CN111095505B - 半导体装置制造用粘接膜及其制造方法、以及半导体装置及其制造方法 - Google Patents

半导体装置制造用粘接膜及其制造方法、以及半导体装置及其制造方法 Download PDF

Info

Publication number
CN111095505B
CN111095505B CN201880060518.0A CN201880060518A CN111095505B CN 111095505 B CN111095505 B CN 111095505B CN 201880060518 A CN201880060518 A CN 201880060518A CN 111095505 B CN111095505 B CN 111095505B
Authority
CN
China
Prior art keywords
adhesive
film
adhesive sheet
carrier film
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880060518.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN111095505A (zh
Inventor
大久保惠介
夏川昌典
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lishennoco Co ltd
Original Assignee
Lishennoco Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lishennoco Co ltd filed Critical Lishennoco Co ltd
Publication of CN111095505A publication Critical patent/CN111095505A/zh
Application granted granted Critical
Publication of CN111095505B publication Critical patent/CN111095505B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
CN201880060518.0A 2017-09-19 2018-09-18 半导体装置制造用粘接膜及其制造方法、以及半导体装置及其制造方法 Active CN111095505B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2017/033746 WO2019058429A1 (ja) 2017-09-19 2017-09-19 半導体装置製造用接着フィルム及びその製造方法
JPPCT/JP2017/033746 2017-09-19
PCT/JP2018/034513 WO2019059188A1 (ja) 2017-09-19 2018-09-18 半導体装置製造用接着フィルム及びその製造方法、並びに、半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
CN111095505A CN111095505A (zh) 2020-05-01
CN111095505B true CN111095505B (zh) 2023-12-15

Family

ID=65810307

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880060518.0A Active CN111095505B (zh) 2017-09-19 2018-09-18 半导体装置制造用粘接膜及其制造方法、以及半导体装置及其制造方法

Country Status (6)

Country Link
JP (1) JPWO2019059188A1 (ko)
KR (1) KR102578510B1 (ko)
CN (1) CN111095505B (ko)
SG (1) SG11202002552PA (ko)
TW (1) TWI753200B (ko)
WO (2) WO2019058429A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023160001A (ja) * 2022-04-21 2023-11-02 浜松ホトニクス株式会社 光検出装置
WO2023248337A1 (ja) * 2022-06-21 2023-12-28 株式会社レゾナック フィルム、巻回体、接続構造体、及び接続構造体の製造方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1131702A (ja) * 1997-07-11 1999-02-02 Hitachi Cable Ltd 接着シートの貼付方法
JPH11106717A (ja) * 1997-10-01 1999-04-20 Oji Paper Co Ltd 粘着ラベル
JP2002299389A (ja) * 2001-03-30 2002-10-11 Lintec Corp 半導体チップ担持用接着テープ・シート、半導体チップ担持体、半導体チップマウント方法および半導体チップ包装体
CN1533686A (zh) * 2002-05-13 2004-09-29 ���������kҵ��ʽ���� 软膜上芯片用软性印刷线路板
JP2006111727A (ja) * 2004-10-14 2006-04-27 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP2006265411A (ja) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd シート状もしくはペースト状接着剤、電子部品装置の製造方法及び電子部品装置
JP2007009022A (ja) * 2005-06-29 2007-01-18 Sekisui Chem Co Ltd シート状接着剤、電子部品装置の製造方法及び電子部品装置
KR20080081408A (ko) * 2007-03-05 2008-09-10 주식회사 네패스 광검출용 반도체 패키지 및 그 제조 방법
KR20120096897A (ko) * 2011-02-23 2012-08-31 미쓰비시 마테리알 가부시키가이샤 증반사 투명막용 조성물, 발광 소자, 및 발광 소자의 제조 방법
WO2014007116A1 (ja) * 2012-07-03 2014-01-09 東レ株式会社 個片化された接着剤層を有する接着剤シートの製造方法、接着剤シートを用いた配線基板の製造方法、半導体装置の製造方法および接着剤シートの製造装置
JP2014033177A (ja) * 2012-07-12 2014-02-20 Denso Corp 半導体装置の製造方法
CN106739369A (zh) * 2016-12-25 2017-05-31 登封市豫科玻璃技术有限公司 一种具有纳米吸收层的防污护洁屏幕保护膜

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274244A (ja) * 1998-03-20 1999-10-08 Sumitomo Metal Mining Co Ltd 半導体パッケージ支持用金属補強板およびその製造方法
JP5157208B2 (ja) 2006-03-20 2013-03-06 日立化成株式会社 ダイボンドダイシングシート
JP2010129632A (ja) * 2008-11-26 2010-06-10 Toppan Printing Co Ltd 剥離シート付き接着シートおよび金属板貼合装置および金属板貼合方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1131702A (ja) * 1997-07-11 1999-02-02 Hitachi Cable Ltd 接着シートの貼付方法
JPH11106717A (ja) * 1997-10-01 1999-04-20 Oji Paper Co Ltd 粘着ラベル
JP2002299389A (ja) * 2001-03-30 2002-10-11 Lintec Corp 半導体チップ担持用接着テープ・シート、半導体チップ担持体、半導体チップマウント方法および半導体チップ包装体
CN1533686A (zh) * 2002-05-13 2004-09-29 ���������kҵ��ʽ���� 软膜上芯片用软性印刷线路板
JP2006111727A (ja) * 2004-10-14 2006-04-27 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP2006265411A (ja) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd シート状もしくはペースト状接着剤、電子部品装置の製造方法及び電子部品装置
JP2007009022A (ja) * 2005-06-29 2007-01-18 Sekisui Chem Co Ltd シート状接着剤、電子部品装置の製造方法及び電子部品装置
KR20080081408A (ko) * 2007-03-05 2008-09-10 주식회사 네패스 광검출용 반도체 패키지 및 그 제조 방법
KR20120096897A (ko) * 2011-02-23 2012-08-31 미쓰비시 마테리알 가부시키가이샤 증반사 투명막용 조성물, 발광 소자, 및 발광 소자의 제조 방법
WO2014007116A1 (ja) * 2012-07-03 2014-01-09 東レ株式会社 個片化された接着剤層を有する接着剤シートの製造方法、接着剤シートを用いた配線基板の製造方法、半導体装置の製造方法および接着剤シートの製造装置
JP2014033177A (ja) * 2012-07-12 2014-02-20 Denso Corp 半導体装置の製造方法
CN106739369A (zh) * 2016-12-25 2017-05-31 登封市豫科玻璃技术有限公司 一种具有纳米吸收层的防污护洁屏幕保护膜

Also Published As

Publication number Publication date
CN111095505A (zh) 2020-05-01
WO2019058429A1 (ja) 2019-03-28
WO2019059188A1 (ja) 2019-03-28
TWI753200B (zh) 2022-01-21
SG11202002552PA (en) 2020-04-29
JPWO2019059188A1 (ja) 2020-11-19
TW201922513A (zh) 2019-06-16
KR20200055011A (ko) 2020-05-20
KR102578510B1 (ko) 2023-09-13

Similar Documents

Publication Publication Date Title
JP4876451B2 (ja) 接着シート
KR20210074413A (ko) 보호막 형성용 필름 및 보호막 형성용 복합 시트
CN111095505B (zh) 半导体装置制造用粘接膜及其制造方法、以及半导体装置及其制造方法
JP6977588B2 (ja) 半導体装置の製造方法及び接着フィルム
JP2011199307A (ja) 半導体装置の製造方法
CN111133564B (zh) 半导体装置制造用粘接膜以及半导体装置及其制造方法
JP7272400B2 (ja) 接着剤組成物及び接着フィルム、並びに接続体の製造方法
JP5370414B2 (ja) 接着シートの製造方法
WO2023199845A1 (ja) 熱硬化性接着剤組成物、積層フィルム、接続体及びその製造方法
CN110678966B (zh) 半导体加工用胶带
WO2023085167A1 (ja) 熱硬化性接着剤組成物、積層フィルム、接続体及びその製造方法
CN113195668B (zh) 临时固定用树脂组合物、临时固定用树脂膜及临时固定用片、以及半导体装置的制造方法
JP2022154844A (ja) 接着剤片付きフィルム、接続体の製造方法、及び接着剤組成物
JP2024090177A (ja) 熱硬化性接着剤組成物及びその紫外線照射物、積層フィルム、並びに接続体及びその製造方法
JP7035347B2 (ja) 半導体加工用テープ

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Tokyo

Applicant after: Lishennoco Co.,Ltd.

Address before: Tokyo

Applicant before: HITACHI CHEMICAL Co.,Ltd.

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant