FI20001384A - Upotetun rakenteen virittäminen - Google Patents
Upotetun rakenteen virittäminen Download PDFInfo
- Publication number
- FI20001384A FI20001384A FI20001384A FI20001384A FI20001384A FI 20001384 A FI20001384 A FI 20001384A FI 20001384 A FI20001384 A FI 20001384A FI 20001384 A FI20001384 A FI 20001384A FI 20001384 A FI20001384 A FI 20001384A
- Authority
- FI
- Finland
- Prior art keywords
- trimming
- embedded structures
- embedded
- structures
- trimming embedded
- Prior art date
Links
- 238000009966 trimming Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/255—Means for correcting the capacitance value
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0253—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing permanent magnets
- H01F41/0286—Trimming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/06—Coaxial lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/08—Strip line resonators
- H01P7/084—Triplate line resonators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20001384A FI20001384A (fi) | 2000-06-09 | 2000-06-09 | Upotetun rakenteen virittäminen |
EP01931743A EP1287725A1 (en) | 2000-06-09 | 2001-04-27 | Trimming of embedded structures |
AU2001258446A AU2001258446A1 (en) | 2000-06-09 | 2001-04-27 | Trimming of embedded structures |
PCT/FI2001/000411 WO2001095684A1 (en) | 2000-06-09 | 2001-04-27 | Trimming of embedded structures |
US10/297,762 US6921868B2 (en) | 2000-06-09 | 2001-04-27 | Trimming of embedded structures |
US11/155,572 US7531755B2 (en) | 2000-06-09 | 2005-06-20 | Trimming of embedded structures |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20001384A FI20001384A (fi) | 2000-06-09 | 2000-06-09 | Upotetun rakenteen virittäminen |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20001384A0 FI20001384A0 (fi) | 2000-06-09 |
FI20001384A true FI20001384A (fi) | 2001-12-10 |
Family
ID=8558533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20001384A FI20001384A (fi) | 2000-06-09 | 2000-06-09 | Upotetun rakenteen virittäminen |
Country Status (5)
Country | Link |
---|---|
US (2) | US6921868B2 (fi) |
EP (1) | EP1287725A1 (fi) |
AU (1) | AU2001258446A1 (fi) |
FI (1) | FI20001384A (fi) |
WO (1) | WO2001095684A1 (fi) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006019567A (ja) * | 2004-07-02 | 2006-01-19 | Seiko Epson Corp | シールド線 |
JP4669338B2 (ja) * | 2005-07-22 | 2011-04-13 | 富士通コンポーネント株式会社 | プリント配線板及びその製造方法 |
US8138588B2 (en) * | 2006-12-21 | 2012-03-20 | Texas Instruments Incorporated | Package stiffener and a packaged device using the same |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3996416A (en) * | 1975-03-18 | 1976-12-07 | Amp Incorporated | Interconnection system and method of assembly |
US4431977A (en) | 1982-02-16 | 1984-02-14 | Motorola, Inc. | Ceramic bandpass filter |
JPS6165465A (ja) * | 1984-09-07 | 1986-04-04 | Toshiba Corp | 厚膜多層基板における膜抵抗体の製造方法 |
US4792779A (en) * | 1986-09-19 | 1988-12-20 | Hughes Aircraft Company | Trimming passive components buried in multilayer structures |
US5165166A (en) * | 1987-09-29 | 1992-11-24 | Microelectronics And Computer Technology Corporation | Method of making a customizable circuitry |
US4859806A (en) * | 1988-05-17 | 1989-08-22 | Microelectronics And Computer Technology Corporation | Discretionary interconnect |
US4896124A (en) | 1988-10-31 | 1990-01-23 | Motorola, Inc. | Ceramic filter having integral phase shifting network |
JPH0334305U (fi) * | 1989-08-14 | 1991-04-04 | ||
JP2725439B2 (ja) * | 1990-05-17 | 1998-03-11 | 株式会社 村田製作所 | 電子部品の周波数調整方法 |
GB9414362D0 (en) * | 1994-07-15 | 1994-09-07 | Plessey Semiconductors Ltd | Trimmable capacitor |
US6229097B1 (en) * | 1996-03-08 | 2001-05-08 | Motorola, Inc. | Substrate having trim window in a C5 array |
WO1998027795A1 (fr) * | 1996-12-17 | 1998-06-25 | Hokuriku Electric Industry Co., Ltd. | Carte de circuit possedant un composant electrique et son procede de fabrication |
JPH10241996A (ja) * | 1997-02-26 | 1998-09-11 | Ngk Spark Plug Co Ltd | 積層回路 |
JPH11191513A (ja) * | 1997-12-26 | 1999-07-13 | Matsushita Electric Ind Co Ltd | 回路基板、および回路基板におけるインダクタンスまたはキャパシタンスの調整方法 |
SE516152C2 (sv) * | 1999-03-17 | 2001-11-26 | Ericsson Telefon Ab L M | Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning |
US6134117A (en) * | 1999-04-16 | 2000-10-17 | Delphi Technologies, Inc. | Method for high resolution trimming of PCB components |
US6534861B1 (en) * | 1999-11-15 | 2003-03-18 | Substrate Technologies Incorporated | Ball grid substrate for lead-on-chip semiconductor package |
TW535352B (en) * | 2000-05-30 | 2003-06-01 | Alps Electric Co Ltd | Surface-mounting type electronic circuit unit |
-
2000
- 2000-06-09 FI FI20001384A patent/FI20001384A/fi not_active IP Right Cessation
-
2001
- 2001-04-27 AU AU2001258446A patent/AU2001258446A1/en not_active Abandoned
- 2001-04-27 US US10/297,762 patent/US6921868B2/en not_active Expired - Fee Related
- 2001-04-27 WO PCT/FI2001/000411 patent/WO2001095684A1/en active Application Filing
- 2001-04-27 EP EP01931743A patent/EP1287725A1/en not_active Withdrawn
-
2005
- 2005-06-20 US US11/155,572 patent/US7531755B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FI20001384A0 (fi) | 2000-06-09 |
EP1287725A1 (en) | 2003-03-05 |
US20050230349A1 (en) | 2005-10-20 |
US6921868B2 (en) | 2005-07-26 |
US7531755B2 (en) | 2009-05-12 |
WO2001095684A1 (en) | 2001-12-13 |
US20030161121A1 (en) | 2003-08-28 |
AU2001258446A1 (en) | 2001-12-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MA | Patent expired |