CN108029199B - 电子部件的贴装结构 - Google Patents

电子部件的贴装结构 Download PDF

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Publication number
CN108029199B
CN108029199B CN201580054489.3A CN201580054489A CN108029199B CN 108029199 B CN108029199 B CN 108029199B CN 201580054489 A CN201580054489 A CN 201580054489A CN 108029199 B CN108029199 B CN 108029199B
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CN
China
Prior art keywords
electronic component
component package
heat dissipation
pattern
metal pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580054489.3A
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English (en)
Chinese (zh)
Other versions
CN108029199A (zh
Inventor
须永英树
岛村雄三
藤井则男
大门裕司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Corp
Original Assignee
Calsonic Kansei Corp
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Publication date
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Publication of CN108029199A publication Critical patent/CN108029199A/zh
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Publication of CN108029199B publication Critical patent/CN108029199B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201580054489.3A 2014-10-31 2015-09-04 电子部件的贴装结构 Expired - Fee Related CN108029199B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014223380A JP6352149B2 (ja) 2014-10-31 2014-10-31 電子部品の実装構造
JP2014-223380 2014-10-31
PCT/JP2015/075194 WO2016067748A1 (ja) 2014-10-31 2015-09-04 電子部品の実装構造

Publications (2)

Publication Number Publication Date
CN108029199A CN108029199A (zh) 2018-05-11
CN108029199B true CN108029199B (zh) 2020-02-21

Family

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Family Applications (1)

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CN201580054489.3A Expired - Fee Related CN108029199B (zh) 2014-10-31 2015-09-04 电子部件的贴装结构

Country Status (4)

Country Link
US (1) US10224261B2 (enExample)
JP (1) JP6352149B2 (enExample)
CN (1) CN108029199B (enExample)
WO (1) WO2016067748A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6569610B2 (ja) * 2016-07-06 2019-09-04 株式会社デンソー 電子装置
CN110856338B (zh) * 2019-10-22 2021-03-23 Tcl华星光电技术有限公司 电路板组件及电子设备
CN116491231A (zh) * 2021-10-29 2023-07-25 京东方科技集团股份有限公司 印刷电路板、其维修方法及显示装置
CN118400989A (zh) * 2024-05-22 2024-07-26 深圳宝创电子设备有限公司 一种全自动高兼容性精密预烧结贴片设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005044968A (ja) * 2003-07-28 2005-02-17 Taiyo Yuden Co Ltd 回路基板
JP2006303392A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Ind Co Ltd プリント配線板と電子回路基板及びその製造方法
CN1893772A (zh) * 2005-06-30 2007-01-10 欧姆龙株式会社 电路基板
JP2008205101A (ja) * 2007-02-19 2008-09-04 Victor Co Of Japan Ltd 電子部品実装基板の製造方法及び電子部品実装基板

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Publication number Priority date Publication date Assignee Title
JPH044779A (ja) 1990-04-20 1992-01-09 Brother Ind Ltd 画像形成装置
JPH087655Y2 (ja) * 1990-04-26 1996-03-04 株式会社ケンウッド 面実装部品の取付構造
JPH06252285A (ja) * 1993-02-24 1994-09-09 Fuji Xerox Co Ltd 回路基板
JP3009176U (ja) * 1994-09-19 1995-03-28 船井電機株式会社 プリント回路基板
JP3308807B2 (ja) * 1996-04-05 2002-07-29 電気化学工業株式会社 回路基板及びその製造方法
JPH09283567A (ja) * 1996-04-15 1997-10-31 Nec Corp Ｔａｂ式半導体装置及びそのリード位置合わせ方法
US6467972B2 (en) * 2000-02-29 2002-10-22 Kyocera Corporation Optical interconnection module
JP3639505B2 (ja) * 2000-06-30 2005-04-20 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線基板及び半導体装置
JP3849573B2 (ja) * 2001-05-22 2006-11-22 株式会社日立製作所 電子装置
JP4254248B2 (ja) * 2002-04-05 2009-04-15 株式会社村田製作所 電子装置
JP2004146476A (ja) * 2002-10-23 2004-05-20 Toyo Commun Equip Co Ltd 印刷配線基板の構造及びその基板を用いた圧電発振器
US6750538B2 (en) * 2002-10-24 2004-06-15 Spectra Physics Semiconductor Lasers, Inc. Heat transfer of solid-state devices
JP2005108387A (ja) * 2003-10-02 2005-04-21 Sankyo Seiki Mfg Co Ltd 光ヘッド装置、実装用ｆｐｃ、放熱方法、ｆｐｃの製造方法
US20050085007A1 (en) * 2003-10-20 2005-04-21 Chuong Vu Joining material stencil and method of use
US20080107867A1 (en) * 2006-11-06 2008-05-08 Fred Miekka Thermally Conductive Low Profile Bonding Surfaces
JP2009105212A (ja) * 2007-10-23 2009-05-14 Toshiba Corp プリント配線板および電子機器
WO2009084127A1 (ja) * 2007-12-28 2009-07-09 Onamba Co., Ltd. 端子板回路
US8411442B2 (en) * 2010-09-09 2013-04-02 Texas Instruments Incorporated Vias in substrate between IC seat and peripheral thermal cage
JP2012195546A (ja) 2011-03-18 2012-10-11 Panasonic Corp 半導体装置と、その実装体及び製造方法
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JP6296717B2 (ja) * 2012-09-14 2018-03-20 キヤノン株式会社 配線基板およびそれを用いた電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005044968A (ja) * 2003-07-28 2005-02-17 Taiyo Yuden Co Ltd 回路基板
JP2006303392A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Ind Co Ltd プリント配線板と電子回路基板及びその製造方法
CN1893772A (zh) * 2005-06-30 2007-01-10 欧姆龙株式会社 电路基板
JP2008205101A (ja) * 2007-02-19 2008-09-04 Victor Co Of Japan Ltd 電子部品実装基板の製造方法及び電子部品実装基板

Also Published As

Publication number Publication date
US10224261B2 (en) 2019-03-05
JP6352149B2 (ja) 2018-07-04
WO2016067748A1 (ja) 2016-05-06
US20170243801A1 (en) 2017-08-24
CN108029199A (zh) 2018-05-11
JP2016092138A (ja) 2016-05-23

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Granted publication date: 20200221