CN1089355C - 片状可固化压敏粘合剂 - Google Patents

片状可固化压敏粘合剂 Download PDF

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Publication number
CN1089355C
CN1089355C CN97113766A CN97113766A CN1089355C CN 1089355 C CN1089355 C CN 1089355C CN 97113766 A CN97113766 A CN 97113766A CN 97113766 A CN97113766 A CN 97113766A CN 1089355 C CN1089355 C CN 1089355C
Authority
CN
China
Prior art keywords
compound
sensitive adhesive
sheet
curable pressure
adherend
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN97113766A
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English (en)
Chinese (zh)
Other versions
CN1170747A (zh
Inventor
中寿贺章
福井弘司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8184639A external-priority patent/JP3022775B2/ja
Priority claimed from JP9021290A external-priority patent/JP3022796B2/ja
Priority claimed from JP9118052A external-priority patent/JP3043292B2/ja
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN1170747A publication Critical patent/CN1170747A/zh
Application granted granted Critical
Publication of CN1089355C publication Critical patent/CN1089355C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/16—Photopolymerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2471/00—Presence of polyether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
CN97113766A 1996-07-15 1997-05-26 片状可固化压敏粘合剂 Expired - Fee Related CN1089355C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP184639/96 1996-07-15
JP8184639A JP3022775B2 (ja) 1995-10-27 1996-07-15 硬化型粘接着シート、部材の接合方法、及び光重合性組成物
JP21290/97 1997-02-04
JP9021290A JP3022796B2 (ja) 1997-02-04 1997-02-04 硬化型粘接着シート及び部材の接合方法
JP118052/97 1997-05-08
JP9118052A JP3043292B2 (ja) 1997-05-08 1997-05-08 エネルギー重合性組成物及び硬化型粘接着シート

Publications (2)

Publication Number Publication Date
CN1170747A CN1170747A (zh) 1998-01-21
CN1089355C true CN1089355C (zh) 2002-08-21

Family

ID=27283367

Family Applications (1)

Application Number Title Priority Date Filing Date
CN97113766A Expired - Fee Related CN1089355C (zh) 1996-07-15 1997-05-26 片状可固化压敏粘合剂

Country Status (5)

Country Link
US (2) US6376070B1 (de)
EP (2) EP1249479B1 (de)
CN (1) CN1089355C (de)
CA (1) CA2205750C (de)
DE (2) DE69727714T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110325612A (zh) * 2017-02-22 2019-10-11 罗曼有限合资公司 可缠绕和冲压的粘合膜

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DE69727714T2 (de) * 1996-07-15 2004-11-25 Sekisui Kagaku Kogyo K.K. Verfahren zum Verbinden von Teilen
JP2000053934A (ja) * 1998-07-28 2000-02-22 Minnesota Mining & Mfg Co <3M> 接着剤組成物およびその前駆体
CN1249190C (zh) * 1998-11-30 2006-04-05 东亚合成株式会社 可活性能束固化的压敏粘合剂组合物和压敏粘合剂片材
CN100357382C (zh) * 1999-02-08 2007-12-26 日立化成工业株式会社 用于电路连接的粘合剂、电极连接构造及电极连接方法
US6602599B1 (en) 1999-06-10 2003-08-05 Nitto Denko Corporation Low-staining adhesive sheets and method for removing resist material
US6571128B2 (en) * 2000-01-21 2003-05-27 Medtronic Minimed, Inc. Microprocessor controlled ambulatory medical apparatus with hand held communication device
JP3730787B2 (ja) * 2000-02-14 2006-01-05 積水化学工業株式会社 光硬化性組成物、光硬化性組成物の製造方法、光硬化型粘接着シート、光硬化型粘接着シートの製造方法及び接合方法
US7079775B2 (en) 2001-02-05 2006-07-18 Finisar Corporation Integrated memory mapped controller circuit for fiber optics transceiver
JP4812963B2 (ja) * 2001-05-18 2011-11-09 リンテック株式会社 半導体ウエハ加工用粘着シートおよび半導体ウエハの加工方法
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JP5711767B2 (ja) 2010-03-09 2015-05-07 ヘンケル ユーエス アイピー エルエルシー 感圧接着剤用カチオン性ｕｖ架橋型アクリルポリマー
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US20120299216A1 (en) * 2010-07-01 2012-11-29 Westech Aerosol Corporation Vacuum Infusion Adhesive and Methods Related Thereto
JP5596588B2 (ja) * 2010-11-08 2014-09-24 日東電工株式会社 紫外線硬化型光学樹脂接着剤組成物
US8785517B2 (en) * 2011-05-25 2014-07-22 3M Innovative Properties Company Pressure-sensitive adhesives with onium-epdxy crosslinking system
EP2723812B1 (de) * 2011-06-23 2016-04-13 3M Innovative Properties Company Druckempfindliche kleber mit einem onium-epoxidharzvernetzersystem
JP6053810B2 (ja) * 2011-11-18 2016-12-27 エルジー・ケム・リミテッド 有機電子装置封止用光硬化型粘接着フィルム、有機電子装置及びその封止方法
KR101479813B1 (ko) 2012-04-10 2015-01-06 (주)엘지하우시스 반경화 감압 점착필름
AU2013329250A1 (en) 2012-10-09 2015-04-30 Avery Dennison Corporation Adhesives and related methods
JP2014111715A (ja) * 2012-10-31 2014-06-19 Nitto Denko Corp 紫外線硬化型アクリル系粘着剤層を有する粘着シートの製造方法
KR101566056B1 (ko) * 2012-12-11 2015-11-04 제일모직주식회사 아크릴계 점착제 조성물, 이를 포함하는 편광판 및 액정표시 장치
WO2014164000A1 (en) 2013-03-13 2014-10-09 3M Innovative Properties Company Adhesives comprising epoxy-acid crosslinked groups and methods
US10047254B2 (en) 2013-09-23 2018-08-14 Bondek Corporation Curable composite manufacturing adhesive
CN104870590A (zh) * 2013-10-10 2015-08-26 艾利丹尼森公司 胶黏剂和相关方法
CN105400472B (zh) * 2015-12-12 2018-01-12 北京化工大学 一种时空分离的uv胶黏剂的制备方法
JP6097815B1 (ja) 2015-12-18 2017-03-15 古河電気工業株式会社 接着剤組成物、これを用いた被着体の接合方法および積層体の製造方法
DE102016207540A1 (de) 2016-05-02 2017-11-02 Tesa Se Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat
DE102016207548A1 (de) 2016-05-02 2017-11-02 Tesa Se Härtbare Klebemasse und darauf basierende Reaktivklebebänder
DE102016207550A1 (de) 2016-05-02 2017-11-02 Tesa Se Funktionalisierte (Co)Polymere für Klebesysteme und Klebebänder
CN109233738A (zh) * 2018-08-31 2019-01-18 江苏科技大学 基于聚集诱导发光机理的荧光胶黏剂及其制备方法与应用
CN110194941A (zh) * 2019-05-29 2019-09-03 厦门艾贝森电子有限公司 一种尺寸稳定潜伏型可加热固化环氧胶膜及制备方法
CN111718681A (zh) * 2020-07-25 2020-09-29 浙江辉柯纸塑制品有限公司 一种紫外光解粘聚丙烯酸酯压敏胶及其制备方法
CN111961416A (zh) * 2020-07-31 2020-11-20 北京贝威通石油科技有限公司 一种高强绝缘胶带及其使用方法
CN112126395B (zh) * 2020-09-21 2022-01-11 烟台大学 一种触变型紫外光固化黏合剂

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EP0439258A2 (de) * 1990-01-12 1991-07-31 Asahi Denka Kogyo Kabushiki Kaisha Gegen aktinische Strahlung empfindliche, selbstklebende Klebstoffzusammensetzung
CN1088954A (zh) * 1992-11-25 1994-07-06 通用电气公司 可紫外固化环氧硅氧烷隔离剂的受控隔离组合物
CN1104671A (zh) * 1993-05-17 1995-07-05 吕特格斯工厂有限公司 辐射交联及随后热硬化的粘合剂

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110325612A (zh) * 2017-02-22 2019-10-11 罗曼有限合资公司 可缠绕和冲压的粘合膜
CN110325612B (zh) * 2017-02-22 2022-01-11 罗曼有限合资公司 可缠绕和冲压的粘合膜

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CA2205750C (en) 2002-11-19
US20030026979A1 (en) 2003-02-06
EP0819746A2 (de) 1998-01-21
CN1170747A (zh) 1998-01-21
EP1249479A3 (de) 2002-11-27
DE69728935D1 (de) 2004-06-09
US6790310B2 (en) 2004-09-14
DE69728935T2 (de) 2005-04-28
EP0819746A3 (de) 2000-08-23
DE69727714D1 (de) 2004-03-25
US6376070B1 (en) 2002-04-23
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