CN107960129B - 增强胶带及使用该增强胶带的柔性扁平电缆 - Google Patents
增强胶带及使用该增强胶带的柔性扁平电缆 Download PDFInfo
- Publication number
- CN107960129B CN107960129B CN201680027901.7A CN201680027901A CN107960129B CN 107960129 B CN107960129 B CN 107960129B CN 201680027901 A CN201680027901 A CN 201680027901A CN 107960129 B CN107960129 B CN 107960129B
- Authority
- CN
- China
- Prior art keywords
- conductor
- flat cable
- flexible flat
- adhesive tape
- reinforcing tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002390 adhesive tape Substances 0.000 title claims description 15
- 239000004020 conductor Substances 0.000 claims abstract description 56
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 45
- 239000010410 layer Substances 0.000 claims abstract description 43
- 239000004831 Hot glue Substances 0.000 claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims abstract description 22
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 12
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 12
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 12
- 229920001225 polyester resin Polymers 0.000 claims abstract description 9
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 7
- 150000001875 compounds Chemical class 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 11
- 229920000728 polyester Polymers 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000004645 polyester resin Substances 0.000 claims description 6
- 230000001737 promoting effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052737 gold Inorganic materials 0.000 abstract description 9
- 239000010931 gold Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 11
- 239000003063 flame retardant Substances 0.000 description 11
- -1 polyethylene terephthalate Polymers 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 238000005227 gel permeation chromatography Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 4
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 238000004128 high performance liquid chromatography Methods 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000007754 air knife coating Methods 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PFURGBBHAOXLIO-UHFFFAOYSA-N cyclohexane-1,2-diol Chemical compound OC1CCCCC1O PFURGBBHAOXLIO-UHFFFAOYSA-N 0.000 description 2
- ZQSIJRDFPHDXIC-UHFFFAOYSA-N daidzein Chemical compound C1=CC(O)=CC=C1C1=COC2=CC(O)=CC=C2C1=O ZQSIJRDFPHDXIC-UHFFFAOYSA-N 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 229960004063 propylene glycol Drugs 0.000 description 2
- 235000013772 propylene glycol Nutrition 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- CHRJZRDFSQHIFI-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;styrene Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=CC=C1C=C CHRJZRDFSQHIFI-UHFFFAOYSA-N 0.000 description 1
- 229940083957 1,2-butanediol Drugs 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940035437 1,3-propanediol Drugs 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004129 EU approved improving agent Substances 0.000 description 1
- 241000416536 Euproctis pseudoconspersa Species 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- FNGGVJIEWDRLFV-UHFFFAOYSA-N anthracene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=CC3=C(C(O)=O)C(C(=O)O)=CC=C3C=C21 FNGGVJIEWDRLFV-UHFFFAOYSA-N 0.000 description 1
- 239000002519 antifouling agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- 235000007240 daidzein Nutrition 0.000 description 1
- INSRQEMEVAMETL-UHFFFAOYSA-N decane-1,1-diol Chemical compound CCCCCCCCCC(O)O INSRQEMEVAMETL-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 1
- 229910000396 dipotassium phosphate Inorganic materials 0.000 description 1
- 235000019797 dipotassium phosphate Nutrition 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 229920000582 polyisocyanurate Polymers 0.000 description 1
- 239000011495 polyisocyanurate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000009823 thermal lamination Methods 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/402—Coloured
- B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
- B32B2307/516—Oriented mono-axially
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
- B32B2307/518—Oriented bi-axially
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/302—Applications of adhesives in processes or use of adhesives in the form of films or foils for bundling cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/421—Polyesters
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
本发明提供了增强胶带以及使用该增强胶带的柔性扁平电缆,所述增强胶带对导体具有优异的粘合性,且在导体端子上进行镀金等处理时能够抑制增强胶带从导体剥离等问题。所述增强胶带在绝缘膜(A)的一面上依次包含:厚度5~50μm的增粘涂层(B);以及厚度10~30μm的热熔粘合剂层(C)。上述增粘涂层(B)优选由包含(b1)热塑性饱和共聚聚酯类树脂100质量份;以及(b2)在一个分子中具有两个以上异氰酸酯基的化合物3~25质量份的涂料构成。
Description
技术领域
本发明涉及一种柔性扁平电缆的增强胶带。更详细地,涉及一种对导体具有优异的粘合性,且在导体端子上进行镀金等处理时能够抑制增强胶带从导体剥离等问题的增强胶带。
背景技术
柔性扁平电缆具有以下结构:由具有绝缘基底膜和粘合性树脂组合物层的层压体等夹持多个排列的导体并覆盖。为了通过连接器将电缆连接到电子设备,上述导体的端子经常粘贴增强胶带进行增强。另外,为了提高电缆的性能,上述导体的端子经常在粘贴增强胶带后实施镀金等。
以往,作为上述增强胶带,使用在厚绝缘膜的一面设置热熔粘合剂层之物,通常是在厚度约150~250μm的双轴拉伸聚对苯二甲酸乙二醇酯膜的一面设置聚酯类热熔粘合剂层之物。但是现有的增强胶带存在导体粘合力随时间下降且耐湿热性低的问题。为此,作为解决这些问题的技术,提出了作为热熔粘合剂使用改性的聚酯类热熔粘合剂层(例如,专利文献1和2)。然而,即使将这些热熔粘合剂应用于增强胶带,在导体端子上进行镀金等处理时,还是不能抑制增强胶带从导体剥离的问题。
现有技术文献
专利文献
专利文献1:特开2002-371258号公报
专利文献2:特开2005-255752号公报
发明内容
本发明的课题在于,提供增强胶带及使用该增强胶带的柔性扁平电缆,所述增强胶带对导体的粘合性优异,在导体端子上进行镀金等处理时能够抑制增强胶带从导体剥离等问题。
经过深入研究后,本发明人惊奇地发现通过在厚绝缘膜和热熔粘合剂之间设置厚的增粘涂层,可以实现上述课题。
即,本发明为用于柔性扁平电缆的增强胶带,在绝缘膜(A)的一面上,依次包含:5~50μm厚的增粘涂层(B)和10~30μm厚的热熔粘合剂层(C)。
第二发明是根据本发明的第一发明所述的增强胶带,所述增粘涂层(B)由包含(b1)热塑性饱和共聚聚酯类树脂100质量份和(b2)在一个分子中具有两个以上异氰酸酯基的化合物3~25质量份的涂料构成。
第三发明是根据本发明的第一发明或第二发明所述的增强胶带,所述热熔粘合剂为热塑性饱和共聚聚酯类的粘合剂。
第四发明是本发明的第一发明~第三发明中任一所述的增强胶带,软化温度为95℃以上。
第五发明是柔性扁平电缆,所述柔性扁平电缆包含第一发明~第四发明中任一所述的增强胶带。
发明效果
本发明的增强胶带对导体具有优异的粘合性,在导体端子上进行镀金等处理时能够抑制增强胶带从导体剥离等问题。因此,本发明的增强胶带可以适用于增强柔性扁平电缆的导体端子。
附图说明
图1是表示将增强胶带粘贴在柔性扁平电缆的导体端子的状态下的一例的局部立体图;
图2是表示软化温度的测量例的图。
符号说明
1 柔性扁平电缆
2 增强胶带
3 导体端子
具体实施方式
本发明的用于柔性扁平电缆的增强胶带在绝缘膜(A)的一面上依次包含:厚度5~50μm的增粘涂层(B)和厚度10~30μm的热熔粘合剂层(C)。
(A)绝缘膜:
上述绝缘膜对本发明的增强胶带提供刚性和强度,起到能够通过连接器将柔性扁平电缆的导体端子连接于电子设备的作用。
作为上述绝缘膜,可以列举由下述树脂中一种以上构成的膜:聚对苯二甲酸乙二醇酯类树脂、聚萘二甲酸乙二醇酯类树脂等聚酯类树脂;聚苯硫醚类树脂;聚碳酸酯类树脂;聚丙烯类树脂、聚乙烯类树脂等聚烯烃类树脂;聚酰胺类树脂和聚苯乙烯类树脂。这些膜包含:未拉伸膜、单轴拉伸膜和双轴拉伸膜。还包含将这些之中一种以上膜层叠两层以上的层压膜。从刚性、强度和成本的观点出发,优选聚对苯二甲酸乙二醇酯类树脂的双轴拉伸膜和将其层压两层以上的层压膜。
对上述绝缘膜的厚度没有进行特别限定,但是从提供刚性和强度的观点出发,通常可以是100μm以上,优选125μm以上。从加工性的观点出发,通常可以是500μm以下,优选250μm以下。
上述绝缘膜可以包含由含有着色剂的树脂构成的着色层。上述绝缘膜可以在构成其的膜的任何一个以上的面上实施印刷。
(B)增粘涂层:
上述层(B)起到提高上述绝缘膜和上述热熔粘合剂层之间的粘合强度并提高导体粘合性的作用。
不特别限定用于形成上述增粘涂层的涂料,但是优选地可以列举包含(b1)热塑性饱和共聚聚酯类树脂100质量份和(b2)在一个分子中具有两个以上异氰酸酯基的化合物3~25质量份的涂料。
上述成分(b1)是成为用于形成增粘涂层的涂料的基材的树脂。作为上述成分(b1),例如,可以使用任何多元羧酸和任何多元醇,可以使用通过公知方法得到的热塑性饱和共聚聚酯类树脂。
作为上述多元羧酸,可以列举:对苯二甲酸、间苯二甲酸、邻苯二甲酸以及萘二甲酸、二苯基-4,4'-二羧酸、二苯氧基乙烷二羧酸、二苯基-3,3'-二羧酸、二苯基-4,4'-二羧酸、蒽二羧酸等芳香族多元羧酸;1,2-环己烷二羧酸、1,3-环己烷二羧酸、1,4-环己烷二羧酸等脂环族二羧酸;丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸和癸二酸等脂肪族多元羧酸;以及这些的酯形成性衍生物等。作为上述羧酸,可以使用这些之中的一种以上。
作为上述多元醇,可以列举:乙二醇、二乙二醇、丙二醇、丁二醇、新戊二醇、聚乙二醇、1,2-丙二醇、1,3-丙二醇、聚丙二醇、1,2-丁二醇、1,3-丁二醇、1,4-丁二醇、1,5-戊二醇、1,6-己二醇、新戊二醇、癸二醇、3-甲基-1,5-戊二醇、2-甲基-1,3-丙二醇、1,2-环己二醇、1,4-环己二醇、1,4-环己烷二醇、2,2,4,4'-四甲基-1,3-环丁二醇、甘油和三羟甲基丙烷等脂肪族多元醇;二甲苯二醇、4,4'-二羟基联苯、2,2-双(4-羟基苯基)丙烷、双(4-羟基苯基)砜、双酚A、双酚A的环氧烷烃加合物等芳香族多元醇;以及这些的酯形成性衍生物等。作为上述多元醇,可以使用这些之中的一种以上。
从导体粘合性和与用于柔性扁平电缆的阻燃性绝缘膜的粘合性的观点出发,上述成分(b1)的数均分子量优选为10000~35000,更优选为15000~30000。
上述成分(b1)的数均分子量是通过凝胶渗透色谱(GPC)测量的值。
在GPC的测量中,作为系统,使用日本分光有限公司制造的高效液相色谱系统“LC-2000Plus(商品名)”(该系统包括:脱气机、液体输送泵“PU-2080(商品名)”、自动取样器“AS-2055(商品名)”、柱式加热炉和RI(差示折射率)检测器);作为色谱柱,使用昭和电工有限公司制造的连接的两根苯乙烯二乙烯苯共聚物填充柱“Shodex GPC K-806L(商品名)”;作为流动相,使用和光纯药工业有限公司制造的高效液相色谱用氯仿(作为稳定剂包含乙醇);且在流速1.0ml/min、柱温40℃、样品浓度1mg/ml、样品注入量100μl的条件下进行。
假定不存在成分(b1)的折射率的分子量依赖性,从RI检测器的检测量求出每个保留体积中的洗脱量。
另外,自保留体积对聚苯乙烯换算分子量的校准曲线是通过使用安捷伦科技(Agilent Technologies)有限公司的标准聚苯乙烯“EasiCal PS-1(商品名)”(plain A的分子量6870000、841700、152800、28770、2930;plain B的分子量2348000、327300、74800、10110、580)制作。
作为解析程序,使用日本分光有限公司制造的“ChromNAV GPC(商品名)”。
需要说明的是,关于GPC理论和实际测量,可以参考由共立出版有限公司出版的“尺寸排阻色谱-高分子的高效液相色谱,作者:森定雄,第一版第一次印刷,1991年12月10日”等参考书籍。
上述成分(b1)可以是结晶性或非结晶性。从抑制增强胶带从导体上剥落等问题的观点出发,上述成分(b1)可以是非结晶性。
在本说明书中,将通过下述温度程序测量的第二熔解曲线(在最后的升温过程中测量的熔解曲线)的熔解热量为10J/g以下的聚酯定义为非结晶性,超过10J/g的聚酯定义为结晶性,上述温度程序如下:使用珀金埃尔默有限公司的Diamond DSC型差示扫描量热仪,以50℃/min的升温速度,将样品加热至200℃,在200℃保持10分钟之后,以20℃/min的降温速度冷却至50℃,在50℃保持10分钟之后,以20℃/min的升温速度加热至200℃。
上述成分(b2)在一个分子中具有两个以上异氰酸酯基,并向增粘涂层赋予作为弹性体的性能,起到提高本发明的增强胶带的导体粘合性的作用。
作为上述成分(b2),可以列举:亚甲基双-4-环己基异氰酸酯;甲苯二异氰酸酯的三羟甲基丙烷加合物、六亚甲基二异氰酸酯的三羟甲基丙烷加合物、异佛尔酮二异氰酸酯的三羟甲基丙烷加合物、甲苯二异氰酸酯的异氰脲酸酯、六亚甲基二异氰酸酯的异氰脲酸酯、异佛尔酮二异氰酸酯的异氰脲酸酯、六亚甲基二异氰酸酯的缩二脲等异氰酸酯;以及上述聚异氰酸酯的嵌段型异氰酸酯等聚氨酯交联剂。作为上述成分(b2),可以使用这些之中的一种或两种以上的混合物。
从导体粘合性的观点出发,相对于100质量份(b1)成分,上述成分(b2)的配合量优选为3~25质量份,更优选为10~23质量份,进一步优选为14~20质量份。
用于形成增粘涂层的涂料根据需要可以含有溶剂,以便稀释到易涂布的浓度。只要不与上述成分(b1)、上述成分(b2)和其它任选成分反应或者催化(促进)这些成分的自反应(包括劣化反应),则对溶剂不做特别限定。例如,可以列举:1-甲氧基-2-丙醇、乙酸乙酯、乙酸正丁酯、甲苯、甲乙酮、甲基异丁酮、双丙酮醇、丙酮等。
用于形成增粘涂层的涂料中根据需要可以包含下述添加剂中一种或两种以上:抗静电剂、表面活性剂、流平剂、触变剂、防污剂、印刷适性改良剂、抗氧化剂、耐气候稳定剂、耐光稳定剂、紫外线吸收剂、热稳定剂、着色剂和填充剂等。
可以通过混合搅拌这些成分获得上述用于形成增粘涂层的涂料。
不特别限定使用上述用于形成增粘涂层的涂料以形成上述层(B)的方法,可以使用公知的网涂方法。具体可以列举:辊涂法、凹版涂布法、逆向涂布法、辊刷法、喷涂法、气刀涂布法和模具涂布法等方法。
从导体粘合性的观点出发,上述增粘涂层(B)的厚度为5~50μm,优选为10~40μm,更优选为15~30μm。
(C)热熔粘合剂层:
上述层(C)起到直接确保导体粘合性的作用。
作为上述热熔粘合剂,可以列举聚酯类、乙烯-乙酸乙烯酯类、聚氨酯类、聚酰胺类、聚苯乙烯类和聚烯烃类的粘合剂。这些之中,优选聚酯类粘合剂,更优选热塑性饱和共聚聚酯类粘合剂,进一步优选熔点为100~150℃的结晶性的热塑性饱和共聚聚酯类粘合剂。
在本说明书中,熔点是通过下述温度程序测量的第二熔解曲线(在最后的升温过程中测量的熔解曲线)中出现的最高温度侧的峰值的峰顶温度,上述温度程序如下:使用珀金埃尔默有限公司的Diamond DSC型差示扫描量热仪,以50℃/min的升温速度,将样品加热至200℃,在200℃保持10分钟之后,以20℃/min的降温速度冷却至50℃,在50℃保持10分钟之后,以20℃/min的升温速度升温至200℃。另外,将第二熔解曲线的熔解热量为10J/g以下的聚酯定义为非结晶性,超过10J/g的聚酯定义为结晶性。
不特别限定形成上述热熔粘合剂层的方法。例如可以列举:使用具有挤出机、T模头和卷绕机的设备熔融挤出的方法;将热熔粘合剂熔解到如1-甲氧基-2-丙醇、乙酸乙酯、乙酸正丁酯、甲苯、甲乙酮、甲基异丁酮、双丙酮醇、丙酮等溶剂中,并通过如辊涂、凹版涂布、逆向涂布、辊刷、喷涂、气刀涂布和模具涂布等公知的网涂方法,在期望的网基材上形成涂膜的方法。
从导体粘合性的观点出发,上述热熔粘合剂层的厚度为10~30μm,优选为15~20μm。
从导体粘合性的观点出发,本发明的增强胶带的软化温度优选为95℃以上,更优选为100℃以上。
在本说明书中,上述软化温度是在使用热机械测量装置从增强胶带的上述层(C)侧渗透压头时的温度-渗透深度曲线中,渗透深度变化率的绝对值为最大的温度。作为压头除使用理学有限公司制造的渗透圆锥销(PN/P1×07R)之外,其余均依照JIS K7196-1991,使用理学有限公司制造的热机械测定装置“TMA 8310(商品名)”,将切成直径5mm的圆形样品、负荷491mN、以及以20℃/min的升温温度从30℃升温至150℃的条件下获得的温度-渗透深度曲线,通过对温度微分并求出曲线的峰顶温度。测量例如图2所示。
虽然并不希望受缚于理论,但是认为之所以通过本发明的结构能够抑制增强胶带从导体剥离等问题,是因为成型加工时厚的增粘涂层成为缓冲体,所以热熔粘合剂不会从导体的周围流出。
不特别限定获得本发明的柔性扁平电缆的方法,可以通过公知的方法获得。作为上述方法,例如可以列举下述方法。使用两卷在绝缘膜的一面上设置有阻燃热熔粘合剂层的公知的用于柔性扁平电缆的阻燃绝缘膜,并使用公知的柔性扁平电缆制造装置,以上述热熔粘合剂层相对的方式送出上述阻燃绝缘膜,在它们之间夹持平行对齐的导体的扁线,并通过上述装置的热压辊进行热压,以使热熔粘合剂层相互熔合。在夹持导体的扁线之前,在上述阻燃绝缘膜上冲孔的同时,从上述阻燃绝缘膜层的一侧将本发明的增强胶带粘贴到冲孔处。接着,将两侧端切成具有预定的成品宽度,并切断孔和本发明的增强胶带的部分,从而可以完成本发明的柔性扁平电缆。图1是示出柔性扁平电缆示例的局部立体图。
不特别限定作为上述导体的扁线,从电缆的滑动性的观点出发,可以是12~50μm厚、0.2~2mm宽的软铜线、硬铜线、以及这些的镀锡线或镀镍线。
实施例
下面,通过实施例说明本发明,但本发明不限于此。
测量方法
(a)导体粘合力1(未处理):
(a-1)柔性扁平电缆的制造:
使用柔性扁平电缆设备,使用两卷理研科技有限公司制造的用于柔性扁平电缆的阻燃绝缘膜“NC 5222(商品名)”,用一侧的上述阻燃绝缘膜的热熔粘合剂层与另一侧的上述阻燃绝缘膜的热熔粘合剂层夹持排列12根的导体宽1.4mm、厚0.035mm的硬铜线,用预热至180℃的压辊和预热至180℃的支承辊,以0.5m/min线速、3MPa压力的条件下按压并热熔后,将两侧端切成宽24mm的成品宽度,在孔和增强胶带的部分中沿机器方向的中心线进行切断,得到长100mm、宽24mm的柔性扁平电缆。此时,在上述阻燃绝缘膜中,沿机器方向以100mm的间隔冲压出机器方向20mm×横向24mm的孔,然后,从绝缘膜层的一侧粘贴切成150mm长度的增强胶带。
(a-2)
在试验速度50mm/min的条件下,从增强胶带180度剥离铜线来测量上述得到的柔性扁平电缆的增强胶带与铜线之间的粘合力。
(b)导体粘合力2(酸浸渍后的导体粘合力):
将上述(a-1)中得到的柔性扁平电缆的增强胶带部分,在温度60℃的5质量%盐酸水溶液中浸渍2小时后,与(a-2)同样地进行测量。
(c)导体粘合力3(碱浸渍后的导体粘合力):
将上述(a-1)中得到的柔性扁平电缆的增强胶带部分,在温度60℃的5质量%氢氧化钠水溶液中浸渍2小时后,与(a-2)同样地进行测量。
(d)导体粘合力4(浸渍盐水后的导体粘合力):
将上述(a-1)中得到的柔性扁平电缆的增强胶带部分,在温度60℃的5质量%氯化钠水溶液中浸渍2小时后,与(a-2)同样地进行测量。
(e)导体粘合力5(镀金处理液浸渍后的导体粘合力):
将上述(a-1)中得到的柔性扁平电缆的增强胶带部分,在温度60℃的柔性扁平电缆的端子镀金用镀金处理液(氰化金钾、氰化钾、磷酸氢钾和碳酸钾的混合水溶液;pH值为11)中浸渍2小时后,与(a-2)同样地进行测量。
(f)导体粘合力6(镀金处理液浸渍后的导体粘合力2):
与上述(e)完全相同的方式对100根电缆的每两根铜线测量(合计数据数量为200个)镀金处理液浸渍后的导体粘合力,数出粘合力为1.5N/14mm以下的数据数量,按照以下标准进行评价。
◎:0个
○:1~4个
△:5~10个
×:11个以上
使用的原材料
(A)绝缘膜:
(A-1)188μm厚的单面易粘合处理双轴拉伸聚对苯二甲酸乙二醇酯类树脂膜。
(B)用于增粘涂层的涂料:
(B-1)将下述(b1)100质量份、下述(b2)17质量份、下述(b3)33质量份和下述(b4)230质量份混合搅拌而得到的涂料。
(B-2)将下述(b1)100质量份、下述(b2)12质量份、下述(b3)33质量份和下述(b4)230质量份混合搅拌而得到的涂料。
(b1)东洋纺有限公司的非结晶性的热塑性饱和共聚聚酯类树脂“BYLON 500(商品名)”,分子量23000,玻璃化转变温度4℃。
(b2)东曹有限公司制造的聚异氰脲酸酯“Coronate HX(商品名)”。
(b3)大日精化工业有限公司制造的油墨“NB500 739蓝(商品名)”。
(b4)甲苯。
(C)热熔粘合剂:
(C-1)东亚合成有限公司的结晶性的热塑性饱和共聚聚酯类树脂“Alon MeltPES-111EE(商品名)”。
(D)隔膜:
(D-1)厚12μm的双轴拉伸聚丙烯类树脂膜。
例1
在上述(A-1)的易粘合面上,使用辊涂机,使用上述(B-1),形成干燥后厚度为15μm的增粘涂层。在上述(D-1)上,挤出并层压上述(C-1),得到15μm厚的膜状热熔粘合剂。在上述得到的上述(A-1)和上述(B-1)的层压体的上述(B-1)侧的一面上,层叠上述得到的(C-1)和上述(D-1)的层压体的上述(C-1)侧的一面进行热层压。将由此获得的层压体切成25mm的宽度以获得增强胶带。进行上述试验(a)至(e)。结果如表1所示。
例2~4、例1C、2C
除了将上述(B)层的厚度和上述(C)的厚度更改为表1所示之外,其余全部按照与例1相同的方式进行。结果如表1所示。
例5
除了代替上述(B-1)使用上述(B-2)之外,其余全部按照与例1相同的方式进行。结果如表1所示。
表1
本发明的增强胶带对导体具有优异的粘合性,且在导体端子上进行镀金等处理时能够抑制增强胶带从导体剥离等问题。
Claims (12)
1.一种增强胶带,所述增强胶带为用于柔性扁平电缆的增强胶带,其特征在于,
在绝缘膜(A)的一面上依次包含:
15~50μm厚的用于提高导体粘合性的增粘涂层(B);以及
10~30μm厚的热熔粘合剂层(C)。
2.根据权利要求1所述的增强胶带,其特征在于,
所述增粘涂层(B)的厚度为15~40μm。
3.根据权利要求1所述的增强胶带,其特征在于,
所述增粘涂层(B)的厚度为15~30μm。
4.根据权利要求1所述的增强胶带,其特征在于,
所述增粘涂层(B)由涂料构成,所述涂料包含:
(b1)热塑性饱和共聚聚酯类树脂100质量份;以及
(b2)在一个分子中具有两个以上异氰酸酯基的化合物3~25质量份。
5.根据权利要求4所述的增强胶带,其特征在于,
所述成分(b2)在一个分子中具有两个以上异氰酸酯基的化合物的配合量为10~25质量份。
6.根据权利要求4所述的增强胶带,其特征在于,
所述成分(b2)在一个分子中具有两个以上异氰酸酯基的化合物的配合量为14~25质量份。
7.根据权利要求4所述的增强胶带,其特征在于,
所述成分(b1)热塑性饱和共聚聚酯类树脂为非结晶性。
8.根据权利要求1所述的增强胶带,其特征在于,
软化温度为95℃以上。
9.根据权利要求1~8中任一项所述的增强胶带,其特征在于,
所述热熔粘合剂为热塑性饱和共聚聚酯类的粘合剂。
10.一种柔性扁平电缆,其特征在于,所述柔性扁平电缆包含权利要求1~9中任一项所述的增强胶带。
11.一种柔性扁平电缆,其特征在于,利用权利要求1~9中任一项所述的增强胶带来增强导体端子。
12.一种使用权利要求1~9中任一项所述的增强胶带来增强柔性扁平电缆的导体端子的方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015102784 | 2015-05-20 | ||
JP2015-102784 | 2015-05-20 | ||
PCT/JP2016/064455 WO2016186073A1 (ja) | 2015-05-20 | 2016-05-16 | 補強テープ、及びこれを用いたフレキシブルフラットケーブル |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107960129A CN107960129A (zh) | 2018-04-24 |
CN107960129B true CN107960129B (zh) | 2020-09-22 |
Family
ID=57319965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201680027901.7A Active CN107960129B (zh) | 2015-05-20 | 2016-05-16 | 增强胶带及使用该增强胶带的柔性扁平电缆 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20180147822A1 (zh) |
EP (1) | EP3300085B1 (zh) |
JP (1) | JP6457078B2 (zh) |
KR (1) | KR20180008537A (zh) |
CN (1) | CN107960129B (zh) |
HU (1) | HUE054210T2 (zh) |
PL (1) | PL3300085T3 (zh) |
TW (1) | TWI676997B (zh) |
WO (1) | WO2016186073A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112513211B (zh) * | 2018-09-06 | 2023-06-27 | 理研科技株式会社 | 热熔胶、加强带、以及使用该加强带加强导体端子的柔性扁平电缆 |
CN109628012B (zh) * | 2018-12-19 | 2021-11-09 | 广东莱尔新材料科技股份有限公司 | 一种耐湿、耐高温、低介电常数的热熔胶膜及其制备方法 |
CN114488431B (zh) * | 2021-12-16 | 2023-08-18 | 中国电子科技集团公司第二十九研究所 | 一种小型化高可靠外调制光源封装结构及封装方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH117838A (ja) * | 1997-06-13 | 1999-01-12 | Dainippon Printing Co Ltd | フラットケ−ブル用被覆材 |
JP2001222919A (ja) * | 2000-02-09 | 2001-08-17 | Dainippon Printing Co Ltd | ヒ−トシ−ル性テ−プおよびそれを使用したフラットケ−ブル |
CN103865462A (zh) * | 2012-12-10 | 2014-06-18 | 日立金属株式会社 | 粘接性树脂组合物以及使用其的粘接膜和扁平电缆 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6123128U (ja) * | 1984-07-12 | 1986-02-10 | 日立電線加工株式会社 | 耐腐蝕性補強板付きテ−プ電線 |
JPS62167383A (ja) * | 1986-01-17 | 1987-07-23 | Sony Chem Kk | 熱接着性難燃化ポリエステルフイルム |
JPH10269856A (ja) * | 1997-03-22 | 1998-10-09 | Totoku Electric Co Ltd | はんだ付け可能なフラットケーブル |
DE102007004102A1 (de) * | 2007-01-26 | 2008-07-31 | Evonik Degussa Gmbh | Kristalline Copolyester mit guter Löslichkeit in nicht halogenierten Lösungsmitteln und ihre Verwendung |
TW200914566A (en) * | 2007-07-10 | 2009-04-01 | Mitsubishi Plastics Inc | Laminate, flat cable using said laminate, and electrical wiring member |
JP5258035B2 (ja) * | 2008-09-02 | 2013-08-07 | リケンテクノス株式会社 | 非ハロゲン系難燃積層フィルムおよびフラットケーブル |
JP5205323B2 (ja) * | 2009-03-26 | 2013-06-05 | リケンテクノス株式会社 | 非ハロゲン系難燃積層フィルムおよびフラットケーブル |
JP5699314B2 (ja) * | 2010-08-23 | 2015-04-08 | 大日本印刷株式会社 | フラットケーブル用被覆材およびそれを使用したフラットケーブル |
WO2013047618A1 (ja) * | 2011-09-30 | 2013-04-04 | 株式会社Adeka | 難燃性樹脂組成物及びこれを用いた電線 |
CN104487534B (zh) * | 2012-07-11 | 2016-11-09 | 大自达电线股份有限公司 | 硬化导电胶组成物、电磁波屏蔽膜、导电胶膜、黏合方法及线路基板 |
JP2014222577A (ja) * | 2013-05-13 | 2014-11-27 | 住友電気工業株式会社 | フラットケーブル |
-
2016
- 2016-05-16 US US15/575,084 patent/US20180147822A1/en active Pending
- 2016-05-16 JP JP2017519205A patent/JP6457078B2/ja active Active
- 2016-05-16 CN CN201680027901.7A patent/CN107960129B/zh active Active
- 2016-05-16 PL PL16796466T patent/PL3300085T3/pl unknown
- 2016-05-16 HU HUE16796466A patent/HUE054210T2/hu unknown
- 2016-05-16 EP EP16796466.7A patent/EP3300085B1/en active Active
- 2016-05-16 WO PCT/JP2016/064455 patent/WO2016186073A1/ja active Application Filing
- 2016-05-16 KR KR1020177035192A patent/KR20180008537A/ko active Application Filing
- 2016-05-20 TW TW105115799A patent/TWI676997B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH117838A (ja) * | 1997-06-13 | 1999-01-12 | Dainippon Printing Co Ltd | フラットケ−ブル用被覆材 |
JP2001222919A (ja) * | 2000-02-09 | 2001-08-17 | Dainippon Printing Co Ltd | ヒ−トシ−ル性テ−プおよびそれを使用したフラットケ−ブル |
CN103865462A (zh) * | 2012-12-10 | 2014-06-18 | 日立金属株式会社 | 粘接性树脂组合物以及使用其的粘接膜和扁平电缆 |
Also Published As
Publication number | Publication date |
---|---|
JP6457078B2 (ja) | 2019-01-23 |
TW201707011A (zh) | 2017-02-16 |
US20180147822A1 (en) | 2018-05-31 |
TWI676997B (zh) | 2019-11-11 |
EP3300085A1 (en) | 2018-03-28 |
EP3300085B1 (en) | 2021-03-31 |
WO2016186073A1 (ja) | 2016-11-24 |
HUE054210T2 (hu) | 2021-08-30 |
PL3300085T3 (pl) | 2021-10-04 |
JPWO2016186073A1 (ja) | 2018-03-15 |
EP3300085A4 (en) | 2018-12-26 |
CN107960129A (zh) | 2018-04-24 |
KR20180008537A (ko) | 2018-01-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101153132B1 (ko) | 접착제 및 이를 이용한 전기 자재용 피복 필름 | |
CN107960129B (zh) | 增强胶带及使用该增强胶带的柔性扁平电缆 | |
TWI610606B (zh) | 零件內建配線基板之製造方法及半導體裝置 | |
JP5304152B2 (ja) | 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板 | |
KR20130122707A (ko) | 플랫 케이블용 피복재 및 그것을 사용한 플랫 케이블 | |
JP2014024961A (ja) | 保護フィルム付き接着シート、積層体の製造方法、及びプリント配線板の製造方法 | |
US4387129A (en) | Laminates having optically clear laminates having high molecular weight phenoxy-high crystallinity polyurethane adhesive | |
KR20150145194A (ko) | 보호 필름 부착 접착 시트 | |
KR20080030055A (ko) | 전기 자재용 접착제 부착 적층 필름 | |
JPS5822163A (ja) | ガスバリヤ−性積層物 | |
US20010018122A1 (en) | Adhesive composition | |
JP4203220B2 (ja) | 積層フィルム | |
JP3847953B2 (ja) | 積層フィルム | |
CN112513211A (zh) | 热熔胶、加强带、以及使用该加强带加强导体端子的柔性扁平电缆 | |
JP2013254703A (ja) | フラットケーブル用被覆材およびそれを用いたフラットケーブル | |
WO2015166796A1 (ja) | フラットケーブル用補強テープ及びフラットケーブル | |
KR102567078B1 (ko) | 절연 시트 및 플랫 케이블 | |
CN109153903B (zh) | 扁平电缆增强带用树脂组合物、扁平电缆增强带和扁平电缆 | |
JP2003086029A (ja) | フラットケーブル被覆材およびそれを用いたフラットケーブル | |
KR101706172B1 (ko) | 메탈 메시용 기재필름 | |
KR20030048272A (ko) | 접착성이 우수한 폴리에스테르 필름의 제조방법 | |
JP2006156243A (ja) | フラットケーブル用絶縁フィルム及びそれを用いたフラットケーブル | |
JP2022131474A (ja) | 表面保護フィルム | |
KR20200023550A (ko) | 금속막 적층용 필름 | |
KR20150140882A (ko) | 메탈 메시용 기재필름 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |