CN109360927A - 用于锂离子二次电池的多层混杂型电池隔板及其制造方法 - Google Patents

用于锂离子二次电池的多层混杂型电池隔板及其制造方法 Download PDF

Info

Publication number
CN109360927A
CN109360927A CN201811466451.9A CN201811466451A CN109360927A CN 109360927 A CN109360927 A CN 109360927A CN 201811466451 A CN201811466451 A CN 201811466451A CN 109360927 A CN109360927 A CN 109360927A
Authority
CN
China
Prior art keywords
separator
layer
film
battery
polypropylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811466451.9A
Other languages
English (en)
Chinese (zh)
Inventor
石烈
吉尔·V·沃森
罗纳德·W·考尔
罗尼·E·史密斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celgard LLC
Original Assignee
Celgard LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celgard LLC filed Critical Celgard LLC
Publication of CN109360927A publication Critical patent/CN109360927A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409Separators, membranes or diaphragms characterised by the material
    • H01M50/44Fibrous material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/052Li-accumulators
    • H01M10/0525Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/403Manufacturing processes of separators, membranes or diaphragms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/403Manufacturing processes of separators, membranes or diaphragms
    • H01M50/406Moulding; Embossing; Cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409Separators, membranes or diaphragms characterised by the material
    • H01M50/411Organic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409Separators, membranes or diaphragms characterised by the material
    • H01M50/411Organic material
    • H01M50/414Synthetic resins, e.g. thermoplastics or thermosetting resins
    • H01M50/417Polyolefins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409Separators, membranes or diaphragms characterised by the material
    • H01M50/449Separators, membranes or diaphragms characterised by the material having a layered structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/463Separators, membranes or diaphragms characterised by their shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/489Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/489Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
    • H01M50/491Porosity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/489Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
    • H01M50/494Tensile strength
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/22All layers being foamed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/24All layers being polymeric
    • B32B2250/246All polymers belonging to those covered by groups B32B27/32 and B32B27/30
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/20Inorganic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00Composition of foam
    • B32B2266/02Organic
    • B32B2266/0214Materials belonging to B32B27/00
    • B32B2266/025Polyolefin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204Di-electric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54Yield strength; Tensile strength
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558Impact strength, toughness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00Polyalkenes
    • B32B2323/04Polyethylene
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00Polyalkenes
    • B32B2323/10Polypropylene
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/10Batteries
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/052Li-accumulators
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01Manufacture or treatment
    • H10W70/05Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01Manufacture or treatment
    • H10W70/05Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/0198Manufacture or treatment batch processes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241Dispositions, e.g. layouts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/941Dispositions of bond pads
    • H10W72/9413Dispositions of bond pads on encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/01Manufacture or treatment
    • H10W74/019Manufacture or treatment using temporary auxiliary substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/20Configurations of stacked chips
    • H10W90/22Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Cell Separators (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201811466451.9A 2013-03-15 2014-03-14 用于锂离子二次电池的多层混杂型电池隔板及其制造方法 Pending CN109360927A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361792722P 2013-03-15 2013-03-15
US61/792,722 2013-03-15
CN201480015019.1A CN105122502A (zh) 2013-03-15 2014-03-14 用于锂离子二次电池的多层混杂型电池隔板及其制造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201480015019.1A Division CN105122502A (zh) 2013-03-15 2014-03-14 用于锂离子二次电池的多层混杂型电池隔板及其制造方法

Publications (1)

Publication Number Publication Date
CN109360927A true CN109360927A (zh) 2019-02-19

Family

ID=51528443

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201811466451.9A Pending CN109360927A (zh) 2013-03-15 2014-03-14 用于锂离子二次电池的多层混杂型电池隔板及其制造方法
CN201911015617.XA Pending CN110767864A (zh) 2013-03-15 2014-03-14 用于锂离子二次电池的多层混杂型电池隔板及其制造方法
CN201480015019.1A Pending CN105122502A (zh) 2013-03-15 2014-03-14 用于锂离子二次电池的多层混杂型电池隔板及其制造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201911015617.XA Pending CN110767864A (zh) 2013-03-15 2014-03-14 用于锂离子二次电池的多层混杂型电池隔板及其制造方法
CN201480015019.1A Pending CN105122502A (zh) 2013-03-15 2014-03-14 用于锂离子二次电池的多层混杂型电池隔板及其制造方法

Country Status (5)

Country Link
US (4) US9455432B2 (https=)
JP (3) JP2016516279A (https=)
KR (2) KR20210029294A (https=)
CN (3) CN109360927A (https=)
WO (1) WO2014152130A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116325317A (zh) * 2022-02-21 2023-06-23 宁德时代新能源科技股份有限公司 电池、用电设备、制备电池的方法和设备

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2732487A4 (en) 2011-07-11 2015-04-08 California Inst Of Techn NEW SEPARATORS FOR ELECTROCHEMICAL SYSTEMS
US9379368B2 (en) 2011-07-11 2016-06-28 California Institute Of Technology Electrochemical systems with electronically conductive layers
JP6228608B2 (ja) * 2012-10-08 2017-11-08 トレオファン・ジャーマニー・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング・ウント・コンパニー・コマンデイトゲゼルシャフト 均質な多孔性および上昇した貫入抵抗を有するミクロ多孔質セパレータフィルム
WO2015074037A2 (en) 2013-11-18 2015-05-21 California Institute Of Technology Separator enclosures for electrodes and electrochemical cells
US10714724B2 (en) 2013-11-18 2020-07-14 California Institute Of Technology Membranes for electrochemical cells
CN105470433B (zh) * 2014-09-29 2020-06-23 株式会社杰士汤浅国际 蓄电元件和蓄电元件的制造方法
CN114122621B (zh) 2015-06-03 2024-08-20 赛尔格有限责任公司 低电阻抗微孔膜、电池隔板、电池单元、电池及相关方法
CN105330937A (zh) * 2015-11-17 2016-02-17 梅庆波 一种湿法制备聚乙烯塑料聚合物的方法
US10340528B2 (en) 2015-12-02 2019-07-02 California Institute Of Technology Three-dimensional ion transport networks and current collectors for electrochemical cells
US9780060B2 (en) * 2015-12-03 2017-10-03 Texas Instruments Incorporated Packaged IC with solderable sidewalls
US10050013B2 (en) 2015-12-29 2018-08-14 Taiwan Semiconductor Manufacturing Company, Ltd. Packaged semiconductor devices and packaging methods
US20170325327A1 (en) * 2016-04-07 2017-11-09 Massachusetts Institute Of Technology Printed circuit board for high power components
CN109314203B (zh) * 2016-06-08 2021-11-30 远景Aesc 日本有限公司 非水电解质二次电池
US20170373011A1 (en) * 2016-06-28 2017-12-28 General Electric Company Semiconductor die backside devices and methods of fabrication thereof
KR101959263B1 (ko) * 2016-08-26 2019-03-19 더블유스코프코리아 주식회사 우수한 인성 및 내열수축성을 가지는 리튬이차전지용 분리막 필름 및 이의 제조방법
KR101964055B1 (ko) * 2016-09-20 2019-04-02 더블유스코프코리아 주식회사 다공성 분리막 및 그 제조방법
KR101964056B1 (ko) * 2016-09-22 2019-04-03 더블유스코프코리아 주식회사 리튬이차전지용 폴리올레핀 분리막 다층 필름 및 이의 제조방법
JP7421932B2 (ja) 2016-11-07 2024-01-25 セルガード エルエルシー 電池セパレーター
EP3539173A4 (en) * 2016-11-11 2020-10-28 Celgard LLC IMPROVED MICROLAYER MEMBRANES, IMPROVED BATTERY SEPARATORS AND RELATED PROCESSES
TWI762647B (zh) * 2017-05-26 2022-05-01 美商希爾格得有限公司 新穎或經改良的微孔膜、電池組分隔件、經塗覆之分隔件、電池組及相關方法
US10763242B2 (en) 2017-06-23 2020-09-01 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
US10541153B2 (en) 2017-08-03 2020-01-21 General Electric Company Electronics package with integrated interconnect structure and method of manufacturing thereof
US10541209B2 (en) 2017-08-03 2020-01-21 General Electric Company Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof
US10804115B2 (en) 2017-08-03 2020-10-13 General Electric Company Electronics package with integrated interconnect structure and method of manufacturing thereof
US10741466B2 (en) 2017-11-17 2020-08-11 Infineon Technologies Ag Formation of conductive connection tracks in package mold body using electroless plating
KR102439828B1 (ko) * 2017-11-30 2022-09-01 주식회사 엘지에너지솔루션 리튬 음극 호스트용 다공성 고분자 막 및 이를 포함하는 리튬 이차전지
KR102605122B1 (ko) 2017-12-08 2023-11-24 인피니언 테크놀로지스 아게 공기 캐비티를 갖는 반도체 패키지
CN108336280B (zh) * 2018-01-09 2021-09-14 深圳中兴新材技术股份有限公司 一种复合隔膜及其制备方法和应用
CN108305979B (zh) * 2018-01-09 2021-06-29 深圳中兴新材技术股份有限公司 复合隔膜及其制备方法和应用
CN108305975B (zh) * 2018-01-09 2021-04-20 深圳中兴新材技术股份有限公司 一种用于锂离子电池的复合隔膜及其制备方法
CN110364666B (zh) * 2018-04-11 2022-05-24 宁德新能源科技有限公司 隔离膜和锂离子电池
US20200083506A1 (en) * 2018-09-07 2020-03-12 Applied Materials, Inc. Ceramic coating on separator for batteries
JP7152106B2 (ja) * 2018-10-30 2022-10-12 帝人株式会社 ポリオレフィン微多孔膜及び液体フィルター
CN109980156B (zh) * 2018-12-24 2024-04-26 中材锂膜有限公司 一种湿法锂离子电池隔膜用除油装置
US11217659B1 (en) 2019-01-24 2022-01-04 Matthew W. Barlow Direct application additive manufacturing for conductive wafer interconnect
CN117996356A (zh) 2019-03-18 2024-05-07 宁德新能源科技有限公司 隔离膜和电化学装置
US11133281B2 (en) 2019-04-04 2021-09-28 Infineon Technologies Ag Chip to chip interconnect in encapsulant of molded semiconductor package
US10796981B1 (en) 2019-04-04 2020-10-06 Infineon Technologies Ag Chip to lead interconnect in encapsulant of molded semiconductor package
CN112018052A (zh) 2019-05-31 2020-12-01 英飞凌科技奥地利有限公司 具有可激光活化模制化合物的半导体封装
US11101541B2 (en) * 2019-10-03 2021-08-24 Advanced Semiconductor Engineering, Inc. Semiconductor assembly and method for manufacturing the same
KR102832317B1 (ko) * 2020-02-07 2025-07-11 삼성전자주식회사 반도체 패키지
WO2021211914A1 (en) * 2020-04-17 2021-10-21 Celgard, Llc Assymetric porous membrane
US11587800B2 (en) 2020-05-22 2023-02-21 Infineon Technologies Ag Semiconductor package with lead tip inspection feature
CN117337516A (zh) 2022-02-23 2024-01-02 株式会社Lg新能源 电化学装置用隔膜基材、包含其的隔膜以及形成电池单体隔膜的方法
TWI819653B (zh) * 2022-06-13 2023-10-21 群創光電股份有限公司 電子裝置與形成電子裝置的方法
CN117276239A (zh) * 2022-06-13 2023-12-22 群创光电股份有限公司 电子装置与形成电子装置的方法
US20240213623A1 (en) * 2022-12-27 2024-06-27 Rivian Ip Holdings, Llc Battery membranes and components thereof
JP2025536601A (ja) * 2023-03-17 2025-11-07 香港時代新能源科技有限公司 セパレータ、二次電池と電力消費装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1286502A (zh) * 1999-08-30 2001-03-07 思凯德公司 爆裂倾向降低的电池隔板
CN1883065A (zh) * 2003-11-21 2006-12-20 永备电池有限公司 高放电容量锂电池
CN101469078A (zh) * 2007-12-26 2009-07-01 Sk能源 微孔性聚烯烃多层膜及其制备方法
CN102141387A (zh) * 2010-01-19 2011-08-03 赛尔格有限责任公司 X射线敏感的电池隔板以及相关方法
CN102171855A (zh) * 2008-09-03 2011-08-31 三菱树脂株式会社 隔板用叠层多孔膜
CN102209632A (zh) * 2008-11-10 2011-10-05 三菱树脂株式会社 叠层多孔膜、锂电池用隔板及电池

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4539256A (en) 1982-09-09 1985-09-03 Minnesota Mining And Manufacturing Co. Microporous sheet material, method of making and articles made therewith
JPS60242035A (ja) 1984-04-27 1985-12-02 Toa Nenryo Kogyo Kk ポリエチレン微多孔膜の製造方法
JPS60228122A (ja) 1984-04-27 1985-11-13 Toa Nenryo Kogyo Kk ポリエチレン極薄フイルムの製造方法
JP3352801B2 (ja) 1994-01-31 2002-12-03 日東電工株式会社 多孔質フィルム、その製造法およびその用途
DE69514711T2 (de) 1994-05-12 2000-05-31 Ube Industries, Ltd. Poröser mehrschichtiger Film
US5667911A (en) 1994-11-17 1997-09-16 Hoechst Celanese Corporation Methods of making cross-ply microporous membrane battery separator, and the battery separators made thereby
TW297171B (https=) 1994-12-20 1997-02-01 Hoechst Celanese Corp
US5922492A (en) 1996-06-04 1999-07-13 Tonen Chemical Corporation Microporous polyolefin battery separator
US5952120A (en) 1997-04-15 1999-09-14 Celgard Llc Method of making a trilayer battery separator
CN1134491C (zh) * 1999-02-19 2004-01-14 东燃化学株式会社 聚烯烃微多孔膜及其制造方法
JP4120116B2 (ja) * 1999-11-25 2008-07-16 宇部興産株式会社 複合多孔質フィルム及びその製造方法
US6562511B2 (en) * 1999-12-09 2003-05-13 Ntk Powerdex, Inc. Battery separator for Li-Ion and/or Li-Ion polymer battery
US20020136945A1 (en) * 2000-01-18 2002-09-26 Call Ronald W. Multilayer battery separators
JP4931163B2 (ja) * 2001-04-24 2012-05-16 旭化成イーマテリアルズ株式会社 ポリオレフィン製微多孔膜
US20050031943A1 (en) * 2003-08-07 2005-02-10 Call Ronald W. Battery separator and method of making same
JP5202816B2 (ja) 2006-04-07 2013-06-05 東レバッテリーセパレータフィルム株式会社 ポリオレフィン微多孔膜及びその製造方法
US20070238017A1 (en) * 2006-04-07 2007-10-11 Celgard Llc Multilayer separator exhibiting improved strength and stability
US10003058B2 (en) * 2006-11-17 2018-06-19 Celgard, Llc Method of making a co-extruded, multi-layered battery separator
WO2009048175A2 (en) * 2007-10-12 2009-04-16 Tonen Chemical Corporation Microporous membranes and methods for making and using such membranes
US8748028B2 (en) * 2007-11-02 2014-06-10 Toray Battery Separator Film Co. Ltd. Multi-layer microporous membrane, battery separator and battery
US8003204B2 (en) * 2007-12-26 2011-08-23 Sk Energy Co., Ltd. Microporous polyolefin multi layer film and preparing method thereof
JP2010024502A (ja) 2008-07-22 2010-02-04 Sumitomo Light Metal Ind Ltd 電解コンデンサ電極用アルミニウム箔
JP5463154B2 (ja) * 2009-03-19 2014-04-09 旭化成イーマテリアルズ株式会社 積層微多孔膜及び非水電解質二次電池用セパレータ
US9196509B2 (en) * 2010-02-16 2015-11-24 Deca Technologies Inc Semiconductor device and method of adaptive patterning for panelized packaging
CN102195020A (zh) * 2010-03-04 2011-09-21 赛尔格有限责任公司 一种防止或减少锂离子电池突然热失控的方法
KR101670200B1 (ko) * 2010-08-02 2016-10-27 셀가드 엘엘씨 높은 용융 온도 미세다공성 리튬-이온 2차 전지 세퍼레이터 및 제조방법 및 용도
KR20120109258A (ko) 2011-03-28 2012-10-08 삼성전기주식회사 이차 전지 섬유상 분리막 및 그 제조 방법
US9331029B2 (en) * 2014-03-13 2016-05-03 Freescale Semiconductor Inc. Microelectronic packages having mold-embedded traces and methods for the production thereof
US9502397B1 (en) * 2015-04-29 2016-11-22 Deca Technologies, Inc. 3D interconnect component for fully molded packages

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1286502A (zh) * 1999-08-30 2001-03-07 思凯德公司 爆裂倾向降低的电池隔板
CN1883065A (zh) * 2003-11-21 2006-12-20 永备电池有限公司 高放电容量锂电池
CN101469078A (zh) * 2007-12-26 2009-07-01 Sk能源 微孔性聚烯烃多层膜及其制备方法
CN102171855A (zh) * 2008-09-03 2011-08-31 三菱树脂株式会社 隔板用叠层多孔膜
CN102209632A (zh) * 2008-11-10 2011-10-05 三菱树脂株式会社 叠层多孔膜、锂电池用隔板及电池
CN102141387A (zh) * 2010-01-19 2011-08-03 赛尔格有限责任公司 X射线敏感的电池隔板以及相关方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116325317A (zh) * 2022-02-21 2023-06-23 宁德时代新能源科技股份有限公司 电池、用电设备、制备电池的方法和设备
CN116325317B (zh) * 2022-02-21 2025-08-15 宁德时代新能源科技股份有限公司 电池、用电设备、制备电池的方法和设备

Also Published As

Publication number Publication date
US20200219796A1 (en) 2020-07-09
US11626349B2 (en) 2023-04-11
JP2020198316A (ja) 2020-12-10
KR20150128973A (ko) 2015-11-18
JP2019054003A (ja) 2019-04-04
US9899298B2 (en) 2018-02-20
US20170092567A1 (en) 2017-03-30
CN110767864A (zh) 2020-02-07
CN105122502A (zh) 2015-12-02
JP7483562B2 (ja) 2024-05-15
KR20210029294A (ko) 2021-03-15
US20140272533A1 (en) 2014-09-18
US9455432B2 (en) 2016-09-27
JP2016516279A (ja) 2016-06-02
WO2014152130A1 (en) 2014-09-25
KR102226140B1 (ko) 2021-03-11
US10601012B1 (en) 2020-03-24

Similar Documents

Publication Publication Date Title
CN109360927A (zh) 用于锂离子二次电池的多层混杂型电池隔板及其制造方法
JP7542043B2 (ja) リチウムイオン二次電池用の改善された微多孔膜セパレータおよび関連方法
TWI426641B (zh) 具有改良之熱特性的多孔狀多層薄膜
JP5250411B2 (ja) ポリオレフィン系微多孔膜及びその製造方法
CN112397846B (zh) 用于锂离子二次电池的改进的多层微孔膜隔板及相关方法
US9419266B2 (en) Polyolefin resin porous film, and non-aqueous electrolyte cell separator using same
KR102432329B1 (ko) 폴리올레핀 미세 다공막, 이의 제조 방법 및 전지용 세퍼레이터
EP2274787B1 (en) Microporous polyolefin film with thermally stable porous layer at high temperature
JP2014012857A (ja) 微多孔膜及びその製造方法、並びに非水電解液2次電池用セパレータ
JP7825394B2 (ja) 蓄電デバイス用セパレータ及び蓄電デバイス

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20190219