CN110461939A - Encapsulating epoxy resin composition and electronic part apparatus - Google Patents
Encapsulating epoxy resin composition and electronic part apparatus Download PDFInfo
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- CN110461939A CN110461939A CN201880021591.7A CN201880021591A CN110461939A CN 110461939 A CN110461939 A CN 110461939A CN 201880021591 A CN201880021591 A CN 201880021591A CN 110461939 A CN110461939 A CN 110461939A
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- epoxy resin
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- filling material
- inorganic filling
- curing agent
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Sealing Material Composition (AREA)
Abstract
A kind of encapsulating epoxy resin composition, it includes (A) epoxy resin, (B) curing agent, (C) curing accelerator and (D) inorganic filling material, aluminium oxide of the above-mentioned inorganic filling material relative to inorganic filling material total amount comprising 75 mass of mass %~98 %.
Description
Technical field
The present invention relates to encapsulating epoxy resin compositions and electronic part apparatus.
Background technique
In recent years, light and shortization of the electronic equipments such as smart phone and multifunction are promoting.Along with this, processing
Heat caused by the electronic equipment of the information of high-speed high capacity is increasing, it is possible to cause the malfunction of electronic equipment.Therefore,
It is required that carrying out high efficiency and heat radiation to heat caused by electronic equipment internal, that is, require high-cooling property (high thermal conductivity).It is studying
Whiles thermal diffusivity high device structure etc., also in the high heat dissipationization of research sealing material itself.As its method, have studied scattered
The use of the inorganic filling material of hot excellent aluminium oxide etc, inorganic filling material high fillingization etc. (such as patent is literary
Offer 1~3).
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2010-24464 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2008-297530 bulletin
Patent document 3: Japanese Unexamined Patent Publication 2003-213089 bulletin
Summary of the invention
Subject to be solved by the invention
But the encapsulating epoxy resin combination of the excellent inorganic filling material of the high thermal diffusivity filled with aluminium oxide etc
Hardness decline, not continuously shaped property excellent material when object has hot.
The purpose of one embodiment of the present invention is, hardness and heat conductivity excellent encapsulating epoxy resin when providing heat
Composition and have with the electronic part apparatus of its element sealed.
Solution for solving the problem
As described above, carrying out thermal diffusivity in the past as the method for radiating to heat caused by electronic equipment
The high fillingization of excellent aluminium oxide, but hardness declines when heat, there are problems for continuously shaped property.The present inventors has carried out depth
Enter research, as a result, by the way that a part of aluminium oxide is replaced into other inorganic filling materials, and realize and take into account epoxy resin
Hardness when the excellent heat conductivity of composition and excellent heat.
For example, as means for solving the problem, including the following embodiments and the accompanying drawings.
A kind of encapsulating epoxy resin composition of 1 > of <, it includes (A) epoxy resin, (B) curing agent, (C) solidifications to promote
Agent and (D) inorganic filling material, above-mentioned inorganic filling material include 75 matter of mass %~98 relative to inorganic filling material total amount
Measure the aluminium oxide of %.
2 > of < encapsulating epoxy resin composition according to 1 > of <, wherein above-mentioned inorganic filling material includes oxygen
Change aluminium and selected from least one of silicon nitride, boron nitride, magnesia, zinc oxide, silicon carbide and aluminium nitride inorganic fill material
Material.
3 > of < encapsulating epoxy resin composition according to 2 > of < 1 > or <, wherein above-mentioned curing agent is solid for phenol
Agent.
A kind of electronic part apparatus of 4 > of < has in element and 1 > of <~<, 3 > being sealed to said elements
The solidfied material of described in any item encapsulating epoxy resin compositions.
Invention effect
According to one method of the present invention, hardness and heat conductivity excellent encapsulating epoxy resin group when heat can be provided
It closes object and has the electronic part apparatus using its element sealed.
Specific embodiment
Hereinafter, mode for carrying out the present invention is described in detail.But the present invention is not by the following embodiments and the accompanying drawings
It limits.In the following embodiments, constituent element (also include element step etc.) is except where specifically stated simultaneously
It is nonessential.It is also the same about numerical value and its range, it does not limit the invention.
In the disclosure, use in "~" numberical range for showing, comprising be recorded in "~" front and back numerical value respectively as
Minimum value and maximum value.
In the disclosure in the interim numberical range recorded, documented upper limit or lower limit in a numberical range
The upper limit or lower limit for the numberical range that other stages are recorded can be replaced into.In addition, documented numerical value in the disclosure
In range, the upper limit or lower limit of the numberical range can also be replaced into value shown in embodiment.
In the disclosure, each ingredient may include a variety of substances being consistent.When there are a variety of and each at split-phase in composition
When the substance of symbol, the containing ratio of each ingredient is unless otherwise specified, then it represents that is present in many kinds of substance in composition
Total containing ratio.
(encapsulating epoxy resin composition)
The encapsulating epoxy resin composition of the disclosure include (A) epoxy resin, (B) curing agent, (C) curing accelerator and
(D) inorganic filling material, above-mentioned inorganic filling material include 75 mass of mass %~98 % relative to inorganic filling material total amount
Aluminium oxide.Thus, it is possible to provide the decline of hardness and the encapsulating epoxy resin composition with high-cooling property when inhibiting hot.Separately
Outside, the encapsulating epoxy resin composition of the disclosure is for example used for encapsulated electronic components device.
[(A) epoxy resin]
The encapsulating epoxy resin composition of the disclosure is (hereinafter also referred to as " composition epoxy resin ".) it include (A) epoxy
Resin.As (A) epoxy resin, as long as then the kind thereof is not particularly limited for the resin in molecule with epoxy group.
As (A) epoxy resin, specifically, can enumerate: phenoloid and aliphatic aldehyde compound will be made in acidity
Under catalyst condensation or cocondensation obtained from phenolic resin carry out epoxidation after epoxy resin, i.e. phenol aldehyde type epoxy resin
(phenol novolak type epoxy, o-cresol phenol aldehyde type epoxy resin etc.), here, the phenoloid is selected from phenol, first
The phenolic compounds such as phenol, dimethlbenzene, resorcinol, catechol, bisphenol-A, Bisphenol F and alpha-Naphthol, betanaphthol, dihydroxy naphthlene
At least one kind of in equal naphthol compounds, the aliphatic aldehyde compound has formaldehyde, acetaldehyde, propionic aldehyde etc.；It will make above-mentioned phenol chemical combination
The aromatic aldehydes such as object and benzaldehyde, salicylide compound be condensed under acidic catalyst or cocondensation obtained from triphenyl methane
Type phenolic resin carries out epoxy resin, the i.e. triphenylmethane type epoxy resin after epoxidation；It will make above-mentioned phenolic compounds and naphthalene
Phenolic compounds and the aldehyde compound phenolic resin obtained from cocondensation under acidic catalyst carry out epoxidation after epoxy resin,
That is copoly type epoxy resin, here, the aldehyde compound has formaldehyde, acetaldehyde, propionic aldehyde, benzaldehyde, salicylide etc.；Bisphenol-A, bis-phenol
The diglycidyl ether of AD, Bisphenol F etc., i.e. diphenyl methane type epoxy resin；The two of the substituted or non-substituted xenol of alkyl
Glycidol ether, i.e. biphenyl type epoxy resin；The diglycidyl ether of stilbene system phenolic compounds, i.e. stilbene type epoxy resin；Bisphenol S etc.
Diglycidyl ether, i.e. containing the epoxy resin of sulphur atom；Contracting as alcohols such as butanediol, polyethylene glycol, polypropylene glycols
The epoxy resin of water glycerin ether；The polybasic carboxylic acids chemical combination such as phthalic acid, M-phthalic acid, tetrahydrophthalic acid, dimeric dibasic acid
The ethylene oxidic ester of object, i.e. glycidyl ester type epoxy resin；With glycidyl substituted aniline, diaminodiphenyl-methane,
Epoxy resin obtained by the reactive hydrogen being bonded on the nitrogen-atoms of isocyanuric acid etc., i.e. glycidyl amine type epoxy resin；By two
The cocondensation resin of cyclopentadiene and phenolic compounds carries out epoxy resin, the i.e. dicyclopentadiene-type epoxy resin after epoxidation；
As vinyl cyclohexene dioxide, the 3,4- epoxycyclohexyl first for making epoxy resin obtained by the ethylene linkage epoxidation of intramolecular
Base -3,4- epoxycyclohexane carboxylate, 2- (3,4- epoxy) cyclohexyl -5,5- spiral shell (3,4- epoxy) hexamethylene -
The alicyclic type epoxy resins such as m- dioxanes；The modified ring of the glycidol ether of paraxylene phenol-formaldehyde resin modified, i.e. paraxylene
Oxygen resin；The glycidol ether of meta-xylene phenol-formaldehyde resin modified, i.e. meta-xylene modified epoxy；Terpene modified phenolic aldehyde tree
The glycidol ether of rouge, i.e. terpene modified epoxy resin；The glycidol ether of dicyclopentadiene-modified phenolic resin, i.e. two rings penta
Diene modified epoxy resin；The glycidol ether of cyclopentadiene phenol-formaldehyde resin modified, i.e. cyclopentadiene modified epoxy；It is polycyclic
The glycidol ether of aromatic rings phenol-formaldehyde resin modified, i.e. polycyclic aromatic rings modified epoxy；Phenolic resin containing naphthalene nucleus
Glycidol ether, i.e. naphthalene type epoxy resin；Halogenated phenol phenol aldehyde type epoxy resin；Hydroquinone type epoxy resin；Trihydroxy methyl
Propane epoxy resin；Threadiness aliphatic epoxy resin obtained by ethylene linkage was waited acid oxidase with peracetic acid；By phenol aralkyl
Epoxy resin, i.e. aralkyl-type epoxy resin after the aralkyl-type phenol resins epoxidations such as resin, naphthols aralkyl resin；
Deng.In addition, epoxides of the epoxides of silicone resin, acrylic resin etc. can be used as epoxy resin also to enumerate.These
Epoxy resin can be used alone, or two or more kinds may be used in combination.
(A) epoxide equivalent (molecular weight/epoxy radix) of epoxy resin is not particularly limited.From mouldability, it is resistance to it is reflow,
From the perspective of the various characteristics such as electrical reliability balance, preferably 100g/eq~1000g/eq, more preferably 150g/eq~
500g/eq。
(A) epoxide equivalent of epoxy resin is set as the value measured and based on the method for JIS K 7236:2009.
(A) fusing point of epoxy resin or softening point are not particularly limited.From the viewpoint of mouldability and it is resistance to it is reflow, it is excellent
40 DEG C~180 DEG C are selected as, from the viewpoint of treatability when preparing composition epoxy resin, more preferably 50 DEG C~130 DEG C.
(A) fusing point of epoxy resin or softening point are set as by remembering in JIS K 7234:1986 and JIS K7233:1986
Single cylinder rotary viscosimeter method of load and the value measured.
From (A) epoxy resin in the viewpoints such as intensity, mobility, heat resistance, mouldability, composition epoxy resin
Containing ratio is preferably the 2 mass % of mass %~10, more preferably the 2.5 mass % of mass %~7.5, further preferably 3 matter
Measure the mass of %~6.5 %.
[(B) curing agent]
The composition epoxy resin of the disclosure includes (B) curing agent.The type of curing agent is not particularly limited, can basis
(A) type of epoxy resin, desired characteristic of composition epoxy resin etc. select.
Specific enumerable as (B) curing agent: phenol curing agent, anhydride curing agent, Polymercaptan curing agent, gathers amine hardener
Amino amides curing agent, isocyanate curing agent, blocked isocyanate curing agent etc..From the viewpoint of improving heat resistance, Gu
Agent is preferably phenol curing agent.
It as phenol curing agent, can specifically enumerate: make phenoloid and formaldehyde, acetaldehyde, propionic aldehyde, benzaldehyde, bigcatkin willow
The aldehyde compounds such as aldehyde be condensed under acidic catalyst or cocondensation obtained from novolac type phenolic resin, here, the phenol
Property compound be selected from resorcinol, catechol, bisphenol-A, Bisphenol F, phenol, cresols, dimethlbenzene, phenylphenol, amino
At least one of naphthol compounds such as the phenolic compounds such as phenol and alpha-Naphthol, betanaphthol, dihydroxy naphthlene；By above-mentioned phenol
Phenol aralkyl resin, the naphthols aralkyl of the property synthesis such as compound and dimethoxy paraxylene, bis- (methoxy) biphenyl
The aralkyl-type phenol resins such as base resin；Paraxylene phenol-formaldehyde resin modified；Meta-xylene phenol-formaldehyde resin modified；Melamine changes
Property phenolic resin；Terpene modified phenolic resin；By above-mentioned phenoloid and bicyclopentadiene by being copolymerized two rings synthesized
Pentadiene type phenolic resin and dicyclopentadiene-type naphthol resin；Cyclopentadiene phenol-formaldehyde resin modified；The modified phenol of polycyclic aromatic rings
Urea formaldehyde；Biphenyl type phenolic resin；Deng.From the viewpoint of for example improve it is resistance to it is reflow, preferred phenol aralkyl resin.
These phenol curing agent can be used alone, or two or more kinds may be used in combination.
(B) functional equivalent's (being hydroxyl equivalent in the case where phenol curing agent) of curing agent is not particularly limited.From at
From the perspective of the various characteristics such as type, resistance to reflow, electrical reliability balance, preferably 70g/eq~1000g/eq is more excellent
It is selected as 80g/eq~500g/eq.
The hydroxyl equivalent of phenol curing agent is set as the value measured and based on the method for JIS K 0070:1992.
(B) fusing point of curing agent or softening point are not particularly limited.From the viewpoint of mouldability and it is resistance to it is reflow, preferably
It is 40 DEG C~180 DEG C, from the viewpoint of treatability when manufacturing composition epoxy resin, more preferably 50 DEG C~130 DEG C.
(B) fusing point of curing agent or softening point are set as by recording in JIS K 7234:1986 and JIS K7233:1986
Single cylinder rotary viscosimeter method and the value that measures.
(A) equivalent proportion of epoxy resin and (B) curing agent, the functional group number i.e. in (B) curing agent in (A) epoxy resin
The ratio between functional group number (functional group number in functional group number/(A) epoxy resin in (B) curing agent) be not particularly limited.From
By respective unreacted amount inhibit it is less from the perspective of, be preferably located at 0.5~1.5 range, be more preferably located at 0.6~
1.3 range is further preferably located at 0.7~1.2 range.
[(C) curing accelerator]
The composition epoxy resin of the disclosure includes (C) curing accelerator.The type of curing accelerator is not particularly limited,
It can be selected according to type, desired characteristic of composition epoxy resin of (A) epoxy resin etc..Promote in addition, solidifying as (C)
Agent, the mobility when electrical reliability of composition epoxy resin and molding, preferably the solidification of phosphorus system promotees
Into agent.
It is specific enumerable as (C) curing accelerator: 1,8- diaza-bicyclic (5,4,0) endecatylene -7,1,
5- diaza-bicyclic (4,3,0) nonene, 11 carbon of 5,6- dibutylamino -1,8- diaza-bicyclic (5,4,0)
The tertiary amines such as alkene -7, benzyl dimethylamine, triethanolamine, dimethylaminoethanol, three (dimethylaminomethyl) phenol and these
The imidazoles such as derivative, 2-methylimidazole, 2- phenylimidazole, 2- phenyl -4-methylimidazole and these derivative,
Organic phosphine and the addition horses in these phosphines such as tributylphosphine, methyldiphenyl base phosphine, triphenylphosphine, diphenylphosphine, Phenylphosphine
That there is the polarized phosphorus compound of intramolecular, four benzene made of the compounds with pi bond such as acid anhydrides, benzoquinones, benzene diazonium methane
Ji Phosphonium tetraphenyl borate salts, triphenylphosphine tetraphenyl borate salts, 2-ethyl-4-methylimidazole tetraphenyl borate salts, N- first
Base tetraphenylphosphoniphenolate tetraphenyl borate salts, the addition product of triphenylphosphine and benzoquinones, three p-methylphenyl phosphines and benzoquinones addition product, triphen
Ji Phosphonium triphenyl borine etc..These curing accelerators can be used alone, or two or more kinds may be used in combination.
About the containing ratio of (C) curing accelerator in composition epoxy resin, as long as it can obtain solidification facilitation effect
It is not particularly limited.Relative to the total amount of (A) epoxy resin and (B) curing agent, (C) in composition epoxy resin, which solidifies, to be promoted
Containing ratio into agent is preferably the 0.1 mass % of mass %~8.0, more preferably the 0.5 mass % of mass %~5.0, further excellent
It is selected as 1.0 mass of mass %~3.0 %.(C) containing ratio of curing accelerator is relative to (A) epoxy resin and (B) curing agent
When total amount is 0.1 mass % or more, have the tendency that the shortening of achievable curing time, when being 8.0 mass % or less, there is solidification
Speed will not it is too fast, obtain the tendency of good molded product.
[(D) inorganic filling material]
The composition epoxy resin of the disclosure includes (D) inorganic filling material.By the inclusion of (D) inorganic filling material, from
And it can realize that hygroscopicity reduces and intensity is improved when solidfied material is made.
In addition, oxygen of (D) inorganic filling material relative to inorganic filling material total amount comprising 75 mass of mass %~98 %
Change aluminium.By the inclusion of the aluminium oxide of 75 mass % or more, the excellent composition epoxy resin of heat conductivity can be obtained, by the inclusion of
98 mass % aluminium oxide below, the composition epoxy resin that hardness declines when can obtain inhibiting heat.In addition, from hygroscopicity,
From the perspective of reducing linear expansion coefficient, intensity raising and solder heat resistance, further preferably comprising 75 mass of mass %~98 %
Aluminium oxide.
(D) oxidation of the inorganic filling material preferably with respect to inorganic filling material total amount comprising 75 mass of mass %~95 %
Aluminium more preferably includes the 75 mass % of mass %~92, includes further preferably the 75 mass % of mass %~90, particularly preferably includes
75 mass of mass %~85 %.
(D) inorganic filling material contains the aluminium oxide of 75 mass of mass %~98 %, therefore includes 2 matter of mass %~25
Measure the inorganic filling material other than the aluminium oxide of %.As inorganic filling material (hereinafter also referred to " other nothings other than aluminium oxide
Machine packing material ".), it can enumerate: fused silica, crystalline silica, silicon nitride, boron nitride, magnesia, zinc oxide, carbon
SiClx and aluminium nitride, zircon, calcium silicates, calcium carbonate, potassium titanate, beryllium oxide, zirconium oxide, forsterite, saponite, spinelle, not
Come the powder of stone, titanium dioxide etc. or mono-crystlling fibre, glass fibre, aromatics by pearl made of these spheroidizations, potassium titanate etc.
Fypro, carbon fiber etc..In addition, from the viewpoint of flame retardant effect, hydrogen-oxygen can be enumerated as other inorganic filling materials
Change aluminium, zinc borate, magnesium hydroxide etc..Other inorganic filling materials can be used alone, and two or more combinations can also be made
With.
From the viewpoint of heat conductivity, (D) inorganic filling material preferably comprise selected from silicon nitride, boron nitride, magnesia,
At least one of zinc oxide, silicon carbide and aluminium nitride inorganic filling material is as the inorganic filling material other than aluminium oxide.Its
In, more preferable silicon carbide.
(D) inorganic filling material preferably comprises the oxygen of 5 mass of mass %~25 % relative to inorganic filling material total amount
Change the inorganic filling material other than aluminium, more preferably include the 8 mass % of mass %~25, further preferably includes 10 mass %~25
Quality % particularly preferably includes 15 mass of mass %~25 %.
For example, (D) inorganic filling material preferably comprises 5 mass of mass %~25 % relative to inorganic filling material total amount
Silicon carbide, more preferably include the 8 mass % of mass %~25, it is especially excellent further preferably comprising 10 mass of mass %~25 %
Choosing includes 15 mass of mass %~25 %.
About the containing ratio of (D) inorganic filling material in composition epoxy resin, from hygroscopicity, drop low linear expansion system
Number, intensity improve and solder heat resistance from the perspective of, relative to composition epoxy resin total amount preferably 83 mass %~
97 mass %, the more preferably 85 mass % of mass %~94, further preferably 88 mass of mass %~93 %.
About the containing ratio of the aluminium oxide in composition epoxy resin, from hygroscopicity, linear expansion coefficient, intensity raising are reduced
From the perspective of solder heat resistance, the preferably 60 mass % of mass %~95 relative to composition epoxy resin total amount, more
The preferably 65 mass % of mass %~90, further preferably 75 mass of mass %~85 %.
It should be noted that the shape of (D) inorganic filling material is not particularly limited, it can be mentioned, for example powderies, spherical, fine
Tie up shape etc..Wherein, preferably spherical the mobility and mold abrasion when the molding of composition epoxy resin.
[other ingredients]
The composition epoxy resin of the disclosure may include except above-mentioned (A) epoxy resin, (B) curing agent, (C) solidification promote
Other ingredients into other than agent and (D) inorganic filling material.As other ingredients, as long as in the range for playing effect of the invention
In be just not particularly limited, can enumerate: release agent；Coupling agent；The fire retardants such as brominated epoxy resin, phosphorus compound；Antimony trioxide,
The flame retardants such as four antimony oxides；Colorant；Stress moderator；The various additives such as antioxidant.
Hereinafter, being said to the concrete example as the release agent of other ingredients, coupling agent, colorant and stress moderator
It is bright.
(release agent)
From the viewpoint of the excellent releasability from mode of mold when obtaining and forming, composition epoxy resin can be also comprising de-
Mould agent.Release agent is not particularly limited, and conventionally known release agent can be used.It is specific enumerable: Brazil wax, lignite
The aliphatic esters system such as the higher fatty acids such as acid, stearic acid, higher fatty acid metal salt, paraffin series wax, montanate wax, oxidation are poly-
Polyolefins wax such as ethylene, non-oxidized polyethylene etc..Release agent can be used alone, and two or more combinations can also be made
With.
In the case where composition epoxy resin includes release agent, the containing ratio of release agent relative to (A) epoxy resin with
(B) total amount of curing agent is preferably 10 mass % hereinafter, from the viewpoint of playing its effect, preferably 0.5 mass % with
On.
(coupling agent)
Composition epoxy resin can also include coupling agent.The type of coupling agent is not particularly limited, and can be used known
Coupling agent.As coupling agent, it can be mentioned, for example silane coupling agents and titanium coupling agent.Coupling agent can be used alone, can also
To be used in combination of two or more.
As silane coupling agent, it can be mentioned, for example: vinyl trichlorosilane, vinyltriethoxysilane, vinyl three
('beta '-methoxy ethyoxyl) silane, γ-methacryloxypropyl trimethoxy silane, β-(3,4- epoxycyclohexyl)
Ethyl trimethoxy silane, γ-glycidoxypropyltrime,hoxysilane, vinyltriacetoxy silane, γ-sulfydryl
Propyl trimethoxy silicane, γ aminopropyltriethoxy silane, γ-[bis- (beta-hydroxyethyls)] aminopropyl triethoxy
Silane, N- β-(amino-ethyl)-gamma-amino propyl trimethoxy silicane, γ-(beta-aminoethyl) aminopropyl diformazan
Oxygroup methyl-monosilane, N- (trimethoxy-silylpropyl) ethylenediamine, N- (dimethoxy-methyl silicyl isopropyl)
Ethylenediamine, methyltrimethoxysilane, methyltriethoxysilane, N- β-(N- vinylbenzylaminoethyl)-γ-
TSL 8330, γ-r-chloropropyl trimethoxyl silane, hexamethyldisilane, γ-anilino- propyl trimethoxy
Base silane, vinyltrimethoxysilane and γ-mercapto propyl methyl dimethoxy silane.
As titanium coupling agent, it can be mentioned, for example: isopropyl triisostearoyltitanate, three (dioctylphyrophosphoric acid acyloxy)
Isopropyl titanate, isopropyl three (N- aminoethyl-amino ethyl) titanate esters, bis- (the double tridecyl phosphorous acyl-oxygens of four octyls
Base) titanate esters, bis- (double tridecyl phosphorous acyloxy) the phosphorous acyl-oxygens of four (2,2- diallyloxymethyl -1- butyl)
Base titanate esters, bis- (dioctylphyrophosphoric acid acyloxy) ethoxyacetic acid ester titanate esters (Japanese: ビ ス (ジ オ Network チ Le パ イ ロ ホ
ス フ ェ ー ト) オ キ シ ア セ テ ー ト チ タ ネ ー ト), bis- (dioctylphyrophosphoric acid acyloxy) ethylene titanate esters, isopropyl three
Caprylyl titanate esters, isopropyl Dimethylacryloyl isostearoyl base titanate esters, isopropyl three (dodecyl) benzenesulfonyl
Titanate esters, two acryloyl group titanate esters of isopropyl stearyl, isopropyl three (dioctyl phosphoric acid acyloxy) titanate esters, isopropyl
Three cumyl phenyl titanate esters of base and bis- (the dioctyl phosphorous acyloxy) titanate esters of tetra isopropyl.
In the case where composition epoxy resin contains coupling agent, the containing ratio of coupling agent is relative to composition epoxy resin
Whole is preferably 3 mass % hereinafter, from the viewpoint of playing its effect, preferably 0.1 mass % or more.
(colorant)
Composition epoxy resin can also include colorant.As colorant, carbon black, organic dyestuff, You Jiyan can be enumerated
Colorant well known to material, iron oxide, red lead, colcother etc..The content of colorant can be properly selected according to purpose etc..Colorant can
To be used alone a kind, can also be used in combination of two or more.
When the electroconductive particles such as carbon black are applied in combination as colorant, it is preferable to use relative to electroconductive particle total amount and
10 μm of partial size or more of particle is 1 mass % colorant below, as the containing ratio of carbon black, preferably with respect to (A) asphalt mixtures modified by epoxy resin
The total amount of rouge and (B) curing agent is 3 mass % or less.
(stress moderator)
Composition epoxy resin can also include silicone oil, rubber particles, synthetic rubber iso-stress moderator.By the inclusion of
Stress moderator can be further reduced the buckling deformation of packaging body and the generation of packaging body crackle.It, can as stress moderator
Enumerate usually used well known stress moderator (flexible agent).Specifically, can enumerate: silicone-based, polystyrene, alkene
The thermoplastic elastomer (TPE)s such as system, carbamate system, Polyester, polyether system, polyamide-based, polybutadiene system；NR (natural rubber),
The rubber particles such as NBR (nitrile rubber), acrylic rubber, polyurethane rubber, silicone powder；Methyl methacrylate-benzene second
Alkene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, methyl methacrylate-butyl acrylate are total
Rubber particles with a core-shell structure such as polymers etc..Stress moderator can be used alone, can also be by two or more groups
It closes and uses.
[preparation method of composition epoxy resin]
The preparation method of composition epoxy resin is not particularly limited.As conventional method, following methods can be enumerated: will advised
After the ingredient mixing machine etc. for determining use level is sufficiently mixed, melting mixing is carried out with mixing mill, extruder etc., it is cooling, it crushes.More
Specifically, it can be mentioned, for example following methods: the specified amount of mentioned component is stirred and mixing, be previously heated to 70 DEG C~
140 DEG C kneader, roller, extruder etc. are kneaded, cooling, are crushed.
(electronic part apparatus)
The above-mentioned encapsulating epoxy resin that the electronic part apparatus of the disclosure has element and is sealed to said elements
The solidfied material of composition.
As electronic part apparatus, electronic component made of being sealed components department with composition epoxy resin can be enumerated
Device, the components department are propped up by the band carrier, wiring plate, glass, silicon wafer, organic substrate etc. after lead frame, wiring
Support component on carry element (active components such as semiconductor chip, transistor, diode, thyristor, capacitor, resistor,
Passive elements such as coil etc.) obtained from.
More specifically, it can enumerate: DIP (Dual Inline Package, dual-in-line package), PLCC (Plastic
Leaded Chip Carrier, the plastic chip carrier with lead), QFP (Quad Flat Package, quad flat envelope
Dress), SOP (Small Outline Package, small outline packages), SOJ (Small Outline J-lead Package, J
The small outline packages of type pin), TSOP (Thin Small Outline Package, Outline Package), TQFP (Thin
Quad Flat Package, slim quad flat package) etc. common plastic molded type IC (Integrated Circuit, collection
At circuit), they have the following structure: the fixing element on lead frame, by the portion of terminal and leading part of the elements such as landing pad
After connecting by wire bonding, convex block etc., pass through the structure that transfer molding etc. is sealed to form using composition epoxy resin；Have
TCP (the Tape for the structure that the element being connect by convex block with carrier is sealed to form with composition epoxy resin
Carrier Package, carrier package)；COB (Chip On Board, chip on board encapsulation) module, Mixed LB films, multi-chip mould
Block etc., they have the following structure: will by wire bonding, flip-chip bond, solder etc. be formed on supporting member
Wiring connection the structure that is sealed to form with composition epoxy resin of element；BGA (Ball Grid Array, ball grid array envelope
Dress), CSP (Chip Size Package, chip size packages), MCP (Multi Chip Package, multi-chip package) etc.,
They have the following structure: being that the back side is formed with the surface carrying element of the supporting member of the terminal of wiring plate connection, lead to
After crossing convex block or wire bonding and connecting element with the wiring being formed on supporting member, with composition epoxy resin to element
Structure made of being sealed.In addition, composition epoxy resin can also be properly used in printed wiring board.
As the method for using composition epoxy resin to be sealed electronic part apparatus, low pressure transfer molding can be enumerated
Method, injection moulding, compression forming methods etc..In these, low pressure transfer molding process is more generally applicable.
Embodiment
The present invention is specifically described by the following examples, but the scope of the present invention is not limited by these embodiments.
[preparation of composition epoxy resin]
After ingredient shown in will be following is pre-mixed (dry-mixed) according to mixing ratio shown in table 1 (mass parts), pinched with twin shaft
Conjunction machine is kneaded, and cooling simultaneously crushes, to prepare the composition epoxy resin of embodiment and comparative example.
(A) epoxy resin
A1 bisphenol-type epoxy resin, Nippon Steel & Sumitomo Metal Corporation, the name of an article " YSLV-80XY "
A2 biphenyl type epoxy resin, Mitsubishi chemical Co., Ltd, the name of an article " YX-4000 "
(B) curing agent
B1 triphenyl methane type phenolic resin, AIR WATER Co., Ltd., the name of an article " HE910 "
(C) curing accelerator
C1 phosphorus system curing accelerator (addition product of tributylphosphine and benzoquinones)
(D) inorganic filling material
DA-1 alumina packing, DENKA Co., Ltd., the name of an article " DAB10F CAll "
DA-2 alumina packing, Co., Ltd. ADMATECHS, the name of an article " AE-2000SI "
DB-1 alumina packing/silica filler=9/1 (mass ratio), DENKA Co., Ltd., the name of an article
" DAB-10FC "
DC-1 average grain diameter (D50, corresponding to the partial size of the volume-cumulative 50% from small particle side) is
14.0 μm, specific surface area 0.3m2The silicon carbide of/g
DC-2 average grain diameter (D50, corresponding to the partial size of the volume-cumulative 50% from small particle side) is
18.6 μm, specific surface area 0.3m2The silicon carbide of/g
[table 1]
(evaluation of hardness when hot)
The evaluation of hardness when the heat of composition epoxy resin is carried out as described below.
Using transfer molding machine, by composition epoxy resin produced above in 175 DEG C~180 DEG C of mold temperature, molding
Pressure 6.9MPa, test film (the diameter 50mm × thickness 3mm that Determination of Hardness when heat is shaped under conditions of 90 seconds curing times
Plectane).Hardness when using the heat of Shore D hardometer measurement test piece after molding immediately.
Show the result in table 2.
[table 2]
As shown in table 2, the comparative example 1 for being 100 mass % relative to the containing ratio of inorganic filling material total amount with aluminium oxide
~3 compare, and for Examples 1 to 3, obtain with high hardness when heat as a result, continuously shaped property is excellent.
(evaluation of thermal conductivity)
The thermal conductivity evaluation of composition epoxy resin is carried out as described below.
Using the manual press-forming machine of vacuum, by composition epoxy resin produced above in mold temperature 175 DEG C~180
DEG C, briquetting pressure 7.0MPa, be shaped under conditions of 600 seconds curing times thermal conductivity evaluation test film (1.1cm square,
Thickness 1.1mm).
For the test film molded, the thermal diffusivity of thickness direction is measured.The measurement of thermal diffusivity uses laser flash
Method (device: LFA447 nanoflash, NETZSCH corporation) Lai Jinhang.The irradiation of pulsed light impulse amplitude 0.31 (ms),
It is carried out under conditions of pressurization 247V.Measurement carries out at 25 DEG C ± 1 DEG C of atmosphere temperature.In addition, using electronic hydrometer (SD-
200L, ALFA MIRAGE Co. Ltd. system) determine the density of above-mentioned test film.
Then, using formula (1), the value of thermal conductivity is obtained and making specific heat, density multiplied by thermal diffusivity.
λ=α × Cp × ρ formula (1)
(in formula (1), λ indicates thermal conductivity (W/ (mK)), and α indicates thermal diffusivity (m2/ s), Cp indicates specific heat (J/ (kg
K)), ρ indicates density (d:kg/m3)。)
Show the result in table 3.
[table 3]
As shown in table 3, the comparative example 1 for being 100 mass % relative to the containing ratio of inorganic filling material total amount with aluminium oxide
~3 compare, and for Examples 1 to 3, obtain the high result of thermal conductivity.
The disclosure for the Japanese patent application 2017-072892 that on March 31st, 2017 files an application is entirely through reference
And it is incorporated herein.
For whole documents, patent application and the technical standard recorded in this specification, each document, patent application and
Technical standard by referring to and the way and situation that is specific and recording respectively that introduce are equal extent, and by referring to and by drawing
Enter in this specification.
Claims (4)
1. a kind of encapsulating epoxy resin composition, it includes (A) epoxy resin, (B) curing agent, (C) curing accelerator and (D)
Inorganic filling material, oxygen of the inorganic filling material relative to inorganic filling material total amount comprising 75 mass of mass %~98 %
Change aluminium.
2. encapsulating epoxy resin composition according to claim 1, wherein the inorganic filling material includes aluminium oxide
And selected from least one of silicon nitride, boron nitride, magnesia, zinc oxide, silicon carbide and aluminium nitride inorganic filling material.
3. according to claim 1 or encapsulating epoxy resin composition as claimed in claim 2, wherein the curing agent is phenol
Curing agent.
4. a kind of electronic part apparatus, the 1~claim 3 of claim for having element and being sealed to the element
Any one of described in encapsulating epoxy resin composition solidfied material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211541808.1A CN115785621A (en) | 2017-03-31 | 2018-03-28 | Epoxy resin composition for sealing and electronic component device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-072892 | 2017-03-31 | ||
| JP2017072892 | 2017-03-31 | ||
| PCT/JP2018/013017 WO2018181600A1 (en) | 2017-03-31 | 2018-03-28 | Epoxy resin composition for sealing, and electronic component device |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211541808.1A Division CN115785621A (en) | 2017-03-31 | 2018-03-28 | Epoxy resin composition for sealing and electronic component device |
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| CN110461939A true CN110461939A (en) | 2019-11-15 |
Family
ID=63677464
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| CN202211541808.1A Pending CN115785621A (en) | 2017-03-31 | 2018-03-28 | Epoxy resin composition for sealing and electronic component device |
| CN201880021591.7A Pending CN110461939A (en) | 2017-03-31 | 2018-03-28 | Encapsulating epoxy resin composition and electronic part apparatus |
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| Country | Link |
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| JP (2) | JP7060011B2 (en) |
| CN (2) | CN115785621A (en) |
| TW (1) | TW201842021A (en) |
| WO (1) | WO2018181600A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111349414A (en) * | 2018-12-21 | 2020-06-30 | 上海得荣电子材料有限公司 | Low-stress insulating glue and preparation method thereof |
| CN115449184A (en) * | 2022-08-31 | 2022-12-09 | 江苏科化新材料科技有限公司 | Low-warpage thermosetting epoxy resin composite material and preparation method and application thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023164333A (en) * | 2022-04-28 | 2023-11-10 | 住友化学株式会社 | Resin composition and alumina powder used therefor |
| JP2023164332A (en) * | 2022-04-28 | 2023-11-10 | 住友化学株式会社 | Resin composition and alumina powder used therefor |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2018181600A1 (en) | 2018-10-04 |
| JP2022097508A (en) | 2022-06-30 |
| TW201842021A (en) | 2018-12-01 |
| CN115785621A (en) | 2023-03-14 |
| JPWO2018181600A1 (en) | 2020-02-13 |
| JP7060011B2 (en) | 2022-04-26 |
| JP7472931B2 (en) | 2024-04-23 |
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