FI20001384A - Upotetun rakenteen virittäminen - Google Patents

Upotetun rakenteen virittäminen Download PDF

Info

Publication number
FI20001384A
FI20001384A FI20001384A FI20001384A FI20001384A FI 20001384 A FI20001384 A FI 20001384A FI 20001384 A FI20001384 A FI 20001384A FI 20001384 A FI20001384 A FI 20001384A FI 20001384 A FI20001384 A FI 20001384A
Authority
FI
Finland
Prior art keywords
trimming
embedded structures
embedded
structures
trimming embedded
Prior art date
Application number
FI20001384A
Other languages
English (en)
Swedish (sv)
Other versions
FI20001384A0 (fi
Inventor
Olli Salmela
Ilpo Kokkonen
Original Assignee
Nokia Networks Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Networks Oy filed Critical Nokia Networks Oy
Priority to FI20001384A priority Critical patent/FI20001384A/fi
Publication of FI20001384A0 publication Critical patent/FI20001384A0/fi
Priority to EP01931743A priority patent/EP1287725A1/en
Priority to AU2001258446A priority patent/AU2001258446A1/en
Priority to PCT/FI2001/000411 priority patent/WO2001095684A1/en
Priority to US10/297,762 priority patent/US6921868B2/en
Publication of FI20001384A publication Critical patent/FI20001384A/fi
Priority to US11/155,572 priority patent/US7531755B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/255—Means for correcting the capacitance value
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0253—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing permanent magnets
    • H01F41/0286—Trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/08—Strip line resonators
    • H01P7/084—Triplate line resonators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
FI20001384A 2000-06-09 2000-06-09 Upotetun rakenteen virittäminen FI20001384A (fi)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FI20001384A FI20001384A (fi) 2000-06-09 2000-06-09 Upotetun rakenteen virittäminen
EP01931743A EP1287725A1 (en) 2000-06-09 2001-04-27 Trimming of embedded structures
AU2001258446A AU2001258446A1 (en) 2000-06-09 2001-04-27 Trimming of embedded structures
PCT/FI2001/000411 WO2001095684A1 (en) 2000-06-09 2001-04-27 Trimming of embedded structures
US10/297,762 US6921868B2 (en) 2000-06-09 2001-04-27 Trimming of embedded structures
US11/155,572 US7531755B2 (en) 2000-06-09 2005-06-20 Trimming of embedded structures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20001384A FI20001384A (fi) 2000-06-09 2000-06-09 Upotetun rakenteen virittäminen

Publications (2)

Publication Number Publication Date
FI20001384A0 FI20001384A0 (fi) 2000-06-09
FI20001384A true FI20001384A (fi) 2001-12-10

Family

ID=8558533

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20001384A FI20001384A (fi) 2000-06-09 2000-06-09 Upotetun rakenteen virittäminen

Country Status (5)

Country Link
US (2) US6921868B2 (fi)
EP (1) EP1287725A1 (fi)
AU (1) AU2001258446A1 (fi)
FI (1) FI20001384A (fi)
WO (1) WO2001095684A1 (fi)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006019567A (ja) * 2004-07-02 2006-01-19 Seiko Epson Corp シールド線
JP4669338B2 (ja) * 2005-07-22 2011-04-13 富士通コンポーネント株式会社 プリント配線板及びその製造方法
US8138588B2 (en) * 2006-12-21 2012-03-20 Texas Instruments Incorporated Package stiffener and a packaged device using the same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3996416A (en) * 1975-03-18 1976-12-07 Amp Incorporated Interconnection system and method of assembly
US4431977A (en) 1982-02-16 1984-02-14 Motorola, Inc. Ceramic bandpass filter
JPS6165465A (ja) * 1984-09-07 1986-04-04 Toshiba Corp 厚膜多層基板における膜抵抗体の製造方法
US4792779A (en) * 1986-09-19 1988-12-20 Hughes Aircraft Company Trimming passive components buried in multilayer structures
US5165166A (en) * 1987-09-29 1992-11-24 Microelectronics And Computer Technology Corporation Method of making a customizable circuitry
US4859806A (en) * 1988-05-17 1989-08-22 Microelectronics And Computer Technology Corporation Discretionary interconnect
US4896124A (en) 1988-10-31 1990-01-23 Motorola, Inc. Ceramic filter having integral phase shifting network
JPH0334305U (fi) * 1989-08-14 1991-04-04
JP2725439B2 (ja) * 1990-05-17 1998-03-11 株式会社 村田製作所 電子部品の周波数調整方法
GB9414362D0 (en) * 1994-07-15 1994-09-07 Plessey Semiconductors Ltd Trimmable capacitor
US6229097B1 (en) * 1996-03-08 2001-05-08 Motorola, Inc. Substrate having trim window in a C5 array
WO1998027795A1 (fr) * 1996-12-17 1998-06-25 Hokuriku Electric Industry Co., Ltd. Carte de circuit possedant un composant electrique et son procede de fabrication
JPH10241996A (ja) * 1997-02-26 1998-09-11 Ngk Spark Plug Co Ltd 積層回路
JPH11191513A (ja) * 1997-12-26 1999-07-13 Matsushita Electric Ind Co Ltd 回路基板、および回路基板におけるインダクタンスまたはキャパシタンスの調整方法
SE516152C2 (sv) * 1999-03-17 2001-11-26 Ericsson Telefon Ab L M Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning
US6134117A (en) * 1999-04-16 2000-10-17 Delphi Technologies, Inc. Method for high resolution trimming of PCB components
US6534861B1 (en) * 1999-11-15 2003-03-18 Substrate Technologies Incorporated Ball grid substrate for lead-on-chip semiconductor package
TW535352B (en) * 2000-05-30 2003-06-01 Alps Electric Co Ltd Surface-mounting type electronic circuit unit

Also Published As

Publication number Publication date
FI20001384A0 (fi) 2000-06-09
EP1287725A1 (en) 2003-03-05
US20050230349A1 (en) 2005-10-20
US6921868B2 (en) 2005-07-26
US7531755B2 (en) 2009-05-12
WO2001095684A1 (en) 2001-12-13
US20030161121A1 (en) 2003-08-28
AU2001258446A1 (en) 2001-12-17

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MA Patent expired