CN1104749C - 叠层式电子零件 - Google Patents

叠层式电子零件 Download PDF

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CN1104749C
CN1104749C CN97122167A CN97122167A CN1104749C CN 1104749 C CN1104749 C CN 1104749C CN 97122167 A CN97122167 A CN 97122167A CN 97122167 A CN97122167 A CN 97122167A CN 1104749 C CN1104749 C CN 1104749C
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中野一博
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Alps Alpine Co Ltd
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B2201/00—Aspects of oscillators relating to varying the frequency of the oscillations
    • H03B2201/01—Varying the frequency of the oscillations by manual means
    • H03B2201/014—Varying the frequency of the oscillations by manual means the means being associated with an element comprising distributed inductances and capacitances
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/18—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance
    • H03B5/1841—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a strip line resonator
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    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
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    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

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Abstract

本发明提供一种共振频率可调整的叠层式电子零件，它包括内部设有微型带状线路的第1电介质层；通过该第1电介质层与上述微型带状线路相对的导电性共振频率调整层；通过第2电介质层与上述共振频率调整层相对、并且与该共振频率调整层电气连接的接地层；该共振频率调整层具有通过第1电介质层与微型带状线路相对的多条平行电极和连接这些平行电极的各一端的连接部，该连接部形成在不与微型带状线路相对的位置。该电子零件不需功率大的激光装置就能调整，能防止微型带状线路的氧化和裂缝和实现小型化。

Description

叠层式电子零件
技术领域
本发明涉及在多层电路基板内部配置共振线路而构成例如VCO的叠层式电子零件，特别涉及共振频率可调整的叠层式电子零件。
背景技术
作为VCO模件，在上表面设有配置电子零件的配线导体层，在内部设有共振导体层，该共振导体层上配置着作为共振线路的微型带状线路(MSL)，将MSL的接地导体层设在共振导体层的下层或下表面的多层型电路基板是公知的。将该构造的VCO模件的振荡频率调整为预定的频率，在制造工序中要调整MSL。
作为振荡频率的调整方法，日本专利公开第329705/1992号揭示的方法是，把设在多层电路基板内部的MSL的一部分作为调整电极导出到多层电路基板的上表面，用切削等适当方法调整该调整电极。另外，日本专利公开第88527/1996号揭示的方法是，从多层电路基板的下表面，与接地导体层和电介质层的各部分一起把内部的MSL用激光调整。
但是，上述现有技术中，前者的构造中，必须把MSL的一部分作为调整电极引出到多层电路基板的上表面，由于该上表面是配置电子零件的配置面，所以，必须将配置面扩大，这样，不利于电路基板的小型化。
后者的构造中，在调整时被切削的金属层成为MSL和接地导体层这样2层，从下表面到MSL的电介质层的厚度从其特性上不能减薄，所以，需要功率大的激光装置，使成本提高，另外，调整后由于MSL露出，会产生MSL氧化、裂缝等问题。
发明内容
本发明是鉴于上述问题而作出的，其目的在于提供一种叠层式电子零件，在微型带状线路(MSL)和与该MSL相对的接地层之间，配设与接地层电气连接的中间接地层，将该中间接地层的一部分做成容易切断的构造。调整共振频率时，用激光切断中间接地层的一部分。被切断的中间接地层的一部分成为电气不稳定状态，在该部分中，MSL代替中间接地层的一部分与接地层电气地相对，这样，在MSL与接地层之间的容量减少。其结果，MSL的特性阻抗改变，共振频率增高。
本发明的叠层式电子零件具有：
内部设有微型带状线路的第1电介质层；
通过该第1电介质层与上述微型带状线路相对的导电性共振频率调整层；
通过第2电介质层与上述共振频率调整层相对、并且与该共振频率调整层电气连接的接地层；
该共振频率调整层具有通过第1电介质层与微型带状线路相对的多条平行电极和连接这些平行电极的各一端的连接部，该连接部形成在不与微型带状线路相对的位置。
如果在共振频率调整层上形成一端由连接部连接着的多条平行电极，则用激光通过接地层和第2电介质层依次地切断各平行电极的连接点，可以使微型带状线路与共振频率调整层之间的相对面积阶段地减少，可微调共振频率。
另外，如果在接地层上形成与平行电极的连接点相对的缝隙，则由该缝隙可使平行电极的连接点位置明确化，并且除了接地层的切断位置外，不必用激光切削，所以可减小激光的功率。
附图说明
图1是本发明一实施例的叠层式电子零件的断面图。
图2是图1所示叠层式电子零件的平面图。
图3是表示图1所示叠层式电子零件各层的平面图。
图4是表示图1所示叠层式电子零件电路的说明图。
图5是表示调整线路变形例的平面图。
具体实施方式
图1是沿图2中A-A线的断面图。图1至图3中，在第1电介质层3a的内部，形成微型带状线路(MSL)4，在第1电介质层3a的表面和背面分别形成第1接地层1和调整线路层5。在调整线路层5与第2接地层2之间形成第2电介质层3b。另外，第1接地层1作为电路基板的配线导体层，在第1接地层1上配置着电子零件(图未示)。
MSL4从平面上看是长方形的，其面积比其它层1、2、3a、3b、5小。在调整线路层5上，形成相互平行的多条平行电极5a和用连接点5c连接各平行电极5a的连接部5b，各平行电极5a形成为梳齿状。平行电极5a从平面看形成在与MSL相对的位置，但连接点5c和连接部5b不与MSL相对。另外，第2接地层2上形成纵长的缝隙2a，该缝隙2a形成在与连接点5c相对的位置。如图2和图3所示，在第1和第2接地层1、2、第1和第2电介质层3a、3b、调整线路层5的端部分别形成通孔6，各层通过该通孔电气连接。
将此构造用于振荡器的共振电路时，如图4所示，构成为MSL4的一端与取出电极4a连接、另一端通过通孔6与第1及第2接地层1、2连接的电路。并且，构成为调整线路层5的一端为开放状态，另一端通过通孔6与第1及第2接地层1、2连接的电路。
在MSL4与调整线路层5之间，因第1电介质层3a而存在容量C1。在图1至图3的构造中，将激光从第2接地层2的方向通过缝隙2a和第2电介质层3b照射，在连接点5c将平行电极5a从连接部5b切断，切断的平行电极5a从接地状态变成为电气不稳定状态，在切断的平行电极5a的部分，MSL4代替平行电极5a地与第2接地层2相对，MSL4与大地间的容量不是C1而变成为C2。该容量C2因形成容量C1的第1电介质层3a与第2电介质层3b的叠层而存在，所以，比容量C1小。因此，一旦切断平行电极5a，MSL4与大地间的容量减少，MSL的特性阻抗改变，共振频率变高。因此，通过切断任意数的平行电极5a，可以阶段地调整MSL的共振频率。另外，由于切断了平行电极5a时共振频率增高，所以，MSL预先把共振频率设定得比所需值低。
根据该构造，不切削MSL4，MSL不氧化，在MSL上不产生裂缝，可长期地保持MSL的特性。另外，由于不考虑MSL4的特性第2电介质层3b可做得很薄，所以，可以减少调整用激光的功率。另外，通过在第2接地层上预先形成缝隙2a，由该缝隙2a使调整线路层5的切断位置明确，并且，不用切削第2接地层2，所以，更加能减小激光的功率。
上述实施例中，是在调整线路层5上形成梳齿状平行电极5a，但是平行电极5a并不限于是梳齿状，例如，也可以如图5所示那样，通过连接部5b交替地连接各平行电极5a的一端，在平行电极5a的周围形成曲拐状开口7。这时，左右连接部5b形成在不与MSL相对的位置，调整连接点5c即可。
本发明具有下述效果：
在MSL和与该MSL相对的接地层之间，配设着与接地层电气连接的中间接地层，将该中间接地层的一部分做成容易切断的构造，所以，不需要功率大的激光装置，可防止MSL的氧化和裂缝，可使电路基板小型化。
如果在共振频率调整层上形成由连接部连接着的多条平行电极，则可以用激光通过接地层和第2电介质层依次地切断各平行电极的连接点，使MSL与大地间的容量阶段地减少，可微调MSL的共振频率。
如果在接地层上形成与平行电极和连接部的连接点相对的缝隙，则由该缝隙可使平行电极的连接点位置明确化，并且除了接地层的切断位置外，不必用激光切削，所以可减小激光的功率。

Claims (2)

1.一种叠层式电子零件，它具有：
内部设有微型带状线路的第1电介质层；
通过该第1电介质层与上述微型带状线路相对的导电性共振频率调整层；
通过第2电介质层与上述共振频率调整层相对、并且与该共振频率调整层电气连接的接地层；
其特征在于，上述共振频率调整层具有通过第1电介质层与微型带状线路相对的多条平行电极和连接这些平行电极的各一端的连接部，该连接部形成在不与微型带状线路相对的位置。
2.如权利要求1所述的叠层式电子零件，其特征在于，在上述接地层上形成与平行电极和连接部的连接点相对的缝隙。
CN97122167A 1996-11-20 1997-11-20 叠层式电子零件 Expired - Fee Related CN1104749C (zh)

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JP8309123A JPH10150308A (ja) 1996-11-20 1996-11-20 積層型電子部品
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE516152C2 (sv) * 1999-03-17 2001-11-26 Ericsson Telefon Ab L M Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning
JP3891737B2 (ja) 1999-04-19 2007-03-14 シャープ株式会社 発振器及びその発振特性調整方法
JP2001292028A (ja) * 2000-04-05 2001-10-19 Murata Mfg Co Ltd 電圧制御発振器の調整方法
WO2001084488A1 (en) * 2000-05-05 2001-11-08 Koninklijke Philips Electronics N.V. Data carrier having means for changing the resonant frequency of its resonant circuit
KR100332883B1 (ko) * 2000-07-25 2002-04-15 이형도 적층 칩부품
JP2002252534A (ja) 2001-02-26 2002-09-06 Matsushita Electric Ind Co Ltd 高周波フィルタ
TWI247480B (en) * 2003-05-13 2006-01-11 Delta Electronics Inc Electronic device having adjustable VCO
US20060091981A1 (en) * 2004-11-04 2006-05-04 Motorola, Inc. Method and system for frequency trimming
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US8760245B2 (en) 2010-12-03 2014-06-24 International Business Machines Corporation Coplanar waveguide structures with alternating wide and narrow portions having different thicknesses, method of manufacture and design structure
US8766748B2 (en) 2010-12-03 2014-07-01 International Business Machines Corporation Microstrip line structures with alternating wide and narrow portions having different thicknesses relative to ground, method of manufacture and design structures
CN106409701A (zh) * 2016-10-26 2017-02-15 中国科学院半导体研究所 一种用于金丝键合的电极结构

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4288530A (en) * 1979-10-15 1981-09-08 Motorola, Inc. Method of tuning apparatus by low power laser beam removal
US4619001A (en) * 1983-08-02 1986-10-21 Matsushita Electric Industrial Co., Ltd. Tuning systems on dielectric substrates
US4583064A (en) * 1983-09-02 1986-04-15 Matsushita Electric Industrial Co., Ltd. Strip-line resonator
JPS62179201A (ja) * 1986-01-31 1987-08-06 Matsushita Electric Ind Co Ltd ストリツプ線路共振器
JPH0671164B2 (ja) * 1988-06-15 1994-09-07 株式会社村田製作所 トリプレート型ストリップラインフィルタ
JPH0656813B2 (ja) * 1989-03-29 1994-07-27 株式会社村田製作所 インダクターを含む電子部品の周波数調整方法
JPH0621706A (ja) * 1991-03-07 1994-01-28 Tdk Corp トリプレート型共振器および超高周波機能部品
JP2662748B2 (ja) * 1991-04-30 1997-10-15 株式会社村田製作所 発振器
JPH05110319A (ja) * 1991-05-17 1993-04-30 Tdk Corp トリプレート形ストリツプライン共振器
JPH05275910A (ja) * 1991-10-30 1993-10-22 Tdk Corp 超高周波用電子部品
JPH05206730A (ja) * 1992-01-27 1993-08-13 Murata Mfg Co Ltd 電圧制御発振器およびその発振周波数の調整方法
JP3193101B2 (ja) * 1992-03-19 2001-07-30 日本碍子株式会社 積層型誘電体フィルタ
NL9400261A (nl) * 1994-02-22 1995-10-02 Hollandse Signaalapparaten Bv Werkwijze voor het vervaardigen van een multilayer microwave board alsmede op deze wijze verkregen boards.
JPH0865016A (ja) * 1994-08-25 1996-03-08 Murata Mfg Co Ltd ストリップライン共振器
JP3178990B2 (ja) * 1995-06-22 2001-06-25 株式会社村田製作所 積層型電子部品の周波数調整方法

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GB2319659A (en) 1998-05-27
GB2319659B (en) 2001-05-16
FR2756107A1 (fr) 1998-05-22
FR2756107B1 (fr) 2000-04-07
DE19750324C2 (de) 1999-11-25
KR100293420B1 (ko) 2001-07-12
KR19980042565A (ko) 1998-08-17
US5952901A (en) 1999-09-14
GB9722588D0 (en) 1997-12-24
CN1197306A (zh) 1998-10-28
JPH10150308A (ja) 1998-06-02
DE19750324A1 (de) 1998-06-04

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