CN112442272A - 马来酰亚胺树脂膜和马来酰亚胺树脂膜用组合物 - Google Patents
马来酰亚胺树脂膜和马来酰亚胺树脂膜用组合物 Download PDFInfo
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- CN112442272A CN112442272A CN202010908139.1A CN202010908139A CN112442272A CN 112442272 A CN112442272 A CN 112442272A CN 202010908139 A CN202010908139 A CN 202010908139A CN 112442272 A CN112442272 A CN 112442272A
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- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
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- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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Abstract
本发明的课题是提供一种将无机粒子高填充且粘接力优异的马来酰亚胺树脂膜。所述马来酰亚胺树脂膜包含:(a)下述式(1)表示的马来酰亚胺(在式(1)中,A独立地表示含有环状结构的四价有机基团。B独立地为具有一个以上碳原子数5以上的脂肪族环、且任选含有杂原子的碳原子数6以上的亚烷基。Q独立地为任选含有杂原子的碳原子数6以上的亚芳基。W表示由B或Q表示的基团。n为0~100,m表示0~100的数。其中,n和m中的至少一者为正数);(b)(甲基)丙烯酸酯;(c)无机粒子;以及(d)固化催化剂。
Description
技术领域
本发明涉及马来酰亚胺树脂膜和马来酰亚胺树脂膜用组合物。
背景技术
近年来,在电子设备中,伴随着高性能化、小型化以及轻量化等,已进行着半导体封装的高密度封装化、LSI的高集成化以及高速化等。随着这些变化,由于在各种电子部件中所产生的热量增大,因此,有效地将来自电子部件的热散发至外部的热对策已经成为非常重要的问题。作为这样的热对策,将由金属、陶瓷以及高分子组合物等散热材料组成的热传导性成型体适用于印刷线路板、半导体封装、壳体、热管、散热板以及热扩散板等散热构件。尤其是由于汽车的EV化或自动驾驶、防止冲撞等安全管理和危机管理等原因,导致电子设备的搭载数量增加,以及来自轻、薄、短、小的电子设备进行散热的热对策尤为重要。
以往,虽然通过将高热传导粒子高度填充在硅酮树脂、环氧树脂等固化性树脂中而制造高热传导树脂或成型体,但若将高热传导粒子高度填充在硅酮树脂、环氧树脂中,则会导致其成型体变硬、变脆(专利文献1、专利文献2)。
作为其对策,已知有使鳞片状、纤维状或板状的热传导粒子在厚度方向上取向来提高热传导率的方法(专利文献3、专利文献4)。但是,由于难以使组合物中的热传导粒子进行取向,因此,在该方法中具有生产性差的缺点。
还已知一种通过改善树脂自身的热传导率、从而改善组合物的热传导率的方法(专利文献5)。但是,在该方法中由于仅限定于具有液晶元骨架的液晶聚合物等树脂,因此,难以在固化后的成型体中具有柔软性。
还已知马来酰亚胺树脂通过主链骨架而具有柔软性和耐热性,从而被用于柔性印刷线路板等(专利文献6)。进一步,还有将马来酰亚胺树脂与环氧树脂、酚醛树脂等进行混合,然后再高度填充无机粒子来降低线膨胀系数的方法。但在该方法中,其与电子部件的粘接力不充分(专利文献7)。
现有技术文献
专利文献
专利文献1:日本特开2000-204259号公报
专利文献2:日本特开2018-087299号公报
专利文献3:国际公开WO2018/030430号公报
专利文献4:国际公开WO2017/179318号公报
专利文献5:国际公开WO2017/111115号公报
专利文献6:国际公开WO2016/114287号公报
专利文献7:日本特开2018-083893号公报
发明内容
发明所要解决的问题
因此,本发明的目的在于,提供一种具有充分的粘接力且高填充有无机粒子的马来酰亚胺树脂膜。
解决问题的方法
为了到达上述目的,本发明人们反复进行了深入研究的结果发现,下述的马来酰亚胺树脂膜能够解决上述问题,从而完成了本发明。
即,本发明为提供以下的马来酰亚胺树脂膜的发明。
<1>
一种马来酰亚胺树脂膜,其包含:
(a)下述式(1)表示的马来酰亚胺,
(在式(1)中,A独立地表示含有环状结构的四价有机基团,B独立地为具有一个以上碳原子数为5以上的脂肪族环、且任选含有杂原子的碳原子数6以上的亚烷基,Q独立地为任选含有杂原子的碳原子数6以上的亚芳基,W表示由B或Q表示的基团,n为0~100,m表示0~100的数。其中,n和m中的至少一者为正数。);
(b)碳原子数10以上的(甲基)丙烯酸酯;
(c)无机粒子;以及
(d)固化催化剂,
其中,(c)成分的无机粒子为树脂膜整体的70~90体积%。
<2>
如<1>所述的马来酰亚胺树脂膜,其中,式(1)中的A表示的有机基团为下述结构式表示的四价有机基团中的任意基团,
(在上述结构式中未键合取代基的键合位置与式(1)中形成环状酰亚胺结构的羰基碳键合。)。
<3>
如<1>或<2>所述的马来酰亚胺树脂膜,其中,
(b)成分的碳原子数10以上的(甲基)丙烯酸酯具有1个以上碳原子数5以上的脂肪族环。
<4>
如<1>~<3>中任一项所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自导电性粒子、热传导性粒子、荧光体、磁性粒子、白色粒子、中空粒子以及电磁波吸收粒子中的至少一种。
<5>
如<1>~<4>中任一项所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自金、银、铜、钯、铝、镍、铁、钛、锰、锌、钨、铂、铅或锡的金属单质、或者焊料、钢或不锈钢的合金中的至少一种导电性粒子。
<6>
如<1>~<4>中任一项所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自氮化硼、氮化铝、氮化硅、氧化铍、氧化镁、氧化锌、氧化铝、碳化硅、金刚石以及石墨烯中的至少一种热传导性粒子。
<7>
如<1>~<4>中任一项所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自铁、钴、镍、不锈钢、Fe-Cr-Al-Si合金、Fe-Si-Al合金、Fe-Ni合金、Fe-Cu-Si合金、Fe-Si合金、Fe-Si-B(-Cu-Nb)合金、Fe-Si-Cr-Ni合金、Fe-Si-Cr合金、Fe-Si-Al-Ni-Cr合金、Fe2O3、Fe3O4、Mn-Zn类铁氧体、Ni-Zn类铁氧体、Mg-Mn类铁氧体、Zr-Mn类铁氧体、Ti-Mn类铁氧体、Mn-Zn-Cu类铁氧体、钡铁氧体以及锶铁氧体中的至少一种磁性粒子。
<8>
如<1>~<4>中任一项所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自二氧化钛、氧化钇、硫酸锌、氧化锌以及氧化镁中的至少一种白色粒子。
<9>
如<1>~<4>中任一项所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自二氧化硅中空球、碳中空球、氧化铝中空球、硅酸铝中空球以及氧化锆中空球中的至少一种中空粒子。
<10>
如<1>~<4>中任一项所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自炭黑、乙炔黑、科琴黑、碳纳米管、石墨烯、富勒烯、羰基铁、电解铁、Fe-Cr类合金、Fe-Al类合金、Fe-Co类合金、Fe-Cr-Al类合金、Fe-Si-Ni类合金、Mg-Zn类铁氧体、Ba2Co2Fe12O22、Ba2Ni2Fe12O22、Ba2Zn2Fe12O22、Ba2Mn2Fe12O22、Ba2Mg2Fe12O22、Ba2Cu2Fe12O22、Ba3Co2Fe24O41、BaFe12O19、SrFe12O19、BaFe12O19以及SrFe12O19中的至少一种电磁波吸收粒子。
<11>
一种马来酰亚胺树脂膜用组合物,其为构成<1>~<10>中任一项所述的马来酰亚胺树脂膜的马来酰亚胺树脂组合物,
该组合物进一步含有(e)有机溶剂,所述树脂组合物在25℃条件下的触变比为1.0~3.0。
发明的效果
本发明的马来酰亚胺树脂膜即使高填充有无机粒子也具有优异的粘接力。因此,作为根据配合的无机粒子的特性而具有各种功能性的树脂膜,可用于各种用途。此外,在无机粒子不具有导电性的情况下,可作为具有低介电特性的粘接性树脂膜使用。
具体实施方式
以下,对本发明的马来酰亚胺树脂膜详细地进行说明。
[(a)马来酰亚胺]
本发明的(a)成分为本发明的马来酰亚胺树脂膜的主要成分,其为下述式(1)表示的马来酰亚胺。
(在式(1)中,A独立地表示含有环状结构的4价有机基团。B独立地为具有1个以上碳原子数5以上的脂肪族环、且任选含有杂原子的碳原子数6以上的亚烷基。Q独立地为任选含有杂原子的碳原子数6以上的亚芳基。W表示由B或Q表示的基团。n为0~100,m表示0~100的数。其中,n和m的至少一者为正数。)
在此,式(1)中的A表示的有机基团独立地为含有环状结构的四价有机基团,特别优选为下述结构式表示的四价有机基团中的任意基团。
(上述结构式中未键合取代基的键合位置与式(1)中形成环状酰亚胺结构的羰基碳键合。)
另外,式(1)中的B独立地为任选含有杂原子的碳原子数为6以上、优选为8以上的亚烷基,且为具有1个以上碳原子数为5以上、优选为6~12的脂肪族环的亚烷基。式(1)中的B更优选为具有下述结构式表示的脂肪族环的亚烷基中的任意亚烷基。通过在分子中具有脂肪族环,从而能够将(c)无机粒子高填充在组合物中。
(上述结构式中未键合取代基的键合位置与式(1)中形成环状酰亚胺结构的氮原子键合。)
Q独立地为任选含有杂原子的碳原子数为6以上亚芳基,优选为碳原子数为8以上的亚芳基。式(1)中的Q更优选为具有下述结构式表示的芳香族环的亚芳基中的任意亚芳基。
(上述结构式中未键合取代基的键合位置与式(1)中形成环状酰亚胺结构的氮原子键合。)
式(1)中的n为0~100的数、优选为0~70的数。式(1)中的m为0~100的数、优选为0~70的数。其中,n和m的至少一者为正数。
作为所述马来酰亚胺的分子量,没有特别限制,优选为2000~50000、更优选为2200~30000,进一步优选为2500~20000。如果(a)成分的分子量在该范围之内,则用于制造马来酰亚胺树脂膜的组合物的粘度不会过高,进一步,由于该树脂膜的固化物具有高强度,因而优选。
需要说明的是,本说明书中所提及的分子量是指将在下述条件下通过GPC测定的聚苯乙烯作为标准物质的重均分子量。
[测定条件]
展开溶剂:四氢呋喃
流量:0.35mL/min
检测器:RI
柱:TSK-GEL Super HZ型(TOSOH CORPORATION制造)
SuperHZ4000(4.6mm I.D.×15cm×1)
SuperHZ3000(4.6mm I.D.×15cm×1)
SuperHZ2000(4.6mm I.D.×15cm×1)
柱温:40℃
试样注入量:5μL(浓度为0.1重量%的THF溶液)
作为所述马来酰亚胺的配合量,没有特别限制,相对于树脂膜的树脂份量100质量份为50质量份~99质量份、优选为60质量份~95质量份、更优选为70质量份~90质量份。如果在该范围之内,则能够将(c)成分的无机粒子高填充,且进一步作为树脂膜具有充分的粘接力。
作为马来酰亚胺,可以通过常规方法由二胺和酸酐而合成,也可以使用市售产品。作为市售产品,可列举BMI-1400、BMI-1500、BMI-2500、BMI-2560、BMI-3000、BMI-5000、BMI-6000以及BMI-6100(以上均为Designer Molecules Inc.制造)等。另外,马来酰亚胺可单独使用一种,也可多种并用。
相对于树脂膜的树脂份量100质量份,(a)成分的配合量优选为40~95质量份、更优选为50~90质量份、进一步优选为70~90质量份。需要说明的是,树脂膜的树脂份量为(a)成分、(b)成分以及(d)成分的总和。
[(b)碳原子数10以上的(甲基)丙烯酸酯]
(b)成分与(a)成分的马来酰亚胺同样地为与无机粒子的相容性良好、并且能够进一步提高树脂膜的粘接力的化合物。
(b)成分是碳原子数为10以上的(甲基)丙烯酸酯、优选为碳原子数为12以上的(甲基)丙烯酸酯、更优选为碳原子数为14~40的(甲基)丙烯酸酯。如果(甲基)丙烯酸酯的碳原子数小于10,则难以获得提高树脂膜的粘接力等效果,并且不能进一步提高未固化树脂膜的挠性。
作为(b)成分的一分子中的(甲基)丙烯酸基团数,没有特别限制,其为1~3个、优选为1个或2个。如果(b)成分的1分子中的(甲基)丙烯酸基数为1~3个,则树脂膜在固化时的收缩小且不会降低粘接力,因而优选。
作为(b)成分的具体例,例如,可列举由以下结构式表示的化合物,但并不限定于此。
(在上述式中,x分别在1~30的范围内)
(在上述式中,x在1~30的范围内)
在上述示例中,作为(b)成分,优选为在一个分子中具有一个以上碳原子数5以上、优选为碳原子数6~12的脂肪族环。
作为(b)成分的配合量没有特别限制,相对于树脂膜的树脂份量100质量份,所述(b)成分的配合量为1~50质量份、优选为3~30质量份、更优选为5~20质量份。如果在该范围之内,则能够将(c)成分的无机粒子高填充,且进一步作为树脂膜具有充分的粘接力。
[(c)无机粒子]
本发明中使用的(c)成分为决定本发明的马来酰亚胺树脂膜的特性的成分,可列举例如:导电性粒子、热传导性粒子、荧光体、磁性粒子、白色粒子、中空粒子、电磁波吸收粒子等。
作为导电性粒子,没有特别限制,可以根据所要达到的目的适当地选择。例如,可列举金属粒子、金属包覆粒子等。其中,由于金属粒子电阻小且能够在高温条件下进行烧结,因而优选。
作为所述金属粒子,可列举金、银、铜、钯、铝、镍、铁、钛、锰、锌、钨、铂、铅、锡等金属单质、或者焊料、钢、不锈钢等合金,优选为银、铜、铝、铁、锌、焊料,更优选为银、铜、铝、焊料。它们可以分别单独使用1种,也可以并用2种以上。
作为所述金属包覆粒子的例子,可以是用金属包覆丙烯酸树脂、环氧树脂等树脂粒子的表面的金属包覆粒子,也可以是用金属包覆玻璃、陶瓷等无机粒子的表面的金属包覆粒子。作为粒子表面的金属包覆方法没有特别限制,可列举例如:化学镀法、溅镀法等。
在此,作为包覆粒子表面的金属的例子,可列举金、银、铜、铁、镍、铝等。
所述导电性粒子只要在与电路电极进行电连接时具有导电性即可。例如,即使为在粒子表面实施了绝缘被膜的粒子,只要在电连接时将粒子变形,暴露出金属粒子,就是导电性粒子。
作为所述导电性粒子的形状,没有特别限制,可列举例如:球形、鳞片状、片状、针状、棒状、椭圆形等。其中,优选为球形、鳞片状、椭圆形、棒状,更优选为球形、鳞片状、椭圆形。
作为所述导电性粒子的平均粒径没有特别限制,作为利用激光衍射法的粒度分布测定装置所测定的中值粒径优选为0.05~50μm、更优选为0.1~40μm、进一步优选为0.5~30μm。若在该范围内,则容易将导电性粒子均匀地分散在所述树脂膜中,所述导电性粒子也不会随着时间的推移而沉降、分离以及不均匀,因而优选。此外,相对于膜的厚度,其粒径优选为50%以下。若相对于膜的厚度,粒径为50%以下时,由于可以容易地将导电性粒子均匀地分散在所述树脂膜中,从而可以容易地获得平坦的膜,因而优选。
作为所述热传导性粒子,没有特别限制,但出于热传导率的考虑,其优选为选自氮化硼、氮化铝、氮化硅、氧化铍、氧化镁、氧化锌、氧化铝、碳化硅、金刚石以及石墨烯中的至少一种。其中,优选为氮化硼、氮化铝、氧化铝、氧化镁、石墨烯。它们可以分别单独使用1种,也可以并用2种以上。
作为所述热传导性粒子的形状,没有特别限制,可列举例如:球形、鳞片状、片状、针状、棒状、椭圆形等。其中,优选为球形、鳞片状、椭圆形、棒状,更优选为球形、鳞片状、椭圆形。
作为所述热传导性粒子的平均粒径没有特别限制,作为利用激光衍射法的粒度分布测定装置所测定的中值粒径优选为0.05~50μm、更优选为0.1~40μm、进一步优选为0.5~30μm。若在此范围内,则容易将热传导性粒子均匀地分散在所述树脂膜中,且随着时间的推移,所述热传导性粒子也不会沉降、分离以及不均匀,因而优选。此外,相对于膜的厚度,其粒径优选为50%以下。若相对于膜的厚度,粒径优选为50%以下时,由于可以容易地将热传导性粒子均匀地分散在所述树脂膜中,从而可以更容易地获得平坦的膜,因而优选。
作为所述荧光体,可使用例如吸收来自将氮化物类半导体作为发光层的半导体发光二极管的光、且使其波长变化成不同波长的光的荧光体。作为这样的荧光体,可列举例如:主要通过Eu、Ce等镧类元素激活的氮化物类荧光体、氮氧化物类荧光体;主要通过Eu等镧类、Mn等过渡金属类元素激活的碱土卤素磷灰石荧光体、碱土金属硼酸卤素荧光体、碱土金属铝酸盐荧光体、碱土金属硅酸盐荧光体、碱土金属硫化物荧光体、稀土硫化物荧光体、碱土金属硫化镓酸盐荧光体、碱土金属碱土氮化硅类荧光体以及锗酸盐荧光体;主要通过Ce等镧类元素激活的稀土铝酸盐荧光体、稀土硅酸盐荧光体;主要通过Eu等镧类元素激活的Ca-Al-Si-O-N类氮氧化合物玻璃荧光体等。这些荧光体可以单独使用1种,也可以并用2种以上。作为具体例,虽能够示例以下的荧光体但并不限定于此。
作为主要通过Eu、Ce等镧类元素激活的氮化物类荧光体,可示例M2Si5N8:Eu、MSi7N10:Eu、M1.8Si5O0.2N8:Eu、M0.9Si7O0.1N10:Eu(M为选自Sr、Ca、Ba、Mg以及Zn中的一种以上)等。
作为主要通过Eu、Ce等镧类元素激活的氮氧化物类荧光体,可示例M2Si2N2:Eu(M为选自Sr、Ca、Ba、Mg以及Zn中的一种以上)等。
作为主要通过Eu等镧类元素、Mn等过渡金属类元素激活的碱土卤素磷灰石荧光体,可示例M5(PO4)3X:Z(M为选自Sr、Ca、Ba以及Mg中的一种以上,X为选自F、Cl、Br以及I的一种以上,Z为选自Eu和锰的一种以上)等。
作为主要通过Eu等镧类元素、Mn等过渡金属类元素激活的碱土金属硼酸卤素荧光体,可示例M2B5O9X:Z(M为选自Sr、Ca、Ba以及Mg中的一种以上。X为选自F、Cl、Br以及I中的一种以上,Z为选自Eu、Mn以及Eu和Mn的一种以上)等。
作为主要通过Eu等镧类元素、Mn等过渡金属类元素激活的碱土金属铝酸盐荧光体,可示例SrAl2O4:Z、Sr4Al14O25:Z、CaAl2O4:Z、BaMg2Al16O27:Z、BaMg2Al16O12:Z、BaMgAl10O17:Z(Z为选自Eu和Mn的一种以上)等。
作为主要通过Eu等镧类元素、Mn等过渡金属类元素激活的碱土金属硅酸盐荧光体,可示例(BaMg)Si2O5:Eu和(BaSrCa)2SiO4:Eu等。
作为主要通过Eu等镧类元素、Mn等过渡金属类元素激活的碱土金属硫化物荧光体,可示例(Ba、Sr、Ca)(Al、Ga)2S4:Eu等。
作为主要通过Eu等镧类元素、Mn等过渡金属类元素激活的稀土硫化物荧光体,可示例La2O2S:Eu、Y2O2S:Eu以及Gd2O2S:Eu等。
作为主要通过Eu等镧类元素、Mn等过渡金属类元素激活的碱土金属硫化镓酸盐荧光体,可示例MGa2S4:Eu(M为选自Sr、Ca、Ba、Mg以及Zn的一种以上)等。
作为主要通过Eu等镧类元素、Mn等过渡金属类元素激活的碱土金属氮化硅荧光体,可示例(Ca、Sr、Ba)AlSiN3:Eu、(Ca、Sr、Ba)2Si5N8:Eu以及SrAlSi4N7:Eu等。
作为主要通过Eu等镧类元素、Mn等过渡金属类元素激活的锗酸盐荧光体,可示例Zn2GeO4:Mn等。
作为主要通过Ce等镧类元素激活的稀土铝酸盐荧光体,可示例Y3Al5O12:Ce、(Y0.8Gd0.2)3Al5O12:Ce、Y3(Al0.8Ga0.2)5O12:Ce以及(Y、Gd)3(Al、Ga)5O12等YAG类荧光体等。另外,也可使用以Tb和Lu等取代Y的一部分或全部的Tb3Al5O12:Ce和Lu3Al5O12:Ce等。
作为主要通过Ce等镧类元素激活的稀土硅酸盐荧光体,可示例Y2SiO5:Ce和Tb等。
所述的Ca-Al-Si-O-N类氮氧化合物玻璃荧光体,其由摩尔%表示,是将CaCO3换算成CaO为20~50摩尔%、将Al2O3设为0~30摩尔%、将SiO设为25~60摩尔%、将AlN设为5~50摩尔%、将稀土氧化物或过渡金属氧化物设为0.1~20摩尔%、并且将5种成分的合计为100摩尔%的氮氧化合物玻璃作为母体材料的荧光体。需要说明的是,在将氮氧化合物玻璃作为母体材料的荧光体中,氮含量优选为15质量%以下。另外,优选在稀土氧化物的状态下含有除稀土氧化物离子以外的成为增敏剂的其它稀土元素离子,优选在荧光体中以0.1~10摩尔%的范围的含量含有稀土元素离子作为共激活剂。
作为其它荧光体,可列举ZnS:Eu等。另外,作为所述以外的硅酸盐类的荧光体,可列举(BaSrMg)3Si2O7:Pb、(BaMgSrZnCa)3Si2O7:Pb、Zn2SiO4:Mn以及BaSi2O5:Pb等。
另外,在所述荧光体中,替代Eu或除Eu之外,还可使用含有选自Tb、Cu、Ag、Au、Cr、Nd、Dy、Co、Ni以及Ti中的一种以上荧光体。
另外,如果是所述荧光体以外的荧光体、且是具有与上述同样的性能、效果的荧光体,也可作为无机粒子在本发明中使用。
对所述荧光体的特征没有特别限制,例如,可使用粉末状的荧光体。另外,对荧光体粉末的形状,没有特别限制,可列举例如:球形、鳞片状、片状、针状、棒状、椭圆形等。其中,优选为球形、鳞片状、片状,更优选为球形、片状。
作为所述荧光体的粒径没有特别限制,作为利用激光衍射法的粒度分布测定装置所测定的中值粒径,其优选为0.05~50μm、更优选为0.1~40μm、进一步优选为0.5~30μm。若在此范围内,则容易将荧光体均匀地分散在所述树脂膜中,且随着时间的推移,所述荧光体也不会沉降、分离以及不均匀,因而优选。此外,相对于膜的厚度,粒径优选为50%以下。若相对于膜的厚度,粒径优选为50%以下时,可以容易地将荧光体均匀地分散在所述树脂膜中,从而可以容易地获得平坦的膜,因而优选。
作为所述磁性粒子没有特别限制,其优选使用铁、钴以及镍等强磁性金属单质;不锈钢、Fe-Cr-Al-Si合金、Fe-Si-Al合金、Fe-Ni合金、Fe-Cu-Si合金、Fe-Si合金、Fe-Si-B(-Cu-Nb)合金、Fe-Si-Cr-Ni合金、Fe-Si-Cr合金以及Fe-Si-Al-Ni-Cr合金等磁性金属合金;赤铁矿(Fe2O3)、磁铁矿(Fe3O4)等金属氧化物;Mn-Zn类铁氧体、Ni-Zn类铁氧体、Mg-Mn类铁氧体、Zr-Mn类铁氧体、Ti-Mn类铁氧体、Mn-Zn-Cu类铁氧体、钡类铁氧体、锶类铁氧体等铁氧体类。
通过配合所述磁性粒子,可以对本发明的树脂组合物赋予磁性,从而成为在高频带区域具有高磁导率低损耗的树脂组合物。
作为所述磁性粒子的形状没有特别限制,可列举例如:球形、鳞片状、片状、针状、棒状、椭圆形、多孔形等。其中,优选为球形、鳞片状、椭圆形、片状、多孔形,更优选为球形、鳞片状、片状、多孔形。
在获得多孔形的磁性粒子的情况下,可以通过在造粒时添加碳酸钙等泡孔调整剂进行造粒、且进行烧成的方法来获得。另外,通过添加抑制在铁氧体化反应中的粒子生长的材料,可以在铁氧体内部形成复杂的空隙。作为这样的材料可列举氧化钽和氧化锆等。
作为所述磁性粒子的粒径没有特别限制,作为利用激光衍射法的粒度分布测定装置所测定的中值粒径,其优选为0.05~50μm、更优选为0.1~40μm、进一步优选为0.5~30μm。若在此范围内,则容易将磁性粒子均匀地分散在所述树脂膜中,且所述磁性粒子也不会随着时间的推移而沉降、分离以及不均匀,因而优选。此外,在加工成为膜状的情况下,相对于膜的厚度,粒径优选为50%以下。若相对于膜的厚度,粒径为50%以下时,可以容易地将磁性粒子均匀地分散在所述树脂膜中,从而可以容易地获得平坦的膜,因而优选。
为了提高面向反射等用途所需的白色度,从而配合了所述白色粒子。例如,作为白色颜料,可列举以二氧化钛和氧化钇为代表的稀土氧化物、硫酸锌、氧化锌以及氧化镁等。它们可以单独使用或并用多种。其中,为了进一步提高白色度,优选使用二氧化钛。该二氧化钛的晶胞具有金红石型、锐钛矿型以及板钛矿型,且可以使用它们中的任一种。但从二氧化钛的白色度和光催化活性的观点考虑,其优选使用金红石型。
作为所述白色粒子的形状没有特别限制,可列举例如:球形、鳞片状、片状、针状、棒状、椭圆形等。其中,优选为球形、椭圆形、片状,更优选为球形。
作为所述白色粒子的平均粒径没有特别限制,作为利用激光衍射法的粒度分布测定装置所测定的中值粒径,其平均粒径优选为0.05~5μm、其中更优选为3μm以下、进一步优选为1μm以下。此外,在加工成为膜状的情况下,相对于膜的厚度,粒径优选为50%以下。相对于膜的厚度,粒径为50%以下时,可以容易地将白色粒子均匀地分散在所述树脂膜中,从而可以容易地获得平坦的膜,因而优选。
为了提高与树脂的润湿性、相容性以及分散性、流动性,白色粒子优选为进行了表面处理后的白色粒子,更优选为用选自二氧化硅、氧化铝、氧化锆、多元醇以及有机硅化合物中的至少一种以上、特别是用其中两种以上处理剂进行了处理表面后的白色粒子。
另外,为了改善配合有所述白色粒子的树脂组合物的初始反射率,并提高流动性,优选用有机硅化合物处理后的二氧化钛。作为有机硅化合物的例子,可列举氯硅烷、硅氮烷、具有环氧基、氨基等反应性官能团的硅烷偶联剂等单体有机硅化合物、硅油、硅酮树脂等有机聚硅氧烷等。需要说明的是,可以使用如硬脂酸那样的有机酸等通常用于二氧化钛的表面处理的其它处理剂,也可用上述以外的处理剂进行表面处理,还可用多种处理剂进行表面处理。
作为中空粒子没有特别限制,可列举例如:二氧化硅中空球、碳中空球、氧化铝中空球、硅铝酸盐中空球等。
作为所述中空粒子的形状没有特别限制,可列举例如:球形、椭圆形、圆柱形、棱柱形等。其中,优选为球形、椭圆形、棱柱形,更优选为球形、棱柱形。
作为所述中空粒子的平均粒径没有特别限制,作为利用激光衍射法粒度分布测定装置所测定的中值粒径,其平均粒径优选为0.01~5μm、其中更优选为0.03~3μm、进一步优选为0.05~1μm。此外,相对于膜的厚度,粒径优选为50%以下。相对于膜的厚度,粒径为50%以下时,可以容易地将中空粒子均匀地分散在所述树脂膜中,从而可以容易地获得平坦的膜,因而优选。
通过配合所述中空粒子,从而能够容易地降低发明的树脂组合物的固化物的比重,并且还能够使其轻量化。
作为所述电磁波吸收粒子没有特别限制,可适用于以导电性粒子、碳粒子为代表的介电损耗性电磁波吸收材料、以铁氧体、软磁性金属粉末为代表的磁损耗性电磁波吸收材料等。
通过配合所述电磁波吸收粒子,能够对本发明的树脂组合物赋予电磁波吸收能力,且能够容易地获得具有电子设备的壳体等电磁波屏蔽性的树脂固化物。
作为介电损耗性电磁波吸收材料,可列举上述的金、银、铜、钯、铝、镍、铁、钛、锰、锌、钨、铂、铅、锡等金属单质、或者焊料、钢、不锈钢等导电性粒子,炭黑、乙炔黑、科琴黑、碳纳米管、石墨烯、富勒烯等碳粒子。其中,优选为炭黑、乙炔黑、科琴黑、碳纳米管、石墨烯、富勒烯。
作为介电损耗性电磁波吸收材料,可列举Mg-Zn类铁氧体、Ba2Co2Fe12O22、Ba2Ni2Fe12O22、Ba2Zn2Fe12O2、Ba2Mn2Fe12O22、Ba2Mg2Fe12O22、Ba2Cu2Fe12O22、Ba3Co2Fe24O41、BaFe12O19、SrFe12O19、BaFe12O19以及SrFe12O19等铁氧体粒子;羰基铁、电解铁、Fe-Cr类合金、Fe-Si类合金、Fe-Ni类合金、Fe-Al类合金、Fe-Co类合金、Fe-Al-Si类合金、Fe-Cr-Si类合金、Fe-Cr-Al类合金、Fe-Si-Ni类合金以及Fe-Si-Cr-Ni类合金等软磁性合金粒子等。其中,优选为选自Mg-Zn类铁氧体、Ba2Co2Fe12O22、Ba2Ni2Fe12O22、Ba2Zn2Fe12O2、Ba2Mn2Fe12O22、Ba2Mg2Fe12O22、Ba2Cu2Fe12O22、Ba3Co2Fe24O41、BaFe12O19、SrFe12O19、BaFe12O19以及SrFe12O19中的至少一种。
这些电磁波吸收粒子可以单独使用1种,也可以组合使用2种以上。
作为所述电磁波吸收粒子的形状没有特别限制,可列举例如:球形、鳞片状、片状、针状、棒状、椭圆形等。其中,优选为球形、鳞片状、椭圆形、棒状,更优选为球形、鳞片状、椭圆形。
作为所述电磁波吸收粒子的粒径没有特别限制,作为利用激光衍射法粒度分布测定装置所测定的中值粒径,优选为0.05~50μm、更优选为0.1~40μm、进一步优选为0.5~30μm以下。若在此范围内,则容易将电磁波吸收粒子均匀地分散在所述树脂膜中,且所述电磁波吸收粒子也不会随着时间的推移而沉降、分离以及不均匀,因而优选。此外,相对于膜的厚度,粒径优选为50%以下。相对于膜的厚度,粒径为50%以下时,可以容易地将电磁波吸收粒子均匀地分散在所述树脂膜中,从而可以容易平坦地将膜进行涂布,因而优选。
为了使树脂膜发挥出无机粒子的功能,重要的不是无机粒子的质量%,而是无机粒子的体积%,优选在树脂膜中尽可能地将无机粒子高填充。作为本发明的无机粒子的配合量,其特征为树脂膜整体的70~90体积%、优选为72~88体积%、更优选为75~85体积%。如果当该含量低于70体积%时,不能充分发挥无机粒子所具有的功能;当该含量高于90体积%时,树脂膜的固化物变脆且粘接力变弱。
[(d)固化催化剂]
本发明中使用的(d)成分为用于使马来酰亚胺树脂膜固化的催化剂。作为固化催化剂没有特别限制,可列举热自由基聚合引发剂、热阳离子聚合引发剂、热阴离子聚合引发剂、光聚合引发剂等。
作为热自由基聚合引发剂,可列举例如:甲乙酮过氧化物、甲基环己酮过氧化物、甲基乙酰乙酸过氧化物、乙酰丙酮过氧化物、1,1-双(叔丁基过氧化)3,3,5-三甲基环己烷、1,1-双(叔己基过氧化)环己烷、1,1-双(叔己基过氧化)3,3,5-三甲基环己烷、1,1-双(叔丁基过氧化)环己烷、2,2-双(4,4-二叔丁基过氧化环己基)丙烷、1,1-双(叔丁基过氧化)环十二烷、正丁基4,4-双(叔丁基过氧化)戊酸酯、2,2-双(叔丁基过氧化)丁烷、1,1-双(叔丁基过氧化)-2-甲基环己烷、叔丁基过氧化氢、对薄荷烷过氧化氢、1,1,3,3-四甲基丁基过氧化氢、叔己基过氧化氢、过氧化二枯基、2,5-二甲基-2,5-双(叔丁基过氧化)己烷、α,α’-双(叔丁基过氧化)二异丙苯、叔丁基异丙苯基过氧化物、过氧化二叔丁基、2,5-二甲基-2,5-双(叔丁基过氧化)己炔-3、过氧化异丁酰、3,5,5-三甲基己酰基过氧化物、辛酰基过氧化物、过氧化月桂酰、肉桂酸过氧化物、间甲苯酰过氧化物、苯甲酰基过氧化物、过氧化二碳酸二异丙酯、双(4-叔丁基环己基)过氧化二碳酸酯、二-3-甲氧基丁基过氧化二碳酸酯、二-2-乙基己基过氧化二碳酸酯、过氧化二碳酸二仲丁酯、二(3-甲基-3-甲氧基丁基)过氧化二碳酸酯、二(4-叔丁基环己基)过氧化二碳酸酯、α,α’-双(过氧化新癸酰基)二异丙苯、过氧化新癸酸异丙苯酯、过氧化新癸酸1,1,3,3-四甲基丁酯、过氧化新癸酸1-环己基-1-甲基乙酯、过氧化新癸酸叔己酯、过氧化新癸酸叔丁酯、过氧化特戊酸叔己酯、过氧化特戊酸叔丁酯、2,5-二甲基-2,5-双(2-乙基己酸过氧化)己烷、1,1,3,3-四甲基丁基过氧化-2-乙基己酸酯、1-环己基-1-甲基乙基过氧化-2-乙基己基酸酯、过氧化2-乙基己酸叔己酯、过氧化2-乙基己基酸叔丁酯、过氧化异丁酸叔丁酯、过氧化马来酸叔丁酯、过氧化十二烷酸叔丁酯、过氧化3,5,5-三甲基己基酸叔丁酯、叔丁基过氧化异丙基单碳酸酯、过氧化2-乙基己基单碳酸叔丁酯、2,5-二甲基-2,5-双(过氧化苯甲酰基)己烷、过氧化醋酸叔丁酯、过氧化苯甲酸叔己酯、过氧化叔丁基间甲苯酰基苯甲酸酯、过氧化苯甲酸叔丁酯、双(叔丁基过氧化)间苯二酸酯、过氧化叔丁基烯丙基单碳酸酯、3,3’,4,4’-四(叔丁基过氧化羰基)苯甲酮等有机过氧化物;2,2’-偶氮双(N-丁基-2-甲基丙酰胺)、2,2’-偶氮双(N-环己基-2-甲基丙酰胺)、2,2’-偶氮双[N-(2-甲基丙基))-2-甲基丙酰胺]、2,2’-偶氮双[N-(2-甲基乙基)-2-甲基丙酰胺]、2,2’-偶氮双(N-己基-2-甲基丙酰胺)、2,2’-偶氮双(N-丙基-2-甲基丙酰胺)、2,2’-偶氮双(N-乙基-2-甲基丙酰胺)、2,2’-偶氮双[2-甲基-N-(2-羟乙基)丙酰胺]、2,2’-偶氮双[N-(2-丙烯基)-2-甲基丙酰胺]、2,2’-偶氮双{2-甲基-N-1,1-双(羟甲基)-2-羟乙基]丙酰胺}、2,2’-偶氮双[N-(2-丙烯基)-2-甲基丙酰胺]、二甲基-1,1’-偶氮(1-环己烷羧酸酯)等偶氮化合物。优选为过氧化二枯基、过氧化二叔丁基、过氧化异丁酰、2,2’-偶氮双(N-丁基-2-甲基丙酰胺)以及2,2’-偶氮双[N-(2-甲基乙基)-2-甲基丙酰胺],更优选为过氧化二枯基、过氧化二叔丁基、过氧化异丁酰。
作为热阳离子聚合引发剂,可列举例如:(4-甲基苯基)[4-(2-甲基丙基)苯基]碘阳离子、(4-甲基苯基)(4-异丙基苯基)碘阳离子、(4-甲基苯基)(4-异丁基)碘阳离子、双(4-叔丁基)碘阳离子、双(4-十二烷基苯基)碘阳离子、(2,4,6-三甲基苯基)[4-(1-甲基乙酸乙醚)苯基]碘阳离子等芳香族碘盐;二苯基[4-(苯基硫)苯基]锍阳离子、三苯基锍阳离子、烷基三苯基锍阳离子等芳香族锍盐。其中,优选为(4-甲基苯基)[4-(2-甲基丙基)苯基]碘阳离子、(4-甲基苯基)(4-异丙基苯基)碘阳离子、三苯基锍阳离子、烷基三苯基锍阳离子,更优选为(4-甲基苯基)[4-(2-甲基丙基)苯基]碘阳离子、(4-甲基苯基)(4-异丙基苯基)碘阳离子。
作为热阴离子聚合引发剂,可列举例如:2-甲基咪唑、2-乙基咪唑、2-苯基咪唑、2-乙基-4-甲基咪唑、2-十一烷基咪唑、1-氰乙基-2-乙基-4-甲基咪唑等咪唑类;三乙胺、三乙二胺、2-(二甲氨基甲基)苯酚、1,8-二氮杂二环[5.4.0]十一碳烯-7、三(二甲氨基甲基)苯酚、苄基二甲胺等胺类;三苯基膦、三丁基膦、三辛基膦等膦类。其中,优选为2-甲基咪唑、2-乙基-4-甲基咪唑、三乙胺、三乙二胺、1,8-二氮杂二环[5.4.0]十一碳烯-7、三苯基膦、三丁基膦,更优选为2-乙基-4-甲基咪唑、1,8-二氮杂二环[5.4.0]十一碳烯-7、三苯基膦。
作为光聚合引发剂没有特别限制,可列举苯甲酮等苯甲酰基化合物(或二苯甲酮化合物),特别是在1-羟基己基酮、2-羟基-2-甲基-1-苯基丙烷-1-酮、1-(4-异丙基苯基)-2-羰基-2-甲基丙烷-1-酮等羟基的α-位的碳原子上具有羰基的苯甲酰基化合物(或二苯甲酮化合物);2-甲基-1-(4-甲基硫苯基)-2-甲基吗啉基丙-1-酮、2-苄基-2-二甲基氨基-1-(4-吗啉基苯基)-丁-1-酮、2-二甲基氨基-2-(4-甲基-苄基)-1-(4-吗啉基-4-苯基)-丁-1-酮等α-烷基氨基苯甲酮化合物;2,4,6-三甲基苯甲酰基二苯基氧化膦、双酰基单有机氧化膦、双(2,6-二氧基苯甲酰基)-2,4,4-三甲基戊基氧化膦等酰基氧化膦化合物;异丁基安息香醚等安息香醚化合物;苯乙酮二乙基缩酮等缩酮化合物;噻吨酮类化合物;苯乙酮类化合物等。
尤其是由于从UV-LED发出的放射线为单一波长,因此,在将UV-LED作为光源使用的情况下,使用在340~400nm区域内具有吸收光谱峰的α-烷基氨基酚化合物、酰基氧化膦化合物的光聚合引发剂为有效。
这些(d)成分可以单独使用1种,也可以并用2种以上。
(d)成分的含量没有特别限定,相对于树脂膜100质量份,(d)成分的含量为0.01~10质量份、优选为0.05~8质量份、更优选为0.1~5质量份。如果在该范围内,则能够使马来酰亚胺树脂膜充分地固化。
进一步,除上述(a)~(d)成分外,根据需要,本发明的马来酰亚胺树脂膜还可以含有粘接助剂、抗氧化剂、阻燃剂等。以下,对各成分进行说明。
[粘接助剂]
作为粘接助剂没有特别限制,可列举例如:正丙基三甲氧基硅烷、正丙基三乙氧基硅烷、正辛基三甲氧基硅烷、正辛基三乙氧基硅烷、苯基三甲氧基硅烷、苯基三乙氧基硅烷、苯基三乙氧基硅烷、甲基三甲氧基硅烷、甲基三乙氧基硅烷、2-[甲氧基(聚氧乙烯)丙基]-三甲氧基硅烷、甲氧基三(氧乙烯)丙基三甲氧基硅烷、3-氨基丙基三甲氧基硅烷、3-巯基丙基三甲氧基硅烷、3-氨基丙基三甲氧基硅烷、3-巯基丙基三甲氧基硅烷、3-(甲基丙烯酰氧基)丙基三甲氧基硅烷、3-异氰酸根合丙基三乙氧基硅烷、3-异氰酸根合丙基三甲氧基硅烷、环氧丙氧基丙基三甲氧基硅烷等硅烷偶联剂、异氰基尿酸三烯丙酯、三缩水甘油基异氰尿酸酯等异氰尿酸酯化合物等。
作为所述粘接助剂的含量没有特别限制,相对于树脂膜的树脂分量100质量份,优选为0.1~10质量份,更优选为0.5~8质量份、进一步优选为1~5质量份。若在该范围内,则不会改变所述树脂膜的物性,并能够进一步提高该树脂膜的粘接力。
[抗氧化剂]
作为抗氧化剂,没有特别限制,可列举例如:正十八烷基-3-(3,5-二叔丁基-4-羟基苯基)丙酸酯、正十八烷基-3-(3,5-二叔丁基-4-羟基苯基)乙酸酯、新十二烷基-3-(3,5-二叔丁基-4-羟基苯基)丙酸酯、十二烷基-β-(3,5-二叔丁基-4-羟基苯基)丙酸酯、乙基-α-(4-羟基-3,5-二叔丁基苯基)异丁酸酯、十八烷基-α-(4-羟基-3,5-二叔丁基苯基)异丁酸酯、十八烷基-α-(4-羟基-3,5-二叔丁基-4-羟基苯基)丙酸酯、2-(正辛基硫代)乙基-3,5-二叔丁基-4-羟基苯乙酸酯、2-(正辛基硫代)乙基-3,5-二叔丁基-4-羟基苯乙酸酯、2-(正十八烷基硫代)乙基-3-(3,5-二叔丁基-4-羟基苯基)丙酸酯、2-(2-硬脂酰氧基乙基硫代)乙基-7-(3-甲基-5-叔丁基-4-羟基苯基)庚酸酯、2-羟乙基-7-(3-甲基-5-叔丁基-4-羟基苯基)丙酸酯等酚类抗氧化剂;二月桂基-3,3'-硫代二丙酸酯、二肉豆蔻基-3,3’-硫代二丙酸酯、二硬脂基-3,3’-硫代二丙酸酯、双十三烷基-3,3’-硫代二丙酸酯、季戊四醇四(3-月桂基硫代丙酸酯)等硫类抗氧化剂;亚磷酸十三烷基酯、亚磷酸三苯酯、亚磷酸三(2,4-二叔丁基苯基)酯、亚磷酸2-乙基己基二苯基酯、二苯基亚磷酸十三烷基酯、2,2-亚甲基双(4,6-二丁基苯基)辛基亚磷酸、二亚磷酸二硬脂基季戊四醇酯、二亚磷酸双(2,6-二叔丁基-4-甲基苯基)季戊四醇酯、2-[[2,4,8,10-四(1,1-二甲基乙基)二苯并[d,f][1,3,2]二氧杂膦-6-基]氧基]-N,N-双[2-[[2,4,8,10-四(1,1-二甲基乙基)二苯并[d,f][1,3,2]二氧杂膦-6-基]氧基]-乙基]乙胺等磷类抗氧化剂。
作为所述抗氧化剂的含量没有特别限制,相对于树脂膜的树脂分量100质量份,优选为0.00001~5质量份,更优选为0.0001~4质量份、进一步优选为0.001~3质量份。如果所述抗氧化剂的量在该范围内,则不会改变所述树脂膜的机械物性,且能够防止该树脂膜的氧化。
[阻燃剂]
作为阻燃剂没有特别限制,可列举例如:磷类阻燃剂、金属水合物、卤素类阻燃剂等。可列举例如:红磷、磷酸一铵、磷酸二铵、磷酸三铵、聚磷酸铵等磷酸铵、磷酸酰胺等无机含氮磷化合物、磷酸、氧化膦、磷酸三苯酯、磷酸三甲苯酯、磷酸三二甲苯酯、磷酸甲苯二苯酯、磷酸甲苯基二-2,6-二甲苯酯、间苯二酚双(二苯基磷酸酯)、1,3-亚苯基双(二-2,6-二甲苯基磷酸酯)、双酚A-双(二苯基磷酸酯)、1,3-亚苯基双(二苯基磷酸酯)、苯基膦酸二乙烯酯、苯基膦酸二烯丙酯、苯基膦酸双(1-丁烯)酯、二苯基膦酸苯酯、二苯基膦酸甲酯、双(2-烯丙基苯氧基)磷腈、二甲酚磷腈等磷腈化合物;磷酸三聚氰胺;焦磷酸三聚氰胺;聚磷酸三聚氰胺、9,10-二羟基-9-氧杂-10-磷杂菲-10-氧化物、10-(2,5-二羟基苯基)-9,10-二羟基-9-氧杂-10-磷杂菲-10-氧化物等磷类阻燃剂、氢氧化铝水合物、氢氧化镁水合物等金属水合物、六溴苯、五溴甲苯、乙烯双(五溴苯基)、乙烯双四溴邻苯二甲酰亚胺、1,2-二溴-4-(1,2-二溴化乙基)环己烷、四溴环辛烷、六溴环十二烷、双(三溴苯氧基)乙烷、溴化聚亚苯基醚、溴化聚苯乙烯、2,4,6-三(三溴苯氧基)-1,3,5-三嗪等卤素类阻燃剂。
作为所述阻燃剂的含量没有特别限制,相对于树脂膜的树脂分量100质量份,优选为0.01~5质量份、更优选为0.05~4质量份、进一步优选为0.1~3质量份。如果所述阻燃剂的量在该范围内,则不会改变所述树脂膜的机械物性,且能够对该树脂膜赋予阻燃性。
[马来酰亚胺树脂膜]
作为将本发明的树脂膜成型的方法没有特别限制,可列举将构成所述树脂膜的马来酰亚胺树脂组合物(即,含有(a)成分、(b)成分、(c)成分以及(d)成分的马来酰亚胺树脂组合物)流延至具有脱模性的膜等上并进行刮浆(squeegee)的方法等。
此时,所述马来酰亚胺树脂组合物优选使用通过加热或溶剂稀释等方法使其低粘度化的组合物、更优选为含有后述的(e)有机溶剂的组合物。在用有机溶剂进行稀释的情况下,如果稀释后的组合物的触变比在1.0~3.0的范围内,则其加工性良好,因而优选,更优选为在1.0~2.5的范围内、进一步优选为1.0~2.0的范围内。需要说明的是,通过改变主轴的转速,并利用JIS K7117-1:1999中记载的旋转粘度计在25℃条件下测定粘度,通过以下计算式求出所述触变比。
触变比=(在1rpm下的粘度[Pa·s]/在10rpm下的粘度[Pa·s])
[(e)有机溶剂]
为了改善用于将马来酰亚胺树脂膜成型的马来酰亚胺树脂组合物的加工性,将(e)有机溶剂添加在马来酰亚胺树脂组合物中。
作为所述有机溶剂没有特别限定,只要能溶解并均匀地分散所述马来酰亚胺树脂组合物即可。具体而言,可列举甲苯、二甲苯、甲乙酮、甲基异丁基酮、环己酮、环戊酮、苯甲醚、二苯醚、乙酸丙酯、乙酸丁酯等,其中,优选使用二甲苯、环己酮、环戊酮、苯甲醚、乙酸丁酯等。
在稀释包含作为树脂膜成分的(a)成分~(d)成分的所述马来酰亚胺树脂组合物时,对所述(e)成分的用量进行最优化,使得稀释后的所述组合物的所述触变比在1.0~3.0的范围内,相对于所述(a)成分~(d)成分的总量100质量份,其优选为2~40质量份、更优选为3~30质量份。
另外,也可以将对于本发明的马来酰亚胺树脂膜具有脱模性的树脂膜设置在该马来酰亚胺树脂膜上。根据绝缘性树脂的种类,使具有脱模性的树脂膜最优化,具体而言,可列举涂布了氟树脂后的PET(聚对苯二甲酸乙二醇酯)膜、涂布了硅酮树脂后的PET膜、PTFE(聚四氟乙烯)、ETFE(聚(乙烯-四氟乙烯))、CTFE(聚氯三氟乙烯)等氟类树脂膜等。通过该树脂膜,容易处理马来酰亚胺树脂膜且能够防止如尘埃等异物的附着。
本发明的马来酰亚胺树脂膜的厚度优选为1μm~2000μm、更优选为1μm~500μm、进一步优选为10μm~300μm。在马来酰亚胺树脂膜的厚度比1μm薄的情况下,难以使其附着到基板等上,在马来酰亚胺树脂膜的厚度比2000μm厚的情况下,难以保持作为膜的柔软性。另外,作为膜的厚度,其优选为(c)成分的无机粒子的粒径的2倍以上、更优选为(c)成分的无机粒子的粒径的3倍以上、进一步优选为(c)成分的无机粒子的粒径的5倍以上1000倍以下。马来酰亚胺树脂膜的厚度在此范围内时,无机粒子不易在膜上形成凸凹,因而优选。
需要说明的是,作为本发明的马来酰亚胺树脂膜的使用方法,可列举在配置具有脱模性的树脂膜的情况下将其剥离后,将该马来酰亚胺树脂膜夹在基板等与半导体等之间,并进行热压使其固化的方法等。作为加热时的温度,优选在100℃~300℃条件下加热10分钟~4小时、更优选在120℃~250℃条件下加热20分钟~3小时、进一步优选在150℃~200℃条件下加热30分钟~2小时。作为压接时的压力,优选为0.01MPa~100MPa、更优选为0.05MPa~80MPa、进一步优选为0.1MPa~50MPa。
实施例
以下,示出合成例、实施例以及比较例,并对本发明更详细地进行说明,但本发明并不限于以下的实施例。
马来酰亚胺(a-1)
下述通式表示的马来酰亚胺化合物(BMI-3000:Designer Molecules Inc.制造)(分子量4000)
马来酰亚胺(a-2)
下述通式表示的马来酰亚胺化合物(BMI-2500:Designer Molecules Inc.制造)(分子量3500)
马来酰亚胺(a-3)
下述通式表示的马来酰亚胺化合物(BMI-1500:Designer Molecules Inc.制造)(分子量2100)
马来酰亚胺(a-4)
252g(1.0mol)的Kayahard AA(日本化药股份有限公司制造)和207g(0.9mol)均苯四酸酐添加在350g的N-甲基吡咯烷酮中,并将混合物在室温条件下搅拌3小时,然后在120℃条件下搅拌了3小时。向得到的溶液中加入196g(2.0mol)的马来酸酐、82g(1.0mol)的乙酸钠以及204g(2.0mol)的乙酸酐,并将混合物在80℃条件下搅拌了1小时。此后,向该反应溶液中加入500g甲苯,将其进一步用水洗涤并脱水后,减压蒸馏去除溶剂,从而得到了下述通式表示的双马来酰亚胺(a-4)(分子量1800)。
马来酰亚胺(a-5)
下述通式表示的双马来酰亚胺化合物(BMI-2300、大和化成股份有限公司制造)(分子量400)
(a-6)环氧树脂“jER-828EL”(三菱化学股份有限公司制造)
(a-7)有机硅树脂“LPS-3412”(信越化学工业股份有限公司制造)
(b-1)下述通式表示的丙烯酸酯(KAYARAD R-684(日本化药股份有限公司制造))
(b-2)甲基丙烯酸环己酯(轻酯(LIGHT ESTER)CH(共荣社化学股份有限公司制造))
(b-3)丙烯酸异冰片酯(大阪有机化学工业股份有限公司制造)
(b-4)丙烯酸叔丁酯(大阪有机化学工业股份有限公司制造)
(c-1)矾土(氧化铝)“AC-9204”(Admatechs股份有限公司制造,平均粒径10μm,密度3.9g/cm3)
(c-2)矾土氧化铝)“AO-502”(Admatechs股份有限公司制造,平均粒径0.7μm,密度3.9g/cm3)
(c-3)氮化硼“SGPS”(Denka股份有限公司制造,平均粒径12μm,密度2.3g/cm3)
(c-4)银“Ag-HWQ”(福田金属箔粉工业股份有限公司制造,平均粒径5μm,密度10g/cm3)
(c-5)黄色荧光体YAG(三菱化学股份有限公司制造,平均粒径2μm,密度3.9g/cm3)
(c-6)Fe-Cr-Al合金(山阳特殊制钢股份有限公司制造,平均粒径4μm,密度7.9g/cm3)
(c-7)Ba2Co2Fe12O22铁氧体(信越化学工业股份有限公司制造,平均粒径6μm,密度4.1g/cm3)
(c-8)氧化钛“CR-90”(石原产业股份有限公司制造,平均粒径0.25μm,密度4.2g/cm3)
(c-9)中空二氧化硅“Silinax”(日铁矿业股份有限公司制造,平均粒径0.1μm,密度0.05g/cm3)
(d-1)过氧化二枯基“Park Mill D”(由日油股份有限公司制造)
(d-2)三苯基膦(由岸田化学株式会社制造)
[实施例1]
将80g马来酰亚胺(a-1)、19g(b-1)、1g(d-1)以及200g二甲苯混合并溶解,且进一步添加1000g(c-3),然后将其混合物放入在搅拌机THINKY CONDITIONING MIXER((Shinky股份有限公司制造)中搅拌3分钟进行消泡,从而制备了马来酰亚胺树脂组合物。使用自动涂布装置PI-1210(Tester产业股份有限公司制造),将所述马来酰亚胺组合物涂布在ETFE(乙烯-四氟乙烯)膜上,从而成型了具有长度150mm×宽度150mm×厚度50μm的膜状。然后,通过在100℃条件下加热30分钟使二甲苯挥发,并在25℃条件下制备了长度150mm×宽度150mm×厚度60μm的固体状的膜。
[实施例2~9、比较例1~18]
在实施例2~9、比较例1~16中,以表1所示的组成与实施例1同样地制备了马来酰亚胺树脂组合物,并以表1所示的膜厚制备了膜。在比较例17中,使用(a-6)制备了环氧树脂组合物。在比较例18中,使用(a-7)制备了有机硅树脂组合物。需要说明的是,在(a-7)中已经含有固化催化剂。在比较例16、17以及18中,由于树脂与无机粒子之间的相容性差,从而该组合物的触变性增大,导致不能形成膜。因此,对比较例16、17以及18中的膜未能进行以下的评价。
[涂膜前的触变比]
对上述实施例1~9和比较例1~18进行了组合物的触变比的测定。所述测定通过改变主轴的转速并利用JIS K 7117-1:1999中记载的旋转粘度计测定了在25℃条件下的粘度,通过以下公式计算出触变比。将结果记载于表1-1、1-2。
触变比=(转速为1rpm下的粘度[Pa·s]/转速为10rpm下的粘度[Pa·s])
[相对介电常数、介电损耗角正切测定]
使用60mm×60mm×厚度0.1mm的模具框,分别夹持实施例1~9和比较例1~15中得到的未固化膜,并在180℃条件下热压1小时,从而制备了试样。将网络分析仪(KeysightTechnologies,Inc.制E5063-2D5)与条状线(Keycom股份有限公司制备)进行连接,对已制备的固化物进行了相对介电常数和介电损耗角正切的测定。将结果记载于表2~7。
[粘接力的测定]
将在实施例1~9和比较例1~15中制备的膜贴附在20mm×20mm的硅晶片上,并且从上按压切割为20mm×20mm的硅晶片,并对它们进行热固化(180℃×1小时)。然后,使用粘接力测定装置(NordsonAdvanced Technology Co.,Ltd制造的Universal Bond TesterSeries 4000(DS-100)),测定了在从晶片的侧面撕裂开时的粘接力(剪切力测试)。将其结果记载于表2~7。
[密度测定]
通过将在实施例1~9和比较例1~15中获得的未固化膜折叠并压制,并在180℃下加热1小时使其固化,从而制备了直径为50mm×厚度为3mm的圆盘状固化物。将该圆盘状固化物作为试验片,依据JIS K7112:1999标准,使用AD-1653(A&D Co.,Ltd制造)测定了在23℃条件下的密度。将其结果记载于表2~7。
[热传导率测定]
在作为成分(c)使用(c-1)~(c-4)的实施例1~4和比较例1~5中,将其所得到的未固化膜进行折叠并压制,并在180℃条件下加热1小时使其硬化后,冲压打孔成直径1cm、厚度2mm的圆盘状,并将其整体用炭黑涂覆。将上述用炭黑涂覆的圆盘状固化膜作为试验片,依据JIS R 1611:2010标准,使用激光闪光法(LFA 447Nanoflash Netchgeleidevau公司制造)测定了热传导率。将其结果示于以下的表2。
表2
[亮度测定]
将使用(c-5)作为(c)成分的实施例5、比较例6以及比较例7中获得的未固化膜夹持在2片ETFE膜之间,使用热压机在80℃、5t的压力条件下进行5分钟压缩成型,从而得到了成型为厚度50μm的片状的组合物片。将得到的组合物片与ETFE膜一起切断为晶片尺寸,将其小片化。剥离所得到的片的单侧的ETFE膜,以使露出的组合物侧与LED晶片相接触的方式置于GaN类倒装晶片型LED晶片上之后,再去除另一个ETFE膜。接下来,在180℃条件下加热成型30分钟,从而形成固化在LED晶片上的含荧光体树脂层。对如此获得的倒装晶片型LED装置通电100mA,以使LED发光,并通过大塚电子股份有限公司制造的LED光学特性监测器(LE-3400)测定了亮度。在三个LED装置上进行该测定,得到了其平均值。将其结果记载在表3。
表3
[矫顽力测定]
通过将使用(c-6)作为(c)成分的实施例6、比较例8以及比较例9中得到的未固化的膜折叠并压制,在180℃条件下加热1小时使其固化,从而制备了长度3cm×宽度4cm×厚度1mm的组合物片。使用振动样品磁强计(VSM-C7,东英工业股份有限公司制造),对所得到的组合物片的矫顽力进行了测定。将其结果记载在表4。
表4
[电磁波吸收特性评价]
通过将使用(c-7)作为(c)成分的实施例7、比较例10以及比较例11中得到的未固化膜折叠并压制,在180℃条件下加热1小时使其固化,从而制备了长度3cm×宽度4cm×厚度100μm的组合物片。使用作为发射器和检测器的网络分析仪(8722D,Agilent TechnologyCo.,Ltd.制造),并使用天线(CC28S,Keycom Co.,Ltd.制造)、透镜(LAS-140B,Keycom Co.,Ltd.制造),从而计算出了在频率37GHz下的吸收率。将结果记载在表5。
表5
[光反射率测定]
通过将使用(c-8)作为(c)成分的实施例8、比较例12以及比较例13中得到的未固化膜进行折叠并压制,在180℃条件下加热1小时使其固化,从而制备了直径50mm×厚度3mm的圆盘型固化物。使用X-rite 8200(SDG Co.,Ltd.制造)测定了在450nm下的光反射率。将结果记载在表6。
表6
将含有(c-9)中空二氧化硅作为(c)成分的实施例9、比较例14以及比较例15的膜的各评价结果记载在表7。
表7
在实施例1~4中,能够制备具有高热传导率且具有充分的粘接力的马来酰亚胺树脂膜。在实施例5~9中,能够高度填充无机粒子且能够制备具有充分的粘接力的马来酰亚胺树脂膜。
在比较例1中,由于无机粒子的量不充分,从而导致热传导率为低值。在比较例2中,由于无机粒子的量过多,从而导致所制备的膜变脆且粘接力为低值。比较例3中,由于不含有作为(b)成分的碳原子数为10以上的(甲基)丙烯酸酯,从而导致其粘接力为低值。在比较例4、5中,由于作为(b)成分的(甲基)丙烯酸酯的碳原子数为7,从而导致其粘接力为低值。在比较例6中,由于荧光体粒子的量不充分,从而导致其亮度为低值。在比较例7中,由于荧光体粒子的量过多,从而导致所制备的膜变脆且粘接力为低值。在比较例8中,由于磁性粒子的量不充分,从而导致其矫顽力为低值。在比较例9中,由于磁性粒子的量过多,从而导致所制备的膜变脆且粘接力为低值。在比较例10中,由于电磁波吸收粒子的量不充分,从而导致其吸收率为低值。在比较例11中,由于电磁波吸收粒子的量过多,从而导致所制备的膜变脆且粘接力为低值。在比较例12中,由于白色粒子的量不充分,从而导致反射率为低值。在比较例13中,由于白色粒子的量过多,从而导致所制备的膜变脆且粘接力为低值。在比较例14中,由于中空粒子的量不充分,从而导致相对介电常数和介电损耗角正切为高值。在比较例15中,由于中空粒子的量过多,从而导致所制备的膜变脆且粘接力为低值。在比较例16、17以及18中,由于树脂与无机粒子之间的相容性差,从而导致其触变比变大,不能涂敷为膜状。
由以上可知,本发明的马来酰亚胺树脂膜可以通过特定的组成将无机粒子高填充,且具有与无机粒子的特性相应的各种功能性,并且粘接力也优异。
需要说明的是,本发明并不限于上述实施方式。上述实施方式为例示,具有与在本发明的权利要求的范围中所记载的技术性思想实质上相同的构成、且发挥相同的作用效果的实施方式也均包含在本发明的技术范围内。
Claims (11)
3.根据权利要求1所述的马来酰亚胺树脂膜,其中,
(b)成分的碳原子数10以上的(甲基)丙烯酸酯具有1个以上碳原子数5以上的脂肪族环。
4.根据权利要求1所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自导电性粒子、热传导性粒子、荧光体、磁性粒子、白色粒子、中空粒子以及电磁波吸收粒子中的至少一种。
5.根据权利要求1所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自金、银、铜、钯、铝、镍、铁、钛、锰、锌、钨、铂、铅或锡的金属单质、或者焊料、钢或不锈钢的合金中的至少一种导电性粒子。
6.根据权利要求1所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自氮化硼、氮化铝、氮化硅、氧化铍、氧化镁、氧化锌、氧化铝、碳化硅、金刚石以及石墨烯中的至少一种热传导性粒子。
7.根据权利要求1所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自铁、钴、镍、不锈钢、Fe-Cr-Al-Si合金、Fe-Si-Al合金、Fe-Ni合金、Fe-Cu-Si合金、Fe-Si合金、Fe-Si-B(-Cu-Nb)合金、Fe-Si-Cr-Ni合金、Fe-Si-Cr合金、Fe-Si-Al-Ni-Cr合金、Fe2O3、Fe3O4、Mn-Zn类铁氧体、Ni-Zn类铁氧体、Mg-Mn类铁氧体、Zr-Mn类铁氧体、Ti-Mn类铁氧体、Mn-Zn-Cu类铁氧体、钡铁氧体以及锶铁氧体中的至少一种磁性粒子。
8.根据权利要求1所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自二氧化钛、氧化钇、硫酸锌、氧化锌以及氧化镁中的至少一种白色粒子。
9.根据权利要求1所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自二氧化硅中空球、碳中空球、氧化铝中空球、硅酸铝中空球以及氧化锆中空球中的至少一种中空粒子。
10.根据权利要求1所述的马来酰亚胺树脂膜,其中,
(c)成分的无机粒子为选自炭黑、乙炔黑、科琴黑、碳纳米管、石墨烯、富勒烯、羰基铁、电解铁、Fe-Cr类合金、Fe-Al类合金、Fe-Co类合金、Fe-Cr-Al类合金、Fe-Si-Ni类合金、Mg-Zn类铁氧体、Ba2Co2Fe12O22、Ba2Ni2Fe12O22、Ba2Zn2Fe12O22、Ba2Mn2Fe12O22、Ba2Mg2Fe12O22、Ba2Cu2Fe12O22、Ba3Co2Fe24O41、BaFe12O19、SrFe12O19、BaFe12O19以及SrFe12O19中的至少一种电磁波吸收粒子。
11.一种马来酰亚胺树脂膜用组合物,其为构成权利要求1所述的马来酰亚胺树脂膜的马来酰亚胺树脂组合物,
该组合物进一步含有(e)有机溶剂,所述树脂组合物在25℃条件下的触变比为1.0~3.0。
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CN115957764B (zh) * | 2023-01-13 | 2024-02-27 | 成都理工大学 | 一种用于乙酸自热重整制氢的镍掺杂钡铁氧体催化剂 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010082658A1 (ja) * | 2009-01-19 | 2010-07-22 | 味の素株式会社 | 樹脂組成物 |
CN102585760A (zh) * | 2004-03-19 | 2012-07-18 | 住友电木株式会社 | 树脂组合物及采用该树脂组合物制作的半导体装置 |
CN106029803A (zh) * | 2014-02-24 | 2016-10-12 | 汉高知识产权控股有限责任公司 | 导热性预涂底部填充配制物及其用途 |
JP2017031341A (ja) * | 2015-08-03 | 2017-02-09 | 京セラ株式会社 | 半導体接着用熱硬化型樹脂組成物及びそれを用いた半導体装置 |
JP2017197616A (ja) * | 2016-04-26 | 2017-11-02 | Jnc株式会社 | 熱硬化性樹脂組成物、およびその硬化物を利用した電子デバイス |
WO2018181697A1 (ja) * | 2017-03-29 | 2018-10-04 | 京セラ株式会社 | 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4113978B2 (ja) * | 1998-11-17 | 2008-07-09 | Dic株式会社 | マレイミド誘導体を含有する活性エネルギー線硬化性樹脂組成物 |
JP3521781B2 (ja) | 1999-01-11 | 2004-04-19 | 信越化学工業株式会社 | 放熱部材 |
TW201929618A (zh) | 2015-01-13 | 2019-07-16 | 日商日立化成股份有限公司 | 柔性印刷電路板用樹脂膜、帶樹脂的金屬箔、覆蓋層膜、接合片及柔性印刷電路板 |
CN108291122B (zh) | 2015-08-08 | 2021-01-05 | 设计分子有限公司 | 阴离子可固化组合物 |
CN108291076A (zh) | 2015-12-24 | 2018-07-17 | 株式会社钟化 | 树脂组合物、使用了其的半固化性热传导膜、电路基板和粘接片 |
EP3419399B1 (en) | 2016-04-11 | 2020-08-26 | Sekisui Polymatech Co., Ltd. | Heat conductive sheet |
EP3499561A4 (en) | 2016-08-08 | 2020-04-15 | Sekisui Chemical Co., Ltd. | HEAT TRANSFER SHEET AND PROCESS FOR PRODUCING THE SAME |
TW202229456A (zh) | 2016-09-26 | 2022-08-01 | 日商昭和電工材料股份有限公司 | 樹脂組成物、半導體用配線層積層體及半導體裝置 |
JP2018083893A (ja) | 2016-11-24 | 2018-05-31 | 日立化成株式会社 | 封止材用固形樹脂組成物及びそれを用いた再配置ウエハー、半導体パッケージ、その製造方法 |
JP2018087299A (ja) | 2016-11-29 | 2018-06-07 | 日立化成株式会社 | エポキシ樹脂組成物、エポキシ樹脂組成物の硬化物、及び電子部品装置 |
JP7196384B2 (ja) * | 2017-09-06 | 2022-12-27 | 大日本印刷株式会社 | ポリイミドフィルム、光学フィルムおよび画像表示装置 |
EP3868837A4 (en) * | 2018-10-19 | 2021-12-08 | Mitsubishi Gas Chemical Company, Inc. | COMPOSITION OF THERMOSETTING RESIN, PRE-IMPREGNATED, RESIN SHEET, LAMINATE SHEET CLAD WITH METAL SHEET, AND PRINTED CIRCUIT BOARD |
JP2020169291A (ja) * | 2019-04-05 | 2020-10-15 | 信越化学工業株式会社 | スラリー組成物、該スラリー組成物の硬化物、該硬化物を用いた基板、フィルム、及びプリプレグ |
JP2021025053A (ja) * | 2019-08-01 | 2021-02-22 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
-
2019
- 2019-09-03 JP JP2019160513A patent/JP7115445B2/ja active Active
-
2020
- 2020-07-30 TW TW109125763A patent/TW202111003A/zh unknown
- 2020-08-11 US US16/990,310 patent/US20210061955A1/en not_active Abandoned
- 2020-08-31 KR KR1020200109874A patent/KR20210028120A/ko unknown
- 2020-09-02 CN CN202010908139.1A patent/CN112442272A/zh active Pending
-
2022
- 2022-05-02 US US17/734,876 patent/US20220267526A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102585760A (zh) * | 2004-03-19 | 2012-07-18 | 住友电木株式会社 | 树脂组合物及采用该树脂组合物制作的半导体装置 |
WO2010082658A1 (ja) * | 2009-01-19 | 2010-07-22 | 味の素株式会社 | 樹脂組成物 |
CN106029803A (zh) * | 2014-02-24 | 2016-10-12 | 汉高知识产权控股有限责任公司 | 导热性预涂底部填充配制物及其用途 |
JP2017031341A (ja) * | 2015-08-03 | 2017-02-09 | 京セラ株式会社 | 半導体接着用熱硬化型樹脂組成物及びそれを用いた半導体装置 |
JP2017197616A (ja) * | 2016-04-26 | 2017-11-02 | Jnc株式会社 | 熱硬化性樹脂組成物、およびその硬化物を利用した電子デバイス |
WO2018181697A1 (ja) * | 2017-03-29 | 2018-10-04 | 京セラ株式会社 | 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114945625A (zh) * | 2020-01-16 | 2022-08-26 | 琳得科株式会社 | 树脂片 |
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JP7115445B2 (ja) | 2022-08-09 |
US20220267526A1 (en) | 2022-08-25 |
US20210061955A1 (en) | 2021-03-04 |
TW202111003A (zh) | 2021-03-16 |
JP2021038318A (ja) | 2021-03-11 |
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