CN109423014A - 树脂组合物 - Google Patents
树脂组合物 Download PDFInfo
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- CN109423014A CN109423014A CN201811019089.0A CN201811019089A CN109423014A CN 109423014 A CN109423014 A CN 109423014A CN 201811019089 A CN201811019089 A CN 201811019089A CN 109423014 A CN109423014 A CN 109423014A
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- ZKXWKVVCCTZOLD-FDGPNNRMSA-N copper;(z)-4-hydroxypent-3-en-2-one Chemical compound [Cu].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O ZKXWKVVCCTZOLD-FDGPNNRMSA-N 0.000 description 1
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- 125000004122 cyclic group Chemical group 0.000 description 1
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- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
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- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
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- PRCNQQRRDGMPKS-UHFFFAOYSA-N pentane-2,4-dione;zinc Chemical compound [Zn].CC(=O)CC(C)=O.CC(=O)CC(C)=O PRCNQQRRDGMPKS-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- CUQCMXFWIMOWRP-UHFFFAOYSA-N phenyl biguanide Chemical compound NC(N)=NC(N)=NC1=CC=CC=C1 CUQCMXFWIMOWRP-UHFFFAOYSA-N 0.000 description 1
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- 229920001225 polyester resin Polymers 0.000 description 1
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- 229920005749 polyurethane resin Polymers 0.000 description 1
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- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
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- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
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- 238000003756 stirring Methods 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000002298 terpene group Chemical group 0.000 description 1
- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
- C08K5/357—Six-membered rings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-169816 | 2017-09-04 | ||
JP2017169816 | 2017-09-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109423014A true CN109423014A (zh) | 2019-03-05 |
Family
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111662532A (zh) * | 2019-03-07 | 2020-09-15 | 味之素株式会社 | 树脂组合物 |
CN112109402A (zh) * | 2019-06-20 | 2020-12-22 | 味之素株式会社 | 树脂片材 |
CN112126193A (zh) * | 2019-06-25 | 2020-12-25 | 味之素株式会社 | 树脂组合物 |
CN112778698A (zh) * | 2019-11-01 | 2021-05-11 | 味之素株式会社 | 树脂组合物 |
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JP7279319B2 (ja) * | 2017-09-04 | 2023-05-23 | 味の素株式会社 | 樹脂組成物 |
JP6870544B2 (ja) * | 2017-09-04 | 2021-05-12 | 味の素株式会社 | 樹脂組成物 |
JP2019173009A (ja) * | 2018-03-28 | 2019-10-10 | 積水化学工業株式会社 | 硬化体、樹脂材料及び多層プリント配線板 |
WO2019189466A1 (ja) * | 2018-03-28 | 2019-10-03 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
JP7305326B2 (ja) * | 2018-09-28 | 2023-07-10 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
WO2023149209A1 (ja) * | 2022-02-03 | 2023-08-10 | 味の素株式会社 | 樹脂組成物 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002293887A (ja) * | 2001-03-30 | 2002-10-09 | Hitachi Chem Co Ltd | プリント配線板用絶縁樹脂組成物及びその用途 |
CN101268146A (zh) * | 2005-09-15 | 2008-09-17 | 积水化学工业株式会社 | 树脂组合物、片状成型体、预浸料、固化体、层叠板及多层层叠板 |
US20090170983A1 (en) * | 2006-01-13 | 2009-07-02 | Yuji Tada | Cyanato Group-Containing Cyclic Phosphazene Compound and Method for Producing The Same |
CN102822272A (zh) * | 2011-03-31 | 2012-12-12 | 积水化学工业株式会社 | 预固化物、粗糙化预固化物及层叠体 |
US20150141583A1 (en) * | 2012-06-27 | 2015-05-21 | Toray Composites (America), Inc. | Benzoxazine resin composition, prepreg, and fiber-reinforced composite material |
JP2015211086A (ja) * | 2014-04-24 | 2015-11-24 | 味の素株式会社 | プリント配線板の絶縁層用樹脂組成物 |
CN105199326A (zh) * | 2014-06-30 | 2015-12-30 | 味之素株式会社 | 树脂组合物 |
CN105916293A (zh) * | 2015-02-24 | 2016-08-31 | 味之素株式会社 | 电路基板及其制造方法 |
JP2016196635A (ja) * | 2015-04-03 | 2016-11-24 | 住友ベークライト株式会社 | プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置 |
WO2017101539A1 (zh) * | 2015-12-17 | 2017-06-22 | 广东生益科技股份有限公司 | 一种热固性树脂组合物以及含有它的预浸料、层压板以及印制电路板 |
JP2017125211A (ja) * | 2017-04-05 | 2017-07-20 | 味の素株式会社 | 樹脂組成物 |
CN106987093A (zh) * | 2015-12-01 | 2017-07-28 | 味之素株式会社 | 树脂组合物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5088146B2 (ja) * | 2008-01-11 | 2012-12-05 | 横浜ゴム株式会社 | 封止剤用液状エポキシ樹脂組成物 |
JP5659673B2 (ja) * | 2010-10-06 | 2015-01-28 | 住友ベークライト株式会社 | 樹脂シート、積層板、電子部品、プリント配線板及び半導体装置 |
JP6696113B2 (ja) * | 2015-04-03 | 2020-05-20 | 住友ベークライト株式会社 | プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置 |
JP7279319B2 (ja) * | 2017-09-04 | 2023-05-23 | 味の素株式会社 | 樹脂組成物 |
-
2018
- 2018-08-30 JP JP2018161660A patent/JP7279319B2/ja active Active
- 2018-09-03 CN CN201811019089.0A patent/CN109423014A/zh active Pending
- 2018-09-03 KR KR1020180104746A patent/KR102560184B1/ko active IP Right Grant
- 2018-09-03 TW TW107130770A patent/TW201922908A/zh unknown
-
2023
- 2023-02-01 JP JP2023013813A patent/JP2023052814A/ja active Pending
- 2023-07-21 KR KR1020230095158A patent/KR102671534B1/ko active IP Right Grant
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002293887A (ja) * | 2001-03-30 | 2002-10-09 | Hitachi Chem Co Ltd | プリント配線板用絶縁樹脂組成物及びその用途 |
CN101268146A (zh) * | 2005-09-15 | 2008-09-17 | 积水化学工业株式会社 | 树脂组合物、片状成型体、预浸料、固化体、层叠板及多层层叠板 |
US20090170983A1 (en) * | 2006-01-13 | 2009-07-02 | Yuji Tada | Cyanato Group-Containing Cyclic Phosphazene Compound and Method for Producing The Same |
CN102822272A (zh) * | 2011-03-31 | 2012-12-12 | 积水化学工业株式会社 | 预固化物、粗糙化预固化物及层叠体 |
US20150141583A1 (en) * | 2012-06-27 | 2015-05-21 | Toray Composites (America), Inc. | Benzoxazine resin composition, prepreg, and fiber-reinforced composite material |
JP2015211086A (ja) * | 2014-04-24 | 2015-11-24 | 味の素株式会社 | プリント配線板の絶縁層用樹脂組成物 |
CN105199326A (zh) * | 2014-06-30 | 2015-12-30 | 味之素株式会社 | 树脂组合物 |
CN105916293A (zh) * | 2015-02-24 | 2016-08-31 | 味之素株式会社 | 电路基板及其制造方法 |
JP2016196635A (ja) * | 2015-04-03 | 2016-11-24 | 住友ベークライト株式会社 | プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置 |
CN106987093A (zh) * | 2015-12-01 | 2017-07-28 | 味之素株式会社 | 树脂组合物 |
WO2017101539A1 (zh) * | 2015-12-17 | 2017-06-22 | 广东生益科技股份有限公司 | 一种热固性树脂组合物以及含有它的预浸料、层压板以及印制电路板 |
JP2017125211A (ja) * | 2017-04-05 | 2017-07-20 | 味の素株式会社 | 樹脂組成物 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111662532A (zh) * | 2019-03-07 | 2020-09-15 | 味之素株式会社 | 树脂组合物 |
CN112109402A (zh) * | 2019-06-20 | 2020-12-22 | 味之素株式会社 | 树脂片材 |
CN112126193A (zh) * | 2019-06-25 | 2020-12-25 | 味之素株式会社 | 树脂组合物 |
CN112778698A (zh) * | 2019-11-01 | 2021-05-11 | 味之素株式会社 | 树脂组合物 |
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JP2023052814A (ja) | 2023-04-12 |
KR102560184B1 (ko) | 2023-07-28 |
KR20190026615A (ko) | 2019-03-13 |
JP7279319B2 (ja) | 2023-05-23 |
KR102671534B1 (ko) | 2024-06-04 |
JP2019044180A (ja) | 2019-03-22 |
TW201922908A (zh) | 2019-06-16 |
KR20230113507A (ko) | 2023-07-31 |
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