CN111793209A - 浆料组合物、该浆料组合物的固化物、使用了该固化物的基板、膜以及预浸料 - Google Patents
浆料组合物、该浆料组合物的固化物、使用了该固化物的基板、膜以及预浸料 Download PDFInfo
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- CN111793209A CN111793209A CN202010257934.9A CN202010257934A CN111793209A CN 111793209 A CN111793209 A CN 111793209A CN 202010257934 A CN202010257934 A CN 202010257934A CN 111793209 A CN111793209 A CN 111793209A
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- cyclic imide
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Classifications
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Abstract
本发明提供一种触变性低且操作性优异的浆料组合物、该浆料组合物的固化物、使用了该固化物的机械特性优异且低相对介电常数、低电介质损耗角正切的基板、膜以及预浸料。所述浆料组合物的特征在于,含有下述(A)成分~(D)成分,且触变比为3.0以下,(A)成分:在1个分子中具有至少1个二聚酸骨架、至少1个碳原子数为6以上的直链亚烷基以及至少2个环状酰亚胺基的环状酰亚胺化合物,(B)成分:通过激光衍射法测定的平均粒径为0.05~20μm的球形二氧化硅微粒和/或氧化铝微粒,(C)成分:能够与(A)成分和(B)成分进行反应的硅烷偶联剂,(D)成分:有机溶剂。
Description
技术领域
本发明涉及浆料组合物、该浆料组合物的固化物、使用了该固化物的基板、膜以及预浸料。
背景技术
通常实施一种通过对溶解在有机溶剂中的树脂进行涂敷来制作片材、膜等树脂成型物的方法。另外,为了提高所述树脂成型物的机械强度、耐热性以及非吸收性等特性,经常在基体树脂中分散并高填充氧化物粒子的填料。
在基体树脂中分散并高填充所述填料的情况下,通常其主流方法为直接将填料投入溶解在有机溶剂的基体树脂中,然后通过门式混合机、三辊磨机等混炼机、分散机对其进行混炼、分散。但是,在该方法中,在填料粒子小的情况下,难以将填料分散在基体树脂中,进而存在着填料粒子的凝聚块形成于基体树脂中、分散有填料的基体树脂的品质容易产生偏差的问题。
另一方面,在以移动电话为代表的移动通信设备、其基站设备、服务器以及路由器等网络基础设施设备、大型计算机等电子设备中,其所使用的信号的高速化和大容量化在逐年推进。与此相伴,搭载在这些电子设备上的印刷电路板需要与20GHz区域的高频进行对应,并且需要能够降低传输损耗的低相对介电常数、低电介质损耗角正切的基板材料。近年来,除了上述电子设备之外,作为处理此类高频信号的应用,在智能交通系统领域和室内短距离通信领域中,也推进着用于处理高频信号的新型系统的实用化以及实用计划,并且,预测今后对于搭载在这些设备上的印刷电路板也进一步需要低传输损耗基板材料。
以往,在要求低传输损耗的印刷电路板中,作为在高频区域中也显示出低相对介电常数及低电介质损耗角正切的耐热性热塑性聚合物,使用聚苯醚(PPE)的树脂。作为聚苯醚类树脂的使用方法,公开了组合使用聚苯醚和热固性树脂的方法(专利文献1、专利文献2)。另外,已知氟化树脂也被作为显示出低相对介电常数、低电介质损耗角正切的材料使用,但其具有加工性差的缺点。
进一步,也对使用马来酰亚胺化合物作为印刷电路板用材料的方法进行了研究。已知一种树脂组合物,其特征在于,具有例如至少具有2个马来酰亚胺骨架的马来酰亚胺化合物、具有至少2个氨基且具有芳香族环结构的芳香族二胺化合物、促进所述马来酰亚胺化合物与所述芳香族二胺化合物之间的反应且具有碱性基团和酚羟基的催化剂、以及二氧化硅(专利文献3)。另外,也已知关于含有长链烷基双马来酰亚胺树脂、以及具有2个以上与所述长链烷基双马来酰亚胺树脂反应的官能团的固化剂的树脂组合物的研究,该长链烷基双马来酰亚胺树脂具有含有碳原子数为10以上的亚烷基链的主链、和含有与所述亚烷基链键合的烷基的侧链(专利文献4)。
基于这些背景,作为毫米波雷达用印刷电路板制造用树脂膜的制造方法,已知一种将具有马来酰亚胺基的化合物与无机填充材料的浆料进行混合的方法(专利文献5)。但是,在该方法中,具有马来酰亚胺基的化合物和无机填充材料浆料的混合物的触变性变高等,导致该混合物的操作性容易变差。例如,如果未选择适当的材料、表面处理等,则触变性增高,进而在制作薄膜片等时,由于在刮板与剥离膜的狭窄间隙施加高剪切应力,因而难以进行薄膜涂敷。
现有技术文献
专利文献
专利文献1:日本特开2010-059363号公报
专利文献2:日本特开2010-275342号公报
专利文献3:日本特开2012-255059号公报
专利文献4:国际公开第2016-114287号
专利文献5:日本特开2017-125128号公报
发明内容
发明所要解决的问题
因此,本发明的目的在于,提供一种触变性低且操作性优异的浆料组合物、该浆料组合物的固化物、使用该固化物的机械特性优异且低相对介电常数、低电介质损耗角正切的基板、膜以及预浸料。
解决问题的方法
为了解决上述问题,本发明人们反复进行深入研究的结果发现,下述浆料组合物能够实现上述目的,进而完成了本发明。
<1>一种浆料组合物,其含有下述(A)成分~(D)成分,且触变比为3.0以下,
(A)成分:在1个分子中具有至少1个二聚酸骨架、至少1个碳原子数为6以上的直链亚烷基以及至少2个环状酰亚胺基的环状酰亚胺化合物,
(B)成分:通过激光衍射法测定的平均粒径为0.05~20μm的球形二氧化硅微粒和/或氧化铝微粒,
(C)成分:能够与(A)成分和(B)成分进行反应的硅烷偶联剂,
(D)成分:有机溶剂。
<2>根据<1>所述的浆料组合物,其中,
所述(A)成分的环状酰亚胺化合物为下式(1)表示的化合物,
(在式(1)中,A独立地表示含有芳香族环或脂肪族环的4价有机基团,B为具有任选含有杂原子的二价脂肪族环的碳原子数为6~18的亚烷基链,Q独立地表示碳原子数为6以上的直链亚烷基,R独立地表示碳原子数为6以上的直链或支链的烷基,n表示1~10的数,m表示0~10的数。)
<3>根据<2>所述的浆料组合物,其中,
所述式(1)中的A为下述结构式表示的基团中的任一种,
(上述结构式中的未与取代基键合的键为与在式(1)中形成环状酰亚胺结构的羰基碳键合的键。)
<4>如<1>~<3>中任一项所述的浆料组合物,其中,
所述(B)成分的微粒的比例为浆料组合物整体的30质量%以上且95质量%以下。
<5>如<1>~<4>中任一项所述的浆料组合物,其中,
所述(C)成分的硅烷偶联剂为具有(甲基)丙烯酸基和/或氨基的硅烷偶联剂。
<6><1>~<5>中任一项所述的浆料组合物的固化物。
<7>根据<6>所述的固化物,其为基板。
<8>根据<6>所述的固化物,其为膜。
<9>根据<6>所述的固化物,其为预浸料。
<10>一种浆料组合物的制造方法,该方法包括对下述(A)成分~(D)成分进行混合,
(A)成分:在1个分子中具有至少1个二聚酸骨架、至少1个碳原子数为6以上的直链亚烷基以及至少2个环状酰亚胺基的环状酰亚胺化合物,
(B)成分:通过激光衍射法测定的平均粒径为0.05~20μm的球形二氧化硅微粒和/或氧化铝微粒,
(C)成分:能够与(A)成分和(B)成分进行反应的硅烷偶联剂,
(D)成分:有机溶剂的步骤的浆料组合物,
其中,所述(B)成分的制造方法为VMC(Vaporized Metal Combustion,气化金属燃烧)法。
发明的效果
本发明的浆料组合物的触变性低,且在进行薄膜化时等操作性优异。另外,在将该组合物制成固化物时,由于该固化物的物理强度、介电特性优异,因此,具有该固化物的基板、膜以及预浸料等适宜作为高频机械用材料使用。
具体实施方式
以下,对本发明进行更详细的说明。
(A)环状酰亚胺化合物
(A)成分为热固化性树脂成分的环状酰亚胺化合物,其在1个分子中具有至少1个二聚酸骨架、至少1个碳原子数为6以上的直链亚烷基以及至少2个环状酰亚胺基。由于(A)成分的环状酰亚胺化合物具有碳原子数为6以上的直链亚烷基,因此含有(A)成分的组合物的固化物不仅具有优异的介电特性,而且苯基的含有比例降低,进而耐电痕性提高。另外,由于(A)成分的环状酰亚胺化合物具有直链亚烷基,因此能够使含有(A)成分的组合物的固化物低弹性化。
作为(A)成分的环状酰亚胺化合物,优选为马来酰亚胺化合物,更优选使用下式(1)表示的马来酰亚胺化合物。
在式(1)中,A独立地表示含有芳香族环或含有脂肪族环的4价有机基团。B为具有任选含有杂原子的二价脂肪族环的碳原子为6~18的亚烷基链。Q独立地表示碳原子数为6以上的直链亚烷基。R独立地表示碳原子数为6以上的直链或支链的烷基。n表示1~10的数。m表示0~10的数。
式(1)中的Q为直链的亚烷基,且它们的碳原子数为6以上、优选为6以上且20以下、更优选为7以上且15以下。
另外,式(1)中的R为烷基,其即可为直链的烷基也可为支链的烷基,且它们的碳原子数为6以上、优选为6以上且12以下。
式(1)中的A表示含有芳香族环或含有脂肪族环的4价有机基团,特别优选下述结构式表示的4价有机基团中的任一种。
(上述结构式中的未与取代基键合的键为与在式(1)中形成环状酰亚胺结构的羰基碳键合的键。)
另外,式(1)中的B为具有任选含有杂原子的二价脂肪族环的碳原子数为6~18的亚烷基,该亚烷基的碳原子数优选为8以上且15以下。式(1)中的B优选为下述结构式表示的具有脂肪族环的亚烷基中的任一种。
(上述结构式中的未与取代基键合的键为与在式(1)中形成环状酰亚胺结构的氮原子键合的键。)
式(1)中的n为1~10的数、优选为2~7的数。式(1)中的m为0~10的数、优选为0~7的数。
对于(A)成分的环状酰亚胺化合物的重均分子量(Mw)而言,包括在室温下的形状,并无特别限定,通过凝胶渗透色谱法(GPC)测定的以聚苯乙烯标准换算的重均分子量优选为500~50000、特别优选为800~40000。如果该重均分子量为500以上,则得到的含有环状酰亚胺化合物的组合物容易成膜,如果该重均分子量为50000以下,则不用担心得到的组合物的粘度过高、进而流动性降低,其层压成型等成型性良好。
作为(A)成分的环状酰亚胺化合物,可以使用BMI-689、BMI-1500、BMI-2500、BMI-2560、BMI-3000以及BMI-5000(以上,Designer Molecules Inc.制造)等市售品。另外,环状酰亚胺化合物可以单独使用1种,也可以并用多种。
在本发明的组合物中,(A)成分优选含有10~90质量%、更优选含有15~85质量%、进一步优选含有20~80质量%。
(B)通过激光衍射法测定的平均粒径为0.05~20μm的球形二氧化硅微粒和/或氧化铝微粒
在本发明的浆料组合物中含有作为(B)成分的二氧化硅微粒和/或氧化铝微粒。作为二氧化硅微粒和/或氧化铝微粒,其为通过激光衍射法测定的平均粒径为0.05~20μm的球形,可以单独使用,也可以混合多个使用。需要说明的是,在本发明中所述的“球形”是指圆球度在0.8~1.0的范围内的球形。该圆球度为随机抽取100个微粒时各微粒的最小直径/最大直径之比的平均值。关于形状,并无特别地限定,但从填充性等观点考虑,优选为圆球形。
通过激光衍射法测定的用于本发明的二氧化硅微粒和/或氧化铝微粒的平均粒径要求为0.05~20μm、优选为0.05~15μm、进一步优选为0.1~10μm。如果平均粒径小于0.05μm,则由于粘度增加而使成型性降低,因此不优选,如果平均粒径超过20μm,则膜等成型物的平坦性降低,因此也不优选。需要说明的是,平均粒径为通过激光衍射法测定的中值粒径(D50)的值。
对于上述二氧化硅微粒和氧化铝微粒的制造而言,对其方法并无特别地限定,优选为通过VMC(Vaporized Metal Combustion气化金属燃烧)法进行制造的方法。VMC法是指在含氧的气氛中通过燃烧器形成化学火焰,并且以形成粉尘云程度的量将构成目标氧化物微粒的一部分的金属粉末投入到化学火焰中,进而使其引发爆燃而制造氧化物微粒。
对VMC方法的作用说明如下。首先,将含有作为反应气体的氧的气体充满在容器中,并在该反应气体中形成化学火焰。接下来,将金属粉末投入该化学火焰中,形成高浓度(500g/m3以上)的粉尘云。于是,通过化学火焰对金属粉末的表面赋予热能,金属粉末的表面温度升高,蒸汽从金属粉末的表面扩散至周围。该蒸气与氧气发生反应而起火并产生火焰。由该火焰产生的热量进一步促进了金属粉末的汽化,产生的蒸汽和反应气体混合,连锁性地起火并传播。此时的金属粉末本身也破碎并飞溅,从而促进了火焰的传播。在燃烧后通过自然冷却所产生的气体,能够形成氧化物微粒的云。所获得的氧化物微粒可通过电集尘器等带电而被捕获。
VMC法为利用粉尘爆炸的原理的方法,其可以瞬时获得大量的氧化物微粒,该微粒具有非常高的圆球度。例如,在获得二氧化硅微粒的情况下,可投入硅粉,在获得氧化铝微粒的情况下,可投入铝粉。通过调整所投入的粉末的粒径、投入量以及火焰温度等,能够调整微粒的粒径,能够容易地制造具有亚微米量级的粒径的超微粒。
(B)成分的微粒的比例为浆料组合物整体的30质量%以上且95质量%以下,优选为35质量%以上且90质量%以下。如果该比例为小于30质量%的值,则不仅微粒容易沉降,而且在涂敷时具有容易发生排斥的倾向。如果该比例为高于95质量%的值,则具有粘度过高的倾向,并且存在操作性降低的倾向。
(C)能够与(A)成分和(B)成分进行反应的硅烷偶联剂
在本发明的浆料组合物中,作为成分(C),可使用能够与(A)成分的环状酰亚胺化合物和(B)成分的二氧化硅微粒和/或氧化铝微粒进行反应的硅烷偶联剂。作为这种偶联剂,可列举含有环氧基的烷氧基硅烷、含有氨基的烷氧基硅烷、含有(甲基)丙烯酸基的烷氧基硅烷以及含有不饱和烷基的烷氧基硅烷。
其中,从降低浆料组合物的粘度、触变性、提高固化物的机械强度、介电特性的观点考虑,进一步从对铜等金属的粘接性提高的观点考虑,适宜使用(甲基)丙烯酸基和/或含有氨基的烷氧基硅烷。作为(C)成分的具体例,可列举3-甲基丙烯酰氧基丙基三甲氧基硅烷、3-丙烯酰氧基丙基三甲氧基硅烷、N-苯基-3-氨基丙基三甲氧基硅烷、N-2-(氨基乙基)-3-氨基丙基三甲氧基硅烷以及3-氨基丙基三甲氧基硅烷等。
相对于以(A)成分为代表的热固性树脂成分的总量,(C)成分的含量优选为0.1~8.0质量%、特别优选为0.3~6.0质量%。如果该含量小于0.1质量%,则对基材的粘接效果、对二氧化硅微粒和/或氧化铝微粒的润湿性不充分,另外,如果该含量大于8.0质量%,则即使在如后面所述地除去(D)成分的有机溶剂之后,其粘度也极大地降低,存在成为空隙的原因、从树脂表面发生渗出的担忧。
(D)有机溶剂
本发明的浆料组合物含有作为成分(D)的有机溶剂。有机溶剂的种类并无特别地限定,优选为对于(A)成分的环状酰亚胺化合物为良溶剂的有机溶剂。
作为(D)成分,可使用例如己烷、庚烷等脂肪族烃;二甲苯、甲苯等芳香族烃;丙酮、甲乙酮(MEK)、环己酮等酮化合物;异丙醇(IPA)、正丁醇等醇化合物;二丁醚、四氢呋喃(THF)等醚化合物;二甲基亚砜(DMSO)等亚砜化合物;二甲基甲酰胺(DMF)、N-甲基-2-吡咯烷酮等酰胺化合物;乙酸乙酯、丙二醇单甲醚乙酸酯(PGMEA)等酯化合物这样的一般的有机溶剂,但从(A)成分的溶解性的观点考虑,优选使用二甲苯、甲苯这样的芳香族烃类有机溶剂。
相对于(A)成分和(B)成分的总和100质量份,(D)成分的配合量优选为10~500质量份、特别优选为20~200质量份。
其它添加剂
根据需要,也可以进一步在本发明的浆料组合物中配合各种添加剂。作为该添加剂,在不损害本发明的效果的范围内,为了改善树脂特性,可以配合环氧树脂等热固化性树脂、有机聚硅氧烷、硅油、热塑性树脂、热塑性弹性体、有机合成橡胶、光稳定剂、阻聚剂、阻燃剂、颜料、染料、固化促进剂、催化剂以及除二氧化硅微粒及氧化铝微粒以外的无机填充材料等。为了改善电特性,也可以配合离子捕集剂等。进一步,为了改善介电特性,也可以配合含氟材料等。
浆料组合物的制造
在制造本发明的浆料组合物的情况下,对各成分的投入顺序、分散方法并无特别地限定。例如,可以将(A)成分的环状酰亚胺化合物、(B)成分的无机填充材料的二氧化硅、氧化铝的微粒粉末和(C)成分的硅烷偶联剂分散在(D)成分的有机溶剂中,也可以将(A)成分预先溶解在成分(D)中来准备清漆,将(B)成分和(C)成分加入其中后进行分散。分散可通过使用三辊、球磨机、超声波分散机、各种混合机、捏合机等设备进行。需要说明的是,为了防止浆料组合物改性,优选在氮气氛中等非氧化性气氛中制造。
所得到的本发明的浆料组合物的触变比为3.0以下。如果触变比大于3.0,则该组合物的操作性容易变差。例如,如果未选择适当的材料、表面处理等,则触变性变高,在制造薄膜片等时,在刮板与剥离膜之间的狭窄间隙施加高剪切应力,因此难以进行薄膜涂敷。
此时的触变比通过使用JIS K 7117-2:1999中记载的锥板型旋转粘度计(E型粘度计)、并利用在25℃/5rpm和50rpm下进行测定而得到的粘度值而计算出。
触变比=(在5rpm下的粘度测定值[Pa·s])/(在50rpm下的粘度测定值[Pa·s])
另外,此时,在25℃/5rpm下的粘度优选为在0.01~10Pa·s的范围。另外,在25℃/50rpm下的粘度优选为在0.01~7.5Pa·s的范围。
(B)成分的无机填充材料可以通过与(C)成分反应、即可以通过(C)成分进行表面处理。作为表面处理的方法并无特别地限定,可以根据通常进行的方法进行处理。例如,可在预先对(B)成分进行干式处理后,将其投入有机溶剂中,也可以以湿式处理的形式在有机溶剂中进行处理。另外,也可以在添加(A)成分的同时添加(B)成分,各成分的添加顺序是任意的。
对于本发明的浆料组合物,例如可以在添加过氧化物等固化促进剂(自由基引发剂)之后,可通过喷雾、辊涂、旋涂、浇铸、浸渍等方法进行涂布,在蒸发除去溶剂之后,使其固化,制成成型物(基板、膜、预浸料等)。此时,该成型物可用于电子零件、粘接剂、耐热膜、保护膜等多种用途,并且适合用作高频装置用材料。在此,蒸散除去所述溶剂的步骤的优选条件为在温度80~150℃的范围内进行0.5~4小时。使所述本发明的浆料组合物固化的步骤的优选条件为在温度150~200℃范围内进行1~16小时。
关于本发明的浆料组合物的实施方式,上述实施方式仅为示例,本发明的浆料组合物并不限定于上述实施方式。本发明的浆料组合物可以将上述实施方式作为代表,本领域技术人员也可以对上述实施方式进行各种变形、变更。
实施例
以下,示出实施例和比较例,对本发明进行具体说明,但本发明并不限定于以下的实施例。
(A)环状酰亚胺化合物
(A-1):下式表示的含有直链亚烷基的马来酰亚胺化合物(BMI-3000:DesignerMolecules Inc.制造)
n≈3(平均值)
(A-2):下式表示的含有直链亚烷基的马来酰亚胺化合物(BMI-2500、DesignerMolecular Inc.制造)
n≈3、m≈3(均为平均值)
(A-3)4,4’-二苯基甲烷双马来酰亚胺(BMI-1000:日本大和化成株式会社制造,比较例用)
(B)通过激光衍射法测定的平均粒径为0.05~20μm的球形二氧化硅微粒和/或氧化铝微粒
(B-1)球形二氧化硅(AdmafineSO-C5,Admatechs制造,通过VMC法制造,平均粒径1.5μm)
(B-2)球形氧化铝(Admafine AO-502,Admatechs制造,通过VMC法制造,平均粒径0.7μm)
(B-3)熔融球形二氧化硅(ES-105,Tokai Minerals制造,平均粒径35μm,比较例用)
(C)能够与(A)成分和(B)成分进行反应的硅烷偶联剂
(C-1)3-甲基丙烯酰氧基丙基三甲氧基硅烷(KBM-503,信越化学工业制造)
(C-2)3-丙烯酰氧基丙基三甲氧基硅烷(KBM-5103,信越化学工业制造)
(C-3)N-苯基-3-氨基丙基三甲氧基硅烷(KBM-573,信越化学工业制造)
(C-4)正己基三甲氧基硅烷(KBM-3063,信越化学工业制造,比较例用)
(D)有机溶剂
(D-1)甲苯
浆料组合物的制造(实施例1~8、比较例1~6)
以表1所示的配合量(质量份)制造了各种浆料组合物。将(A)成分的环状酰亚胺化合物、(B)成分的二氧化硅微粒和/或氧化铝微粒以及(C)成分的硅烷偶联剂(但比较例1和比较例2除外)加入(D)成分的有机溶剂中,用搅拌机进行预混合,制备粗浆料溶液,通过分散器使粗浆料溶液分散,获得了均匀地分散有填料的浆料组合物。对该浆料组合物测定了以下的各特性,将结果示于表1。
凝聚试验
使用贝克式涂布机,以30μm的厚度、A4尺寸的方式将所得到的浆料组合物涂敷在作为支撑基材的厚度38μm聚对苯二甲酸乙二醇酯(PET)制的膜(G2-38,帝人制造)上,并在120℃下使其干燥。在干燥之后,用肉眼观察,将1块聚集体也没有确认到的情况评价为○,即使确认到1块聚集体的情况也评价为×。
粘度测定、触变比的计算
使用JIS K 7117-2:1999中记载的锥板型旋转粘度计,对所获得的浆料组合物测定在25℃、5rpm以及50rpm下进行测定时的粘度。根据该触变比并通过下式计算出触变比。
触变比=(在5rpm下的粘度测定值[Pa·s])/(在50rpm下的粘度测定值[Pa·s])
成型物的制作(实施例9~12、比较例7~8)
接下来,将2质量份的过氧化二枯基(商品名:PERCUMYL D,日本日油制造)添加在实施例1、实施例2、实施例3、实施例5、以及比较例1和比较例3的100质量份的各浆料组合物中,使其溶解。然后,将各浆料组合物注入经聚四氟乙烯涂层处理后的试验片制作用模具中,在100℃、实施1小时的条件下使有机溶剂挥发,然后在175℃下保持2小时,使其固化,获得了JIS K 7161-2:2014中记载的IA型试验片。使用该试验片进行了以下的各种特性。将其结果示于表2。
拉伸强度、拉伸应力以及拉伸强度应变的测定
基于JIS K 7161-1:2014的方法,在25℃下测定了拉伸强度、拉伸应力以及拉伸强度应变。
相对介电常数、电介质损耗角正切的测定
与上述的成型物的制作同样,使各浆料组合物固化,获得了厚度200μm的膜。然后,将网络分析仪(Keysight公司制造E5063-2D5)与带状线(KEYCOM株式会社制造)进行连接,测定了所述膜在频率10GHz下的相对介电常数和电介质损耗角正切。
表2
根据以上的试验结果可知,本发明的浆料组合物的触变性低,并且操作性优异。另外还可知,由该浆料组合物形成的膜的机械特性优异,且相对介电常数、电介质损耗角正切也低,由该浆料组合物形成的成型物适于高频设备用材料。
Claims (9)
1.一种浆料组合物,其含有下述(A)成分~(D)成分,且触变比为3.0以下,
(A)成分:在1个分子中具有至少1个二聚酸骨架、至少1个碳原子数为6以上的直链亚烷基以及至少2个环状酰亚胺基的环状酰亚胺化合物,
(B)成分:通过激光衍射法测定的平均粒径为0.05~20μm的球形二氧化硅微粒和/或氧化铝微粒,
(C)成分:能够与(A)成分和(B)成分进行反应的硅烷偶联剂,
(D)成分:有机溶剂。
4.根据权利要求1~3中任一项所述的浆料组合物,其中,
所述(B)成分的微粒的比例为浆料组合物整体的30质量%以上且95质量%以下。
5.根据权利要求1~3中任一项所述的浆料组合物,其中,
所述(C)成分的硅烷偶联剂为具有(甲基)丙烯酸基和/或氨基的硅烷偶联剂。
6.权利要求1~3中任一项所述的浆料组合物的固化物。
7.根据权利要求6所述的固化物,其为基板。
8.根据权利要求6所述的固化物,其为膜。
9.根据权利要求6所述的固化物,其为预浸料。
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2020
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- 2020-04-01 KR KR1020200039580A patent/KR20200117884A/ko not_active Application Discontinuation
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TW202104363A (zh) | 2021-02-01 |
JP2020169291A (ja) | 2020-10-15 |
US20200317916A1 (en) | 2020-10-08 |
KR20200117884A (ko) | 2020-10-14 |
US11530324B2 (en) | 2022-12-20 |
CN111793209B (zh) | 2023-11-17 |
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