JP7024929B2 - （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法 - Google Patents

（メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法 Download PDF

Info

Publication number
JP7024929B2
JP7024929B2 JP2021559334A JP2021559334A JP7024929B2 JP 7024929 B2 JP7024929 B2 JP 7024929B2 JP 2021559334 A JP2021559334 A JP 2021559334A JP 2021559334 A JP2021559334 A JP 2021559334A JP 7024929 B2 JP7024929 B2 JP 7024929B2
Authority
JP
Japan
Prior art keywords
meth
acrylate
acrylate resin
resin
trihydroxybenzene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021559334A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021181958A1 (https=
Inventor
知之 今田
教夫 長江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of JPWO2021181958A1 publication Critical patent/JPWO2021181958A1/ja
Application granted granted Critical
Publication of JP7024929B2 publication Critical patent/JP7024929B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2021559334A 2020-03-10 2021-02-04 （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法 Active JP7024929B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020040778 2020-03-10
JP2020040778 2020-03-10
PCT/JP2021/004013 WO2021181958A1 (ja) 2020-03-10 2021-02-04 （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021181958A1 JPWO2021181958A1 (https=) 2021-09-16
JP7024929B2 true JP7024929B2 (ja) 2022-02-24

Family

ID=77671369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021559334A Active JP7024929B2 (ja) 2020-03-10 2021-02-04 （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法

Country Status (5)

Country Link
JP (1) JP7024929B2 (https=)
KR (1) KR102915144B1 (https=)
CN (1) CN115279815B (https=)
TW (1) TWI842976B (https=)
WO (1) WO2021181958A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI884320B (zh) * 2020-12-15 2025-05-21 日商Ｄｉｃ股份有限公司 聚合性化合物、活性能量線硬化性樹脂組成物、硬化物、抗蝕用組成物、及抗蝕膜
JP2023100439A (ja) * 2022-01-06 2023-07-19 Dic株式会社 エポキシ樹脂、エポキシ樹脂組成物、及び、硬化物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012528223A (ja) 2009-05-27 2012-11-12 サントル ナシオナル ドゥ ラ ルシェルシェサイアンティフィク（セエヌエールエス） 熱硬化性エポキシ樹脂の新規な製造方法
WO2019017013A1 (ja) 2017-07-21 2019-01-24 Dic株式会社 エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680760A (ja) * 1992-09-02 1994-03-22 Dai Ichi Kogyo Seiyaku Co Ltd 不飽和基含有ポリカルボン酸樹脂の製造方法及び該樹脂を含有するホトソルダーレジスト樹脂組成物
JPH0841146A (ja) * 1994-07-27 1996-02-13 Nippon Kayaku Co Ltd 樹脂組成物、レジストインキ組成物及びその硬化物
JP2003026763A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ樹脂組成物
JP2010285403A (ja) 2009-06-15 2010-12-24 Nissan Chem Ind Ltd 架橋剤及び該架橋剤を含有するレジスト下層膜形成組成物
JP2015010120A (ja) * 2013-06-27 2015-01-19 東レ株式会社 エポキシ樹脂硬化物微粒子、その分散液及びそれらの製造方法
CN103865232A (zh) * 2014-02-27 2014-06-18 江苏恒神纤维材料有限公司 一种高韧性阻燃环氧树脂组合物及其制备方法
JP6575838B2 (ja) 2017-07-14 2019-09-18 Dic株式会社 エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物
JP7192520B2 (ja) * 2019-01-23 2022-12-20 Dic株式会社 エポキシ（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品
TWI884320B (zh) * 2020-12-15 2025-05-21 日商Ｄｉｃ股份有限公司 聚合性化合物、活性能量線硬化性樹脂組成物、硬化物、抗蝕用組成物、及抗蝕膜

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012528223A (ja) 2009-05-27 2012-11-12 サントル ナシオナル ドゥ ラ ルシェルシェサイアンティフィク（セエヌエールエス） 熱硬化性エポキシ樹脂の新規な製造方法
WO2019017013A1 (ja) 2017-07-21 2019-01-24 Dic株式会社 エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物

Also Published As

Publication number Publication date
CN115279815B (zh) 2024-02-20
JPWO2021181958A1 (https=) 2021-09-16
CN115279815A (zh) 2022-11-01
WO2021181958A1 (ja) 2021-09-16
TW202136329A (zh) 2021-10-01
TWI842976B (zh) 2024-05-21
KR102915144B1 (ko) 2026-01-20
KR20220152194A (ko) 2022-11-15

Similar Documents

Publication Publication Date Title
JP6822758B2 (ja) タッチパネル用感光性樹脂組成物およびその硬化膜、ならびに当該硬化膜を有するタッチパネル
JP2020071262A (ja) 隔壁用感光性樹脂組成物及びその硬化物並びにその製造方法
TWI883152B (zh) 感光性樹脂組成物、硬化膜、基板、基板的製造方法及顯示裝置
JP7024929B2 (ja) （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法
JP2003055362A (ja) 脂環式化合物
JP4231076B2 (ja) 感光性樹脂組成物
TWI900479B (zh) 感光性樹脂組成物、使感光性樹脂組成物硬化而成的硬化膜、帶有硬化膜的基板及帶有硬化膜的基板的製造方法
TWI848061B (zh) 含酸基之(甲基)丙烯酸酯樹脂、硬化性樹脂組成物、硬化物、絕緣材料、阻焊用樹脂材料及阻焊構件
TW202003610A (zh) 感光性樹脂組成物、該感光性樹脂組成物的硬化物及含有該硬化物的顯示裝置
JP7844098B2 (ja) 硬化膜付き基板の製造方法、硬化膜付き基板、感光性樹脂組成物、感光性樹脂組成物を硬化してなる硬化膜および硬化膜または硬化膜付き基板を有する表示装置
JP7192521B2 (ja) 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
JP7288233B2 (ja) 重合性化合物、活性エネルギー線硬化性樹脂組成物、硬化物、レジスト用組成物、及びレジスト膜
KR20220110775A (ko) 지환식 아크릴레이트 화합물, 지환식 에폭시 아크릴레이트 화합물, 경화성 조성물 및 경화물
JP2012041493A (ja) 硬化性組成物、その硬化物、及び光学材料
WO2019124232A1 (ja) 光硬化性樹脂組成物
TWI811384B (zh) 含酸基之（甲基）丙烯酸酯樹脂組成物、硬化性樹脂組成物、硬化物、及阻焊劑用樹脂材料
JPWO2018186183A1 (ja) 酸基含有（メタ）アクリレート樹脂及びソルダーレジスト用樹脂材料
JP6599785B2 (ja) カルボキシル基含有フルオレン系ポリエステル樹脂、及びその製造方法
JP2021095461A (ja) ラジカル重合性化合物、硬化性組成物および硬化物
JP2016166351A (ja) 硬化性組成物及びその硬化物並びに硬度向上方法
TW202309659A (zh) 黑色抗蝕劑用感光性樹脂組成物、硬化膜、硬化膜的製造方法、以及具有所述硬化膜的彩色濾光片及隔離壁
WO2021177251A1 (ja) ポジ型感光性樹脂組成物
JP2021095462A (ja) 脂環式エポキシアクリレート型重合性単量体、エポキシ基含有（メタ）アクリル重合体、硬化性組成物および硬化物
TW202548425A (zh) 感光性樹脂組成物、使感光性樹脂組成物硬化而成的硬化膜、帶有硬化膜的基板及帶有硬化膜的基板的製造方法
TW202608938A (zh) 附硬化膜的基板之製造方法、附硬化膜的基板、感光性樹脂組成物、使感光性樹脂組成物硬化而成的硬化膜以及具有硬化膜或附硬化膜的基板之顯示裝置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211005

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20211005

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220111

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220124

R151 Written notification of patent or utility model registration

Ref document number: 7024929

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250