JP6352149B2 - 電子部品の実装構造 - Google Patents

電子部品の実装構造 Download PDF

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Publication number
JP6352149B2
JP6352149B2 JP2014223380A JP2014223380A JP6352149B2 JP 6352149 B2 JP6352149 B2 JP 6352149B2 JP 2014223380 A JP2014223380 A JP 2014223380A JP 2014223380 A JP2014223380 A JP 2014223380A JP 6352149 B2 JP6352149 B2 JP 6352149B2
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JP
Japan
Prior art keywords
electronic component
mounting structure
pattern
component package
metal pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014223380A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016092138A5 (enExample
JP2016092138A (ja
Inventor
須永　英樹
英樹 須永
雄三 島村
雄三 島村
則男 藤井
則男 藤井
裕司 大門
裕司 大門
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Corp
Original Assignee
Calsonic Kansei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Calsonic Kansei Corp filed Critical Calsonic Kansei Corp
Priority to JP2014223380A priority Critical patent/JP6352149B2/ja
Priority to PCT/JP2015/075194 priority patent/WO2016067748A1/ja
Priority to CN201580054489.3A priority patent/CN108029199B/zh
Priority to US15/518,942 priority patent/US10224261B2/en
Publication of JP2016092138A publication Critical patent/JP2016092138A/ja
Publication of JP2016092138A5 publication Critical patent/JP2016092138A5/ja
Application granted granted Critical
Publication of JP6352149B2 publication Critical patent/JP6352149B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2014223380A 2014-10-31 2014-10-31 電子部品の実装構造 Active JP6352149B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014223380A JP6352149B2 (ja) 2014-10-31 2014-10-31 電子部品の実装構造
PCT/JP2015/075194 WO2016067748A1 (ja) 2014-10-31 2015-09-04 電子部品の実装構造
CN201580054489.3A CN108029199B (zh) 2014-10-31 2015-09-04 电子部件的贴装结构
US15/518,942 US10224261B2 (en) 2014-10-31 2015-09-04 Electronic component mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014223380A JP6352149B2 (ja) 2014-10-31 2014-10-31 電子部品の実装構造

Publications (3)

Publication Number Publication Date
JP2016092138A JP2016092138A (ja) 2016-05-23
JP2016092138A5 JP2016092138A5 (enExample) 2017-11-24
JP6352149B2 true JP6352149B2 (ja) 2018-07-04

Family

ID=55857094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014223380A Active JP6352149B2 (ja) 2014-10-31 2014-10-31 電子部品の実装構造

Country Status (4)

Country Link
US (1) US10224261B2 (enExample)
JP (1) JP6352149B2 (enExample)
CN (1) CN108029199B (enExample)
WO (1) WO2016067748A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6569610B2 (ja) * 2016-07-06 2019-09-04 株式会社デンソー 電子装置
CN110856338B (zh) * 2019-10-22 2021-03-23 Tcl华星光电技术有限公司 电路板组件及电子设备
CN116491231A (zh) * 2021-10-29 2023-07-25 京东方科技集团股份有限公司 印刷电路板、其维修方法及显示装置
CN118400989A (zh) * 2024-05-22 2024-07-26 深圳宝创电子设备有限公司 一种全自动高兼容性精密预烧结贴片设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH044779A (ja) 1990-04-20 1992-01-09 Brother Ind Ltd 画像形成装置
JPH087655Y2 (ja) * 1990-04-26 1996-03-04 株式会社ケンウッド 面実装部品の取付構造
JPH06252285A (ja) * 1993-02-24 1994-09-09 Fuji Xerox Co Ltd 回路基板
JP3009176U (ja) * 1994-09-19 1995-03-28 船井電機株式会社 プリント回路基板
JP3308807B2 (ja) * 1996-04-05 2002-07-29 電気化学工業株式会社 回路基板及びその製造方法
JPH09283567A (ja) * 1996-04-15 1997-10-31 Nec Corp Ｔａｂ式半導体装置及びそのリード位置合わせ方法
US6467972B2 (en) * 2000-02-29 2002-10-22 Kyocera Corporation Optical interconnection module
JP3639505B2 (ja) * 2000-06-30 2005-04-20 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線基板及び半導体装置
JP3849573B2 (ja) * 2001-05-22 2006-11-22 株式会社日立製作所 電子装置
JP4254248B2 (ja) * 2002-04-05 2009-04-15 株式会社村田製作所 電子装置
JP2004146476A (ja) * 2002-10-23 2004-05-20 Toyo Commun Equip Co Ltd 印刷配線基板の構造及びその基板を用いた圧電発振器
US6750538B2 (en) * 2002-10-24 2004-06-15 Spectra Physics Semiconductor Lasers, Inc. Heat transfer of solid-state devices
JP2005044968A (ja) * 2003-07-28 2005-02-17 Taiyo Yuden Co Ltd 回路基板
JP2005108387A (ja) * 2003-10-02 2005-04-21 Sankyo Seiki Mfg Co Ltd 光ヘッド装置、実装用ｆｐｃ、放熱方法、ｆｐｃの製造方法
US20050085007A1 (en) * 2003-10-20 2005-04-21 Chuong Vu Joining material stencil and method of use
JP2006303392A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Ind Co Ltd プリント配線板と電子回路基板及びその製造方法
JP4265578B2 (ja) * 2005-06-30 2009-05-20 オムロン株式会社 回路基板
US20080107867A1 (en) * 2006-11-06 2008-05-08 Fred Miekka Thermally Conductive Low Profile Bonding Surfaces
JP2008205101A (ja) * 2007-02-19 2008-09-04 Victor Co Of Japan Ltd 電子部品実装基板の製造方法及び電子部品実装基板
JP2009105212A (ja) * 2007-10-23 2009-05-14 Toshiba Corp プリント配線板および電子機器
WO2009084127A1 (ja) * 2007-12-28 2009-07-09 Onamba Co., Ltd. 端子板回路
US8411442B2 (en) * 2010-09-09 2013-04-02 Texas Instruments Incorporated Vias in substrate between IC seat and peripheral thermal cage
JP2012195546A (ja) 2011-03-18 2012-10-11 Panasonic Corp 半導体装置と、その実装体及び製造方法
JP5618419B2 (ja) * 2011-06-13 2014-11-05 株式会社日立製作所 沸騰冷却システム
JP6296717B2 (ja) * 2012-09-14 2018-03-20 キヤノン株式会社 配線基板およびそれを用いた電子機器

Also Published As

Publication number Publication date
US10224261B2 (en) 2019-03-05
WO2016067748A1 (ja) 2016-05-06
US20170243801A1 (en) 2017-08-24
CN108029199B (zh) 2020-02-21
CN108029199A (zh) 2018-05-11
JP2016092138A (ja) 2016-05-23

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