SG11202002552PA - Adhesive film for use in semiconductor device manufacture, manufacturing method of said adhesive film, semiconductor device, and manufacturing method of semiconductor device - Google Patents

Adhesive film for use in semiconductor device manufacture, manufacturing method of said adhesive film, semiconductor device, and manufacturing method of semiconductor device

Info

Publication number
SG11202002552PA
SG11202002552PA SG11202002552PA SG11202002552PA SG11202002552PA SG 11202002552P A SG11202002552P A SG 11202002552PA SG 11202002552P A SG11202002552P A SG 11202002552PA SG 11202002552P A SG11202002552P A SG 11202002552PA SG 11202002552P A SG11202002552P A SG 11202002552PA
Authority
SG
Singapore
Prior art keywords
semiconductor device
manufacturing
adhesive film
manufacture
device manufacture
Prior art date
Application number
SG11202002552PA
Other languages
English (en)
Inventor
Keisuke Ohkubo
Masanori Natsukawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG11202002552PA publication Critical patent/SG11202002552PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202002552PA 2017-09-19 2018-09-18 Adhesive film for use in semiconductor device manufacture, manufacturing method of said adhesive film, semiconductor device, and manufacturing method of semiconductor device SG11202002552PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2017/033746 WO2019058429A1 (ja) 2017-09-19 2017-09-19 半導体装置製造用接着フィルム及びその製造方法
PCT/JP2018/034513 WO2019059188A1 (ja) 2017-09-19 2018-09-18 半導体装置製造用接着フィルム及びその製造方法、並びに、半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
SG11202002552PA true SG11202002552PA (en) 2020-04-29

Family

ID=65810307

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202002552PA SG11202002552PA (en) 2017-09-19 2018-09-18 Adhesive film for use in semiconductor device manufacture, manufacturing method of said adhesive film, semiconductor device, and manufacturing method of semiconductor device

Country Status (6)

Country Link
JP (1) JPWO2019059188A1 (ko)
KR (1) KR102578510B1 (ko)
CN (1) CN111095505B (ko)
SG (1) SG11202002552PA (ko)
TW (1) TWI753200B (ko)
WO (2) WO2019058429A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023160001A (ja) * 2022-04-21 2023-11-02 浜松ホトニクス株式会社 光検出装置
WO2023248337A1 (ja) * 2022-06-21 2023-12-28 株式会社レゾナック フィルム、巻回体、接続構造体、及び接続構造体の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3402131B2 (ja) * 1997-07-11 2003-04-28 日立電線株式会社 半導体パッケージ用基体への接着シートの貼付方法
JPH11106717A (ja) * 1997-10-01 1999-04-20 Oji Paper Co Ltd 粘着ラベル
JPH11274244A (ja) * 1998-03-20 1999-10-08 Sumitomo Metal Mining Co Ltd 半導体パッケージ支持用金属補強板およびその製造方法
JP3542080B2 (ja) * 2001-03-30 2004-07-14 リンテック株式会社 半導体チップ担持用接着テープ・シート、半導体チップ担持体、半導体チップマウント方法および半導体チップ包装体
KR100632861B1 (ko) * 2002-05-13 2006-10-13 미쓰이 긴조꾸 고교 가부시키가이샤 칩온 필름용 플렉시블 프린트배선판
JP4677758B2 (ja) * 2004-10-14 2011-04-27 日立化成工業株式会社 ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法
JP2006265411A (ja) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd シート状もしくはペースト状接着剤、電子部品装置の製造方法及び電子部品装置
JP2007009022A (ja) * 2005-06-29 2007-01-18 Sekisui Chem Co Ltd シート状接着剤、電子部品装置の製造方法及び電子部品装置
JP5157208B2 (ja) 2006-03-20 2013-03-06 日立化成株式会社 ダイボンドダイシングシート
KR100870810B1 (ko) * 2007-03-05 2008-11-27 주식회사 네패스 광검출용 반도체 패키지 및 그 제조 방법
JP2010129632A (ja) * 2008-11-26 2010-06-10 Toppan Printing Co Ltd 剥離シート付き接着シートおよび金属板貼合装置および金属板貼合方法
JP5741811B2 (ja) * 2011-02-23 2015-07-01 三菱マテリアル株式会社 発光素子向け増反射透明膜用組成物、発光素子、および発光素子の製造方法
KR101456826B1 (ko) * 2012-07-03 2014-10-31 도레이 카부시키가이샤 개편화된 접착제층을 갖는 접착제 시트의 제조 방법, 접착제 시트를 사용한 배선 기판의 제조 방법, 반도체 장치의 제조 방법 및 접착제 시트의 제조 장치
JP2014033177A (ja) * 2012-07-12 2014-02-20 Denso Corp 半導体装置の製造方法
CN106739369A (zh) * 2016-12-25 2017-05-31 登封市豫科玻璃技术有限公司 一种具有纳米吸收层的防污护洁屏幕保护膜

Also Published As

Publication number Publication date
KR20200055011A (ko) 2020-05-20
TW201922513A (zh) 2019-06-16
CN111095505A (zh) 2020-05-01
CN111095505B (zh) 2023-12-15
JPWO2019059188A1 (ja) 2020-11-19
TWI753200B (zh) 2022-01-21
KR102578510B1 (ko) 2023-09-13
WO2019059188A1 (ja) 2019-03-28
WO2019058429A1 (ja) 2019-03-28

Similar Documents

Publication Publication Date Title
EP3407376A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
PT3572478T (pt) Uso de película adesiva e processo de fabrico de aparelho eletrónico
PT3442010T (pt) Película adesiva para utilização no fabrico de dispositivos semicondutores e método de fabrico de dispositivos semicondutores
EP3279925A4 (en) Semiconductor device and manufacturing method thereof
SG11201601300TA (en) Adhesive film and method for manufacturing semiconductor device
TWI562323B (en) Semiconductor device package and method of manufacturing the same
IL259346B (en) A layer preparation for a semiconductor, a method for producing a layer preparation for a semiconductor, a method for producing a semiconductor element, a method for producing a processing material for a semiconductor, and a semiconductor device
EP3255658A4 (en) Method for manufacturing semiconductor device, and underfill film
EP3093885A4 (en) Semiconductor device and semiconductor device manufacturing method
GB2573215B (en) Semiconductor manufacturing method and semiconductor manufacturing device
HK1252326A1 (zh) 半導體器件及其製造方法
SG11201705967TA (en) Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsink
SG10201705697RA (en) Dicing-tape-integrated film for semiconductor back surface, and method for producing semiconductor device
SG11201608083QA (en) Adhesive film and semiconductor package using adhesive film
KR102276146B9 (ko) 박막 트랜지스터 기판 및 이의 제조 방법
TWI563668B (en) Thin film transistor, method of manufacturing thereof, and application thereof
EP3451062A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
HK1251718A1 (zh) 半導體裝置及其製造方法
SG11201703337RA (en) Film-like adhesive composite sheet and method for manufacturing semiconductor device
EP3506369A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
HK1246002A1 (zh) 半導體器件及其製造方法
GB201717453D0 (en) Thin film transistor array substrate and manufacturing method thereof
SG11202007053XA (en) Manufacturing method for semiconductor device, and adhesive film
SG11202004352PA (en) Laminated film and method for producing semiconductor element
EP3306669A4 (en) Thin film transistor and manufacturing method thereof