WO2019059188A1 - 半導体装置製造用接着フィルム及びその製造方法、並びに、半導体装置及びその製造方法 - Google Patents
半導体装置製造用接着フィルム及びその製造方法、並びに、半導体装置及びその製造方法 Download PDFInfo
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- WO2019059188A1 WO2019059188A1 PCT/JP2018/034513 JP2018034513W WO2019059188A1 WO 2019059188 A1 WO2019059188 A1 WO 2019059188A1 JP 2018034513 W JP2018034513 W JP 2018034513W WO 2019059188 A1 WO2019059188 A1 WO 2019059188A1
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- 238000000113 differential scanning calorimetry Methods 0.000 description 1
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- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
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- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- HZGIOLNCNORPKR-UHFFFAOYSA-N n,n'-bis(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCNCCC[Si](OC)(OC)OC HZGIOLNCNORPKR-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
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- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
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- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
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- 150000003553 thiiranes Chemical group 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
- B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
Definitions
- the present disclosure relates to an adhesive film used in a process of manufacturing a semiconductor device, a method of manufacturing the same, and a semiconductor device and a method of manufacturing the same.
- Patent Document 1 discloses an adhesive sheet (dicing die bonding sheet) having a function of fixing a semiconductor wafer in a dicing step and a function of bonding a semiconductor chip to a substrate in a die bonding step.
- the shape of the semiconductor chip and the shape of the adhesive for bonding the same to the substrate are generally the same.
- these shapes are rectangular or square.
- the area of the substrate to which the semiconductor chip is to be bonded is limited, or when the electrical connection between the semiconductor chip and the substrate is required at a position different from the conventional one, in comparison with the conventional shape.
- An object of the present disclosure is to provide an adhesive film provided with an adhesive piece having a complicated shape which is useful for efficiently performing an adhesion process in a manufacturing process of a semiconductor device, and a method for sufficiently and stably manufacturing the same. I assume. Another object of the present disclosure is to provide a semiconductor device using a complex-shaped adhesive piece and a method of manufacturing the same.
- the present disclosure provides a method of manufacturing an adhesive film used in a manufacturing process of a semiconductor device.
- This manufacturing method comprises the steps of: (A) preparing a laminate having at least a strip-like carrier film having a width of 100 mm or less and an adhesive layer formed to cover the surface of the carrier film, and (B) an adhesive layer And in the order of obtaining a plurality of adhesive pieces arranged on the carrier film so as to be aligned in the longitudinal direction of the carrier film by die-cutting, and when performing die-cutting in the step (B),
- the adhesive layer and the carrier film are incised so as to satisfy the condition represented by inequality (1), and at least one of the convex portion and the concave portion is formed on at least one side of the rectangular or square adhesive piece. It has the following shape. 0 ⁇ D / T ⁇ 0.6 (1) [Wherein, D is the depth (in ⁇ m) of the incision with respect to the carrier film, and T is the thickness (in ⁇ m) of the carrier film. ]
- a belt-like carrier film having a width of 100 mm or less and a plurality of adhesive pieces arranged on the carrier film in the longitudinal direction of the carrier film are provided.
- An adhesive film is produced.
- the step (B) by forming the incision so as to satisfy the condition represented by the inequality (1), the adhesive film of the above configuration can be manufactured sufficiently and stably.
- the adhesive strip has a more complex shape than a rectangular or square, as described above.
- the shape of the adhesive piece may be appropriately set according to the shape of the region of the substrate to which the semiconductor chip is to be bonded or the shape of the semiconductor chip.
- the adhesive strip may have six or more corners, or eight or more corners.
- L-shaped is mentioned as an example of the shape of the adhesive agent piece which has six corners.
- the adhesive film manufactured by the said manufacturing method may further be equipped with the protection member which covers the surface of several adhesive agent pieces. That is, the laminate prepared in the step (A) further includes a protective film disposed so as to cover the adhesive layer, and in the step (B), to satisfy the condition represented by the inequality (1). Notches may be made in the protective film, the adhesive layer and the carrier film.
- the adhesive film is in a state of being covered by the protective member by the protective film being die-cut together with the adhesive layer.
- This protective member covers the second surface opposite to the first surface on the carrier film side of the adhesive piece, and has the same shape as the adhesive piece. By covering the adhesive strip with the protective member, dust and the like can be prevented from adhering to the adhesive strip until the time of use.
- the present disclosure provides an adhesive film used in a semiconductor device manufacturing process.
- the adhesive film includes a carrier film having a width of 100 mm or less, a plurality of adhesive pieces arranged on the carrier film in the longitudinal direction of the carrier film, and a carrier film along the outer edge of the adhesive pieces.
- the depth of the incision and the thickness of the carrier film satisfy the condition represented by inequality (1) below, and the adhesive strip has a convex portion and a convex portion on at least one side of the rectangle or the square: At least one of the recesses has a formed shape. 0 ⁇ D / T ⁇ 0.6 (1) [Wherein, D is the depth (in ⁇ m) of the incision with respect to the carrier film, and T is the thickness (in ⁇ m) of the carrier film. ]
- a plurality of adhesive pieces arranged to be aligned on the carrier film can be sequentially picked up, and then each adhesive piece can be arranged in a predetermined area of the substrate, and the substrate and the semiconductor chip Can be carried out efficiently.
- the shape of the adhesive piece may be appropriately set according to the shape of the region of the substrate to which the semiconductor chip is to be bonded or the shape of the semiconductor chip.
- the thickness of the carrier film is, for example, 10 to 200 ⁇ m.
- the size and the number of adhesive pieces disposed on the carrier film may be appropriately set according to the design of the semiconductor device to be manufactured.
- the area of one adhesive strip can range from 10 to 200 mm 2 .
- the percentage of the area of the surface of the carrier film covered by the plurality of adhesive pieces can be 10 to 60% based on the area of the carrier film.
- An array of one or more adhesive strips may be formed on the carrier film.
- the adhesive film covers a second surface opposite to the first surface on the carrier film side of the adhesive piece, and may further include a protective member having the same shape as the adhesive piece. By covering the adhesive strip with the protective member, dust and the like can be prevented from adhering to the adhesive strip until the time of use.
- the adhesive force between the carrier film and the adhesive strip is from the viewpoint of the processability of the adhesive film (from the point of preventing the adhesive strip from being inadvertently peeled off from the carrier film during and after die cutting). It is preferable that it is 2 N / m or more.
- an adhesive film provided with an adhesive strip having a complicated shape which is useful for efficiently performing an adhesion step in a manufacturing process of a semiconductor device, and a method for sufficiently and stably manufacturing the same.
- a semiconductor device using a complex-shaped adhesive piece and a method of manufacturing the same are provided.
- FIG. 1 is a perspective view schematically showing an embodiment of an adhesive film according to the present disclosure.
- FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. 3 (a) to 3 (f) are plan views showing variations of the shape of the adhesive piece.
- FIG. 4 is a plan view showing an example of the arrangement of T-shaped adhesive pieces and semiconductor chips.
- FIG. 5: is sectional drawing which shows typically the laminated body on which the carrier film, the adhesive bond layer, and the protective film were laminated
- FIG. 6 is a perspective view showing how a plurality of adhesive pieces are formed on the carrier film by die cutting.
- FIG. 7 is a cross-sectional view schematically showing how the adhesive strip and the protective member covering the adhesive strip are picked up from the carrier film.
- FIG. 8 is a cross-sectional view schematically showing an example of a semiconductor device manufactured using the adhesive strip according to the present disclosure.
- Fig.9 (a) is sectional drawing which shows typically the apparatus used for evaluation of pick-up property in an Example and a comparative example, Comprising: The cross section which shows a mode that an adhesive agent peels from a carrier film in the corner part of a double clip. It is a figure, FIG.9 (b) is sectional drawing which shows a mode that an adhesive piece passes a corner part, closely_contact
- (meth) acrylic means acrylic or methacrylic.
- FIG. 1 is a perspective view schematically showing an adhesive film according to the present embodiment.
- FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG.
- Adhesive films 10 shown in these figures are a band-like carrier film 1 having a width of 100 mm or less, and a plurality of carrier films 1 arranged on the carrier film 1 in the longitudinal direction (direction of arrow X shown in FIG. 1).
- Adhesive film 3p, protective member 5p covering surface F2 of adhesive film 3p and having the same shape as adhesive film 3p, and carrier film 1 formed along the outer edge of adhesive film 3p And an incision 1c.
- the surface F2 (second surface) of the adhesive piece 3p is a surface opposite to the surface F1 (first surface) of the adhesive piece 3p on the carrier film 1 side.
- the adhesive film 10 is applicable to various adhesion processes (for example, adhesion of a semiconductor chip and a substrate) in a manufacturing process of a semiconductor device.
- a plurality of adhesive pieces 3p arranged to line up on the carrier film 1 can be sequentially picked up, and then each adhesive piece 3p can be arranged in a predetermined area of the substrate, and the substrate
- the step of bonding the semiconductor chip to the semiconductor chip can be carried out efficiently.
- FIGS. 1 and 2 show the case where one row 3A of a plurality of adhesive pieces 3p is provided on the carrier film 1, two or more rows 3A are provided on the carrier film 1. It may be done.
- the adhesive agent piece 3p which concerns on this embodiment has a shape (T character shape) like a thick T character, as shown in FIG.
- This shape has eight angles C1 to C8, as shown in FIG. 3 (a).
- this shape can be said to be a shape in which one convex portion is formed at the central part of one side of a rectangle, and it can also be said to be a shape in which one recess is formed at each end of one side of a rectangle. .
- the shape of the adhesive piece 3p is not limited to the shape shown in FIG. 3A, and may be a shape in which at least one of a convex portion and a concave portion is formed on at least one side of a rectangle or a square.
- it may be L-shaped, and may have six corners C1 to C6.
- FIG. 3C it may have a shape in which one recess is formed in a rectangle or a square, and may have eight corners C1 to C8.
- a recess is formed at one corner (lower left in FIG. 3D) of a rectangle or square and a protrusion is formed on one side (right side in FIG. 3D).
- a convex portion is formed on one side of a rectangle or a square, and a concave portion is formed on the other side, and has twelve corners C1 to C12. It is also good.
- the shape of a recessed part or a convex part may be a triangle or circular arc shape, as shown to FIG. 3 (f).
- the shape of the adhesive piece may be appropriately set according to the shape of the region of the substrate to which the semiconductor chip is to be bonded or the shape of the semiconductor chip.
- the shape of the semiconductor chip is, for example, rectangular or square, and a plurality of terminals are provided at the corners, and it is necessary to connect these terminals to the wiring of the substrate, the terminals and the wiring are adhesive pieces
- the shape of the adhesive strip may be determined so that it does not overturn.
- FIG. 4 is a plan view showing an example of the arrangement of the T-shaped adhesive piece 3p and the rectangular semiconductor chip S. As shown in FIG. In the regions R1 and R2 shown in FIG. 4, no adhesive is present between the substrate and the semiconductor chip, and the substrate and the semiconductor chip can be electrically connected in these regions R1 and R2.
- the adhesive strip 3p in this embodiment is assumed to have a sufficiently small size, and the area of one adhesive strip 3p is, for example, 10 to 200 mm 2 , 20 to 160 mm 2 or 25 to 100 mm 2 . It may be.
- the ratio of the area (area ratio of adhesive pieces) on the surface of the carrier film 1 and covered by the plurality of adhesive pieces 3p is, for example, 10 to 60% based on the area of the carrier film 1; It may be 10 to 35% or 15 to 33%.
- the adhesive piece 3p and the protective member 5p covering the adhesive piece 3p are formed by die cutting (see FIG. 6). At the time of die cutting, cuts 1c are formed in the carrier film 1 along the outer edge of the adhesive piece 3p. Assuming that the depth of the cut 1c with respect to the carrier film 1 is D ⁇ m and the thickness of the carrier film is T ⁇ m (see FIG. 2), the depth of the cut 1c satisfies the condition represented by the following inequality (1) and the inequality (2) It is preferable that the condition shown by) be satisfied, and it is more preferable that the condition shown by inequality (3) be satisfied. 0 ⁇ D / T ⁇ 0.6 (1) 0.1 ⁇ D / T ⁇ 0.6 (2) 0.15 ⁇ D / T ⁇ 0.6 (3)
- the mold removal shown in FIG. It can be implemented. Specifically, the adhesive piece 3 p and the protective member 5 p can be sufficiently suppressed from remaining on the unnecessary portion 30 side without adhering to the carrier film 1.
- the pickup shown in FIG. 7 can be suitably implemented by setting the value of D / T to a value smaller or smaller than the upper limit values of the above inequalities (1) to (3).
- the adhesive film 10 is made to abut on the carrier film 1 side of the adhesive film 10 in the direction of the arrow shown in FIG. As shown in the figure, the front of the adhesive piece 3p and the protective member 5p is likely to float from the carrier film 1 by moving.
- the adhesive composition constituting the adhesive piece 3p is likely to be insufficient in pick-up property because it enters the incision 1c.
- the adhesive composition constituting the adhesive piece 3p adheresive layer 3
- the value of D / T tends to be excessively large (the incision 1c becomes excessively deep). It is in. It is inferred that the pressing force promotes the adhesion of the adhesive composition into the incision 1c, and the adhesive composition is likely to come out of the protective member 5p.
- the protrusion distance of the adhesive composition from the outer edge of the protective member 5p is less than 40 ⁇ m from the viewpoint of pick up property when using the adhesive film 10.
- the carrier film 1 is band-like and has a width of 100 mm or less.
- the width of the carrier film 1 may be appropriately set in accordance with the size of the adhesive piece 3p disposed thereon and the number of rows 3A.
- the width of the carrier film 1 is preferably 10 to 50 mm, and may be 10 to 30 mm or 10 to 20 mm.
- the width of the carrier film 1 is 10 mm or more, when the roll-to-roll method is adopted, it is easy to prevent the deterioration in workability caused by the twisting of the carrier film 1.
- the material of the carrier film 1 is not particularly limited as long as it can sufficiently withstand the tension applied in the manufacturing process of the adhesive film 10 and the manufacturing process of the semiconductor device.
- the carrier film 1 is preferably transparent from the viewpoint of the visibility of the adhesive piece 3p and / or the protective member 5p disposed thereon.
- the carrier film 1 may be a polyester film such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinyl acetate film, poly-4-methylpentene-1, ethylene-vinyl acetate co
- a polyolefin film such as a polymer, a homopolymer or copolymer such as ethylene-ethyl acrylate copolymer, or a mixture thereof, a plastic film such as a polyvinyl chloride film or a polyimide film, or the like can be used.
- the carrier film 1 may have a single layer structure or a multilayer structure.
- the thickness of the carrier film 1 may be appropriately selected within a range that does not impair the workability, and is, for example, 10 to 200 ⁇ m, and may be 20 to 100 ⁇ m or 25 to 80 ⁇ m. These thickness ranges are practically acceptable and economically effective.
- the carrier film 1 it is also possible to use a low surface energy film made of a fluorocarbon resin.
- a film for example, A-63 (release treatment agent: modified silicone type) manufactured by Teijin Film Solutions Ltd., and A-31 (release treatment agent: Pt type manufactured by Teijin Film Solutions Ltd.) There are silicone type etc.
- the surface of the carrier film 1 is separated from silicone release agent, fluorine release agent, long chain alkyl acrylate release agent, etc. You may form the release layer comprised from a mold agent.
- the adhesion between the carrier film 1 and the adhesive strip 3p is preferably 2 N / m or more, more preferably 2 to 10 N / m, and 2 to 6 N / m or 2 to 4 N / m. May be When the adhesion is 2 N / m or more, it is easy to prevent the adhesive piece 3p from being peeled carelessly from the carrier film 1 in the process of producing the adhesive film 10, and on the other hand, 10 N / m or less Thus, when using the adhesive film 10, it is easy to stably pick up the adhesive strip 3p and the protective member 5p covering the adhesive strip 3p from the carrier film 1.
- the adhesion of the adhesive strip 3p to the carrier film 1 means 90 ° peel strength.
- an adhesive layer of 20 mm in width made of the same composition as the adhesive strip 3p is formed on the carrier film 1
- the prepared sample is prepared, which means the peel strength measured when the adhesive layer is peeled from the carrier film at an angle of 90 ° and a peeling speed of 50 mm / min.
- the adhesive strip 3p is formed by simultaneously die-cutting the adhesive layer 3 formed to cover the surface of the carrier film 1 and the protective film 5 disposed to cover the adhesive layer 3 to form a protective member 5p. (See FIG. 6).
- the thickness of the adhesive piece 3p may be appropriately selected within a range that does not impair the workability, and is, for example, 3 to 50 ⁇ m, and may be 5 to 40 ⁇ m or 7 to 30 ⁇ m. Sufficient adhesion can be easily secured by the thickness of the adhesive strip 3p being 3 ⁇ m or more, and the adhesive composition constituting the adhesive strip 3p can be protruded from the protective member 5p by being 50 ⁇ m or less It is easy to control.
- the adhesive composition constituting the adhesive strip 3p only needs to have properties (for example, adhesiveness and heat resistance to heat of about 150 ° C.) that can be used without problems in the manufacturing process of the semiconductor device. What is used in the manufacturing process of the semiconductor device may be adopted appropriately.
- the adhesive strip 3p preferably contains a thermoplastic resin, a thermosetting resin, a curing accelerator, and a filler, and may contain a photoreactive monomer, a photopolymerization initiator, and the like as necessary. With the thinning of substrates, substrates having low heat resistance tend to be used, and there is a need to lower the temperature of the manufacturing process of semiconductor devices. It is preferable that the adhesive strip 3p can adhere an object under temperature conditions of 160 ° C. or less.
- thermoplastic resin a resin having thermoplasticity or a resin having thermoplasticity at least in an uncured state and forming a crosslinked structure after heating can be used.
- a thermoplastic resin as a tape for processing a semiconductor, a (meth) acrylic copolymer (hereinafter referred to as “reactive group-containing (meth) acrylic copolymer”) having a reactive group from the viewpoint of being excellent in shrinkage, heat resistance and peelability. It may be called "polymer”) is preferable.
- the adhesive piece 3p may not include the thermosetting resin. That is, the aspect containing a reactive group containing (meth) acrylic copolymer, a hardening accelerator, and a filler may be sufficient.
- a thermoplastic resin can be used individually by 1 type or in combination of 2 or more types.
- Examples of the (meth) acrylic copolymer include (meth) acrylic acid ester copolymers such as acrylic resin and acrylic rubber, and acrylic rubber is preferable.
- the acrylic rubber preferably comprises an acrylic ester as a main component and is formed by copolymerization of a monomer selected from (meth) acrylic ester and acrylonitrile.
- (meth) acrylic acid esters methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, hexyl acrylate, cyclohexyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, Examples thereof include isopropyl acrylate, butyl methacrylate, isobutyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate and the like.
- (meth) acrylic acid ester copolymer a copolymer containing butyl acrylate and acrylonitrile as a copolymer component, and a copolymer containing ethyl acrylate and acrylonitrile as a copolymer component are preferable.
- the reactive group-containing (meth) acrylic copolymer is preferably a reactive group-containing (meth) acrylic copolymer containing a (meth) acrylic monomer having a reactive group as a copolymerization component.
- a reactive group-containing (meth) acrylic copolymer can be obtained by copolymerizing a monomer composition containing a (meth) acrylic monomer having a reactive group and the above-described monomer. .
- the reactive group is preferably an epoxy group, a carboxyl group, an acryloyl group, a methacryloyl group, a hydroxyl group or an episulfide group from the viewpoint of heat resistance improvement, and from the viewpoint of crosslinkability, an epoxy group and a carboxyl group are more preferable.
- the reactive group-containing (meth) acrylic copolymer is preferably an epoxy group-containing (meth) acrylic copolymer containing a (meth) acrylic monomer having an epoxy group as a copolymerization component.
- the (meth) acrylic monomer having an epoxy group glycidyl acrylate, 4-hydroxybutyl acrylate glycidyl ether, 3,4-epoxycyclohexyl methyl acrylate, glycidyl methacrylate, 4-hydroxybutyl methacrylate glycidyl ether, 3,4- Epoxy cyclohexyl methyl methacrylate and the like can be mentioned.
- the (meth) acrylic monomer having a reactive group is preferably glycidyl acrylate or glycidyl methacrylate from the viewpoint of heat resistance.
- the Tg of the thermoplastic resin is preferably ⁇ 50 ° C. to 50 ° C.
- the Tg of the thermoplastic resin is 50 ° C. or less, the flexibility of the adhesive piece 3 p can be easily secured.
- the unevenness is present when pasted to the adherend, it becomes easy to follow and has appropriate adhesiveness.
- the Tg of the thermoplastic resin is ⁇ 50 ° C. or higher, it is easy to suppress the flexibility of the adhesive piece 3 p from becoming too high, and excellent handleability, adhesiveness, and releasability can be achieved.
- the Tg of a thermoplastic resin is the midpoint glass transition temperature value obtained by differential scanning calorimetry (DSC). Specifically, the Tg of the thermoplastic resin is an intermediate value calculated by the method according to JIS K 7121: 1987, measuring the change in heat quantity under the conditions of a temperature rising rate of 10 ° C./min and a measuring temperature of -80 to 80 ° C. It is a point glass transition temperature.
- the weight average molecular weight of the thermoplastic resin is preferably 100,000 or more and 2,000,000 or less.
- the weight average molecular weight is 100,000 or more, heat resistance can be easily secured when used for temporary fixation.
- the weight average molecular weight of the thermoplastic resin is more preferably 500,000 or more and 2,000,000 or less, and still more preferably 1,000,000 or more and 2,000,000 or less.
- a weight average molecular weight is a polystyrene conversion value which used the calibration curve by standard polystyrene by the gel permeation chromatography method (GPC).
- the total content of these is 0.1 to 20% by mass based on the total amount of the copolymerization component.
- the content is preferably 0.5 to 15% by mass, and more preferably 1.0 to 10% by mass. If the content is within the above range, it is easy to achieve all of the flexibility, adhesiveness and releasability of the adhesive strip 3p to a higher level.
- the (meth) acrylic copolymer having a reactive group as described above one obtained by a polymerization method such as pearl polymerization or solution polymerization may be used.
- a commercial product such as HTR-860P-3CSP (trade name, manufactured by Nagase ChemteX Co., Ltd.) may be used.
- thermosetting resin Any thermosetting resin can be used without particular limitation as long as it can be cured by heat.
- thermosetting resin epoxy resin, acrylic resin, silicone resin, phenol resin, thermosetting polyimide resin, polyurethane resin, melamine resin, urea resin, etc. may be mentioned. These can be used singly or in combination of two or more.
- the epoxy resin is not particularly limited as long as it cures and has a heat-resistant function.
- a bifunctional epoxy resin such as bisphenol A epoxy, a novolac epoxy resin such as phenol novolac epoxy resin, and a cresol novolac epoxy resin can be used.
- the epoxy resin conventionally known ones such as polyfunctional epoxy resin, glycidyl amine type epoxy resin, heterocycle-containing epoxy resin, alicyclic epoxy resin and the like can be used.
- Examples of the phenol novolac epoxy resin include Epicoat 152, Epicoat 154 (all manufactured by Mitsubishi Chemical Co., Ltd.), EPPN-201 (manufactured by Nippon Kayaku Co., Ltd.), DEN-438 (manufactured by Dow Chemical Co.) and the like.
- o-cresol novolac type epoxy resin As o-cresol novolac type epoxy resin, YDCN-700-10 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027 (all of them) Nippon Kayaku Co., Ltd., YDCN 701, YDCN 702, YDCN 703, YDCN 704 (all manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) and the like.
- Epon 1031S made by Mitsubishi Chemical Corporation
- araldite 0163 made by BASF Japan Ltd.
- Denacol EX-611, EX-614, EX-614B, EX-622, EX-512, EX-521 And EX-421, EX-411 and EX-321 all of which are manufactured by Nagase ChemteX Co., Ltd.
- amine type epoxy resin Epicoat 604 (made by Mitsubishi Chemical Corporation), YH-434 (made by Nippon Steel & Sumikin Chemical Co., Ltd.), TETRAD-X, TETRAD-C (all are made by Mitsubishi Gas Chemical Co., Ltd.), ELM-120 (Manufactured by Sumitomo Chemical Co., Ltd.) and the like.
- heterocycle-containing epoxy resin include Araldite PT810 (manufactured by BASF Japan Ltd.), ERL 4234, ERL 4299, ERL 4221, and ERL 4206 (all manufactured by Union Carbide). These epoxy resins can be used singly or in combination of two or more.
- the epoxy resin curing agent which is a part of the thermosetting resin component
- a commonly used known resin can be used. Specifically, amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, bisphenol A, bisphenol F, bisphenols having two or more phenolic hydroxyl groups in one molecule such as bisphenol S, phenol novolac resin And phenol resins such as bisphenol A novolac resin and cresol novolac resin.
- phenol resins such as phenol novolac resin, bisphenol A novolac resin, and cresol novolac resin are preferable from the viewpoint of being excellent in electrolytic corrosion resistance at the time of moisture absorption.
- the epoxy curing agent may be used simultaneously with the epoxy resin or may be used alone.
- Phenolite LF 4871, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, Phenolite VH 4170 (all manufactured by DIC Corporation, trade names), H-1 (Meiwa) Made by Kasei Co., Ltd., trade name, Epicure MP402FPY, Epicure YL6065, Epicure YLH129B65, Mirex XL, Mirex XLC, Mirex XLC-LL, Mirex RN, Mirex RS, Mirex VR (all are manufactured by Mitsubishi Chemical Corporation, etc.), etc. It is preferable to use a material having the following structure.
- the content of the thermosetting resin in the adhesive piece 3p is preferably 10 to 500 parts by mass, more preferably 30 to 450 parts by mass, and still more preferably 50 to 400 parts by mass with respect to 100 parts by mass of the thermoplastic resin. It is easy to achieve the outstanding adhesiveness after thermosetting of adhesive piece 3p as content of a thermosetting resin is in a mentioned range.
- adhesive piece 3p contains the (meth) acrylic copolymer which has an epoxy group
- the hardening accelerator which promotes hardening of the epoxy group contained in the said acrylic copolymer.
- curing accelerators that promote curing of epoxy groups include phenolic curing agents, acid anhydride curing agents, amine curing agents, imidazole curing agents, imidazoline curing agents, triazine curing agents, and phosphine curing agents. It can be mentioned. Among these, from the viewpoint of rapid curing, heat resistance and releasability, an imidazole-based curing agent which can be expected to shorten the process time and improve the workability is preferable. These compounds can be used singly or in combination of two or more.
- the content of the curing accelerator in the adhesive strip 3p is preferably 0.01 to 50 parts by mass, more preferably 0.02 to 20 parts by mass, and more preferably 0.025 to 10 parts by mass with respect to 100 parts by mass of the thermoplastic resin. Parts are more preferred. It exists in the tendency which can fully suppress the fall of storage stability, improving the hardenability of adhesive agent piece 3p as content of a hardening accelerator is in the said range.
- the adhesive strip 3p preferably contains an inorganic filler.
- the inorganic filler include metal fillers such as silver powder, gold powder and copper powder, and nonmetallic inorganic fillers such as silica, alumina, boron nitride, titania, glass, iron oxide and ceramic.
- the inorganic filler can be selected according to the desired function.
- the inorganic filler preferably has an organic group on the surface.
- the surface of the inorganic filler is modified with an organic group, so that the dispersibility in an organic solvent when preparing a varnish for forming the adhesive strip 3p, and the high elastic modulus and the excellent peeling of the adhesive strip 3p It is easy to make
- the inorganic filler having an organic group on the surface can be obtained, for example, by mixing a silane coupling agent represented by the following formula (B-1) and an inorganic filler and stirring at a temperature of 30 ° C. or more. It can be confirmed by UV measurement, IR measurement, XPS measurement or the like that the surface of the inorganic filler has been modified by the organic group.
- X represents an organic group selected from the group consisting of phenyl group, glycidoxy group, acryloyl group, methacryloyl group, mercapto group, amino group, vinyl group, isocyanate group and methacryloxy group;
- Is an integer of 0 or 1 to 10.
- R 11 , R 12 and R 13 each independently represent an alkyl group having 1 to 10 carbon atoms.
- alkyl group having 1 to 10 carbon atoms examples include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, isopropyl group and isobutyl group.
- the alkyl group having 1 to 10 carbon atoms is preferably a methyl group, an ethyl group and a pentyl group from the viewpoint of easy availability.
- X is preferably an amino group, a glycidoxy group, a mercapto group and an isocyanate group, and more preferably a glycidoxy group and a mercapto group.
- s in the formula (B-1) is preferably 0 to 5, and more preferably 0 to 4.
- trimethoxyphenylsilane dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, N- (2 -Aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycide Xylpropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-isocyanatopropyltrie
- 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane are preferable, trimethoxyphenylsilane, 3-glycidoxy Propyltrimethoxysilane and 3-mercaptopropyltrimethoxysilane are more preferred.
- the silane coupling agent can be used singly or in combination of two or more.
- the content of the coupling agent is preferably 0.01 to 50 parts by mass, and 0.05 to 20 parts by mass, with respect to 100 parts by mass of the inorganic filler, from the viewpoint of achieving a balance between heat resistance and storage stability.
- the amount is more preferably 0.5 to 10 parts by mass from the viewpoint of heat resistance improvement.
- the content of the inorganic filler in the adhesive piece 3p is preferably 600 parts by mass or less, more preferably 500 parts by mass or less, and 400 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin. More preferable.
- the lower limit of the content of the inorganic filler is not particularly limited, but is preferably 5 parts by mass or more, and more preferably 8 parts by mass or more with respect to 100 parts by mass of the thermoplastic resin.
- Adhesive piece 3 p may contain an organic filler.
- the organic filler include carbon, rubber fillers, silicone particles, polyamide particles and polyimide particles. 300 mass parts or less are preferable with respect to 100 mass parts of thermoplastic resins, as for content of an organic filler, 200 mass parts or less are more preferable, and 100 mass parts or less are still more preferable.
- the lower limit of the content of the organic filler is not particularly limited, but is preferably 5 parts by mass or more with respect to 100 parts by mass of the thermoplastic resin.
- the adhesive strip 3p may be diluted with an organic solvent, if necessary.
- the organic solvent is not particularly limited, but can be determined in consideration of the volatility and the like at the time of film formation from the boiling point.
- relatively low boiling point solvents such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, xylene, etc. It is preferable from the viewpoint of difficulty in curing.
- a solvent having a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, cyclohexanone and the like. These solvents can be used singly or in combination of two or more.
- the protective member 5 p simultaneously cuts off the adhesive layer 3 formed so as to cover the surface of the carrier film 1 and the protective film 5 arranged so as to cover the adhesive layer 3 to form an adhesive piece 3 p. (See FIG. 6).
- the protective member 5p according to the present embodiment is formed at the same time as the adhesive piece 3p by die cutting, and thus has substantially the same shape as the adhesive piece 3p.
- the protective film 5 may be a film which can be punched out in the manufacturing process of the adhesive film 10 and can easily peel the protective member 5p from the adhesive piece 3p in the manufacturing process of the semiconductor device.
- the adhesion between the adhesive strip 3p and the protective member 5p is preferably 16 N / m or less, more preferably 10 N / m or less, and 5 N / m or less or 4.5 N / m or less It is also good.
- the adhesive strip 3p is made of a thermosetting resin composition, it is preferable that the adhesion of the protective member 5p to the adhesive strip 3p be in the above range after heat treatment at 100 ° C. for 10 minutes.
- the adhesion is 16 N / m or less, the adhesive strip 3p in a state of being covered with the protective member 5p is temporarily crimped to an adherend (for example, a substrate) under conditions of 100 ° C. for 3 seconds, for example.
- the adhesion of the protective member 5p to the adhesive strip 3p means 90 ° peel strength, and specifically, a protective film of the same width on a 20 mm wide adhesive layer made of the same composition as the adhesive strip 3p. Means a peel strength which is measured when the prepared sample is prepared and this protective film is peeled from the adhesive layer at an angle of 90 ° and a peeling speed of 300 mm / min.
- polyester-based films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinyl acetate film, poly-4-methylpentene-1, ethylene-vinyl acetate co
- a polyolefin film such as a polymer, a homopolymer or copolymer such as ethylene-ethyl acrylate copolymer, or a mixture thereof, a plastic film such as a polyvinyl chloride film or a polyimide film, or the like can be used.
- the protective film 5 may have a single layer structure or a multilayer structure.
- the thickness of the protective film 5 may be appropriately selected within a range that does not impair the workability, and is, for example, 10 to 200 ⁇ m, and may be 20 to 100 ⁇ m or 25 to 80 ⁇ m. These thickness ranges are practically acceptable and economically effective.
- the light transmittance of the protective member 5 p is preferably lower than the light transmittance of the carrier film 1.
- a device such as a camera
- the manufacturing method of the present embodiment includes the following steps.
- FIG. 5 is sectional drawing which shows typically the laminated body 20 prepared by (A) process.
- the laminate 20 can be produced as follows. First, the raw material resin composition of the adhesive layer 3 is dissolved in a solvent such as an organic solvent to prepare a varnished coating liquid. The coating liquid is applied onto the carrier film 1 and then the solvent is removed to form the adhesive layer 3.
- the coating method may, for example, be a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method or a curtain coating method. Next, the protective film 5 is attached to the surface of the adhesive layer 3 under the conditions of normal temperature to 60 ° C. Thereby, the laminated body 20 can be obtained.
- the laminated film is produced by bonding together the protective film 5 so that this may be covered, and this is cut
- FIG. 6 is a perspective view showing how a plurality of adhesive pieces 3p and a protective member 5p covering the adhesive pieces 3p are formed on the carrier film 1 by die cutting in the (B) step.
- the laminate 20 passes between the rotating body 51 having a plurality of blades 51 c for carrying out the die cutting on the outer peripheral surface and the roll 52 paired with the rotating body 51.
- An adhesive piece 3p and a protection member 5p according to the shape of the blade 51c are continuously formed on the carrier film 1.
- the surface on the protective film 5 side of the laminate 20 faces the rotating body 51
- the surface on the carrier film 1 side faces the roll 52.
- the depth of the cut formed in the laminate 20 by the blade 51c by adjusting the distance between the rotation shaft 51a of the rotating body 51 and the rotation shaft 52a of the roll 52 or changing the height of the blade 51c Can be adjusted.
- the cut 1c is formed in the carrier film 1 along the outer edge of the adhesive piece 3p.
- the depth of the cut 1c with respect to the carrier film 1 is D ⁇ m and the thickness of the carrier film is T ⁇ m (see FIG. 2)
- the depth of the cut 1c satisfies the condition represented by the following inequality (1) and the inequality (2)
- the condition shown by be satisfied, and it is more preferable that the condition shown by inequality (3) be satisfied.
- the mold removal shown in FIG. 6 can be suitably performed.
- the pickup shown in FIG. 7 can be suitably implemented by setting the value of D / T to a value smaller or smaller than the upper limit values of the above inequalities (1) to (3).
- the laminate 20 which has passed between the rotating body 51 and the roll 52 is separated into the adhesive film 10 and the unnecessary portion 30 as shown in FIG. 6, and is wound around each reel (not shown).
- the unnecessary portion 30 includes the adhesive layer 3 and the protective film 5 in which the adhesive piece 3 p and the protective member 5 p are hollowed out.
- FIG. 7 is a cross-sectional view schematically showing how the adhesive strip 3p and the protective member 5p covering the adhesive strip 3p are picked up from the carrier film 1.
- the adhesive film 10 is moved in the direction of the arrow shown in FIG. 7 while bringing the surface of the adhesive film 10 on the carrier film 1 side into contact with the wedge shaped member 60 in a state where a constant tension is applied to the adhesive film 10.
- the front of the adhesive agent piece 3p and the protection member 5p will be in the state which floated from the carrier film 1.
- FIG. 7 is a cross-sectional view schematically showing how the adhesive strip 3p and the protective member 5p covering the adhesive strip 3p are picked up from the carrier film 1.
- the adhesive strip 3p and the protective member 5p are picked up by the pickup device 65 having a suction force.
- the pickup device 65 having a suction force.
- the adhesive strip 3p in a state of being covered by the protective member 5p is disposed at a predetermined position and direction of the substrate (not shown).
- temporary pressure bonding of the adhesive piece 3p to the substrate is performed.
- the temporary pressure bonding may be performed, for example, at a temperature of 60 to 150 ° C. and a pressing force of 0.03 to 1 MPa for 0.1 to 10 seconds.
- the adhesive piece 3p is in close contact with the substrate to such an extent that the adhesive piece 3p is weak but does not peel off from the substrate.
- the protective member 5p is peeled off from the adhesive piece 3p using an adhesive tape or the like.
- the semiconductor chip is crimped to the substrate.
- the pressure bonding may be performed, for example, at a temperature of 60 to 150 ° C. under a pressure of 0.05 to 1 MPa for 0.1 to 10 seconds.
- the heating temperature is desirably low, the pressure bonding temperature is preferably 160 ° C. or less, and the heat curing temperature thereafter is also preferably 160 ° C. or less.
- FIG. 8 is a cross-sectional view schematically showing an example of a semiconductor device manufactured using the adhesive piece 3p.
- the semiconductor device 100 shown in the figure is disposed between the semiconductor chip S, the substrate 50 to which the semiconductor chip S is electrically connected, and the semiconductor chip S and the substrate 50.
- the semiconductor chip S and the substrate 50 And an adhesive strip 3p for bonding the
- the shape of the semiconductor chip S is, for example, rectangular or square, while the shape of the adhesive piece 3p is T-shaped, and the shape of the semiconductor chip S is different from the shape of the adhesive piece 3p.
- the substrate 50 and the semiconductor chip S can be electrically connected by the conductive materials A1 and A2 in the regions R1 and R2.
- the method of manufacturing the semiconductor device 100 includes the steps of preparing a laminate (not shown) in which the substrate 50, the adhesive piece 3p, and the semiconductor chip S are laminated in this order, and heating the laminate. Bonding the substrate 50 and the semiconductor chip S via The temperature for bonding the substrate 50 and the semiconductor chip S is preferably a low temperature, for example, 160 ° C. or less.
- this indication is not limited to the above-mentioned embodiment.
- the case where the colored protective film 5 is used is illustrated so that the presence or absence, the direction, etc. of the protective member 5p can be grasped by a camera or the like, but instead of this, a predetermined protective member 5p is used.
- the position of may be marked.
- it is set as the aspect by which the adhesive agent piece 3p was colored it is not necessary to provide the protection member 5p.
- the direction of the adhesive piece 3p does not matter (for example, when the shape of the adhesive piece 3p is circular), it is not necessary to identify the direction.
- Example 1 (Preparation of adhesive varnish) An adhesive varnish was obtained by mixing the following materials and vacuum degassing.
- Thermoplastic resin: HTR-860P-3 (trade name, manufactured by Nagase ChemteX Co., Ltd., glycidyl group-containing acrylic rubber, molecular weight 1,000,000, Tg-7 ° C.) 100 parts by mass
- Thermosetting resin: YDCN-700-10 (Trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., o-cresol novolac epoxy resin, epoxy equivalent weight 210) 30 parts by mass
- Thermosetting resin: LF-4871 (trade name, manufactured by DIC, bisphenol A epoxy resin, Epoxy equivalent 118) 95 parts by mass
- Thermosetting resin: YDF-8170C (trade name, manufactured by Nippon Steel Sumikin Chemical Co., Ltd., bisphenol F type epoxy resin, epoxy equivalent 157) 100 parts by mass Curing accelerator: 2PZ-CN (com
- the adhesive varnish was applied onto surface release-treated polyethylene terephthalate (manufactured by Teijin Film Solutions Co., Ltd., trade name: Teijin Tetron Film A-53, thickness T: 38 ⁇ m). After the drying step, a film having a 25 ⁇ m-thick adhesive layer formed on one side of the polyethylene terephthalate film (carrier film) was obtained. A laminated film was obtained by laminating this film and a colored 50 ⁇ m-thick polyethylene film (manufactured by Tamapoly Co., Ltd., TDM-1). By slitting this laminated film to a width of 15 mm, a strip-like laminated body was obtained.
- the laminated film obtained as described above was die-cut by using an apparatus having a configuration shown in FIG. 6 to obtain an adhesive film according to this example.
- the shape of the adhesive piece was a shape (area: 29 mm 2 ) in which a corner of a part of a rectangle of about 7 mm in length ⁇ about 6 mm in width was missing.
- the pitch P was about 9 mm.
- the depth D of the incision was obtained by measuring each depth on the basis of an electron microscope image at any 10 locations of the incision formed in the carrier film, and was taken as the average value. The same applies to the following examples and comparative examples.
- Example 2 An adhesive film was produced in the same manner as in Example 1 except that a carrier film having a different surface treatment from that of the carrier film used in Example 1 was used, and the depth D of the cuts in the carrier film was changed. .
- a carrier film a surface release-treated polyethylene terephthalate film (manufactured by Teijin Film Solutions Co., Ltd., trade name: Teijin Tetron Film A-63, thickness T: 38 ⁇ m) was used.
- Example 3 An adhesive film was produced in the same manner as in Example 2 except that the depth D of the cuts in the carrier film was changed.
- Comparative Example 1 An adhesive film was produced in the same manner as in Example 1 except that the depth D of the cuts in the carrier film was changed.
- Comparative Example 2 An adhesive film was produced in the same manner as in Example 1 except that the depth D of the cuts in the carrier film was changed.
- Comparative Example 3 An adhesive film was produced in the same manner as in Example 1 except that a carrier film having a different surface treatment from that of the carrier film used in Example 1 was used, and the depth D of the cuts in the carrier film was changed. .
- a carrier film a surface release-treated polyethylene terephthalate film (manufactured by Teijin Film Solutions Ltd., trade name: Teijin Tetron Film A-31, thickness T: 38 ⁇ m) was used.
- Adhesion (N / m) measured value (mN) / 20 (mm) Evaluation was performed based on the following criteria. A: Adhesion force is 2 N / m or more B: Adhesion force is less than 2 N / m
- the bonding process in the manufacturing process of the semiconductor device is efficiently performed.
- An adhesive film useful for the present invention and a method for producing the same in a sufficiently stable manner are provided.
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Abstract
Description
0<D/T≦0.6 (1)
[式中、Dはキャリアフィルムに対する切込みの深さ(単位μm)であり、Tはキャリアフィルムの厚さ(単位μm)である。]
0<D/T≦0.6 (1)
[式中、Dはキャリアフィルムに対する切込みの深さ(単位μm)であり、Tはキャリアフィルムの厚さ(単位μm)である。]
図1は本実施形態に係る接着フィルムを模式的に示す斜視図である。図2は図1に示すII-II線における断面図である。これらの図に示す接着フィルム10は、幅100mm以下の帯状のキャリアフィルム1と、キャリアフィルム1上に、その長手方向(図1に示す矢印Xの方向)に並ぶように配置されている複数の接着剤片3pと、接着剤片3pの表面F2を覆っており且つ接着剤片3pと同じ形状を有する保護部材5pと、接着剤片3pの外縁に沿うように、キャリアフィルム1に形成された切込み1cとを備える。図2に示すとおり、接着剤片3pの表面F2(第二面)は、接着剤片3pのキャリアフィルム1側の面F1(第一面)と反対側の面である。
面積率R(%)=A/(P×W)×100
0<D/T≦0.6 (1)
0.1≦D/T≦0.6 (2)
0.15≦D/T≦0.6 (3)
[キャリアフィルム]
キャリアフィルム1は、上述のとおり、帯状であって、100mm以下の幅を有する。キャリアフィルム1の幅は、その上に配置する接着剤片3pのサイズ及び列3Aの数に応じて適宜設定すればよい。例えば、図1に示すように、列3Aの数が一つである場合、キャリアフィルム1の幅は10~50mmであることが好ましく、10~30mm又は10~20mmであってもよい。キャリアフィルム1の幅が10mm以上であることで、ロールtoロール方式を採用した場合、キャリアフィルム1が捻れることに起因する作業性低下を防止しやすい。
接着剤片3pは、キャリアフィルム1の表面を覆うように形成された接着剤層3と、接着剤層3を覆うように配置された保護フィルム5とを同時に型抜きすることにより、保護部材5pとともに形成されるものである(図6参照)。接着剤片3pの厚さは、作業性を損なわない範囲で適宜選択すればよく、例えば、3~50μmであり、5~40μm又は7~30μmであってもよい。接着剤片3pの厚さが3μm以上であることで十分な接着性を確保しやすく、他方、50μm以下であることで接着剤片3pを構成する接着剤組成物が保護部材5pからはみ出ることを抑制しやすい。
熱可塑性樹脂としては、熱可塑性を有する樹脂、又は少なくとも未硬化状態において熱可塑性を有し、加熱後に架橋構造を形成する樹脂を用いることができる。熱可塑性樹脂としては、半導体加工用テープとして、収縮性、耐熱性及び剥離性に優れる観点から、反応性基を有する(メタ)アクリル共重合体(以下、「反応性基含有(メタ)アクリル共重合体」という場合もある)が好ましい。
熱可塑性樹脂として、反応性基含有(メタ)アクリル共重合体を含む場合、接着剤片3pは、熱硬化性樹脂を含まない態様でもよい。すなわち、反応性基含有(メタ)アクリル共重合体と、硬化促進剤と、フィラーとを含む態様でもよい。
熱可塑性樹脂は、一種を単独で又は二種以上を組み合わせて用いることができる。
(メタ)アクリル酸エステル共重合体としては、共重合成分としてブチルアクリレート及びアクリロニトリルを含む共重合体、共重合成分としてエチルアクリレート及びアクリロニトリルを含む共重合体が好ましい。
熱硬化性樹脂としては、熱により硬化する樹脂であれば特に制限なく用いることができる。熱硬化性樹脂としては、エポキシ樹脂、アクリル樹脂、シリコーン樹脂、フェノール樹脂、熱硬化型ポリイミド樹脂、ポリウレタン樹脂、メラミン樹脂、ユリア樹脂等が挙げられる。これらは、一種を単独で又は二種以上を組み合わせて用いることができる。
フェノールノボラック型エポキシ樹脂としては、エピコート152、エピコート154(いずれも三菱ケミカル株式会社製)、EPPN-201(日本化薬株式会社製)、DEN-438(ダウケミカル社製)等が挙げられる。
o-クレゾールノボラック型エポキシ樹脂としては、YDCN-700-10(新日鉄住金化学株式会社製)、EOCN-102S、EOCN-103S、EOCN-104S、EOCN-1012、EOCN-1025、EOCN-1027(いずれも日本化薬株式会社製)、YDCN701、YDCN702、YDCN703、YDCN704(いずれも新日鉄住金化学株式会社製)等が挙げられる。
多官能エポキシ樹脂としては、Epon 1031S(三菱ケミカル株式会社製)、アラルダイト0163(BASFジャパン社製)、デナコールEX-611、EX-614、EX-614B、EX-622、EX-512、EX-521、EX-421、EX-411、EX-321(いずれもナガセケムテックス株式会社製)等が挙げられる。
アミン型エポキシ樹脂としては、エピコート604(三菱ケミカル株式会社製)、YH-434(新日鉄住金化学株式会社製)、TETRAD-X、TETRAD-C(いずれも三菱ガス化学株式会社製)、ELM-120(住友化学株式会社製)等が挙げられる。
複素環含有エポキシ樹脂としては、アラルダイトPT810(BASFジャパン社製)、ERL4234、ERL4299、ERL4221、ERL4206(いずれもユニオンカーバイド社製)等が挙げられる。これらのエポキシ樹脂は、一種を単独で又は二種以上を組み合わせて用いることができる。
なお、エポキシ硬化剤は、エポキシ樹脂と同時に用いてもよいし、単独で用いてもよい。
硬化促進剤としては、イミダゾール類、ジシアンジアミド誘導体、ジカルボン酸ジヒドラジド、トリフェニルホスフィン、テトラフェニルホスホニウムテトラフェニルボレート、2-エチル-4-メチルイミダゾール-テトラフェニルボレート、1,8-ジアザビシクロ[5,4,0]ウンデセン-7-テトラフェニルボレート等が挙げられる。これらは、一種を単独で又は二種以上を組み合わせて用いることができる。
接着剤片3pは、無機フィラーを含有することが好ましい。無機フィラーとしては、銀粉、金粉、銅粉等の金属フィラー、シリカ、アルミナ、窒化ホウ素、チタニア、ガラス、酸化鉄、セラミック等の非金属無機フィラーなどが挙げられる。無機フィラーは所望する機能に応じて選択することができる。
炭素数1~10のアルキル基としては、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、イソプロピル基、イソブチル基等が挙げられる。
炭素数1~10のアルキル基は、入手が容易であるという観点から、メチル基、エチル基及びペンチル基が好ましい。Xは、耐熱性の観点から、アミノ基、グリシドキシ基、メルカプト基及びイソシアネート基が好ましく、グリシドキシ基及びメルカプト基がより好ましい。式(B-1)中のsは、高熱時のフィルム流動性を抑制し、耐熱性を向上させる観点から、0~5が好ましく、0~4がより好ましい。
これらの中でも、3-アミノプロピルトリエトキシシラン、3-グリシドキシプロピルトリメトキシシラン、3-イソシアネートプロピルトリエトキシシラン、3-メルカプトプロピルトリメトキシシランが好ましく、トリメトキシフェニルシラン、3-グリシドキシプロピルトリメトキシシラン、3-メルカプトプロピルトリメトキシシランがより好ましい。シランカップリング剤は、一種を単独で又は二種以上を組み合わせて用いることができる。
接着剤片3pは、有機フィラーを含有してもよい。有機フィラーとしては、カーボン、ゴム系フィラー、シリコーン系微粒子、ポリアミド微粒子、ポリイミド微粒子等が挙げられる。有機フィラーの含有量は、熱可塑性樹脂100質量部に対し、300質量部以下が好ましく、200質量部以下がより好ましく、100質量部以下が更により好ましい。有機フィラーの含有量の下限は特に制限はないが、熱可塑性樹脂100質量部に対し、5質量部以上であることが好ましい。
接着剤片3pは、必要に応じて、有機溶剤を用いて希釈してもよい。有機溶剤は特に限定されないが、製膜時の揮発性等を沸点から考慮して決めることができる。具体的には、メタノール、エタノール、2-メトキシエタノール、2-エトキシエタノール、2-ブトキシエタノール、メチルエチルケトン、アセトン、メチルイソブチルケトン、トルエン、キシレン等の比較的低沸点の溶剤が、製膜時にフィルムの硬化が進みにくいという観点から好ましい。また、製膜性を向上させる等の目的では、ジメチルアセトアミド、ジメチルホルムアミド、N-メチルピロリドン、シクロヘキサノン等の比較的高沸点の溶剤を使用することが好ましい。これらの溶剤は、一種を単独で又は二種以上を組み合わせて用いることができる。
保護部材5pは、キャリアフィルム1の表面を覆うように形成された接着剤層3と、接着剤層3を覆うように配置された保護フィルム5とを同時に型抜きすることにより、接着剤片3pとともに形成されるものである(図6参照)。本実施形態に係る保護部材5pは、型抜きによって接着剤片3pと同時に形成されるものであるから、接着剤片3pと実質的に同じ形状である。保護フィルム5としては、接着フィルム10の製造プロセスにおいて打抜き加工が可能であり且つ半導体装置の製造プロセスにおいて接着剤片3pから保護部材5pを容易に剥離し得るものであればよい。
次に、接着フィルム10の製造方法について説明する。本実施形態の製造方法は以下の工程を含む。
(A)幅100mm以下の帯状のキャリアフィルム1と、キャリアフィルム1の表面を覆うように形成された接着剤層3と、接着剤層3を覆うように配置された保護フィルム5と有する積層体20を準備する工程。
(B)積層体20における接着剤層3及び保護フィルム5を型抜きすることによって、キャリアフィルム1上にキャリアフィルム1の長手方向に並ぶように配置された複数の接着剤片3pを得る工程。
0<D/T≦0.6 (1)
0.1≦D/T≦0.6 (2)
0.15≦D/T≦0.6 (3)
次に、接着フィルム10の使用方法について説明する。図7はキャリアフィルム1から接着剤片3p及びこれを覆う保護部材5pをピックアップされる様子を模式的に示す断面図である。接着フィルム10に一定の張力を付与した状態で、くさび状部材60に接着フィルム10のキャリアフィルム1側の面を当接させながら、図7に示す矢印の方向に接着フィルム10を移動させる。これにより、同図に示すように、接着剤片3p及び保護部材5pの前方がキャリアフィルム1から浮いた状態となる。この状態のときに、例えば、吸引力を有するピックアップ装置65で接着剤片3p及び保護部材5pをピックアップする。例えば、ピックアップ装置65として、保護部材5pを視認するカメラ等を備えたものを使用することで、接着剤片3p及び保護部材5pの有無、並びに、向き等の情報を把握することが可能である。これらの情報に基づいて、その後の接着工程を適切に実施することができる。
図8は接着剤片3pを使用して製造された半導体装置の一例を模式的に示す断面図である。同図に示す半導体装置100は、半導体チップSと、半導体チップSが電気的に接続された基板50と、半導体チップSと基板50との間に配置されており、半導体チップSと基板50とを接着する接着剤片3pとを備える。半導体チップSの形状は、例えば、長方形又は正方形であるのに対して接着剤片3pの形状はT字型であり、半導体チップSの形状と接着剤片3pの形状が異なっている。かかる構成を採用することにより、図4に示したとおり、領域R1,R2において基板50と半導体チップSを導電材料A1,A2によって電気的に接続することが可能である。
(接着剤ワニスの調製)
以下の材料を混合するとともに真空脱気することによって接着剤ワニスを得た。
・熱可塑性樹脂:HTR-860P-3(商品名、ナガセケムテックス株式会社製、グリシジル基含有アクリルゴム、分子量100万、Tg-7℃)100質量部
・熱硬化性樹脂:YDCN-700-10(商品名、新日鉄住金化学株式会社製、o-クレゾールノボラック型エポキシ樹脂、エポキシ当量210)30質量部
・熱硬化性樹脂:LF-4871(商品名、DIC株式会社製、ビスフェノールA型エポキシ樹脂、エポキシ当量118)95質量部
・熱硬化性樹脂:YDF-8170C(商品名、新日鉄住金化学株式会社製、ビスフェノールF型エポキシ樹脂、エポキシ当量157)100質量部
・硬化促進剤:2PZ-CN(商品名、四国化成工業株式会社製、イミダゾール化合物)0.3質量部
・表面処理フィラー:SC-2050-HLG(商品名、株式会社アドマテックス製)330質量部
・シランカップリング剤:A-189(商品名、NUC株式会社製、γ-メルカプトプロピルトリメトキシシラン)0.9質量部
・シランカップリング剤:A-1160(商品名、NUC株式会社製、γ-ウレイドプロピルトリエトキシシラン)2質量部
上記接着剤ワニスを、表面離型処理ポリエチレンテレフタレート(帝人フィルムソリューション株式会社製、商品名:テイジンテトロンフィルムA-53、厚さT:38μm)上に塗工した。乾燥工程を経て、上記ポリエチレンテレフタレートフィルム(キャリアフィルム)の一方の面に、厚さ25μmの接着剤層が形成されたフィルムを得た。このフィルムと、着色された厚さ50μmのポリエチレンフィルム(タマポリ株式会社製、TDM-1)とを貼り合わせることによって、積層フィルムを得た。この積層フィルムを15mm幅にスリットすることによって、帯状の積層体を得た。
実施例1で使用したキャリアフィルムと異なる表面処理が施されたキャリアフィルムを使用し且つキャリアフィルムに対する切込みの深さDを変更したことの他は、実施例1と同様にして接着フィルムを作製した。キャリアフィルムとして、表面離型処理ポリエチレンテレフタレートフィルム(帝人フィルムソリューション株式会社製、商品名:テイジンテトロンフィルムA-63、厚さT:38μm)を使用した。キャリアフィルムに対する切込みの深さDは18μmであり、D/T(=18/38)の値は約0.5であった。
キャリアフィルムに対する切込みの深さDを変更したことの他は、実施例2と同様にして接着フィルムを作製した。キャリアフィルムに対する切込みの深さDは21μmであり、D/T(=21/38)の値は約0.6であった。
キャリアフィルムに対する切込みの深さDを変更したことの他は、実施例1と同様にして接着フィルムを作製した。キャリアフィルムに対する切込みの深さDは26μmであり、D/T(=26/38)の値は約0.7であった。
キャリアフィルムに対する切込みの深さDを変更したことの他は、実施例1と同様にして接着フィルムを作製した。キャリアフィルムに対する切込みの深さDは33μmであり、D/T(=33/38)の値は約0.9であった。
実施例1で使用したキャリアフィルムと異なる表面処理が施されたキャリアフィルムを使用し且つキャリアフィルムに対する切込みの深さDを変更したことの他は、実施例1と同様にして接着フィルムを作製した。キャリアフィルムとして、表面離型処理ポリエチレンテレフタレートフィルム(帝人フィルムソリューション株式会社製、商品名:テイジンテトロンフィルムA-31、厚さT:38μm)を使用した。キャリアフィルムに対する切込みの深さDは29μmであり、D/T(=29/38)の値は約0.8であった。
(1)キャリアフィルム密着力(90°ピール強度)
型抜きを行っていない積層フィルム(キャリアフィルム/接着剤層/保護フィルム)を20mm幅に切り出した。両面テープを用い、キャリアフィルム側の面をアルミニウム板に貼り付けた後、保護フィルムを剥がした。その後、キャリアフィルムに対する接着剤層の角度を90°に維持しながら、接着剤層を上方に引き上げることによってキャリアフィルムから接着剤層を剥離させた。引き上げ速度は50mm/分とし、測定環境温度は23±2℃とした。引き上げに要する力を測定した。この測定値(mN)及び試料の幅(20mm)を下記式に代入することによって、キャリアフィルムと接着剤層と間の密着力を算出した。
密着力(N/m)=測定値(mN)/20(mm)
以下の基準に基づいて、評価を行った。
A:密着力が2N/m以上
B:密着力が2N/m未満
接着フィルムの上面(保護部材側の面)の顕微鏡画像に基づき、保護部材の外縁から接着剤組成物が最もはみ出している箇所の距離を測定した。
以下の基準に基づいて、評価を行った。
A:はみ出し距離が20μm以下
B:はみ出し距離が20μm超
ダブルクリップ(幅32mm)を板の端部に固定して図9(a)に示す構成の装置を作製した。実施例及び比較例に係る接着フィルム(幅15mm)に一定の張力を付与した状態で、ダブルクリップBのコーナー部Cに接着フィルム10のキャリアフィルム側の面を当接させながら、同図に示す矢印の方向に接着フィルム10を50mm/分の速度で移動させた。コーナー部Cにおける接着フィルム10の折れ曲がり角度は150°程度とした。連続して並ぶ25個の接着剤片3p(及び保護部材5p)のうち、コーナー部Cにおいて、キャリアフィルムから剥離して浮いた状態(図9(a)参照)となるか否かを目視により観察した。図9(b)に示すように、キャリアフィルム1に付着したままコーナー部Cを通過した接着剤片3pを「剥離しなかった接着剤片」としてカウントした。
以下の基準に基づいて、評価を行った。
A:25個の接着剤片のうち、剥離しなかった接着剤片が2個以下
B:25個の接着剤片のうち、剥離しなかった接着剤片が3個以上
Claims (18)
- 半導体装置製造用接着フィルムの製造方法であって、
(A)幅100mm以下の帯状のキャリアフィルムと、前記キャリアフィルムの表面を覆うように形成された接着剤層とを少なくとも有する積層体を準備する工程と、
(B)前記接着剤層を型抜きすることによって、前記キャリアフィルム上に前記キャリアフィルムの長手方向に並ぶように配置された複数の接着剤片を得る工程と、
をこの順序で含み、
(B)工程において前記型抜きを行うとき、以下の不等式(1)で示される条件を満たすように、前記接着剤層及び前記キャリアフィルムに対して切込みを入れ、
前記接着剤片が、長方形又は正方形の少なくとも一辺において、凸部及び凹部の少なくとも一方が形成された形状を有する、接着フィルムの製造方法。
0<D/T≦0.6 (1)
[式中、Dは前記キャリアフィルムに対する切込みの深さ(単位μm)であり、Tは前記キャリアフィルムの厚さ(単位μm)である。] - 前記接着剤片が6つ以上の角を有する、請求項1に記載の接着フィルムの製造方法。
- 前記接着剤片の形状がL字型である、請求項2に記載の接着フィルムの製造方法。
- 前記接着剤片が8つ以上の角を有する、請求項1に記載の接着フィルムの製造方法。
- 前記積層体は、前記接着剤層を覆うように配置された保護フィルムを更に有し、
前記不等式(1)で示される条件を満たすように、前記保護フィルム、前記接着剤層及び前記キャリアフィルムに対して切込みを入れる、請求項1~4のいずれか一項に記載の接着フィルムの製造方法。 - 半導体装置製造用接着フィルムであって、
幅100mm以下の帯状のキャリアフィルムと、
前記キャリアフィルム上に前記キャリアフィルムの長手方向に並ぶように配置されている複数の接着剤片と、
前記接着剤片の外縁に沿うように、前記キャリアフィルムに形成された切込みと、
を備え、
前記切込みの深さ及び前記キャリアフィルムの厚さが以下の不等式(1)で示される条件を満たし、
前記接着剤片が、長方形又は正方形の少なくとも一辺において、凸部及び凹部の少なくとも一方が形成された形状を有する、接着フィルム。
0<D/T≦0.6 (1)
[式中、Dは前記キャリアフィルムに対する切込みの深さ(単位μm)であり、Tは前記キャリアフィルムの厚さ(単位μm)である。] - 前記接着剤片が6つ以上の角を有する、請求項6に記載の接着フィルム。
- 前記接着剤片の形状がL字型である、請求項7に記載の接着フィルム。
- 前記接着剤片が8つ以上の角を有する、請求項6に記載の接着フィルム。
- 前記接着剤片の前記キャリアフィルム側の第一面と反対側の第二面を覆っており、前記接着剤片と同じ形状を有する保護部材を更に備える、請求項6~9のいずれか一項に記載の接着フィルム。
- 前記接着剤片の面積が10~200mm2である、請求項6~10のいずれか一項に記載の接着フィルム。
- 前記キャリアフィルムの表面であって前記複数の接着剤片によって覆われている領域の割合が前記キャリアフィルムの面積を基準として10~60%である、請求項6~11のいずれか一項に記載の接着フィルム。
- 前記キャリアフィルムと前記接着剤片との間の密着力が2N/m以上である、請求項6~12のいずれか一項に記載の接着フィルム。
- 前記キャリアフィルムの厚さは、10~200μmである、請求項6~13のいずれか一項に記載の接着フィルム。
- 基板と、
半導体チップと、
請求項6~14のいずれか一項に記載の接着フィルムの前記接着剤片と、
を備え、
前記接着剤片が前記基板と前記半導体チップとの間に配置されており、前記基板と前記半導体チップとを接着しており、
前記半導体チップの形状と前記接着剤片の形状が異なっている、半導体装置。 - 請求項6~14のいずれか一項に記載の接着フィルムの前記接着剤片を使用する、半導体装置の製造方法。
- 基板と前記接着剤片と半導体チップとがこの順序で積層されている積層体を準備する工程と、
前記積層体を加熱することによって前記接着剤片を介して前記基板と前記半導体チップを接着する工程と、
を含み、
前記半導体チップの形状と前記接着剤片の形状が異なっている、請求項16に記載の半導体装置の製造方法。 - 前記積層体を160℃以下の温度に加熱することによって前記接着剤片によって前記基板に対して前記半導体チップを接着する、請求項17に記載の半導体装置の製造方法。
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