CN114716707A - 聚酰亚胺膜、铜张层叠板及电路基板 - Google Patents
聚酰亚胺膜、铜张层叠板及电路基板 Download PDFInfo
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- CN114716707A CN114716707A CN202210504040.4A CN202210504040A CN114716707A CN 114716707 A CN114716707 A CN 114716707A CN 202210504040 A CN202210504040 A CN 202210504040A CN 114716707 A CN114716707 A CN 114716707A
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- diamine
- polyimide
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- 229910052802 copper Inorganic materials 0.000 title claims description 36
- 239000010949 copper Substances 0.000 title claims description 36
- 229920006259 thermoplastic polyimide Polymers 0.000 claims abstract description 167
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical group C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims abstract description 101
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims abstract description 96
- 150000000000 tetracarboxylic acids Chemical group 0.000 claims abstract description 50
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 48
- CXISKMDTEFIGTG-UHFFFAOYSA-N [4-(1,3-dioxo-2-benzofuran-5-carbonyl)oxyphenyl] 1,3-dioxo-2-benzofuran-5-carboxylate Chemical group C1=C2C(=O)OC(=O)C2=CC(C(OC=2C=CC(OC(=O)C=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)=O)=C1 CXISKMDTEFIGTG-UHFFFAOYSA-N 0.000 claims abstract description 31
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical group C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 claims abstract description 29
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims abstract description 18
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 claims abstract description 12
- AMNPXXIGUOKIPP-UHFFFAOYSA-N [4-(carbamothioylamino)phenyl]thiourea Chemical compound NC(=S)NC1=CC=C(NC(N)=S)C=C1 AMNPXXIGUOKIPP-UHFFFAOYSA-N 0.000 claims abstract description 11
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 claims abstract description 9
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- 125000005462 imide group Chemical group 0.000 claims description 70
- 125000004427 diamine group Chemical group 0.000 claims description 58
- -1 diamine compound Chemical class 0.000 claims description 57
- 125000005647 linker group Chemical group 0.000 claims description 39
- 230000009477 glass transition Effects 0.000 claims description 16
- 125000003545 alkoxy group Chemical group 0.000 claims description 15
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 10
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 6
- 125000004414 alkyl thio group Chemical group 0.000 claims description 3
- 125000006157 aromatic diamine group Chemical group 0.000 claims 11
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 15
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- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 13
- 238000001035 drying Methods 0.000 description 13
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- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 10
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- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 4
- QGMGHALXLXKCBD-UHFFFAOYSA-N 4-amino-n-(2-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=CC=C1N QGMGHALXLXKCBD-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
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- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 3
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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- H—ELECTRICITY
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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Landscapes
- Engineering & Computer Science (AREA)
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- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210504040.4A CN114716707B (zh) | 2016-09-29 | 2017-09-11 | 聚酰亚胺膜、铜张层叠板及电路基板 |
Applications Claiming Priority (11)
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| JP2016191787 | 2016-09-29 | ||
| JP2016-191787 | 2016-09-29 | ||
| JP2016-191786 | 2016-09-29 | ||
| JP2016191786 | 2016-09-29 | ||
| JP2016256927 | 2016-12-28 | ||
| JP2016-256927 | 2016-12-28 | ||
| JP2016-256928 | 2016-12-28 | ||
| JP2016256928 | 2016-12-28 | ||
| CN202210504040.4A CN114716707B (zh) | 2016-09-29 | 2017-09-11 | 聚酰亚胺膜、铜张层叠板及电路基板 |
| PCT/JP2017/032642 WO2018061727A1 (ja) | 2016-09-29 | 2017-09-11 | ポリイミドフィルム、銅張積層板及び回路基板 |
| CN201780059180.2A CN109789689A (zh) | 2016-09-29 | 2017-09-11 | 聚酰亚胺膜、铜张层叠板及电路基板 |
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| CN114716707A true CN114716707A (zh) | 2022-07-08 |
| CN114716707B CN114716707B (zh) | 2024-10-11 |
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| CN202210504040.4A Active CN114716707B (zh) | 2016-09-29 | 2017-09-11 | 聚酰亚胺膜、铜张层叠板及电路基板 |
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| CN (2) | CN109789689A (ko) |
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| WO (1) | WO2018061727A1 (ko) |
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| JP2018165346A (ja) * | 2017-03-28 | 2018-10-25 | 東レ・デュポン株式会社 | ポリイミドフィルム |
| WO2020022129A1 (ja) * | 2018-07-25 | 2020-01-30 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及び回路基板 |
| JP7156877B2 (ja) * | 2018-09-18 | 2022-10-19 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及びパターン化金属張積層板 |
| JP7446741B2 (ja) * | 2018-09-28 | 2024-03-11 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及び回路基板 |
| JP7093282B2 (ja) * | 2018-09-29 | 2022-06-29 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及び回路基板 |
| JP7381197B2 (ja) | 2018-10-31 | 2023-11-15 | 日鉄ケミカル＆マテリアル株式会社 | 回路基板及び多層回路基板 |
| CN113544191B (zh) * | 2019-03-01 | 2024-03-29 | Jsr株式会社 | 高频电路用层叠体及其制造方法、柔性印刷基板、b阶片、以及层叠体卷绕体 |
| JPWO2020213515A1 (ko) | 2019-04-16 | 2020-10-22 | ||
| JP7231932B2 (ja) * | 2019-05-10 | 2023-03-02 | ユニチカ株式会社 | ポリイミドフィルム |
| KR20200135028A (ko) * | 2019-05-24 | 2020-12-02 | 피아이첨단소재 주식회사 | 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판 |
| WO2020262450A1 (ja) * | 2019-06-27 | 2020-12-30 | 日鉄ケミカル＆マテリアル株式会社 | 樹脂フィルム、金属張積層体及びその製造方法 |
| JP7247037B2 (ja) * | 2019-06-28 | 2023-03-28 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及びパターン化金属張積層板 |
| KR102435973B1 (ko) * | 2020-07-06 | 2022-08-25 | 한화솔루션 주식회사 | 고굴곡 및 저유전성 연성 동박 적층판 |
| WO2021010783A1 (ko) * | 2019-07-17 | 2021-01-21 | 한화솔루션 주식회사 | 고굴곡 및 저유전성 연성 동박 적층판 |
| JP7184858B2 (ja) | 2019-09-28 | 2022-12-06 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミドフィルム、金属張積層板及び回路基板 |
| CN114502617B (zh) * | 2019-10-07 | 2024-05-03 | 艾曲迪微系统股份有限公司 | 聚酰亚胺前体、感光性树脂组合物、层间绝缘膜、覆盖涂层、表面保护膜和电子部件 |
| JP7429519B2 (ja) * | 2019-11-05 | 2024-02-08 | 株式会社カネカ | 多層ポリイミドフィルム |
| KR20210116311A (ko) * | 2020-03-17 | 2021-09-27 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 폴리이미드, 가교 폴리이미드, 접착제 필름, 적층체, 커버레이 필름, 수지를 구비한 구리박, 금속 피복 적층판, 회로 기판 및 다층 회로 기판 |
| JP7486393B2 (ja) | 2020-09-30 | 2024-05-17 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板、その製造方法及び回路基板 |
| CN116507667A (zh) * | 2020-10-14 | 2023-07-28 | 株式会社钟化 | 多层聚酰亚胺薄膜、覆金属箔层压板和多层聚酰亚胺薄膜的制造方法 |
| WO2022080314A1 (ja) * | 2020-10-14 | 2022-04-21 | 株式会社カネカ | 複層ポリイミドフィルム、金属張積層板、及び複層ポリイミドフィルムの製造方法 |
| KR102458949B1 (ko) * | 2020-11-09 | 2022-10-26 | 엘지전자 주식회사 | 연성 인쇄회로기판용 기재 |
| CN112409621B (zh) * | 2020-11-27 | 2022-09-09 | 桂林电器科学研究院有限公司 | 高强度低介电性聚酰亚胺多层膜及其制备方法 |
| CN112375221B (zh) * | 2020-11-27 | 2023-05-02 | 桂林电器科学研究院有限公司 | 一种低介电性聚酰亚胺复合薄膜及其制备方法 |
| JPWO2022138666A1 (ko) * | 2020-12-21 | 2022-06-30 | ||
| TWI827897B (zh) * | 2020-12-29 | 2024-01-01 | 達邁科技股份有限公司 | 低介電損失之聚醯亞胺膜 |
| US11746083B2 (en) | 2020-12-30 | 2023-09-05 | Industrial Technology Research Institute | Compound, resin composition and laminated substrate thereof |
| JP2022149188A (ja) | 2021-03-25 | 2022-10-06 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及び回路基板 |
| JP2022151716A (ja) | 2021-03-26 | 2022-10-07 | 日鉄ケミカル＆マテリアル株式会社 | 回路基板 |
| KR20240046171A (ko) * | 2021-08-13 | 2024-04-08 | 엘지전자 주식회사 | 복합 폴리이미드 기판, 복합 폴리이미드 조성물 및 이를 이용한 인쇄 회로 기판 |
| CN113604045B (zh) * | 2021-08-31 | 2022-09-02 | 烟台丰鲁精细化工有限责任公司 | 一种低介电性能的热塑性聚酰亚胺树脂复合薄膜及其制备方法 |
| JP2023079202A (ja) | 2021-11-26 | 2023-06-07 | 住友化学株式会社 | ポリイミド系樹脂前駆体 |
| CN116178953A (zh) | 2021-11-26 | 2023-05-30 | 住友化学株式会社 | 聚酰亚胺系膜 |
| JP2023149136A (ja) * | 2022-03-30 | 2023-10-13 | 日鉄ケミカル＆マテリアル株式会社 | アミノ化合物、当該アミノ化合物を用いたポリアミド酸及びポリイミド、並びにこれらの製造方法 |
| WO2024135665A1 (ja) * | 2022-12-22 | 2024-06-27 | ウィンゴーテクノロジー株式会社 | ポリイミド化合物、それを用いたリチウムイオン二次電池用負極材料、リチウムイオン二次電池用負極、およびリチウムイオン二次電池 |
| WO2024142635A1 (ja) * | 2022-12-27 | 2024-07-04 | 株式会社カネカ | ポリイミドフィルム及びその製造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05271438A (ja) * | 1992-07-21 | 1993-10-19 | Ube Ind Ltd | ポリイミド複合シート |
| JP2002307608A (ja) * | 2001-04-10 | 2002-10-23 | Kanegafuchi Chem Ind Co Ltd | 積層体の製造方法および多層プリント配線板 |
| US20090252957A1 (en) * | 2006-07-06 | 2009-10-08 | Kenichi Kasumi | Thermoplastic polyimide, and laminated polyimide film and metal foil-laminated polyimide film using the thermoplastic polyimide |
| JP2011177929A (ja) * | 2010-02-26 | 2011-09-15 | Nippon Steel Chem Co Ltd | 金属−絶縁樹脂基板及びその製造方法 |
| CN105339416A (zh) * | 2013-06-28 | 2016-02-17 | 新日铁住金化学株式会社 | 聚酰亚胺、树脂膜及金属包覆层叠体 |
| WO2016052316A1 (ja) * | 2014-09-30 | 2016-04-07 | 新日鉄住金化学株式会社 | ポリアミド酸、ポリイミド、樹脂フィルム及び金属張積層板 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4872185B2 (ja) | 2003-05-06 | 2012-02-08 | 三菱瓦斯化学株式会社 | 金属張り積層体 |
| CN100494281C (zh) * | 2007-09-27 | 2009-06-03 | 湖北省化学研究院 | 改性马来酰亚胺封端型聚酰亚胺树脂组合物及其应用 |
| JP5181618B2 (ja) * | 2007-10-24 | 2013-04-10 | 宇部興産株式会社 | 金属箔積層ポリイミド樹脂基板 |
| CN102712187B (zh) * | 2010-01-18 | 2016-03-30 | 株式会社钟化 | 多层聚酰亚胺膜及使用有该多层聚酰亚胺膜的柔性金属箔积层板 |
| JP6767759B2 (ja) * | 2016-03-17 | 2020-10-14 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド、樹脂フィルム及び金属張積層板 |
-
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05271438A (ja) * | 1992-07-21 | 1993-10-19 | Ube Ind Ltd | ポリイミド複合シート |
| JP2002307608A (ja) * | 2001-04-10 | 2002-10-23 | Kanegafuchi Chem Ind Co Ltd | 積層体の製造方法および多層プリント配線板 |
| US20090252957A1 (en) * | 2006-07-06 | 2009-10-08 | Kenichi Kasumi | Thermoplastic polyimide, and laminated polyimide film and metal foil-laminated polyimide film using the thermoplastic polyimide |
| JP2011177929A (ja) * | 2010-02-26 | 2011-09-15 | Nippon Steel Chem Co Ltd | 金属−絶縁樹脂基板及びその製造方法 |
| CN105339416A (zh) * | 2013-06-28 | 2016-02-17 | 新日铁住金化学株式会社 | 聚酰亚胺、树脂膜及金属包覆层叠体 |
| WO2016052316A1 (ja) * | 2014-09-30 | 2016-04-07 | 新日鉄住金化学株式会社 | ポリアミド酸、ポリイミド、樹脂フィルム及び金属張積層板 |
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| JPWO2018061727A1 (ja) | 2019-07-25 |
| CN109789689A (zh) | 2019-05-21 |
| TWI775775B (zh) | 2022-09-01 |
| WO2018061727A1 (ja) | 2018-04-05 |
| TWI781901B (zh) | 2022-10-21 |
| TW201825295A (zh) | 2018-07-16 |
| CN114716707B (zh) | 2024-10-11 |
| JP6936239B2 (ja) | 2021-09-15 |
| TW202233433A (zh) | 2022-09-01 |
| KR20190055809A (ko) | 2019-05-23 |
| KR102290631B1 (ko) | 2021-08-19 |
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