CN110060968B - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
- Publication number
- CN110060968B CN110060968B CN201910191898.8A CN201910191898A CN110060968B CN 110060968 B CN110060968 B CN 110060968B CN 201910191898 A CN201910191898 A CN 201910191898A CN 110060968 B CN110060968 B CN 110060968B
- Authority
- CN
- China
- Prior art keywords
- terminal
- wiring
- semiconductor device
- mounting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 125000006850 spacer group Chemical group 0.000 claims 2
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 11
- 239000010949 copper Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910191898.8A CN110060968B (zh) | 2014-09-16 | 2015-03-04 | 半导体装置 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014187801A JP6370652B2 (ja) | 2014-09-16 | 2014-09-16 | 半導体装置 |
| JP2014-187801 | 2014-09-16 | ||
| CN201910191898.8A CN110060968B (zh) | 2014-09-16 | 2015-03-04 | 半导体装置 |
| CN201510095089.9A CN105990283B (zh) | 2014-09-16 | 2015-03-04 | 半导体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510095089.9A Division CN105990283B (zh) | 2014-09-16 | 2015-03-04 | 半导体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110060968A CN110060968A (zh) | 2019-07-26 |
| CN110060968B true CN110060968B (zh) | 2023-11-03 |
Family
ID=55798129
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910191898.8A Active CN110060968B (zh) | 2014-09-16 | 2015-03-04 | 半导体装置 |
| CN201510095089.9A Active CN105990283B (zh) | 2014-09-16 | 2015-03-04 | 半导体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510095089.9A Active CN105990283B (zh) | 2014-09-16 | 2015-03-04 | 半导体装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6370652B2 (ja) |
| CN (2) | CN110060968B (ja) |
| TW (1) | TWI587459B (ja) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1677660A (zh) * | 2004-03-30 | 2005-10-05 | 夏普株式会社 | 半导体装置及其制造方法、半导体模块装置以及布线基片 |
| CN1770441A (zh) * | 2004-10-18 | 2006-05-10 | 夏普株式会社 | 半导体元件的连接结构、布线衬底及半导体装置 |
| CN1996586A (zh) * | 2006-01-06 | 2007-07-11 | 松下电器产业株式会社 | 半导体元件安装用衬底、半导体装置及电子设备 |
| CN101009270A (zh) * | 2006-01-26 | 2007-08-01 | 松下电器产业株式会社 | 半导体装置、电子设备及半导体装置用衬底的制造方法 |
| JP2013258347A (ja) * | 2012-06-14 | 2013-12-26 | Renesas Electronics Corp | 半導体装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04264795A (ja) * | 1991-02-19 | 1992-09-21 | Fujitsu Ltd | チップ部品搭載パッド |
| JP5150076B2 (ja) * | 2006-09-15 | 2013-02-20 | 株式会社豊田自動織機 | 表面実装用電子部品の表面実装構造 |
| JP5621951B1 (ja) * | 2012-12-19 | 2014-11-12 | 株式会社村田製作所 | チップ部品の実装構造およびモジュール部品 |
| JP2014146689A (ja) * | 2013-01-29 | 2014-08-14 | Panasonic Corp | 紫外線発光装置 |
| JP6362889B2 (ja) * | 2013-04-26 | 2018-07-25 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
-
2014
- 2014-09-16 JP JP2014187801A patent/JP6370652B2/ja active Active
-
2015
- 2015-03-04 TW TW104106909A patent/TWI587459B/zh active
- 2015-03-04 CN CN201910191898.8A patent/CN110060968B/zh active Active
- 2015-03-04 CN CN201510095089.9A patent/CN105990283B/zh active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1677660A (zh) * | 2004-03-30 | 2005-10-05 | 夏普株式会社 | 半导体装置及其制造方法、半导体模块装置以及布线基片 |
| CN1770441A (zh) * | 2004-10-18 | 2006-05-10 | 夏普株式会社 | 半导体元件的连接结构、布线衬底及半导体装置 |
| CN1996586A (zh) * | 2006-01-06 | 2007-07-11 | 松下电器产业株式会社 | 半导体元件安装用衬底、半导体装置及电子设备 |
| CN101009270A (zh) * | 2006-01-26 | 2007-08-01 | 松下电器产业株式会社 | 半导体装置、电子设备及半导体装置用衬底的制造方法 |
| JP2013258347A (ja) * | 2012-06-14 | 2013-12-26 | Renesas Electronics Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6370652B2 (ja) | 2018-08-08 |
| JP2016062971A (ja) | 2016-04-25 |
| CN105990283A (zh) | 2016-10-05 |
| CN110060968A (zh) | 2019-07-26 |
| TWI587459B (zh) | 2017-06-11 |
| CN105990283B (zh) | 2019-04-09 |
| TW201613043A (en) | 2016-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Tokyo Applicant after: Kaixia Co.,Ltd. Address before: Tokyo Applicant before: TOSHIBA MEMORY Corp. Address after: Tokyo Applicant after: TOSHIBA MEMORY Corp. Address before: Tokyo Applicant before: Pangea Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220126 Address after: Tokyo Applicant after: Pangea Co.,Ltd. Address before: Tokyo Applicant before: TOSHIBA MEMORY Corp. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |