CN113539885B - 信息处理装置、检测方法、基板处理系统及物品的制造方法 - Google Patents

信息处理装置、检测方法、基板处理系统及物品的制造方法 Download PDF

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CN113539885B
CN113539885B CN202110382069.5A CN202110382069A CN113539885B CN 113539885 B CN113539885 B CN 113539885B CN 202110382069 A CN202110382069 A CN 202110382069A CN 113539885 B CN113539885 B CN 113539885B
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control
sensors
abnormality
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control units
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CN113539885A (zh
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增田充宏
鲛岛裕纪
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Canon Inc
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Canon Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49215—Regulate temperature of coolant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computational Linguistics (AREA)
  • Computing Systems (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Artificial Intelligence (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Health & Medical Sciences (AREA)
  • General Factory Administration (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
CN202110382069.5A 2020-04-13 2021-04-09 信息处理装置、检测方法、基板处理系统及物品的制造方法 Active CN113539885B (zh)

Applications Claiming Priority (2)

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JP2020-071692 2020-04-13
JP2020071692A JP7423396B2 (ja) 2020-04-13 2020-04-13 情報処理装置、検出方法、プログラム、基板処理システム、及び物品の製造方法

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CN113539885A CN113539885A (zh) 2021-10-22
CN113539885B true CN113539885B (zh) 2025-06-27

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KR (1) KR20210127089A (enExample)
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TW (1) TWI838606B (enExample)

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JP2023102218A (ja) * 2022-01-11 2023-07-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置管理システム、基板処理装置管理方法および基板処理装置管理プログラム
JP2023103123A (ja) * 2022-01-13 2023-07-26 株式会社Ｓｃｒｅｅｎホールディングス 適正判定装置および適正判定方法
JP2023105744A (ja) * 2022-01-19 2023-07-31 株式会社Ｓｃｒｅｅｎホールディングス 支援装置、支援方法および支援プログラム
JP2023122512A (ja) * 2022-02-22 2023-09-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置管理システム、支援装置、基板処理装置、チャンバ間性能比較方法およびチャンバ間性能比較プログラム
WO2023162856A1 (ja) * 2022-02-22 2023-08-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置管理システム、支援装置、基板処理装置、チャンバ間性能比較方法およびチャンバ間性能比較プログラム
JP7750775B2 (ja) * 2022-03-02 2025-10-07 株式会社Ｓｃｒｅｅｎホールディングス 制御支援装置および制御支援方法
JP2023132914A (ja) * 2022-03-11 2023-09-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置管理システム、管理装置、基板処理装置、基板処理装置管理方法および基板処理装置管理プログラム
JP2023169060A (ja) * 2022-05-16 2023-11-29 横河電機株式会社 装置、方法およびプログラム
CN115798167B (zh) * 2023-01-05 2023-04-21 石家庄市惠源淀粉有限公司 用于淀粉葡萄糖生产工艺的设备异常报警方法及装置

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JP2019049778A (ja) * 2017-09-07 2019-03-28 日本電信電話株式会社 検知装置、検知方法及び検知プログラム

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JP2005136004A (ja) 2003-10-28 2005-05-26 Nikon Corp 露光装置、およびデバイス製造方法
JP2006278396A (ja) * 2005-03-28 2006-10-12 Tokyo Electron Ltd 処理装置及びプログラム
JP2007219692A (ja) 2006-02-15 2007-08-30 Omron Corp プロセス異常分析装置およびプロセス異常分析システム並びにプログラム
JP5811683B2 (ja) * 2011-08-18 2015-11-11 株式会社Ihi 異常診断装置
JP2014143927A (ja) * 2013-01-28 2014-08-14 Hitachi High-Technologies Corp 核酸増幅装置および温度調節機能の異常検出方法
WO2015145500A1 (ja) 2014-03-27 2015-10-01 日本電気株式会社 システム分析装置、分析モデル生成方法、システム分析方法およびシステム分析プログラム
JP6853617B2 (ja) 2015-07-14 2021-03-31 中国電力株式会社 故障予兆監視方法
JP7034646B2 (ja) * 2017-09-25 2022-03-14 株式会社Ｓｃｒｅｅｎホールディングス 異常検知装置、及び異常検知方法
JP7106847B2 (ja) 2017-11-28 2022-07-27 横河電機株式会社 診断装置、診断方法、プログラム、および記録媒体
JP6808684B2 (ja) * 2018-06-14 2021-01-06 キヤノン株式会社 情報処理装置、判定方法、プログラム、リソグラフィシステム、および物品の製造方法
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JP2019049778A (ja) * 2017-09-07 2019-03-28 日本電信電話株式会社 検知装置、検知方法及び検知プログラム

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TWI838606B (zh) 2024-04-11
JP7423396B2 (ja) 2024-01-29
JP2021168364A (ja) 2021-10-21
CN113539885A (zh) 2021-10-22
KR20210127089A (ko) 2021-10-21

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