PT3442010T - Película adesiva para utilização no fabrico de dispositivos semicondutores e método de fabrico de dispositivos semicondutores - Google Patents

Película adesiva para utilização no fabrico de dispositivos semicondutores e método de fabrico de dispositivos semicondutores

Info

Publication number
PT3442010T
PT3442010T PT177749892T PT17774989T PT3442010T PT 3442010 T PT3442010 T PT 3442010T PT 177749892 T PT177749892 T PT 177749892T PT 17774989 T PT17774989 T PT 17774989T PT 3442010 T PT3442010 T PT 3442010T
Authority
PT
Portugal
Prior art keywords
semiconductor device
device manufacturing
adhesive film
manufacturing
adhesive
Prior art date
Application number
PT177749892T
Other languages
English (en)
Original Assignee
Mitsui Chemicals Tohcello Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Tohcello Inc filed Critical Mitsui Chemicals Tohcello Inc
Publication of PT3442010T publication Critical patent/PT3442010T/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0647—Polyepoxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
PT177749892T 2016-03-29 2017-03-27 Película adesiva para utilização no fabrico de dispositivos semicondutores e método de fabrico de dispositivos semicondutores PT3442010T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016066439 2016-03-29

Publications (1)

Publication Number Publication Date
PT3442010T true PT3442010T (pt) 2022-06-29

Family

ID=59964573

Family Applications (1)

Application Number Title Priority Date Filing Date
PT177749892T PT3442010T (pt) 2016-03-29 2017-03-27 Película adesiva para utilização no fabrico de dispositivos semicondutores e método de fabrico de dispositivos semicondutores

Country Status (6)

Country Link
EP (1) EP3442010B1 (pt)
JP (1) JP6654689B2 (pt)
KR (1) KR102234844B1 (pt)
PT (1) PT3442010T (pt)
TW (1) TWI735557B (pt)
WO (1) WO2017170452A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7212674B2 (ja) * 2018-03-28 2023-01-25 三井化学東セロ株式会社 粘着性フィルムおよび電子装置の製造方法
EP3778816A4 (en) * 2018-03-28 2021-12-29 Mitsui Chemicals Tohcello, Inc. Adhesive film and electronic device manufacturing method
WO2019188543A1 (ja) * 2018-03-30 2019-10-03 三井化学東セロ株式会社 電子装置の製造方法
EP3862403A4 (en) * 2018-10-05 2022-07-13 Mitsui Chemicals Tohcello, Inc. ADHESIVE FILM AND METHOD OF MAKING AN ELECTRONIC DEVICE
EP3940764A4 (en) * 2019-03-14 2022-12-14 Mitsui Chemicals Tohcello, Inc. ELECTRONIC DEVICE MANUFACTURING METHOD
US20220189791A1 (en) * 2019-03-14 2022-06-16 Mitsui Chemicals Tohcello, Inc. Method for manufacturing electronic device
CN113574660A (zh) * 2019-03-14 2021-10-29 三井化学东赛璐株式会社 电子装置的制造方法
WO2024034410A1 (ja) * 2022-08-09 2024-02-15 Dic株式会社 シーラントフィルム、ラミネートフィルム及び包装材

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2707931A1 (de) * 1977-02-24 1978-08-31 Semikron Gleichrichterbau Verfahren zum aufbringen einer schutzschicht auf halbleiterbauelementen
JP5137937B2 (ja) * 2009-12-16 2013-02-06 日東電工株式会社 半導体装置製造用耐熱性粘着シート、該シートに用いる粘着剤、及び該シートを用いた半導体装置の製造方法
US8431444B2 (en) * 2011-08-16 2013-04-30 General Electric Company Epoxy encapsulating and lamination adhesive and method of making same
JP5917215B2 (ja) * 2012-03-16 2016-05-11 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
KR101393701B1 (ko) * 2012-11-29 2014-05-13 서울과학기술대학교 산학협력단 웨이퍼의 휨 발생 방지와 방열기능을 부여하는 팬 아웃 웨이퍼 레벨 패키징 공정
US20140162407A1 (en) * 2012-12-10 2014-06-12 Curtis Michael Zwenger Method And System For Semiconductor Packaging
JP2014210909A (ja) 2013-04-02 2014-11-13 日東電工株式会社 半導体装置の製造方法
JP6787900B2 (ja) * 2015-09-01 2020-11-18 リンテック株式会社 粘着シート

Also Published As

Publication number Publication date
KR102234844B1 (ko) 2021-03-31
EP3442010A1 (en) 2019-02-13
JPWO2017170452A1 (ja) 2018-12-13
EP3442010B1 (en) 2022-06-01
WO2017170452A1 (ja) 2017-10-05
JP6654689B2 (ja) 2020-02-26
TWI735557B (zh) 2021-08-11
EP3442010A4 (en) 2019-12-18
KR20180118776A (ko) 2018-10-31
TW201800527A (zh) 2018-01-01

Similar Documents

Publication Publication Date Title
EP3407376A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
IL248489B (en) Substrate and device for creating a template for use in metrology, a metrological method and a method for preparing the device
TWI562209B (en) Semiconductor device and method for manufacturing the same
PT3442010T (pt) Película adesiva para utilização no fabrico de dispositivos semicondutores e método de fabrico de dispositivos semicondutores
SG10201912585TA (en) Semiconductor device and method for manufacturing the same
EP3190608A4 (en) Laminated structure, method for manufacturing same, semiconductor device, and crystalline film
SG11201802510SA (en) Laminate film for temporary bonding, methods for producing substrate workpiece and laminate substrate workpiece using the laminate film for temporary bonding, and method for producing semiconductor device using the same
PT3339023T (pt) Laminado, método para o fabrico do laminado, dispositivo semicondutor e método para o fabrico do dispositivo semicondutor
PT3572478T (pt) Uso de película adesiva e processo de fabrico de aparelho eletrónico
EP3279925A4 (en) Semiconductor device and manufacturing method thereof
SG10201608814YA (en) Semiconductor device and method for manufacturing the semiconductor device
SG11201601300TA (en) Adhesive film and method for manufacturing semiconductor device
EP3098249A4 (en) Resin composition, resin film, and semiconductor device and method for manufacturing same
IL259347B (en) Semiconductor layer preparation, semiconductor layer preparation manufacturing method, semiconductor element manufacturing method, semiconductor processing material manufacturing method, and semiconductor device
EP3179525A4 (en) Semiconductor device and method for manufacturing same
EP3093885A4 (en) Semiconductor device and semiconductor device manufacturing method
EP3255658A4 (en) Method for manufacturing semiconductor device, and underfill film
SG10201705697RA (en) Dicing-tape-integrated film for semiconductor back surface, and method for producing semiconductor device
SG11201708565RA (en) Electronic-device-protecting film, electronic-device-protecting member, method for manufacturing electronic device, and method for manufacturing package
HK1251718A1 (zh) 半導體裝置及其製造方法
EP3506369A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
EP3451062A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
EP3029726A4 (en) Semiconductor device and method for manufacturing same
PL3162730T3 (pl) Sposób i urządzenie do wytwarzania torebek z folii
SG11202007053XA (en) Manufacturing method for semiconductor device, and adhesive film