CN110913603B - 一种组装pcb板的元器件贴片装置 - Google Patents
一种组装pcb板的元器件贴片装置 Download PDFInfo
- Publication number
- CN110913603B CN110913603B CN201911242326.4A CN201911242326A CN110913603B CN 110913603 B CN110913603 B CN 110913603B CN 201911242326 A CN201911242326 A CN 201911242326A CN 110913603 B CN110913603 B CN 110913603B
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- CN
- China
- Prior art keywords
- frame
- plate
- pcb
- limiting
- feeding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911242326.4A CN110913603B (zh) | 2019-12-06 | 2019-12-06 | 一种组装pcb板的元器件贴片装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911242326.4A CN110913603B (zh) | 2019-12-06 | 2019-12-06 | 一种组装pcb板的元器件贴片装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110913603A CN110913603A (zh) | 2020-03-24 |
CN110913603B true CN110913603B (zh) | 2020-11-20 |
Family
ID=69822969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911242326.4A Expired - Fee Related CN110913603B (zh) | 2019-12-06 | 2019-12-06 | 一种组装pcb板的元器件贴片装置 |
Country Status (1)
Country | Link |
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CN (1) | CN110913603B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112203494A (zh) * | 2020-10-28 | 2021-01-08 | 江苏贺鸿智能科技有限公司 | 一种组装pcb板的元器件贴片器 |
CN113438827B (zh) * | 2021-07-28 | 2022-05-10 | 江苏传艺科技股份有限公司 | 带有双边间距调节机构的smt装贴设备及其方法 |
CN115070161B (zh) * | 2022-08-18 | 2022-11-08 | 迅管(深圳)科技有限公司 | 一种集成电路板构件制造设备 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59113699A (ja) * | 1982-12-20 | 1984-06-30 | 三洋電機株式会社 | 電子部品装着装置 |
JPH11128800A (ja) * | 1997-10-27 | 1999-05-18 | Fujitsu Ten Ltd | 接着剤塗布装置 |
CN201671925U (zh) * | 2010-05-20 | 2010-12-15 | 西北工业大学 | 功能材料小片贴片装置 |
CN105633758B (zh) * | 2016-03-25 | 2017-11-17 | 宗智辉 | 端子插件机的插件机构 |
CN108770231A (zh) * | 2018-08-06 | 2018-11-06 | 张家港市欧微自动化研发有限公司 | 一种pcb贴片点胶设备 |
-
2019
- 2019-12-06 CN CN201911242326.4A patent/CN110913603B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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CN110913603A (zh) | 2020-03-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201016 Address after: Room 337, area w, 3 / F, building 1, No. 9138 Beiqing highway, Qingpu District, Shanghai 201700 Applicant after: Shanghai Sunsky Electronic Technology Co.,Ltd. Address before: 710000 Northwestern Polytechnical University, 127 Youyi Road, Xi'an, Shaanxi Applicant before: Wang Qiang |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Room 337, area w, 3 / F, building 1, No. 9138 Beiqing highway, Qingpu District, Shanghai 201700 Patentee after: Shanghai Sunsky Electronic Technology (Group) Co.,Ltd. Address before: Room 337, area w, 3 / F, building 1, No. 9138 Beiqing highway, Qingpu District, Shanghai 201700 Patentee before: Shanghai Sunsky Electronic Technology Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201120 Termination date: 20211206 |