CN1104671A - 辐射交联及随后热硬化的粘合剂 - Google Patents

辐射交联及随后热硬化的粘合剂 Download PDF

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CN1104671A
CN1104671A CN94105549.3A CN94105549A CN1104671A CN 1104671 A CN1104671 A CN 1104671A CN 94105549 A CN94105549 A CN 94105549A CN 1104671 A CN1104671 A CN 1104671A
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esterification
varnish
polyepoxides
binder blend
carboxylic acid
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U·格龙克
K·P·里比坦茨
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Rain Carbon Germany GmbH
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    • G03F7/004Photosensitive materials
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Abstract

本发明的粘合剂混合物含有:
a.用不饱和羧酸部分酯化过的聚环氧化合物,
b.用不饱和羧酸酯化过的聚环氧化合物,其羟基 用二羧酸酐部分或全部酯化成相应的酸性酯,
其中环氧基量与羧基量成化学计算量比。

Description

本发明涉及一种可通过辐射交联及随后热处理硬化的粘合剂混合物。
这类粘合剂可应用于印刷电路板工艺中,特别是用于阻焊清漆。在未光照又未交联的聚合物易溶解的场合就需要使用这种经紫外线或光化射线照射能快速交联的高性能粘合剂。这种经紫外线照射预交联后不易溶解的聚合物必须经热硬化生成一种具有良好的物理特性和电气性能以及较好的耐焊液特性的产物。
齐聚物体系或聚合物体系能满足这些要求,这类体系均含有未饱和的环氧基,最简单的例子是经烯不饱和酸部分酯化的聚合环氧化合物。这种未经辐射交联的聚合物仅能溶于某些有机溶剂中,但不能溶于碱性水溶液中。
由此,基本上改进了专利EP-A346486中所论述的粘合剂体系,此体系含有部分丙烯酸化的环氧树脂,苯乙烯-马来酸酐共聚物和用不饱和羧酸酯化过的环氧树脂,其羟基用二羧酸酐酯化成相应的半酯。这种据认为在成膜过程中必须要用的苯乙烯-马来酸酐共聚物不能经紫外线照射而交联,而是先在热硬化时同步交联,这是不利的。因此,在开发光照印刷电路板时,部分共聚物将脱落下来,造成阻焊清漆的分辩率下降,这对于印刷电路板上的狭窄线路是不利的。
按照EP-A 0418011,所有的特性如紫外线交联性,热硬化性和在含某种分子的碱性水溶液中的溶解度均能满足要求。由甲酚-酚醛清漆构成的环氧树脂用丙烯酸部分酯化,酯化形成的羟基用二羧酸酯酐化成相应的半酯。
但是,实验比较表明,这类分子只有在应用环氧化的甲酚-酚醛清漆时才能得到好的特性,如果应用环氧化的酚-酚醛清漆则不行。当应用环氧化的酚-酚醛清漆时,所得产品的分子具有较低的活性,特别是在紫外线照射交联时活性低。实例表明,照射时间需50秒,因此从经济实用角度看,这种粘合剂是不可取的。
因此,本发明目的就是要提供一种不仅有所需的良好特性,而且能克服上述的缺点的粘合剂或粘合剂混合物。
应用权利要求1至3中的粘合剂混合物解决了这一问题。这种粘合剂混合物特别适用于生产权利要求4和5中的阻焊清漆和耐光材料。
这类粘合剂混合物含有:
a.用不饱和羧酸部分酯化过的聚环氧化合物,
b.用不饱和羧酸完全酯化的聚环氧化合物,基羧基用二羧酸酐部分或全部酯化成相应的酸性酯。
已发现这类粘合剂混合物具有良好的成膜特性,在紫外线照射时快速交联,并随后热硬化成很牢固的产物,只要a中的环氧基的量与b中的羧基量成化学计量比,产物就具有最佳的机械性能及电气性能。
辐射引发交联的速度必须通过添加已知的光引发剂来加快。
未交联的粘合剂混合物可用通常的有机溶剂或用碱性水溶液从底板上溶解掉。
经紫外线预交联的粘合剂混合物第二步通过环氧基与羧基的反应而热处理硬化。
经辐照预交联的粘合剂在硬化时形成具有较高交联密度的产物,这种产物具有极好的耐焊液特性。
本发明的粘合剂含有两种不同结构的组分,一种光引发剂,但不含附加的硬化剂。
组分a是聚环氧化合物,它用一种或多种烯不饱和酸部分酯化,即部分环氧基(10%-90%,最好30%-70%)用不饱和羧酸或羧酸混合物以已知的方法酯化。含有烯不饱和键的所有芳族或脂族羧酸均可作为对应的不饱和羧酸使用。例如可用丁烯酸,乙烯基醋酸,肉桂酸或呋喃-2-丙烯酸,特别是丙烯酸和甲基丙烯酸。多酚,特别是双酚多缩水甘油基醚以及环氧化酚-酚醛清漆,O-甲酚-酚醛清漆和双酚-酚醛清漆均可作为聚环氧化合物。
组分b是聚环氧化合物与一种或多种烯不饱和酸的反应产物,它在随后的酯化反应中进一步酯化,这时第一次酯化反应所形成的二次羟基与二羧酸酐反应生成相应的酸性酯。
可用与制备组分a时相同的初始化合物作为聚环氧化合物及烯不饱和羧酸。当然,为制备组分b,聚环氧化合物中的所有环氧基均被酯化。
不饱和酯与二羧酸酐的进一步反应同样可按已知的方法进行。所有常见二羧酸酐,如琥珀酸酐,谷氨酸酐,马来酸酐,邻苯二甲酸酐和四氢邻苯二甲酸酐都可使用。约50-100%的二次羟基起反应。
为制备本发明所述的粘合剂混合物,可将组分a和b互相混合,混合比例的选择要使组分a中所含的所有环氧基量与组分b中所含的羧基量成化学计量比。
本发明所述的粘合剂混合物可作为光硬化,预硬化和随后热硬化清漆,特别是作为阻焊清漆或耐光材料的聚合物组分,也可作为金属线的涂层和所谓罐头盒涂层聚合物组分。
这类清漆含有附加的光聚合引发剂,需要时还可加入填料,颜料,漆助剂和酸硬化加速剂。
适当选择本发明粘合剂的组分和比例可制成液态清漆,不含溶剂的清漆或干燥后不粘的含溶剂清漆。这些清漆有各种用途,如用于丝网印刷,帘布热合,喷涂,滚涂等等。
实施例
例1
粘合剂A
1664克(1摩尔)主要成分为双酚-A(8-官能团)的环氧树脂溶于840克甲氧基丙基醋酸酯中,并与288克(4摩尔)丙烯酸一起在80℃下搅拌24小时。
反应所得的部分酯化聚环氧树脂中环氧当量约为700,粘度(25℃)约为7500毫泊·秒。
例2
粘合剂B
1664克(1摩尔)主要成分为双酚-A(8-官能团)的环氧树脂溶于1304克甲氧基丙基醋酸酯中,并与576克(8摩尔)丙烯酸一起在80℃下搅拌24小时。
反应所得的酸性酯中酸当量约为550,粘度(25℃)约为50000毫泊·秒。
例3
粘合剂A1
类似例1,1摩尔双酚-A-二缩水甘油基醚(370克)与1摩尔丙烯酸(72克)反应。
酯化所得的聚环氧树脂中环氧当量约为450,粘度(25℃)约为80000毫泊·秒。
例4
粘合剂B1
类似例2,370克(1摩尔)双酚-A-二缩水甘油基醚与144克(2摩尔)丙烯酸反应,紧接着与200克(2摩尔)琥珀酸酐起反应。
反应所得的酸性酯中酸当量为357,粘度(25℃)约为180000毫泊·秒。
例5至10
利用粘合剂A和B,按清漆工业中常用的方法用颜料,填料,溶剂和添加剂,可根据例1至3配制成丝网印刷工艺所用的阻焊清漆。
利用粘合剂A1和B1,可配制用于帘布热合工艺的不含溶剂的阻焊清漆,由于其加工粘度高,所以这种清漆通常在60-80℃下应用。
例5至10中配制的所有清漆,都能按照使用溶剂(丁基乙二醇)或碱性苏打水溶液进行紫外线预交联来制备。
这些清漆的鉴定是以掺杂Fe的6000瓦照射器照射约60秒,并在150℃下后续硬化30分钟来进行的。
清漆组分配方及特性列于下表:
例  5  6  7  8  9  10
粘合剂A  700  700  700
粘合剂A1  450  450  450
粘合剂B  275  450  550
粘合剂B1  180  260  360
甲氧基丙
基醋酸酯  225  267  290
二乙基硫
呫吨酮(光
引发剂)  30.00  34.50  37.50  19.00  21.50  24.30
乙基甲基
咪唑(加速剂)  1.40  2.25  2.75  0.90  1.30  1.80
Cu-酞菁绿  9.35  11.50  12.50  6.30  7.10  8.10
滑石粉  87.00  102.00  111.60  15.00  16.90  20.70
硫化钡  348.20  410.70  446.40  60.30  67.70  82.80
Modaflow
(过程介质)  7.80  9.20  10.00  6.30  7.10  8.10
BYK051
(去泡沫剂)  16.50  19.60  21.30  13.20  14.90  17.00
焊前在Cu
上的附着力GT  1  0-1  0  0-1  0  0
焊后在Cu
上的附着力GT  2  1  0-1  1  0-1  0-1
绝缘电阻
(按IPC-SM840B) >109>109>109>109>109>109

Claims (5)

1、粘合剂混合物,其中含有:
a.用不饱和羧酸部分酯化过的聚环氧化合物,
b.用不饱和羧酸酯化过的聚环氧化合物,其羟基用二羧酸酐部分或全部酯化成相应的酸性酯,
其中环氧基量与羧基量成化学计算量比。
2、权利要求1中的粘合剂混合物,其特征为在制备a和b中的部分或全部酯化的聚环氧化合物时所采用的初始物料是相同的或者是不相同的,它们是双酚多缩水甘油基醚或环氧化酚-酚醛清漆,双酚-酚醛清漆或0-甲酚-酚醛清漆。
3、权利要求1和2中的粘合剂混合物,其特征为a中的部分酯化的聚环氧化合物是30-75%的环氧基已用丙烯酸或甲基丙烯酸酯化过的聚环氧化合物。
4、权利要求1至3中的粘合剂混合物,用于制备耐光材料。
5、权利要求1至3中的粘合剂混合物,用于制备阻焊清漆。
CN94105549.3A 1993-05-17 1994-05-17 辐射交联及随后热硬化的粘合剂 Pending CN1104671A (zh)

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DEP4316401.3 1993-05-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1089355C (zh) * 1996-07-15 2002-08-21 积水化学工业株式会社 片状可固化压敏粘合剂

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5973034A (en) * 1995-10-11 1999-10-26 Nippon Kayaku Kabushiki Kaisha (Oxide or sulfide) powder epoxy (meth) acrylate w/glass and/or metal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1089355C (zh) * 1996-07-15 2002-08-21 积水化学工业株式会社 片状可固化压敏粘合剂

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