CN111356300B - 一种印刷集成电路板成型制作工艺 - Google Patents
一种印刷集成电路板成型制作工艺 Download PDFInfo
- Publication number
- CN111356300B CN111356300B CN202010166529.6A CN202010166529A CN111356300B CN 111356300 B CN111356300 B CN 111356300B CN 202010166529 A CN202010166529 A CN 202010166529A CN 111356300 B CN111356300 B CN 111356300B
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- Prior art keywords
- guide
- insulating substrate
- plate
- circuit board
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 230000007246 mechanism Effects 0.000 claims abstract description 65
- 239000003292 glue Substances 0.000 claims abstract description 23
- 239000011248 coating agent Substances 0.000 claims abstract 2
- 238000000576 coating method Methods 0.000 claims abstract 2
- 238000005096 rolling process Methods 0.000 claims description 19
- 230000002457 bidirectional effect Effects 0.000 claims description 12
- 230000000670 limiting effect Effects 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 8
- 230000009471 action Effects 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 238000005520 cutting process Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 230000001174 ascending effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010166529.6A CN111356300B (zh) | 2020-03-11 | 2020-03-11 | 一种印刷集成电路板成型制作工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010166529.6A CN111356300B (zh) | 2020-03-11 | 2020-03-11 | 一种印刷集成电路板成型制作工艺 |
Publications (2)
Publication Number | Publication Date |
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CN111356300A CN111356300A (zh) | 2020-06-30 |
CN111356300B true CN111356300B (zh) | 2021-04-30 |
Family
ID=71194457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202010166529.6A Active CN111356300B (zh) | 2020-03-11 | 2020-03-11 | 一种印刷集成电路板成型制作工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN111356300B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112911822B (zh) * | 2021-02-05 | 2022-04-01 | 深圳信立能实业有限公司 | 一种集成电路加工用贴片系统 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110002161A (ko) * | 2009-07-01 | 2011-01-07 | 이진영 | 솔더페이스트 검사장치 |
CN208338043U (zh) * | 2018-04-28 | 2019-01-04 | 惠州市吉立智能科技有限公司 | 一种双头贴片机 |
CN209089297U (zh) * | 2018-09-07 | 2019-07-09 | 深圳科未来科技有限公司 | 一种新型集成电路设计用自动贴片装置 |
CN209526966U (zh) * | 2018-10-25 | 2019-10-22 | 江西慧智科技有限公司 | 一种集成电路板焊锡固定夹持装置 |
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2020
- 2020-03-11 CN CN202010166529.6A patent/CN111356300B/zh active Active
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Publication number | Publication date |
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CN111356300A (zh) | 2020-06-30 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210401 Address after: Room 26, 6 / F, unit 1, Zhongnan SOHO City, Wen'an street, dingziqiao Road, Wuchang District, Wuhan City, Hubei Province Applicant after: Zhongou (Hubei) Intellectual Property Service Co.,Ltd. Address before: 317000 Baishuiyang town Baixi Road, Linhai City, Taizhou City, Zhejiang Province Applicant before: Ni Minyue Effective date of registration: 20210401 Address after: 246200 Wenhui Road, economic development zone, Wangjiang County, Anqing City, Anhui Province Applicant after: Anhui Botai Circuit Technology Co.,Ltd. Address before: Room 26, 6 / F, unit 1, Zhongnan SOHO City, Wen'an street, dingziqiao Road, Wuchang District, Wuhan City, Hubei Province Applicant before: Zhongou (Hubei) Intellectual Property Service Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Process for Forming Printed Integrated Circuit Board Granted publication date: 20210430 Pledgee: Wangjiang County Financing Guarantee Co.,Ltd. Pledgor: Anhui Botai Circuit Technology Co.,Ltd. Registration number: Y2024980010562 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |