CN110337718B - 绝缘基体、半导体封装以及半导体装置 - Google Patents

绝缘基体、半导体封装以及半导体装置 Download PDF

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Publication number
CN110337718B
CN110337718B CN201880013156.XA CN201880013156A CN110337718B CN 110337718 B CN110337718 B CN 110337718B CN 201880013156 A CN201880013156 A CN 201880013156A CN 110337718 B CN110337718 B CN 110337718B
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China
Prior art keywords
metal layer
bonding material
insulating
lead terminal
layer
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CN201880013156.XA
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English (en)
Chinese (zh)
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CN110337718A (zh
Inventor
重田真实
作本大辅
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
CN201880013156.XA 2017-02-23 2018-02-14 绝缘基体、半导体封装以及半导体装置 Active CN110337718B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-031899 2017-02-23
JP2017031899 2017-02-23
PCT/JP2018/005080 WO2018155282A1 (ja) 2017-02-23 2018-02-14 絶縁基体、半導体パッケージおよび半導体装置

Publications (2)

Publication Number Publication Date
CN110337718A CN110337718A (zh) 2019-10-15
CN110337718B true CN110337718B (zh) 2023-06-16

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Application Number Title Priority Date Filing Date
CN201880013156.XA Active CN110337718B (zh) 2017-02-23 2018-02-14 绝缘基体、半导体封装以及半导体装置

Country Status (5)

Country Link
US (2) US11335613B2 (https=)
EP (1) EP3588549A4 (https=)
JP (3) JP6829303B2 (https=)
CN (1) CN110337718B (https=)
WO (1) WO2018155282A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240105528A1 (en) * 2021-01-29 2024-03-28 Kyocera Corporation Semiconductor package and semiconductor electronic device
CN113937613A (zh) * 2021-09-22 2022-01-14 中国电子科技集团公司第十一研究所 一种星载泵浦ld强化组件及激光器

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294667A (ja) * 1999-04-09 2000-10-20 Matsushita Electronics Industry Corp 半導体パッケージおよびその製造方法
JP2002141596A (ja) * 2000-10-31 2002-05-17 Kyocera Corp 光半導体素子収納用パッケージ
JP2004228532A (ja) * 2003-01-27 2004-08-12 Kyocera Corp 入出力端子および半導体素子収納用パッケージならびに半導体装置
JP2004296577A (ja) * 2003-03-26 2004-10-21 Kyocera Corp 入出力端子および半導体素子収納用パッケージならびに半導体装置
JP2006179839A (ja) * 2004-11-29 2006-07-06 Kyocera Corp 接続端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置
JP2010199277A (ja) * 2009-02-25 2010-09-09 Kyocera Corp 接続装置、フレキシブル基板付き半導体素子収納用パッケージ、およびフレキシブル基板付き半導体装置
JP2012222079A (ja) * 2011-04-06 2012-11-12 Kyocera Corp 端子構造体、電子部品収納用パッケージおよび電子装置
CN103180941A (zh) * 2010-10-27 2013-06-26 京瓷株式会社 布线基板
CN103250240A (zh) * 2011-05-31 2013-08-14 京瓷株式会社 元件收纳用封装、半导体装置用部件以及半导体装置
CN103329260A (zh) * 2011-07-26 2013-09-25 京瓷株式会社 半导体元件收纳用封装体、具备其的半导体装置及电子装置
CN103688598A (zh) * 2011-07-22 2014-03-26 京瓷株式会社 布线基板以及电子装置
JP2015103619A (ja) * 2013-11-22 2015-06-04 京セラ株式会社 素子収納用パッケージおよび実装構造体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289960A (ja) * 2001-03-27 2002-10-04 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP3619473B2 (ja) * 2001-06-25 2005-02-09 京セラ株式会社 半導体素子収納用パッケージ
JP2009158511A (ja) * 2007-12-25 2009-07-16 Sumitomo Metal Electronics Devices Inc 入出力端子及び半導体素子収納用パッケージ
CN105144370B (zh) * 2013-09-25 2017-11-14 京瓷株式会社 电子部件收纳用封装件以及电子装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294667A (ja) * 1999-04-09 2000-10-20 Matsushita Electronics Industry Corp 半導体パッケージおよびその製造方法
JP2002141596A (ja) * 2000-10-31 2002-05-17 Kyocera Corp 光半導体素子収納用パッケージ
JP2004228532A (ja) * 2003-01-27 2004-08-12 Kyocera Corp 入出力端子および半導体素子収納用パッケージならびに半導体装置
JP2004296577A (ja) * 2003-03-26 2004-10-21 Kyocera Corp 入出力端子および半導体素子収納用パッケージならびに半導体装置
JP2006179839A (ja) * 2004-11-29 2006-07-06 Kyocera Corp 接続端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置
JP2010199277A (ja) * 2009-02-25 2010-09-09 Kyocera Corp 接続装置、フレキシブル基板付き半導体素子収納用パッケージ、およびフレキシブル基板付き半導体装置
CN103180941A (zh) * 2010-10-27 2013-06-26 京瓷株式会社 布线基板
JP2012222079A (ja) * 2011-04-06 2012-11-12 Kyocera Corp 端子構造体、電子部品収納用パッケージおよび電子装置
CN103250240A (zh) * 2011-05-31 2013-08-14 京瓷株式会社 元件收纳用封装、半导体装置用部件以及半导体装置
CN103688598A (zh) * 2011-07-22 2014-03-26 京瓷株式会社 布线基板以及电子装置
CN103329260A (zh) * 2011-07-26 2013-09-25 京瓷株式会社 半导体元件收纳用封装体、具备其的半导体装置及电子装置
JP2015103619A (ja) * 2013-11-22 2015-06-04 京セラ株式会社 素子収納用パッケージおよび実装構造体

Also Published As

Publication number Publication date
US20200058578A1 (en) 2020-02-20
JP7350902B2 (ja) 2023-09-26
EP3588549A4 (en) 2020-12-02
JP2021064812A (ja) 2021-04-22
US11335613B2 (en) 2022-05-17
JP6829303B2 (ja) 2021-02-10
EP3588549A1 (en) 2020-01-01
WO2018155282A1 (ja) 2018-08-30
JP2022046748A (ja) 2022-03-23
CN110337718A (zh) 2019-10-15
US11901247B2 (en) 2024-02-13
JP7007502B2 (ja) 2022-01-24
US20220238400A1 (en) 2022-07-28
JPWO2018155282A1 (ja) 2019-12-12

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