CN112384546A - 导热性树脂组合物 - Google Patents
导热性树脂组合物 Download PDFInfo
- Publication number
- CN112384546A CN112384546A CN201980044517.1A CN201980044517A CN112384546A CN 112384546 A CN112384546 A CN 112384546A CN 201980044517 A CN201980044517 A CN 201980044517A CN 112384546 A CN112384546 A CN 112384546A
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- Prior art keywords
- resin composition
- thermally conductive
- epoxy compound
- curing agent
- conductive resin
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 66
- 239000004593 Epoxy Substances 0.000 claims abstract description 81
- 150000001875 compounds Chemical class 0.000 claims abstract description 62
- 150000001412 amines Chemical class 0.000 claims abstract description 56
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 47
- 239000011231 conductive filler Substances 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 125000000355 1,3-benzoxazolyl group Chemical group O1C(=NC2=C1C=CC=C2)* 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 229910052582 BN Inorganic materials 0.000 claims description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- UMGYJGHIMRFYSP-UHFFFAOYSA-N 2-(4-aminophenyl)-1,3-benzoxazol-5-amine Chemical group C1=CC(N)=CC=C1C1=NC2=CC(N)=CC=C2O1 UMGYJGHIMRFYSP-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
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- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
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- 238000009835 boiling Methods 0.000 claims description 3
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
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- 229910052759 nickel Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
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- -1 bisphenol a Chemical class 0.000 description 12
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- 239000003960 organic solvent Substances 0.000 description 7
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- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 5
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- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 3
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- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
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- PMJNNCUVWHTTMV-UHFFFAOYSA-N [1,3]oxazolo[5,4-f][1,3]benzoxazole Chemical compound C1=C2OC=NC2=CC2=C1N=CO2 PMJNNCUVWHTTMV-UHFFFAOYSA-N 0.000 description 3
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- 229940126214 compound 3 Drugs 0.000 description 3
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Abstract
本发明提供一种可形成粘合性和热导率高的固化物的树脂组合物。本发明的树脂组合物,其特征在于:含有环氧化合物(A)、胺固化剂(B)和导热性填料(C);所述环氧化合物(A)为液状,所述胺固化剂(B)包含苯并恶唑骨架。
Description
技术领域
本发明涉及导热性优良的树脂组合物、使用该树脂组合物的导热固化物以及电子部件。
背景技术
近年来,由于电子部件的小型化和高密度化,每单位体积的发热密度增加,因而,需要提高粘合各构成部件的导热粘合剂的热导率。对于导热粘合剂的热导率提高,可举出填充高导热性填料的方法。例如,专利文献1中,通过混合高导热性填料并控制该填料的粒径和形状,实现了固化物的高热导率化。
然而,如果在环氧化合物单体中大量混合导热性填料以提高热导率时,树脂组合物的粘度显著增加,从而导致操作性恶化和粘合力下降这样的问题。
由此,由导热性填料的高填充化所引起的高热导率化存在界限,因而,需要通过增加作为基质(matrix)的环氧树脂本身的导热性来提高固化物的热导率。
例如,专利文献2中,记载了通过双酚型环氧树脂和包含各种液晶元(mesogen)骨架的环氧树脂来改善热导率的方法。
现有技术文献
专利文献
专利文献1:日本特开2015-174906号公报
专利文献2:日本特开平11-323162号公报
发明内容
发明要解决的问题
然而,专利文献2记载的方法中,单体的环氧树脂组合物自身的粘度增加,因而,在添加了导热性填料的情况下,需要添加溶剂使其低粘度化。因此,作为粘合剂的处理性恶化。另外,固化物的热导率和粘合力未达到足够的值,因而,需要进一步提高。
本发明是鉴于以上现有技术问题而创造的;本发明提供用于形成导热性优良的粘合层的树脂组合物、使用该树脂组合物的导热固化物以及电子部件。
解决问题的手段
本发明人经专心研究,其结果发现,通过以下所示的手段可解决上述问题,从而完成了本发明。即,本发明是由以下所构成的。
一种树脂组合物,其特征在于:含有环氧化合物(A)、胺固化剂(B)和导热性填料(C);所述环氧化合物(A)为液状,所述胺固化剂(B)包含苯并恶唑骨架。
所述树脂组合物,优选25℃和5rpm下的粘度为10Pa·s~300Pa·s的树脂组合物。
导热性填料(C),优选自由氧化铝、氧化镁、氧化锌、氮化硼、氮化铝、氮化硅、钛酸钡、碳化硅、碳、金刚石、银、金、铜、镍和铝构成的群中的至少一种。另外,导热性填料(C)优选为球状,并且导热性填料(C)的含量优选相对于树脂组合物总体积为40体积%~75体积%。
胺固化剂(B)优选为5-氨基-2-(对氨基苯基)苯并恶唑。
相对于全部环氧化合物(A),含量为10重量%以上的作为环氧化合物(A)的三官能以上的环氧化合物。
环氧化合物(A)与胺固化剂(B)的质量比优选为(A)/(B)=90/10~60/40。另外,所述树脂组合物优选不包含沸点为200℃以下的化合物。
一种导热粘合剂或电子部件,其特征在于包含所述树脂组合物。
发明效果
本发明的树脂组合物可形成维持有粘合性的同时并具有高热导率的固化物。另外,使用本发明树脂组合物的电子部件也具有优良的导热性。
具体实施方式
<环氧化合物(A)>
用于本发明的环氧化合物(A)需要在室温(25℃)下为液状。优选即使在10℃以下也为液状,更优选在0℃以下也为液状。由于环氧化合物(A)为液状,因而,可提高树脂组合物的导热性。然而,下限并没有特别限定,在工业上为-20℃以上,就足够了。
作为环氧化合物(A),只要在室温(25℃)下为液状,就没有特别限定,例如,可举出:通过将双酚A、双酚F、双酚AD、双酚S、四甲基双酚A、四甲基双酚F、四甲基双酚AD、四甲基双酚S、四溴双酚A、四氯双酚A和四氟双酚A等双酚类进行缩水甘油基化而形成的双酚型环氧化合物;通过将联苯二酚、二羟基萘和9,9-二(4-羟基苯基)芴等二元酚类进行缩水甘油基化而形成的环氧化合物;通过将1,1,1-三(4-羟基苯基)甲烷、4,4-(1-(4-(1-(4-羟基苯基)-1-甲基乙基)苯基)亚乙基)双酚等三酚类进行缩水甘油基化而形成的环氧化合物;通过将1,1,2,2-四(4-羟基苯基)乙烷等四酚类进行缩水甘油基化而形成的环氧化合物;通过将苯酚酚醛清漆、甲酚酚醛清漆、双酚A酚醛清漆、溴化苯酚酚醛清漆和溴化双酚A酚醛清漆等酚醛清漆类进行缩水甘油基化而形成的酚醛清漆型环氧化合物;通过将邻苯二酚、间苯二酚、对苯二酚和苯三酚等多元酚类进行缩水甘油基化而形成的环氧化合物;通过将甘油、聚乙二醇等多元醇进行缩水甘油基化而形成的脂肪族醚型环氧化合物;通过将对羟基苯甲酸和β-羟基萘甲酸等羟基羧酸进行缩水甘油基化而形成的醚酯型环氧化合物;通过将邻苯二甲酸和对苯二甲酸等多元羧酸进行缩水甘油基化而形成的酯型环氧化合物;4,4-二氨基二苯甲烷、间苯二甲胺和氨基苯酚等胺化合物的缩水甘油化物;异氰脲酸三缩水甘油酯等胺型环氧化合物等的缩水甘油型环氧化合物;以及3,4-环氧环己基甲基-3',4'-环氧环己烷甲酸酯等脂环族环氧化合物等。这些可单独使用或将两种以上并用。其中,从固化物的粘合性和耐热性优良方面来看,优选:通过将双酚A进行缩水甘油基化而形成的环氧化合物、通过将双酚F进行缩水甘油基化而形成的环氧化合物、氨基酚型环氧化合物、间苯二甲胺型环氧化合物或苯酚酚醛清漆型环氧化合物。
环氧化合物(A)的粘度并没有特别限定,但优选在0.1Pa·s~20Pa·s的范围内,更优选在0.5Pa·s~15Pa·s的范围内,进一步优选在1Pa·s~10Pa·s的范围内。当环氧化合物(A)的粘度小于0.1Pa·s时,在树脂组合物固化前,环氧树脂可能会渗出;而当环氧化合物(A)的粘度超过20Pa·s时,树脂组合物的粘度变得过高,可能会变得难以处理。
当环氧化合物(A)的总量为100质量%时,优选含有10质量%以上的一分子中具有三官能(具有三个环氧基)以上的多官能环氧化合物。该含量更优选为20质量%以上,进一步优选为30质量%以上。通过含有10质量%以上的三官能以上的多官能环氧化合物,可提高交联密度,并能进一步提高热导率。作为三官能以上的多官能环氧化合物,优选为间苯二甲胺型环氧化合物或氨基酚型环氧化合物。这些多官能环氧化合物可单独使用或将两种以上并用。
<胺固化剂(B)>
本发明中所使用的胺固化剂(B)需要包含苯并恶唑骨架。胺固化剂(B)与在室温下为液状的环氧化合物反应,形成环氧树脂固化物。胺固化剂(B)是包含苯并恶唑骨架的固化剂,因而,在环氧树脂的固化物中导入苯并恶唑骨架后,能显著提高作为基质的环氧树脂的热导率。因此,能提高树脂组合物的固化物的热导率。
作为胺固化剂(B)的种类,可举出:5-氨基-2-(对氨基苯基)苯并恶唑、6-氨基-2-(对氨基苯基)苯并恶唑、5-氨基-2-(间氨基苯基)苯并恶唑、6-氨基-2-(间氨基苯基)苯并恶唑、2,2'-对亚苯基双(5-氨基苯并恶唑)、2,2'-对亚苯基双(6-氨基苯并恶唑)、1-(5-氨基苯并恶唑基)-4-(6-氨基苯并恶唑基)苯、2,6-(4,4'-二氨基二苯基)苯并[1,2-d:5,4-d']双恶唑、2,6-(4,4'-二氨基二苯基)苯并[1,2-d:4,5-d']双恶唑、2,6-(3,4'-二氨基二苯基)苯并[1,2-d:5,4-d']双恶唑、2,6-(3,4'-二氨基二苯基)苯并[1,2-d:4,5-d']双恶唑、2,6-(3,3'-二氨基二苯基)苯并[1,2-d:5,4-d']双恶唑和2,6-(3,3'-二氨基二苯基)苯并[1,2-d:4,5-d']双恶唑等。这些可单独使用或将两种以上并用。其中,从固化物的热导率和胺固化剂(B)自身的制造容易性方面来看,优选5-氨基-2-(对氨基苯基)苯并恶唑或6-氨基-2-(间氨基苯基)苯并恶唑。另外,作为胺固化剂(B),也可使用加成了环氧等的胺加成物这样的化合物。
胺固化剂(B)的形状并没有特别限定,可为矩形状、多边形状、立方体状、椭圆状、球状、针状、平板状、线状或鳞片状中的任一种。优选的形状为针状或矩形状。通过具有所述优选的形状并与液状的环氧化合物(A)反应而形成环氧树脂的固化物时,胺固化剂(B)沿着导热性填料(C)的颗粒间填充。可推测在随后的固化反应中,环氧树脂(A)定向于长径方向进行固化生长,导热性填料(C)之间形成了热传导路径,其结果是,提高了整个固化物的热导率。
胺固化剂(B)的纵横比(胺固化剂(B)的长径与短径的长度比)优选为1.3以上,更优选为1.5以上,进一步优选为1.7以上,特别优选为2以上。通过将纵横比设定为1.3以上,可提高树脂组合物的固化物热导率。纵横比的上限并没有特别限定,但优选为20以下,更优选为18以下,进一步优选小于4,特别优选为3以下。
另外,从储藏稳定性的观点来看,胺固化剂(B)的纵横比(胺固化剂(B)的长径与短径的长度比)优选为1.3以上,更优选为1.5以上,进一步优选为1.7以上,特别优选为1.8以上。纵横比的上限并没有特别限定,但优选为15以下,更优选小于4,进一步优选为3以下,特别优选为2以下。通过使纵横比小于4,当导热性填料(C)为球状时,相容性变得特别好,并且可将粘度保持在操作性良好的值,因而,具有展示出优良储藏稳定性的趋势。
作为胺固化剂(B)的长径,优选在50μm~1000μm的范围内,更优选在100μm~800μm的范围内,进一步优选在200μm~600μm的范围内。如果长径小于50μm,则上述热导率的提高效果不充分;而如果长径超过1000μm,则胺在涂膜中沿面方向取向,可能会使固化物厚度方向上的热导率变得不充分。
胺固化剂(B)的熔点优选为60℃以上、400℃以下,更优选为80℃以上、380℃以下,进一步优选为100℃以上、350℃以下。熔点过低时,易于溶出,因而可能会损害保存稳定性;而熔点过高时,固化时需要高温和长时间,且操作性变差。
另外,本发明中,除了含有苯并恶唑骨架的固化剂(B)以外,在不损害本发明效果的范围内,也可并用通常所使用的固化剂。作为这样的固化剂,可示例出胺系固化剂、酸酐系固化剂和苯酚系固化剂等。具体而言,作为胺系固化剂,可举出:脂肪族二胺类、脂肪族多胺类、包含芳香环的脂肪族多胺类、脂环式或环状多胺类以及芳香族伯胺类等。作为酸酐系固化剂,可举出:脂肪族酸酐类、脂环式酸酐类、芳香族酸酐类以及卤素系酸酐等。作为苯酚系固化剂,可示例出:三苯酚、苯酚酚醛清漆和甲酚酚醛清漆等。在使用这些固化剂的情况下,当整个树脂组合物为100质量%时,这些固化剂的含量优选为50质量%以下,更优选为30质量%以下,进一步优选为10质量%以下,特别优选为1质量%以下。当这些固化剂的含量过高时,则相对于整个树脂组合物的具有苯并恶唑骨架的固化剂含量就相对降低,可能存在树脂组合物的热导率恶化情况。
关于环氧化合物(A)与胺固化剂(B)的混合比,从树脂组合物的固化性观点来看,通常相对于环氧化合物(A)的1当量环氧基,优选胺固化剂(B)的胺当量(胺当量/环氧当量)在0.2~1.2当量的范围内。更优选为0.4以上,进一步优选为0.6以上。另外,优选为1.0以下,更优选为0.8以下。
环氧化合物(A)与胺固化剂(B)的质量比优选为(A)/(B)=90/10~60/40,更优选为85/15~65/35,进一步优选为80/20~70/30。通过使质量比在上述范围内,树脂组合物的固化物展现出优良的导热性。
<导热性填料(C)>
作为导热性填料(C),只要是具有导热性的填料,就没有限定。例如,可将以下的导电性无机填充剂进行单独使用或将两种以上并用:氧化铝、氧化镁、氧化锌、氮化硼、氮化铝、氮化硅、钛酸钡、碳化硅、碳(carbon)、金刚石、银、金、铜、镍和铝等。其中,优选使用电绝缘性的无机填充剂。通过使用电绝缘性的无机填充剂,例如,在电子设备内部使用时,既可促进散热,又可防止部件之间的短路。具体而言,例如,可举出:氮化铝、氧化铝、钛酸钡、氮化硼、碳化硅和氧化锌等。其中,优选氮化铝、氮化硼或氧化铝。
作为导热性填料(C)的形状,可使用规则形状或不规则形状中的任一种。作为所述形状,例如,可举出:多边形状、立方体状、椭圆状、球状、针状、平板状、鳞片状或这些的混合物或聚集体。其中,优选使用球状物。通过使用球状的导热性填料(C),树脂组合物的粘度变低,并且处理性变良好。作为导热性填料(C)的纵横比,优选为1.5以下,更优选为1.3以下,进一步优选为1.1以下。
导热性填料(C)的平均粒径并没有特别限定,但优选为1μm~100μm,更优选为2μm~80μm,进一步优选为3μm~60μm,特别优选为5~50μm。平均粒径小于1μm时,可能存在以下情况:树脂组合物的粘度变高,操作性恶化,或者热导率恶化。平均粒径超过100μm时,树脂组合物的最小涂膜厚度增加,可能会使涂膜的热阻恶化。
相对于树脂组合物的总体积,导热性填料(C)的添加量优选为40体积%~75体积%,更优选为45体积%~70体积%,进一步优选为55体积%~65体积%。当导热性填料(C)的添加量小于40体积%时,导热性填料(C)的填充量低,无法展现出填料的热导率,固化物的热导率可能会显著降低;当导热性填料(C)的添加量超过75体积%时,可能会存在以下情况:由树脂组合物的粘度过高所导致的操作性恶化或粘合力恶化。
<树脂组合物>
本发明的树脂组合物含有环氧化合物(A)、胺固化剂(B)和导热性填料(C),并且所述环氧化合物(A)为液状,所述胺固化剂(B)包含苯并恶唑骨架。
树脂组合物的粘度优选为10Pa·s~300Pa·s,更优选为15Pa·s~200Pa·s,进一步优选为20Pa·s~100Pa·s。当树脂组合物的粘度小于10Pa·s时,可能存在树脂组合物涂布时的操作性恶化或渗出的情况;当树脂组合物的粘度超过300Pa·s时,可能存在以下情况:处理性变难,无法形成均匀的固化物,从而热导率恶化。
本发明中,根据需要,还可添加不降低热导率、反应性、耐热性、强韧性和储藏稳定性等程度的环氧化物反应性稀释剂。作为反应性稀释剂的例子,可举出苯基缩水甘油醚、丁基缩水甘油醚、烷基缩水甘油醚、烷基二缩水甘油醚、亚烷基二醇缩水甘油醚、亚烷基二醇二缩水甘油醚、氧化苯乙烯、氧化辛烯以及这些的混合物等。当总树脂组合物为100质量%时,反应性稀释剂的含量优选为50质量%以下,更优选为20质量%以下,进一步优选为5质量%以下。
本发明中,为了调整树脂组合物的粘度,也可添加在低于固化温度的温度下挥发的有机溶剂。作为有机溶剂,优选沸点为200℃以下的有机溶剂,具体而言,可举出:甲醇、乙醇、丙醇、丁醇、甲苯、二甲苯、Solvesso(注册商标)类、Isopar(注册商标)类、乙酸乙酯、乙酸丁酯、甲基乙基酮、环己酮、环己醇、异佛尔酮、甲基溶纤剂、乙基溶纤剂、丁基溶纤剂、丁基溶纤剂乙酸酯、乙基卡必醇、乙基卡必醇醋酸酯、乙二醇单乙酸酯、二甲基甲酰胺、γ-丁内酯和正甲基吡咯烷酮等。由于有机溶剂挥发后所形成的空隙可能会导致固化物的粘合性或热导率恶化,或者有机溶剂的挥发可能会给操作环境带来不良影响,因而,树脂组合物优选不包含有机溶剂。优选地,当树脂组合物的总量为100质量%时,有机溶剂优选为50质量%以下,更优选为20质量%以下,进一步优选为5质量%以下,也可为0质量%。
另外,还可根据需要使用以下的添加剂:硅烷偶联剂和钛酸酯偶联剂、抗氧化剂(受阻酚系或磷系等)、脱模剂(高级脂肪酸和蜡等)、阻燃剂(卤素和磷化合物等)、消泡剂和着色剂等。
通过加热本发明的树脂组合物,能使具有苯并恶唑骨架的胺固化物与环氧化合物反应,从而形成作为环氧固化树脂的粘合层。加热温度取决于环氧化合物(A)和胺化合物(B)的种类,但通常在80℃~250℃的范围内,优选在100℃~200℃的范围内,更优选在120℃~160℃的范围内。另外,反应(固化)时间也可进行适当设定,通常为0.1~6小时,优选为0.5~5小时,更优选为1~3小时左右。
实施例
以下,通过实施例来具体示出本发明的树脂组合物,但本发明不局限于此。实施例和比较例中,单独的术语“份”表示质量份。
(实施例1)
通过在烧瓶中放入13质量份的环氧化合物1、3质量份的环氧化合物2、5质量份的胺1和100质量份的导热性填料1,充分搅拌,混合,从而制备树脂组合物1。测定所得树脂组合物1的热固化物的导热性。结果示于表1。
(实施例2~11、比较例1~3)
将表1和表2所记载的各成分以各质量份进行混合,并如同实施例1进行充分搅拌、混合,从而制备树脂组合物2~14。测定所得树脂组合物2~14的热固化物的导热性。结果示于表1和表2。
<热固化物的制作>
将实施例和比较例中所得的树脂组合物放入设定为150℃的模具中,在150℃下热压成形2小时,从而获得热固化物试验片。
<热导率的测定>
对于实施例和比较例中所得的树脂组合物的热固化物试验片,分别测定25℃下的热扩散率、比热、密度,并根据以下公式算出热导率。
(公式):热导率λ(W/mK)=α·Cp·d
其中,α:热扩散率(m2/s);Cp:比热(J/(kg·K));d:密度(kg/m3)
使用NETZSCH公司制造的氙气闪光分析仪LFA 467Hyperflash,并通过氙闪光法测量热扩散率α。通过阿基米德法测定密度d。另外,使用日立高新技术公司(Hitachi High-TechScience)制造的DSC7020,并根据DSC法测定比热Cp。
<粘度的测定>
通过以下方法测定粘度:使用以25℃的恒温水进行温度控制的东机产业公司制造的E型粘度计TV-25,并在锥形转子3°×R12下,测定实施例和比较例中所得的0.4mL树脂组合物的粘度。将转速为5rpm时的值作为测定值。
<粘合强度的测定>
根据JIS-K6850(1990),测定剪切粘合强度。在25mm×100mm×1.6mm铝片的一侧12.5mm上涂布树脂组合物,并贴上另一片相同类型的铝片后,在150℃下加热固化2小时,从而制成试验片(铝片/树脂组合物/铝片)。该试验片以10mm/min的拉伸速度平行于粘合面进行拉伸,并通过断裂时的最大负荷除以粘合面积,求出粘合强度。
【表1】
环氧化合物1:jER828(双酚A型环氧树脂,三菱化学(Mitsubishi Chemical)公司制造),室温(25℃)下为液状
环氧化合物2:jER630(氨基酚型多官能环氧树脂,三菱化学(Mitsubishi Chemical)公司制造),室温(25℃)下为液状
环氧化合物3:TETRAD-X(间苯二甲胺型多官能环氧树脂,三菱气体化学(MitsubishiGas Chemical)公司制造),室温(25℃)下为液状
环氧化合物4:jER806(双酚F型环氧树脂,三菱化学公司制造),室温(25℃)下为液状
环氧化合物5:Epolight 1600(1,6-己二醇二缩水甘油醚,共荣社化学公司制造),室温(25℃)下为液状
胺1:5-氨基-2-(对氨基苯基)苯并恶唑
胺2:6-氨基-2-(间氨基苯基)苯并恶唑
胺3:双氰胺
胺4:间苯二胺
胺5:4,4'-二氨基二苯甲烷
填料1:AS-400(类球形氧化铝,平均粒径13μm,昭和电工公司制造)
填料2:CB-A50BC(球状氧化铝,平均粒径50μm,昭和电工公司制造)
填料3:AO-509(球状氧化铝,平均粒径10μm,Admatechs公司制造)
填料4:AO-502(球状氧化铝,平均粒径0.7μm,Admatechs公司制造)
填料5:SP-3(鳞片状氮化硼,Denka公司制造)
【表2】
环氧化合物1:jER828(双酚A型环氧树脂,三菱化学(Mitsubishi Chemical)公司制造),室温(25℃)下为液状
环氧化合物2:jER630(氨基酚型多官能环氧树脂,三菱化学(Mitsubishi Chemical)公司制造),室温(25℃)下为液状
环氧化合物3:TETRAD-X(间苯二甲胺型多官能环氧树脂,三菱气体化学(MitsubishiGas Chemical)公司制造),室温(25℃)下为液状
环氧化合物4:jER806(双酚F型环氧树脂,三菱化学公司制造),室温(25℃)下为液状
环氧化合物5:Epolight 1600(1,6-己二醇二缩水甘油醚,共荣社化学公司制造),室温(25℃)下为液状
胺1:5-氨基-2-(对氨基苯基)苯并恶唑
胺2:6-氨基-2-(间氨基苯基)苯并恶唑
胺3:双氰胺
胺4:间苯二胺
胺5:4,4'-二氨基二苯甲烷
填料1:AS-400(类球形氧化铝,平均粒径13μm,昭和电工公司制造)
填料2:CB-A50BC(球状氧化铝,平均粒径50μm,昭和电工公司制造)
填料3:AO-509(球状氧化铝,平均粒径10μm,Admatechs公司制造)
填料4:AO-502(球状氧化铝,平均粒径0.7μm,Admatechs公司制造)
填料5:SP-3(鳞片状氮化硼,Denka公司制造)
另外,表中的原材料详细情况如下所述。
<环氧化合物(A)>
环氧化合物1:jER(注册商标)828(双酚A型环氧树脂,三菱化学公司制造),双官能环氧化合物,室温(25℃)下为液状
环氧化合物2:iER(注册商标)630(氨基酚型环氧树脂,三菱化学公司制造),三官能环氧化合物,室温(25℃)下为液状
环氧化合物3:TETRAD(注册商标)-X(间苯二甲胺型四官能环氧树脂,三菱气体化学公司制造),室温(25℃)下为液状
环氧化合物4:jER(注册商标)806(双酚F型环氧树脂,三菱化学公司制造),双官能环氧化合物,室温(25℃)下为液状
环氧化合物5:Epolight(注册商标)1600(1,6-己二醇二缩水甘油醚,共荣社化学公司制造),双官能环氧化合物,室温(25℃)下为液状
<胺固化剂(B)>
胺1:5-氨基-2-(对氨基苯基)苯并恶唑
胺2:6-氨基-2-(间氨基苯基)苯并恶唑
胺3:双氰胺
胺4:间苯二胺
胺5:4,4'-二氨基二苯甲烷
<导热性填料(C)>
填料1:AS-400(类球形氧化铝,平均粒径13μm,昭和电工公司制造)
填料2:CB-A50BC(球状氧化铝,平均粒径50μm,昭和电工公司制造)
填料3:AO-509(球状氧化铝,平均粒径10μm,Admatechs公司制造)
填料4:AO-502(球状氧化铝,平均粒径0.7μm,Admatechs公司制造)
填料5:SP-3(鳞片状氮化硼,Denka公司制造)
从表1和表2记载的结果可知,与比较例1~3的固化物相比,使用胺固化剂(其包含具有苯并恶唑骨架的固化剂)的实施例1~11的固化物可发挥优良的热导率和粘合强度这两方面。
Claims (11)
1.一种导热性树脂组合物,其特征在于,含有环氧化合物A、胺固化剂B和导热性填料C;所述环氧化合物A为液状,所述胺固化剂B包含苯并恶唑骨架。
2.一种导热性树脂组合物,其特征在于,相对于树脂组合物的总体积,导热性填料C的含量为40体积%~75体积%。
3.如权利要求1或2所述的导热性树脂组合物,其特征在于,所述树脂组合物在25℃和5rpm下的粘度为10Pa·s~300Pa·s。
4.如权利要求1~3中任一项所述的导热性树脂组合物,其特征在于,胺固化剂B为5-氨基-2-(对氨基苯基)苯并恶唑。
5.如权利要求1~4中任一项所述的导热性树脂组合物,导热性填料C选自由氧化铝、氧化镁、氧化锌、氮化硼、氮化铝、氮化硅、钛酸钡、碳化硅、碳、金刚石、银、金、铜、镍和铝构成的群中的至少一种。
6.如权利要求1~5中任一项所述的树脂组合物,其特征在于,导热性填料C为球状。
7.如权利要求1~6中任一项所述的导热性树脂组合物,其特征在于,相对于全部环氧化合物A,含有10重量%以上的作为环氧化合物A的三官能以上的环氧化合物。
8.如权利要求1~7中任一项所述的导热性树脂组合物,其特征在于,环氧化合物A与胺固化剂B的质量比为A/B=90/10~60/40。
9.如权利要求1~8中任一项所述的导热性树脂组合物,其特征在于,所述导热性树脂组合物不包含沸点为200℃以下的化合物。
10.一种导热粘合剂,其特征在于,包含权利要求1~9中任一项所述的导热性树脂组合物。
11.一种电子部件,其特征在于,包含权利要求1~9中任一项所述的导热性树脂组合物。
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