CN110461939A - 密封用环氧树脂组合物和电子部件装置 - Google Patents

密封用环氧树脂组合物和电子部件装置 Download PDF

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Publication number
CN110461939A
CN110461939A CN201880021591.7A CN201880021591A CN110461939A CN 110461939 A CN110461939 A CN 110461939A CN 201880021591 A CN201880021591 A CN 201880021591A CN 110461939 A CN110461939 A CN 110461939A
Authority
CN
China
Prior art keywords
epoxy resin
mass
filling material
inorganic filling
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880021591.7A
Other languages
English (en)
Chinese (zh)
Inventor
田中实佳
堀慧地
姜东哲
山浦格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN202211541808.1A priority Critical patent/CN115785621A/zh
Publication of CN110461939A publication Critical patent/CN110461939A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
CN201880021591.7A 2017-03-31 2018-03-28 密封用环氧树脂组合物和电子部件装置 Pending CN110461939A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211541808.1A CN115785621A (zh) 2017-03-31 2018-03-28 密封用环氧树脂组合物和电子部件装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-072892 2017-03-31
JP2017072892 2017-03-31
PCT/JP2018/013017 WO2018181600A1 (ja) 2017-03-31 2018-03-28 封止用エポキシ樹脂組成物及び電子部品装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202211541808.1A Division CN115785621A (zh) 2017-03-31 2018-03-28 密封用环氧树脂组合物和电子部件装置

Publications (1)

Publication Number Publication Date
CN110461939A true CN110461939A (zh) 2019-11-15

Family

ID=63677464

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201880021591.7A Pending CN110461939A (zh) 2017-03-31 2018-03-28 密封用环氧树脂组合物和电子部件装置
CN202211541808.1A Pending CN115785621A (zh) 2017-03-31 2018-03-28 密封用环氧树脂组合物和电子部件装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202211541808.1A Pending CN115785621A (zh) 2017-03-31 2018-03-28 密封用环氧树脂组合物和电子部件装置

Country Status (4)

Country Link
JP (2) JP7060011B2 (ja)
CN (2) CN110461939A (ja)
TW (1) TW201842021A (ja)
WO (1) WO2018181600A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111349414A (zh) * 2018-12-21 2020-06-30 上海得荣电子材料有限公司 一种低应力绝缘胶及其制备方法
CN115449184A (zh) * 2022-08-31 2022-12-09 江苏科化新材料科技有限公司 一种低翘曲热固性环氧树脂复合材料及其制备方法与应用

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023164333A (ja) * 2022-04-28 2023-11-10 住友化学株式会社 樹脂組成物およびそれに用いるアルミナ粉末
JP2023164332A (ja) * 2022-04-28 2023-11-10 住友化学株式会社 樹脂組成物およびそれに用いるアルミナ粉末

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04202522A (ja) * 1990-11-30 1992-07-23 Toray Ind Inc 半導体封止用エポキシ系樹脂組成物
JP2005206725A (ja) * 2004-01-23 2005-08-04 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2006028264A (ja) * 2004-07-13 2006-02-02 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2007262398A (ja) * 2006-03-01 2007-10-11 Hitachi Chem Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2008063571A (ja) * 2006-08-09 2008-03-21 Hitachi Chem Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2008297530A (ja) * 2007-06-04 2008-12-11 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN102585438A (zh) * 2011-01-06 2012-07-18 日立化成工业株式会社 密封用环氧树脂组合物和电子部件装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62141021A (ja) * 1985-12-13 1987-06-24 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JPS63142025A (ja) * 1986-12-05 1988-06-14 Toshiba Chem Corp 封止用樹脂組成物
JP2004018790A (ja) * 2002-06-19 2004-01-22 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP3989349B2 (ja) * 2002-09-30 2007-10-10 京セラケミカル株式会社 電子部品封止装置
JP2005200533A (ja) * 2004-01-15 2005-07-28 Kyocera Chemical Corp 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
JP6185719B2 (ja) 2010-03-31 2017-08-23 日立化成株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP2015183093A (ja) * 2014-03-24 2015-10-22 三菱化学株式会社 積層型半導体装置用の層間充填材に好適な組成物、積層型半導体装置、および積層型半導体装置の製造方法
JP6183061B2 (ja) 2013-08-27 2017-08-23 日立化成株式会社 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04202522A (ja) * 1990-11-30 1992-07-23 Toray Ind Inc 半導体封止用エポキシ系樹脂組成物
JP2005206725A (ja) * 2004-01-23 2005-08-04 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2006028264A (ja) * 2004-07-13 2006-02-02 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2007262398A (ja) * 2006-03-01 2007-10-11 Hitachi Chem Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2008063571A (ja) * 2006-08-09 2008-03-21 Hitachi Chem Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2008297530A (ja) * 2007-06-04 2008-12-11 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN102585438A (zh) * 2011-01-06 2012-07-18 日立化成工业株式会社 密封用环氧树脂组合物和电子部件装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111349414A (zh) * 2018-12-21 2020-06-30 上海得荣电子材料有限公司 一种低应力绝缘胶及其制备方法
CN115449184A (zh) * 2022-08-31 2022-12-09 江苏科化新材料科技有限公司 一种低翘曲热固性环氧树脂复合材料及其制备方法与应用
CN115449184B (zh) * 2022-08-31 2024-02-20 江苏中科科化新材料股份有限公司 一种低翘曲热固性环氧树脂复合材料及其制备方法与应用

Also Published As

Publication number Publication date
JPWO2018181600A1 (ja) 2020-02-13
JP7060011B2 (ja) 2022-04-26
JP7472931B2 (ja) 2024-04-23
JP2022097508A (ja) 2022-06-30
WO2018181600A1 (ja) 2018-10-04
TW201842021A (zh) 2018-12-01
CN115785621A (zh) 2023-03-14

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Address after: Tokyo, Japan

Applicant after: Showa electrical materials Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: HITACHI CHEMICAL Co.,Ltd.

Address after: Tokyo, Japan

Applicant after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: Showa electrical materials Co.,Ltd.