CN109152326B - 电子部件贴装系统及电子部件贴装方法 - Google Patents

电子部件贴装系统及电子部件贴装方法 Download PDF

Info

Publication number
CN109152326B
CN109152326B CN201810132785.6A CN201810132785A CN109152326B CN 109152326 B CN109152326 B CN 109152326B CN 201810132785 A CN201810132785 A CN 201810132785A CN 109152326 B CN109152326 B CN 109152326B
Authority
CN
China
Prior art keywords
electronic component
component mounting
substrate
mounting
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810132785.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN109152326A (zh
Inventor
太田秀典
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Precision Machinery Co Ltd
Original Assignee
Hanwha Precision Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanwha Precision Machinery Co Ltd filed Critical Hanwha Precision Machinery Co Ltd
Publication of CN109152326A publication Critical patent/CN109152326A/zh
Application granted granted Critical
Publication of CN109152326B publication Critical patent/CN109152326B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Operations Research (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Toxicology (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201810132785.6A 2016-11-17 2018-02-09 电子部件贴装系统及电子部件贴装方法 Active CN109152326B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016224372A JP6915981B2 (ja) 2016-11-17 2016-11-17 電子部品実装システム及び電子部品実装方法
KR10-2017-0075811 2017-06-15
KR1020170075811A KR102350923B1 (ko) 2016-11-17 2017-06-15 전자 부품 실장 시스템 및 전자 부품 실장 방법

Publications (2)

Publication Number Publication Date
CN109152326A CN109152326A (zh) 2019-01-04
CN109152326B true CN109152326B (zh) 2022-01-28

Family

ID=62197852

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810132785.6A Active CN109152326B (zh) 2016-11-17 2018-02-09 电子部件贴装系统及电子部件贴装方法

Country Status (3)

Country Link
JP (1) JP6915981B2 (ko)
KR (1) KR102350923B1 (ko)
CN (1) CN109152326B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10893639B2 (en) * 2017-01-12 2021-01-12 Panasonic Intellectual Property Management Co., Ltd. Component mounting using feedback correction
JP6547137B2 (ja) * 2017-01-12 2019-07-24 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置
JP6547136B2 (ja) * 2017-01-12 2019-07-24 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置
JP6706768B2 (ja) * 2019-06-10 2020-06-10 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置
JP6706769B2 (ja) * 2019-06-10 2020-06-10 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319378A (ja) * 2006-09-05 2006-11-24 Matsushita Electric Ind Co Ltd 電子部品実装システムおよび電子部品実装方法
CN101868126A (zh) * 2009-04-17 2010-10-20 松下电器产业株式会社 电子零件安装方法
JP2013105806A (ja) * 2011-11-11 2013-05-30 Panasonic Corp 電子部品実装システムおよび電子部品実装方法
CN104837298A (zh) * 2014-02-06 2015-08-12 Ekra自动化系统有限公司 用于印制基板的设备和方法
CN104996005A (zh) * 2012-11-19 2015-10-21 松下知识产权经营株式会社 电子元件安装系统及电子元件安装方法
CN105917217A (zh) * 2014-02-06 2016-08-31 欧姆龙株式会社 品质管理系统
CN105940354A (zh) * 2014-02-10 2016-09-14 欧姆龙株式会社 品质管理装置及其控制方法
CN106031328A (zh) * 2014-01-29 2016-10-12 欧姆龙株式会社 质量管理装置及质量管理装置的控制方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08153995A (ja) * 1994-11-28 1996-06-11 Oki Electric Ind Co Ltd 半導体装置の位置合わせ方法
JPH11204934A (ja) * 1998-01-13 1999-07-30 Fuji Photo Film Co Ltd 電子部品の実装方法
JP2003110288A (ja) * 2001-07-23 2003-04-11 Fuji Mach Mfg Co Ltd 対回路基板作業システムおよび電子回路製造方法
JP2006080197A (ja) * 2004-09-08 2006-03-23 Juki Corp 電子部品実装装置における吸着ノズルの位置補正方法
JP2008205424A (ja) * 2007-01-26 2008-09-04 Juki Corp 部品実装方法及び装置
JP4700653B2 (ja) * 2007-05-30 2011-06-15 ヤマハ発動機株式会社 実装ライン、実装基板の検査装置および検査方法
JP2010141209A (ja) * 2008-12-12 2010-06-24 Sony Corp 基板検査装置及び基板検査方法
US9609760B2 (en) * 2011-06-02 2017-03-28 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting method
KR20140102597A (ko) * 2011-12-22 2014-08-22 파나소닉 주식회사 전자부품 실장라인 및 전자부품 실장방법
JP6035937B2 (ja) * 2012-07-20 2016-11-30 日本電気株式会社 部品搭載装置および部品搭載方法
CN105164522B (zh) * 2013-02-03 2017-05-10 名古屋电机工业株式会社 部件安装基板检查方法以及采用该检查方法的基板制造系统
JP6320108B2 (ja) * 2014-03-27 2018-05-09 株式会社Ｆｕｊｉ 不良製品の目視検査を実施する作業者を支援する装置
JP2016174110A (ja) * 2015-03-17 2016-09-29 東レエンジニアリング株式会社 実装位置補正方法および実装位置補正装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319378A (ja) * 2006-09-05 2006-11-24 Matsushita Electric Ind Co Ltd 電子部品実装システムおよび電子部品実装方法
CN101868126A (zh) * 2009-04-17 2010-10-20 松下电器产业株式会社 电子零件安装方法
JP2013105806A (ja) * 2011-11-11 2013-05-30 Panasonic Corp 電子部品実装システムおよび電子部品実装方法
CN104996005A (zh) * 2012-11-19 2015-10-21 松下知识产权经营株式会社 电子元件安装系统及电子元件安装方法
CN106031328A (zh) * 2014-01-29 2016-10-12 欧姆龙株式会社 质量管理装置及质量管理装置的控制方法
CN104837298A (zh) * 2014-02-06 2015-08-12 Ekra自动化系统有限公司 用于印制基板的设备和方法
CN105917217A (zh) * 2014-02-06 2016-08-31 欧姆龙株式会社 品质管理系统
CN105940354A (zh) * 2014-02-10 2016-09-14 欧姆龙株式会社 品质管理装置及其控制方法

Also Published As

Publication number Publication date
JP2018082096A (ja) 2018-05-24
KR102350923B1 (ko) 2022-01-13
JP6915981B2 (ja) 2021-08-11
CN109152326A (zh) 2019-01-04
KR20180055674A (ko) 2018-05-25

Similar Documents

Publication Publication Date Title
CN109152326B (zh) 电子部件贴装系统及电子部件贴装方法
US10068872B2 (en) Mounting apparatus and method of correcting offset amount of the same
TWI619184B (zh) 確定和調整半導體元件接合相關平行度級別的系統和方法
JP4542046B2 (ja) 穴開け方法及び穴開け装置
US20140076956A1 (en) Soldering machine and method of soldering
JP6411028B2 (ja) 管理装置
WO2014037993A1 (ja) 作業装置
TW201513762A (zh) 用於自動調整點膠機之點膠單元的方法與裝置
CN105453716B (zh) 电子元件安装机及转印确认方法
JP6420245B2 (ja) エッジ検出に基づいて材料を供給する方法
JPWO2014033856A1 (ja) 基板用作業機器の基板高さ補正方法
JP6035517B2 (ja) 電子部品実装方法
JP2004146776A (ja) フリップチップ実装装置及びフリップチップ実装方法
KR102402523B1 (ko) 전자 부품 실장 시스템 및 전자 부품 실장 방법
JP2005353750A (ja) 電子部品搭載装置の保守管理装置
JPWO2018207313A1 (ja) 情報処理装置、３次元実装関連装置、実装システム及び情報処理方法
JP2009117411A (ja) 部品実装システム
CN102205450B (zh) 点焊nc数据生成方法及自动焊接装置
JP4918015B2 (ja) 部品実装方法
JP6748846B2 (ja) 部品実装システム及び部品実装システムにおけるデータフィードバック方法並びに部品実装システムにおけるデータフィードバック方法を実行するためのプログラム
TWI805031B (zh) 測定裝置、測定方法及接合系統
JP6339316B2 (ja) 部品実装システムおよびそれに用いる実装プログラムデータチェック方法
JP2007180232A (ja) ボンディング装置及び半導体装置の製造方法
JP5137612B2 (ja) ボンディング方法及びボンディング装置
JP2019160854A (ja) 部品実装方法及び部品実装ライン

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
CB02 Change of applicant information

Address after: Gyeongnam Changwon City, South Korea

Applicant after: HANWHA AEROSPACE Co.,Ltd.

Address before: Gyeongnam Changwon City, South Korea

Applicant before: HANWHA TECHWIN Co.,Ltd.

CB02 Change of applicant information
TA01 Transfer of patent application right

Effective date of registration: 20190409

Address after: Gyeongnam Changwon City, South Korea

Applicant after: Hanwha Precision Machinery Co.,Ltd.

Address before: Gyeongnam Changwon City, South Korea

Applicant before: HANWHA AEROSPACE Co.,Ltd.

TA01 Transfer of patent application right
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant