CN109070214A - 用于3d导线模块的方法和结构 - Google Patents

用于3d导线模块的方法和结构 Download PDF

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CN109070214A
CN109070214A CN201780014908.XA CN201780014908A CN109070214A CN 109070214 A CN109070214 A CN 109070214A CN 201780014908 A CN201780014908 A CN 201780014908A CN 109070214 A CN109070214 A CN 109070214A
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module
method described
mechanism according
dielectric
metal
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CN109070214B (zh
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D.E.汤普森
C.坎塔托尔
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R and D 电路股份有限公司
R&D Circuits Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
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Abstract

本发明提供了一种结构和机构，通过该结构和机构，通过利用增材制造工艺产生电连接，其以可定制的图案来连接模块的顶部和底部。具体地，可以在模块的表面上创建连接点，并将它们布线到交替位置，将原始图案转换为更小、更大或交替的图案。

Description

用于3D导线模块的方法和结构
相关申请
本申请引用并结合了申请人于2016年6月22日提交的序列号15/189,435的TraceAnywhere Interconnect的为整个主题的在先申请，如同在此并入本文。
技术领域
本发明一般涉及电测试和测量，具体地说，本发明涉及一种在模块(block)中产生导电路径的新方法。特别地，本发明涉及在两个或更多个离散接触点之间形成电互连机构，例如但不限于两个或更多个并联电路平面内的电路焊盘，其中电路形成在上述两个或更多个电路平面之间的三维空间中，以允许两个或多个电气装置通过所述互连装置电耦合。与当前的工业机构相比，本发明的这种新机构减少了设计时间并增加了导电路径布线选择。
背景技术
传统的互连技术通过导电迹线限制电路到x-y平面的布线。然后，这些迹线在z轴上通过垂直于迹线形成的孔(通孔)连接，在迹线上对齐。然后用部分或完全填充的金属化方式涂覆或电镀这些通孔，将迹线连接到在上方和下方的x-y平面中形成的电路。
这些互连结构通常在结构的外主表面的任一侧上具有接触焊盘阵列，有时甚至在结构的副侧或副表面上。这些接触焊盘旨在与外表面上的电子元件电耦合。当在每一侧上存在大量接触焊盘或点以进行电耦合时，内部电路层变得非常密集并且需要大量的布线层。这些层中的每层传统上形成由两层组成的层对，夹在电介质片的两侧。这些片材同时制造，然后与另外的电介质片层连结在一起，形成多层结构。然后穿通或部分穿通这些层堆形成通孔并对其金属化，形成所需的z轴互连。在将各层连结在一起之前，可以在每个层对上形成部分通孔或埋入通孔并对其金属化。
替代地，为了改善布线密度，电介质层和电路层可以一个在另一个上面依次构建，仅在必要时形成盲孔。这消除了通孔的需要，其在通孔不是必需的层上占据x-y平面中的布线空间。这种孔在任何地方的方法大大提高了布线密度，但是受到顺序构建这些层而花费时间和人力的影响。
发明内容
本发明提供一种机构和结构，其中形成电互连机构，其具有两个或更多个离散接触点之间的复杂连接，例如但不限于两个或更多个并联电路平面内的电路焊盘，其中电路形成在上述两个或更多个电路平面之间的三维空间中，以这种方式，本发明提供了通过所述互连装置的两个或多个电气装置的电耦合。
本发明提供了一种结构和机构，通过该结构和机构，通过利用增材制造工艺产生电连接，其以可定制的图案连接模块的顶部和底部。具体地，可以在模块的表面上创建连接点，并且布线到交替位置，将原始图案转换为更小、更大或交替的图案。
附图说明
图1是在电介质填充前本发明的添加金属构造的侧剖视图；
图2是在电介质填充后本发明的添加金属构造的侧剖视图；
图3是在移除底板后本发明的金属和电介质的侧剖视图；
图4是本发明实施例的侧视图，其中根据本发明的机构使用了独特的结构选择；
图5是本发明一个实施例示出了加强机构的剖视图；
图6是本发明另一个实施例的剖视图；
图7示出了本发明的另一个实施例，其中本发明的结构被连接用于测试和测量应用。
具体实施方式
本申请引用并结合了申请人于2016年6月22日提交的序列号为15/189,435的Trace Anywhere Interconnect为整个主题的在先申请，如同在此并入本文。现有技术中的在先申请之间的区别在于，在本申请的当前应用中，在电介质材料(例如但不限于塑料)添加之前首先提供金属化。这与在先的Trace Anywhere Interconnect申请完全相反。
现在参考图1-7，图1-3示出了本发明的结构和机构的基本构造步骤。图4示出了使用该机构的一些替代且有利的布线能力。图5和6示出了本发明的两个实施例。图7示出了另一个实施例，其中本发明的结构被连接用于测试和测量应用。
图1-3详细描述了本发明的基本构造技术。首先，通过3D打印机或市售和已知的工艺(例如材料喷射、粘结剂喷射、材料挤出、粉末床熔合、定向能量沉积(directed energydeposition)或片材层压(sheet lamination))形成的金属通过增材工艺沉积并形成所需形状(图1)(1、2、3、4)。添加电介质(5)，通常是环氧树脂材料，以填充金属中的间隙(图2)。通过不允许模具填充某些区域，也可以将空气添加到模型中。一旦填充电介质材料，保持框架(4)将通过二次加工(例如，研磨、刻蚀、激光切割或铣削)移除。成品模块(6)现在具有单独的隔离路径，这些路径将向所述模块上的不同点提供一个或多个电连接。
增材制造提供了许多在印刷线路板(PCB)中通常不可用的有利选择。尽管某些示例不会直接类似于传统的导线，但是导电路径在本文中将被称为“导线”。
第一种布线选择是可以具有任意角度的简单直导线(1A)。这是简单的点对点连接。第二种选择是让导线(1B)为曲线形中，以有助于在模块内布线。第三种选择是在导线中进行多个阶梯高度变化(1C)，以在模块内进行布线。第四种选择是将单独的导线合并成联结的较大导线，以降低电阻率、改变电感、改变电容或简化构造。第五种选择是创建同轴传输线结构(1E)、波导、或其他阻抗控制结构。
可以将用于提供支撑的附加机械结构添加到本发明的经打印3D导线模块中。例如，用于盖(10)的孔和用于锁定机构的特征可以内建于该设计中。与传统机构相比，这减少了加工工艺过程中的步骤数。
图5示出了本发明的实施例的插座，其使用该工艺以将更大间距焊盘图案缩放成更精细的封装尺寸。通过添加互连材料(9)(例如，导电弹性柱片、弹簧销、或其他顺应性互连装置)，可以将集成电路芯片(8)插入到板或其他互连装置中。
在图6的实施例中，内部框架工件(13)被显示为处于塑料增材机械支撑结构内。该内部框架13为本发明提供了若干益处。这将允许对准特征(12)直接与模块内的导线的公差精度相关联。这将允许诸如螺孔(11)或夹具这样的机械连接特征。这将增加整个模块的强度，改善固体电介质的强度。这也将允许改变模块的温度膨胀特性。
图7示出了测试测量目的的本发明的应用。图7中的应用是用于测试和测量应用，其中插座(15)必须放置在印刷线路板(16)(PWB或PCB)上以将其电连接到自动测试设备，例如Advantest 93k或Teradyne UltraFlex测试仪。
3D导线模块(6)可以将PCB(16)上的电焊盘图案转换成较小的图案，该图案与被测器件(DUT：Device Under Test)(8)引脚图案匹配。
在图7的应用中，弹性柱(9)将3D导线模块(6)连接到插座(15)。插座保持弹簧销(14)，其提供顺应性以将DUT(8)电连接到3D导线模块(6)。
在这种情况下，本发明的3D导线模块允许PCB(16)更快速和容易地制造，因为与DUT(8)间距相比，PCB(16)具有更大的通孔间距。
此外，Trace Anywhere Interconnect申请的各种实施例结构结合本发明的机构和结构可以并且在此并入本文。
尽管出于本公开的目的描述了目前优选的实施例，但是在机构步骤的布置中的许多改变和本领域技术人员可以制造装置部件。这些变化包含在由所附权利要求限定的本发明的精神内。

Claims (32)

1.一种形成电互连机构的方法，步骤包括：
沉积金属，通过增材工艺形成所需形状；和
添加电介质，通常是环氧材料，以填充所述金属中的间隙，通过二次加工去除保持框架，从而制成成品模块(具有单独的隔离路径，该隔离路径向所述模块上的不同点提供一个或多个电连接。
2.根据权利要求1所述的方法，其中，所述金属由3D打印机提供。
3.根据权利要求1所述的方法，其中，用于形成所述金属的所述增材工艺是激光烧结。
4.根据权利要求所述的方法，其中，所述电介质是添加以填充所述金属中的间隙的环氧树脂材料。
5.根据权利要求4所述的方法，其中，所述电介质可以包括通过不允许所述模具填充某些区域而添加到模型中的空气。
6.根据权利要求1所述的方法，其中，一旦所述电介质材料填充，则通过研磨、刻蚀、激光切割或铣削中之一的二次加工去除保持框架。
7.根据权利要求1所述的方法，还包括提供简单的直导线的步骤，所述直导线可以以任何角度布置，以用于点对点连接。
8.根据权利要求1所述的方法，还包括，成形具有曲线形的导线，以有助于在所述模块内布线。
9.根据权利要求1所述的方法，还包括，在所述导线中进行多个阶梯高度变化，以在所述模块内进行布线。
10.根据权利要求1所述的方法，还包括，将单独的导线合并成联结的较大导线，以降低电阻率、改变电感、改变电容或简化构造。
11.根据权利要求1所述的方法，还包括，提供同轴传输线结构波导，或其他阻抗控制结构。
12.根据权利要求1所述的方法，还包括，通过为所述结构的盖提供孔和为所述盖提供锁定机构而将用于提供支撑的附加机械结构内建到所述电互连机构中，从而与其他工艺相比减少了所述结构的构造步骤。
13.根据权利要求1所述的方法，还包括，使用插座以将更大间距焊盘图案缩放成更精细的封装尺寸，其中通过添加互连材料，可以将集成电路芯片插入到板或其他互连装置中。
14.根据权利要求13所述的方法，其中，所述互连材料可以是导电弹性柱片层、弹簧销、或其他顺应互连装置。
15.根据权利要求1所述的方法，其中所述结构具有内部框架，其提供与所述模块内的导线的公差精度直接相关联的对准，并且允许诸如螺孔或夹具这样的机械连接特征，从而增加总体模块强度、改善固体电介质的强度并允许改变模块的温度膨胀特性。
16.根据权利要求1所述的方法，其中，弹性柱将3D导线模块(6)连接到插座(15)。并且插座保持弹簧销，其提供顺应性以将DUT(8)电连接到所述结构，从而允许印刷电路板(PCB)更快速和容易地制造，因为与被测器件(DUT)间距相比，它的通孔间距更大。
17.一种电互连机构，包括：
通过增材工艺沉积并形成所需形状的金属；并且通常是环氧材料的电介质被添加以填充所述金属中的间隙，通过二次加工去除保持框架，从而制成成品模块(具有单独的隔离路径，该隔离路径向所述模块上的不同点提供一个或多个电连接。
18.根据权利要求17所述的机构，其中，所述金属由3D打印机提供。
19.根据权利要求17所述的机构，其中，形成所述金属的所述增材工艺是激光烧结。
20.根据权利要求17所述的机构，其中，所述电介质是添加以填充所述金属中的间隙的环氧树脂材料。
21.根据权利要求17所述的机构，其中，所述电介质可以包括通过不允许所述模具填充某些区域而添加到模型中的空气。
22.根据权利要求17所述的机构，其中，一旦所述电介质材料填充，则通过研磨、刻蚀、激光切割或铣削中之一的二次加工去除保持框架。
23.根据权利要求17所述的机构，还包括提供简单的直导线的步骤，所述直导线可以以任何角度布置，以用于点对点连接。
24.根据权利要求17所述的机构，还包括，成形具有曲线形的导线，以有助于在所述模块内布线。
25.根据权利要求17所述的机构，还包括，所述导线具有多个阶梯高度变化，以在所述模块内进行布线。
26.根据权利要求17所述的机构，还包括合并成联结的较大导线的单独导线，以降低电阻率、改变电感、改变电容或简化构造。
27.根据权利要求17所述的机构，还包括，同轴传输线结构波导，或其他阻抗控制结构。
28.根据权利要求17所述的机构，还包括，通过为所述结构的盖提供孔和为所述盖提供锁定机构，将用于提供支撑的附加机械结构内建到所述电互连机构中，从而与传统工艺相比减少了所述结构的构造步骤。
29.根据权利要求17所述的机构，还包括，用于将较大间距焊盘图案缩放成更精细的封装尺寸的插座，其中通过添加互连材料，可以将集成电路芯片插入到板或其他互连装置中。
30.根据权利要求29所述的机构，其中，所述互连材料可以是导电弹性柱片或弹簧销的一种。
31.根据权利要求17所述的机构，其中，所述结构具有内部框架，所述内部框架通过直接相关联到所述模块内的导线的公差精度而对准，并且允许诸如螺孔或夹具这样的机械连接特征，从而增加总体模块强度、改善固体电介质的强度并允许改变模块的温度膨胀特性。
32.根据权利要求17所述的机构，其中，弹性柱将3D导线模块(6)连接到插座(15)。并且插座保持弹簧销，其提供顺应性以将DUT(8)电连接到结构，从而允许印刷电路板(PCB)更快速和容易地制造，因为与被测器件(DUT)间距相比，印刷电路板(PCB)的通孔间距更大。
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