TWI838606B - 資訊處理裝置、檢測方法、程式、基板處理系統及物品之製造方法 - Google Patents

資訊處理裝置、檢測方法、程式、基板處理系統及物品之製造方法 Download PDF

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TWI838606B
TWI838606B TW110103938A TW110103938A TWI838606B TW I838606 B TWI838606 B TW I838606B TW 110103938 A TW110103938 A TW 110103938A TW 110103938 A TW110103938 A TW 110103938A TW I838606 B TWI838606 B TW I838606B
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sensors
control
abnormality
control units
unit
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TW110103938A
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TW202208996A (zh
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増田充宏
鮫島裕紀
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日商佳能股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49215—Regulate temperature of coolant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Software Systems (AREA)
  • Evolutionary Computation (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Mathematical Physics (AREA)
  • Biophysics (AREA)
  • Artificial Intelligence (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Data Mining & Analysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computational Linguistics (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • General Factory Administration (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
TW110103938A 2020-04-13 2021-02-03 資訊處理裝置、檢測方法、程式、基板處理系統及物品之製造方法 TWI838606B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-071692 2020-04-13
JP2020071692A JP7423396B2 (ja) 2020-04-13 2020-04-13 情報処理装置、検出方法、プログラム、基板処理システム、及び物品の製造方法

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TW202208996A TW202208996A (zh) 2022-03-01
TWI838606B true TWI838606B (zh) 2024-04-11

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JP (1) JP7423396B2 (enExample)
KR (1) KR20210127089A (enExample)
CN (1) CN113539885B (enExample)
TW (1) TWI838606B (enExample)

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JP2023102218A (ja) * 2022-01-11 2023-07-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置管理システム、基板処理装置管理方法および基板処理装置管理プログラム
JP2023103123A (ja) * 2022-01-13 2023-07-26 株式会社Ｓｃｒｅｅｎホールディングス 適正判定装置および適正判定方法
JP2023105744A (ja) * 2022-01-19 2023-07-31 株式会社Ｓｃｒｅｅｎホールディングス 支援装置、支援方法および支援プログラム
CN119213531A (zh) * 2022-02-22 2024-12-27 株式会社斯库林集团 基板处理装置管理系统、辅助装置、基板处理装置、腔室间性能比较方法以及腔室间性能比较程序
JP2023122512A (ja) * 2022-02-22 2023-09-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置管理システム、支援装置、基板処理装置、チャンバ間性能比較方法およびチャンバ間性能比較プログラム
JP7750775B2 (ja) * 2022-03-02 2025-10-07 株式会社Ｓｃｒｅｅｎホールディングス 制御支援装置および制御支援方法
JP2023132914A (ja) * 2022-03-11 2023-09-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置管理システム、管理装置、基板処理装置、基板処理装置管理方法および基板処理装置管理プログラム
JP2023169060A (ja) * 2022-05-16 2023-11-29 横河電機株式会社 装置、方法およびプログラム
CN115798167B (zh) * 2023-01-05 2023-04-21 石家庄市惠源淀粉有限公司 用于淀粉葡萄糖生产工艺的设备异常报警方法及装置

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JP2019101495A (ja) * 2017-11-28 2019-06-24 横河電機株式会社 診断装置、診断方法、プログラム、および記録媒体
TW202002121A (zh) * 2018-06-14 2020-01-01 日商佳能股份有限公司 資訊處理設備、判斷方法、程式、微影系統及製造物的方法

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US7065422B1 (en) * 2002-06-28 2006-06-20 Advanced Micro Devices, Inc. Method and apparatus for system state classification
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JP2019101495A (ja) * 2017-11-28 2019-06-24 横河電機株式会社 診断装置、診断方法、プログラム、および記録媒体
TW202002121A (zh) * 2018-06-14 2020-01-01 日商佳能股份有限公司 資訊處理設備、判斷方法、程式、微影系統及製造物的方法

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CN113539885B (zh) 2025-06-27
CN113539885A (zh) 2021-10-22
KR20210127089A (ko) 2021-10-21
JP2021168364A (ja) 2021-10-21
TW202208996A (zh) 2022-03-01
JP7423396B2 (ja) 2024-01-29

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