CN1193381C - 在衬底上允许微调的设备和允许微调衬底的制造方法 - Google Patents

在衬底上允许微调的设备和允许微调衬底的制造方法 Download PDF

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CN1193381C
CN1193381C CNB008050864A CN00805086A CN1193381C CN 1193381 C CN1193381 C CN 1193381C CN B008050864 A CNB008050864 A CN B008050864A CN 00805086 A CN00805086 A CN 00805086A CN 1193381 C CN1193381 C CN 1193381C
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L·－A·奥洛夫松
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Abstract

为了能在一个具有表面安装在该衬底上的分立的元件(6)和/或集成在该衬底中的元件(7)的衬底(1)上微调，对于每个被微调的元件，一个可微调的结构(9)被提供在该衬底的表面上。

Description

在衬底上允许微调的设备 和允许微调衬底的制造方法
技术领域
本发明通常涉及微调(trimming)，并且特别涉及在一个衬底上的功能性微调和/或元件微调，其中该衬底具有在衬底上表面安装和/或集成在衬底上的元件。
发明背景
在陶瓷衬底表面上印制电路布线的激光微调本身是已知的。
在一些申请中，对衬底的物理尺寸有严格要求。这引出所谓的LTCC(低温陶瓷Cofired衬底)衬底的一种设计，其中一些元件例如电阻、电感、和电容在与安装在衬底表面的表面安装元件的同时被集成在该衬底的不同层。
从日本专利摘要Nos.JP02052494A和JP60194556A中，已知在多层衬底中开一个孔或窗口以便微调集成在衬底中的一个层上的元件。在顶层上开一个孔或窗口的问题是在表面空间是非常有限的顶层上失去了太大的区域。
发明概述
本发明的目的是在一个多层衬底上允许微调，该多层衬底对衬底的物理尺寸特别是顶层表面是严格要求的，而不必在衬底上开孔或开窗以便使元件部分免调。
此发明的目的是这样实现的：在衬底表面上提供一个可调结构，该结构连接到要微调的元件上，不管该元件是否被表面安装的还是集成在衬底中的，以便微调每个元件。
即提出一种用于微调一个分立的电容器的装置，分立的电容器被表面安装在一个衬底上，其特征在于它包括一个可微调电容器，可微调电容器在衬底的表面上具有一个可微调的第一电极，以及一个集成在衬底中的第二电极，可微调电容器的第一和第二电极分别连接到表面安装的分立的电容器的电极以并联连接该可微调电容器与表面安装的分立的电容器。
也提出一种制造衬底的方法，该衬底允许一个表面安装在该衬底上的分立的电容器的微调，特征在于提供一个可微调电容器，可微调电容器在衬底的表面上具有一个可微调的第一电极，以及一个集成在衬底中的第二电极，将可微调电容器的第一和第二电极分别连接到表面安装的分立的电容器的电极以并联连接该可微调电容器与表面安装的分立的电容器。
以这种方式能够实现功能性微调和元件微调。
附图的简要说明
下面将参照附图详细描述本发明，其中
图1示意性地举例说明一个具有表面安装电感的多层衬底以及一个根据本发明的微调结构的第一实施例，
图2示意性地举例说明一个具有表面安装的电容器的多层衬底以及一个根据本发明的微调结构的第二实施例，
图3示意性地举例说明一个具有表面安装的贴片电阻器的多层衬底以及一个根据本发明的微调结构的第三实施例，
图4示意性地举例说明一个具有表面安装的分立的元件，一个集成在衬底上的电阻器的多层衬底，以及一个根据本发明的微调结构的第四实施例。
发明描述
图1示意性地举例说明一个多层衬底1，其中多个元件2a，2b，2c被集成在不同的层上。
在衬底1的表面上，一个分立的元件以电感的形式被安装。
在电感器的电感值是非常低的以致于作为该陶瓷衬底中的印制电感器实现该元件是可能的应用中，大部分的电感器布置在不影响衬底表面区域的内层。为了能使电感值微调，只有电感器的一小部分位于根据本发明的衬底表面上。
在需要较高电感值的应用中，得使用如图1中示意的电感器3的表面安装电感器。
根据本发明，分立的电感器3与印制在衬底1表面的可微调结构4串联。在图1的实施例中，如果需要该可微调结构4包括一个被激光微调的电感器。
由于商业上可用的分立的电感器的电感值是固定的，以这样的方式选择可微调结构4，即能够微调商业上可用的固定电感值和顶层上该可微调结构的区域的差，它被如此设计以最小化其所占区域。
除集成在衬底1中的电感器之外，图1中的微调结构4理所当然能适用于激光微调。
由此举例来说，在图1的衬底1中元件2c可以是集成在衬底1中的一层上的电感器。为了利用微调结构4能微调该电感器2c的电感值，该电感器2c和4通过衬底1顶层中的通孔5互相连接。
图2举例说明图1中具有元件2a，2b和2c的衬底1的一个实施例。
在图2的实施例中，一个分立的电容器6被表面安装在该衬底1的表面上。电容器6应该与一个可微调电容器7并联，可微调电容器7的电极8具有一个集成在衬底1的一层中，其另一个电极以微调电极9的形式在衬底1的表面上。该微调电极9与表面安装的分立的电容器6的电极之一串联连接。
利用一个呈导电区域状态的微调结构9，激光微调该电容器6和7的电容是可能的。
集成在衬底1中一个层上的电容器7的电极8通过衬底1的顶层中的通孔10被连接到电容器6的另一个电极。
图3举例说明具有集成元件2a，2b和2c的衬底1的另一个实施例。
在图3的实施例中，一个分立的芯片电阻器11应该被安装在该衬底1的表面上。
为了允许微调该分立的电阻器11，一个可微调结构以一个可微调电阻器12的形式被印制在衬底1的表面上并与分立的电阻器11串联连接。如图3中所示，可微调电阻器12被连接到在不同层上集成在衬底1中的其它元件。
利用普通的激光微调，该可微调电阻器12被微调。
图4举例说明具有集成的元件2a，2b和2c的衬底1的一个第四实施例。
在图4的实施例中，一个分立的元件13被安装在该衬底1的表面上。一个电阻器14被印制在衬底1的一个内层上。为了允许微调电阻器14，一个可微调电阻器15被印制在衬底1的表面上并通过在衬底1的顶层中的通孔16与电阻器14串联连接。为了微调该电阻器14的电阻值，使用激光微调以微调可微调电阻器15。
从上文应是显而易见的，利用如上所述的可微调元件结构，微调是容易进行的。

Claims (2)

1.一种用于微调一个分立的电容器(6)的装置，分立的电容器(6)被表面安装在一个衬底(1)上，其特征在于它包括一个可微调电容器(7)，该可微调电容器(7)在衬底(1)的表面上具有一个可微调的第一电极(9)，以及一个集成在衬底(1)中的第二电极(8)，可微调电容器(7)的第一和第二电极(9，8)分别连接到表面安装的分立的电容器(6)的电极以并联连接该可微调电容器(7)与表面安装的分立的电容器(6)。
2.一种制造衬底的方法，该衬底允许一个表面安装在该衬底上的分立的电容器的微调，特征在于提供一个可微调电容器(7)，该可微调电容器(7)在衬底(1)的表面上具有一个可微调的第一电极(9)，以及一个集成在衬底(1)中的第二电极(8)，将可微调电容器(7)的第一和第二电极(9，8)分别连接到表面安装的分立的电容器(6)的电极以并联连接该可微调电容器(7)与表面安装的分立的电容器(6)。
CNB008050864A 1999-03-17 2000-02-18 在衬底上允许微调的设备和允许微调衬底的制造方法 Expired - Fee Related CN1193381C (zh)

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SE9900960A SE516152C2 (sv) 1999-03-17 1999-03-17 Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning
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EP1169718A1 (en) 2002-01-09
JP2002539635A (ja) 2002-11-19
DE60038548D1 (de) 2008-05-21
HK1045756A1 (zh) 2002-12-06
WO2000055870A1 (en) 2000-09-21
CN1343365A (zh) 2002-04-03
KR20020002479A (ko) 2002-01-09
TW526604B (en) 2003-04-01
SE9900960L (sv) 2000-09-18
DE60038548T2 (de) 2008-07-31
EP1169718B1 (en) 2008-04-09
US6664481B1 (en) 2003-12-16
AU3990200A (en) 2000-10-04
ATE391996T1 (de) 2008-04-15
SE9900960D0 (sv) 1999-03-17
SE516152C2 (sv) 2001-11-26
CA2367384A1 (en) 2000-09-21

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