CN109423014A - 树脂组合物 - Google Patents

树脂组合物 Download PDF

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Publication number
CN109423014A
CN109423014A CN201811019089.0A CN201811019089A CN109423014A CN 109423014 A CN109423014 A CN 109423014A CN 201811019089 A CN201811019089 A CN 201811019089A CN 109423014 A CN109423014 A CN 109423014A
Authority
CN
China
Prior art keywords
resin composition
resin
conductor layer
layer
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811019089.0A
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English (en)
Chinese (zh)
Inventor
西村嘉生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of CN109423014A publication Critical patent/CN109423014A/zh
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/35Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357Six-membered rings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/005Additives being defined by their particle size in general
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/006Additives being defined by their surface area
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201811019089.0A 2017-09-04 2018-09-03 树脂组合物 Pending CN109423014A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-169816 2017-09-04
JP2017169816 2017-09-04

Publications (1)

Publication Number Publication Date
CN109423014A true CN109423014A (zh) 2019-03-05

Family

ID=65514791

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811019089.0A Pending CN109423014A (zh) 2017-09-04 2018-09-03 树脂组合物

Country Status (4)

Country Link
JP (2) JP7279319B2 (ko)
KR (2) KR102560184B1 (ko)
CN (1) CN109423014A (ko)
TW (1) TW201922908A (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111662532A (zh) * 2019-03-07 2020-09-15 味之素株式会社 树脂组合物
CN112109402A (zh) * 2019-06-20 2020-12-22 味之素株式会社 树脂片材
CN112126193A (zh) * 2019-06-25 2020-12-25 味之素株式会社 树脂组合物
CN112778698A (zh) * 2019-11-01 2021-05-11 味之素株式会社 树脂组合物

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7279319B2 (ja) * 2017-09-04 2023-05-23 味の素株式会社 樹脂組成物
JP6870544B2 (ja) * 2017-09-04 2021-05-12 味の素株式会社 樹脂組成物
JP2019173009A (ja) * 2018-03-28 2019-10-10 積水化学工業株式会社 硬化体、樹脂材料及び多層プリント配線板
WO2019189466A1 (ja) * 2018-03-28 2019-10-03 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7305326B2 (ja) * 2018-09-28 2023-07-10 積水化学工業株式会社 樹脂材料及び多層プリント配線板
WO2023149209A1 (ja) * 2022-02-03 2023-08-10 味の素株式会社 樹脂組成物

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002293887A (ja) * 2001-03-30 2002-10-09 Hitachi Chem Co Ltd プリント配線板用絶縁樹脂組成物及びその用途
CN101268146A (zh) * 2005-09-15 2008-09-17 积水化学工业株式会社 树脂组合物、片状成型体、预浸料、固化体、层叠板及多层层叠板
US20090170983A1 (en) * 2006-01-13 2009-07-02 Yuji Tada Cyanato Group-Containing Cyclic Phosphazene Compound and Method for Producing The Same
CN102822272A (zh) * 2011-03-31 2012-12-12 积水化学工业株式会社 预固化物、粗糙化预固化物及层叠体
US20150141583A1 (en) * 2012-06-27 2015-05-21 Toray Composites (America), Inc. Benzoxazine resin composition, prepreg, and fiber-reinforced composite material
JP2015211086A (ja) * 2014-04-24 2015-11-24 味の素株式会社 プリント配線板の絶縁層用樹脂組成物
CN105199326A (zh) * 2014-06-30 2015-12-30 味之素株式会社 树脂组合物
CN105916293A (zh) * 2015-02-24 2016-08-31 味之素株式会社 电路基板及其制造方法
JP2016196635A (ja) * 2015-04-03 2016-11-24 住友ベークライト株式会社 プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
WO2017101539A1 (zh) * 2015-12-17 2017-06-22 广东生益科技股份有限公司 一种热固性树脂组合物以及含有它的预浸料、层压板以及印制电路板
JP2017125211A (ja) * 2017-04-05 2017-07-20 味の素株式会社 樹脂組成物
CN106987093A (zh) * 2015-12-01 2017-07-28 味之素株式会社 树脂组合物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5088146B2 (ja) * 2008-01-11 2012-12-05 横浜ゴム株式会社 封止剤用液状エポキシ樹脂組成物
JP5659673B2 (ja) * 2010-10-06 2015-01-28 住友ベークライト株式会社 樹脂シート、積層板、電子部品、プリント配線板及び半導体装置
JP6696113B2 (ja) * 2015-04-03 2020-05-20 住友ベークライト株式会社 プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
JP7279319B2 (ja) * 2017-09-04 2023-05-23 味の素株式会社 樹脂組成物

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002293887A (ja) * 2001-03-30 2002-10-09 Hitachi Chem Co Ltd プリント配線板用絶縁樹脂組成物及びその用途
CN101268146A (zh) * 2005-09-15 2008-09-17 积水化学工业株式会社 树脂组合物、片状成型体、预浸料、固化体、层叠板及多层层叠板
US20090170983A1 (en) * 2006-01-13 2009-07-02 Yuji Tada Cyanato Group-Containing Cyclic Phosphazene Compound and Method for Producing The Same
CN102822272A (zh) * 2011-03-31 2012-12-12 积水化学工业株式会社 预固化物、粗糙化预固化物及层叠体
US20150141583A1 (en) * 2012-06-27 2015-05-21 Toray Composites (America), Inc. Benzoxazine resin composition, prepreg, and fiber-reinforced composite material
JP2015211086A (ja) * 2014-04-24 2015-11-24 味の素株式会社 プリント配線板の絶縁層用樹脂組成物
CN105199326A (zh) * 2014-06-30 2015-12-30 味之素株式会社 树脂组合物
CN105916293A (zh) * 2015-02-24 2016-08-31 味之素株式会社 电路基板及其制造方法
JP2016196635A (ja) * 2015-04-03 2016-11-24 住友ベークライト株式会社 プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
CN106987093A (zh) * 2015-12-01 2017-07-28 味之素株式会社 树脂组合物
WO2017101539A1 (zh) * 2015-12-17 2017-06-22 广东生益科技股份有限公司 一种热固性树脂组合物以及含有它的预浸料、层压板以及印制电路板
JP2017125211A (ja) * 2017-04-05 2017-07-20 味の素株式会社 樹脂組成物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111662532A (zh) * 2019-03-07 2020-09-15 味之素株式会社 树脂组合物
CN112109402A (zh) * 2019-06-20 2020-12-22 味之素株式会社 树脂片材
CN112126193A (zh) * 2019-06-25 2020-12-25 味之素株式会社 树脂组合物
CN112778698A (zh) * 2019-11-01 2021-05-11 味之素株式会社 树脂组合物

Also Published As

Publication number Publication date
JP2023052814A (ja) 2023-04-12
KR102560184B1 (ko) 2023-07-28
KR20190026615A (ko) 2019-03-13
JP7279319B2 (ja) 2023-05-23
KR102671534B1 (ko) 2024-06-04
JP2019044180A (ja) 2019-03-22
TW201922908A (zh) 2019-06-16
KR20230113507A (ko) 2023-07-31

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