815B (zh) 2024-02-20
JPWO2021181958A1 (https=) 2021-09-16
JP7024929B2 (ja) 2022-02-24
CN115279815A (zh) 2022-11-01
WO2021181958A1 (ja) 2021-09-16
TW202136329A (zh) 2021-10-01
KR102915144B1 (ko) 2026-01-20
KR20220152194A (ko) 2022-11-15

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