TWI676997B - 補強帶及使用此之可撓性平面纜線 - Google Patents
補強帶及使用此之可撓性平面纜線 Download PDFInfo
- Publication number
- TWI676997B TWI676997B TW105115799A TW105115799A TWI676997B TW I676997 B TWI676997 B TW I676997B TW 105115799 A TW105115799 A TW 105115799A TW 105115799 A TW105115799 A TW 105115799A TW I676997 B TWI676997 B TW I676997B
- Authority
- TW
- Taiwan
- Prior art keywords
- reinforcing tape
- conductor
- layer
- flexible flat
- flat cable
- Prior art date
Links
- 230000002787 reinforcement Effects 0.000 title description 3
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 60
- 239000004020 conductor Substances 0.000 claims abstract description 54
- 239000004831 Hot glue Substances 0.000 claims abstract description 21
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 12
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 12
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 12
- 229920001225 polyester resin Polymers 0.000 claims abstract description 9
- 239000004645 polyester resin Substances 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 16
- 229920000728 polyester Polymers 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000003973 paint Substances 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims 2
- 238000000576 coating method Methods 0.000 abstract description 20
- 239000011248 coating agent Substances 0.000 abstract description 18
- 238000007747 plating Methods 0.000 abstract description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052737 gold Inorganic materials 0.000 abstract description 12
- 239000010931 gold Substances 0.000 abstract description 12
- 239000010410 layer Substances 0.000 description 31
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000011247 coating layer Substances 0.000 description 8
- -1 polyethylene terephthalate Polymers 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000005227 gel permeation chromatography Methods 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 5
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 4
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000007754 air knife coating Methods 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PFURGBBHAOXLIO-UHFFFAOYSA-N cyclohexane-1,2-diol Chemical compound OC1CCCCC1O PFURGBBHAOXLIO-UHFFFAOYSA-N 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000000411 inducer Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004811 liquid chromatography Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 238000007761 roller coating Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- KHZYMPDILLAIQY-UHFFFAOYSA-N 3-(3-carboxyphenyl)benzoic acid Chemical compound OC(=O)C1=CC=CC(C=2C=C(C=CC=2)C(O)=O)=C1 KHZYMPDILLAIQY-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- LNNIPFBETXOKIA-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-9h-fluoren-2-yl]phenol Chemical compound C1=CC(O)=CC=C1C1=CC=C(C=2C(=CC=CC=2)C2)C2=C1C1=CC=C(O)C=C1 LNNIPFBETXOKIA-UHFFFAOYSA-N 0.000 description 1
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 239000004129 EU approved improving agent Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- POEKKPPBDGWWEV-UHFFFAOYSA-N NC(=O)N.NC(=O)N.C(CCCCCN=C=O)N=C=O Chemical compound NC(=O)N.NC(=O)N.C(CCCCCN=C=O)N=C=O POEKKPPBDGWWEV-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- FNGGVJIEWDRLFV-UHFFFAOYSA-N anthracene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=CC3=C(C(O)=O)C(C(=O)O)=CC=C3C=C21 FNGGVJIEWDRLFV-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical group OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- IKGRHMKNUHTLIL-UHFFFAOYSA-N cyanic acid 3,5,5-trimethylcyclohex-2-en-1-one Chemical compound O=C1C=C(CC(C)(C)C1)C.N#CO IKGRHMKNUHTLIL-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- INSRQEMEVAMETL-UHFFFAOYSA-N decane-1,1-diol Chemical compound CCCCCCCCCC(O)O INSRQEMEVAMETL-UHFFFAOYSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 1
- 229910000396 dipotassium phosphate Inorganic materials 0.000 description 1
- 235000019797 dipotassium phosphate Nutrition 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- KPQDSKZQRXHKHY-UHFFFAOYSA-N gold potassium Chemical compound [K].[Au] KPQDSKZQRXHKHY-UHFFFAOYSA-N 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000582 polyisocyanurate Polymers 0.000 description 1
- 239000011495 polyisocyanurate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000001542 size-exclusion chromatography Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
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Abstract
本發明係一種補強帶及使用此之可撓性平面纜線,其課題係提供:對於與導體之接著性優越,對於導體終端進行金鍍敷等之處理時,可抑制補強帶則自導體剝離等之損壞的補強帶,及使用此等之可撓性平面纜線。於絕緣薄膜(A)之單面上,依序具有厚度5~50μm之中介塗層的層(B),及厚度10~30μm之熱熔接著劑的層(C)之補強帶。上述中介塗層的層(B)係理想為作為包含(b1)熱可塑性飽和共聚合聚酯系樹脂100質量份;和於(b2)1分子中具有2以上之異氰酸酯基之化合物3~25質量份之塗料所成之補強帶。
Description
本發明係有關可撓性平面纜線之補強帶。更詳細係有關對於與導體之接著性優越,對於導體終端進行金鍍敷等之處理時,可抑制補強帶則自導體剝離等之損壞的補強帶。
可撓性平面纜線係經由具有絕緣基材薄膜與接著性樹脂組成物層之層積體等,而夾持所配列之複數的導體,具有被覆之構造。上述導體之終端係為了作為呈可將纜線連接器連接於電子機器,而經常加以貼合補強帶而加以補強。另外,上述導體之終端係為了使纜線的性能提升,而加以貼合補強帶之後,經常施以金鍍敷等。
自以往,作為上述補強帶係加以使用設置熱熔接著劑層於厚度之絕緣薄膜的單片者,典型來說係設置聚酯系熱熔接著劑層於厚度150~250μm程度之雙軸延伸聚乙烯對苯二甲酸酯薄膜之單片者。但,對於以往的補強帶,係有著導體接著力經時性下降,及耐濕熱性低之問題。因此,作為解決此等問題之技術,提案有使用作為熱
熔接著劑而加以改質之聚酯系熱熔接著劑層(例如,專利文獻1及2)。但,即使將此等熱熔接著劑適用於補強帶,在對於導體終端進行金鍍敷等之處理時,亦無法抑止補強帶自導體剝離等之損壞者。
[專利文獻1]日本特開2002-371258號公報
[專利文獻2]日本特開2005-255752號公報
本發明之課題係提供:對於與導體之接著性優越,對於導體終端進行金鍍敷等之處理時,可抑制補強帶則自導體剝離等之損壞的補強帶,及使用此等之可撓性平面纜線。
本發明者係進行銳意研究的結果,令人驚訝地發現經由於厚度之絕緣薄膜與熱熔接著劑層之間,設置厚度之中介塗層之時,可達成上述課題者。
即,本發明係可撓性平面纜線用補強帶,其中,於絕緣薄膜(A)之單面上,依序具有厚度5~50μm之中介塗層的層(B),及厚度10~30μm之熱熔接著劑
的層(C)之補強帶。
第2發明係如第1發明所記載之補強帶,其中,前述中介塗層的層(B)則包含(b1)熱可塑性飽和共聚合聚酯系樹脂100質量份;和於(b2)1分子中具有2以上之異氰酸酯基之化合物3~25質量份之塗料所成。
第3發明係如第1發明或第2發明所記載之補強帶,其中,前述熱熔接著劑則為熱可塑性飽和共聚合聚酯系之接著劑。
第4發明係如第1至第3發明之任一項所記載之補強帶,其中,軟化溫度則為95℃以上。
第5發明係包含如第1至4發明之任一項所記載之補強帶的可撓性平面纜線。
本發明之補強帶係對於與導體之接著性優越,在對於導體終端進行金鍍敷等之處理時,可抑止補強帶自導體剝離等之損壞者。因此,本發明之補強帶係可最佳地適用於可撓性平面纜線之導體終端的補強者。
1‧‧‧可撓性平面纜線
2‧‧‧補強帶
3‧‧‧導體終端
圖1係顯示貼合補強帶於可撓性平面纜線的導體終端之狀態的一例之部分斜視圖。
圖2係顯示軟化溫度之測定例的圖表。
本發明之可撓性平面纜線用補強帶係於絕緣薄膜(A)之單面上,依序具有厚度5~50μm之中介塗層的層(B),及厚度10~30μm之熱熔接著劑的層(C)。
上述絕緣薄膜係對於本發明之補強帶賦予剛性與強度,將可撓性平面纜線之導體終端,作為呈可連接器連接於電子機器之功用。
作為上述絕緣薄膜係例如,可舉出聚乙烯對苯二甲酸酯系樹脂,聚萘二甲酸乙二酯系樹脂等之聚酯系樹脂;聚苯硫醚系樹脂;聚碳酸酯系樹脂;聚丙烯系樹脂;聚乙烯系樹脂等之聚烯烴系樹脂;聚醯胺系樹脂;及聚苯乙烯系樹脂;等之樹脂之1種以上所成之薄膜者。此等薄膜係包含無定向膜,單軸定向膜,及雙軸定向膜。另外,包含層積2層以上此等之1種以上的層積薄膜。在此等之中,從剛性,強度及成本之觀點,聚乙烯對苯二甲酸酯系樹脂之雙軸定向膜,及層積2層以上此等之層積薄膜為佳。
上述絕緣薄膜之厚度係未特別加以限制,但從賦予剛性與強度的觀點,通常為100μm以上、而理想為125μm以上即可。從加工性的觀點,通常為500μm以下、理想為250μm以下即可。
上述絕緣薄膜係包含含有著色劑之樹脂所成之著色層者即可。上述絕緣薄膜係於構成此等之薄膜的任一個1以上的面上方,施以印刷即可。
上述層(B)係使上述絕緣薄膜與上述熱熔接著劑的層之接著強度提升之同時,作為提高導體接著性之功用。
作為為了形成上述中介塗層的層之塗料係並未特別加以限制,但理想為可舉出包含(b1)熱可塑性飽和共聚合聚酯系樹脂100質量份;和於(b2)1分子中具有2以上之異氰酸酯基之化合物3~25質量份之塗料者。
上述成分(b1)係成為中介塗層形成用塗料的基底材之樹脂。作為上述成分(b1)係例如,使用任意之多價羧酸與任意之多價醇,而可使用由公知的方法所得到之熱可塑性飽和共聚合聚酯系樹脂者。
作為上述多價羧酸,係可舉出對苯二甲酸,間苯二甲酸,鄰苯二酸,及萘二甲酸,聯苯-4,4’-二羧酸,二苯氧基乙烷二羧酸,聯苯-3,3’-二羧酸,聯苯-4,4’-二羧酸,蒽二羧酸等之芳香族多價羧酸;1,2-環己二羧酸,1,3-環己二羧酸,1,4-環己二羧酸等之脂環式二羧酸;丙二酸,琥珀酸,戊二酸,己二酸,庚二酸,辛二酸,壬二酸,及癸二酸等之脂肪族多價羧酸;及此等之酯形成性誘導體等。作為上述羧酸係可使用此等之1種以上。
作為上述多價醇係例如,可舉出乙二醇,二甘醇,丙二醇,伸丁二醇,新戊二醇,聚乙二醇,1,2-丙二醇,1,3-丙二醇,聚丙二醇,1,2-丁二醇,1,3-丁二醇,1,4-丁二醇,1,5-戊二醇,1,6-己二醇,新戊二醇,癸二醇,3-甲基-1,5-戊二醇,2-甲基-1,3-丙二醇,1,2-環己二醇,1,4-環己二醇,1,4-環己烷二甲醇,2,2,4,4’-四甲基-1,3-環丁二醇,甘油,及三羥甲基丙烷等之脂肪族多價醇;己二醇,4,4’-二羥基聯苯,2,2-雙(4-羥基苯基)丙烷,雙(4-羥基苯基)碸,雙酚A,雙酚A之環氧烷附加物等之芳香族多價醇;及此等之酯形成性誘導體等。作為上述多價醇係可使用此等之1種以上者。
上述成分(b1)之數平均分子量係從導體接著性,及與可撓性平面纜線用難燃絕緣薄膜之接著性的觀點,10,000~35,000為佳,而15,000~30,000則更佳。
上述成分(b1)之數平均分子量係膠透層析術(GPC)之測定的值。
GPC之測定係作為系統,使用日本分光股份有限公司之高速液體層析術系統「LC-2000Plus(商品名)」(包含除氣器、送液幫浦「PU-2080(商品名)」、自動取樣器「AS-2055(商品名)」、管柱烘箱及RI(折射率)檢出器之系統);作為管柱,連結昭和電工股份有限公司之苯乙烯二乙苯烯共聚合體充填管柱「Shodex GPC K-806L(商品名)」2條而使用;將和光純藥工業股份有限公司之高速液體層析術用三氯甲烷(作為安定劑而含有乙醇)
作為移動相;以流速1.0毫升/分,管柱溫度40℃,試料濃度1毫克/毫升,試料注入量100微升的條件進行。
在各保持容量的溶出量係看作無上述成分(b1)之折射率之分子量依存性而自RI檢出器的檢出量求取。
另外自保持容量對於聚苯乙烯換算分子量的校正曲線,係使用日本Agilent Technology股份有限公司之標準聚苯乙烯「EasiCal PS-1(商品名)」(Plain A之分子量6870000、841700、152800、28770、2930;Plain B之分子量2348000、327300、74800、10110、580)而作成。
解析程式係使用日本分光股份有限公司之「ChromNAV GPC(商品名)」。
然而,對於GPC之理論及測定的實際係可參照共立出版股份有限公司之「尺寸排除層析術 高分子之高速液體層析術、作者:森定雄、初版第1刷1991年12月10日」等之參考書者。
上述成分(b1)係均可為結晶性,以及非結晶性。上述成分(b1)係從抑制補強帶自導體產生剝離等之損壞的觀點,可為非結晶性。
在本說明書中,使用股份有限公司PerkinElmer JAPAN之Diamond DSC型示差掃描熱量計,將試料,以50℃/分之升溫速度升溫至200℃,以200℃進行10分鐘保持之後,以20℃/分之降溫速度冷卻至50
℃,以50℃進行10分鐘保持之後,以20℃/分之升溫速度加熱至200℃之溫度程式加以測定之二度融解曲線(在最後之升溫過程中加以測定之融解曲線)之融解熱量則將10J/g以下之聚酯定義為非結晶性,而將超過10J/g之聚酯定義為結晶性。
上述成分(b2)係於1分子中具有2以上之異氰酸酯基,於中介塗層的層,賦予作為彈性體的性質,作為使本發明之補強帶的導體接著性提升之功用。
作為上述成分(b2)係例如,可舉出亞甲雙-4-環己基異氰酸酯;二異氰酸甲苯之三羥甲基丙烷加合物體,六亞甲基二異氰酸酯之三羥甲基丙烷加合物體,二異氰酸異佛爾酮之三羥甲基丙烷加合物體,甲次苯基雙異氰酸鹽之異氰尿酸體,六亞甲基二異氰酸酯之異氰尿酸體,二異氰酸異佛爾酮之異氰尿酸體,六亞甲基二異氰酸酯之雙尿素體等之聚異氰酸酯;及上述聚異氰酸酯之塊型異氰酸酯等之胺甲酸乙酯交聯劑等。作為上述成分(b2)係可使用此等1種或2種以上的混合物者。
上述成分(b2)之調配量係從導體接著性的觀點,對於上記成分(b1)100質量份而言,理想為3~25質量份,更理想為10~23質量份,而又更理想為14~20質量份。
上述中介塗層形成用塗料係為了稀釋為容易塗工之濃度,而因應期望而含有溶劑亦可。溶劑係如為與上記成分(b1)、上記成分(b2)、及其他任意成分反
應,以及未將此等成分之本身反應(包含劣化反應)作為觸媒(促進)者,並無特別加以限制。例如,可舉出1-甲氧基-2-丙醇,乙酸乙酯,乙酸n丁酯,甲苯,丁酮,甲基異丁基酮,二丙酮醇,及丙酮等者。
對於上述中介塗層形成用塗料,係因應期望,含有1種或2種以上帶電防止劑,界面活性劑,均染劑,流動減黏性賦予劑,污染防止劑,印刷性改良劑,氧化防止劑,耐候性安定劑,耐光性安定劑,紫外線吸收劑,熱安定劑,著色劑,及填充物等之添加劑亦可。
上述中介塗層形成用塗料係可經由混合攪拌此等成分而得到者。
使用上述中介塗層形成用塗料而形成上述層(B)的方法係無特別加以限制,而可使用公知之網塗布方法者。具體而言係可舉出滾輪塗層,凹版印刷塗層,反向塗層,滾動刷,噴霧塗層,氣刀塗層,及模塗層等之方法者。
上述中介塗層的層(B)之厚度係從導體接著性之觀點,5~50μm、理想為10~40μm、而更理想為15~30μm。
上述層(C)係作為直接性地擔保導體接著性的功用。
作為上述熱熔接著劑係例如,可舉出聚酯
系,乙烯醋酸乙烯基系,聚氨酯系,聚醯胺系,聚苯乙烯系,及聚烯烴系之接著劑者。在此等之中,聚酯系接著劑為佳,而熱可塑性飽和共聚合聚酯系接著劑則更佳,而在結晶性之熱可塑性飽和共聚合聚酯系接著劑,熔點為100~150℃者則更佳。
在本說明書中,熔點係使用股份有限公司PerkinElmer JAPAN之Diamond DSC型示差掃描熱量計,將試料,以50℃/分之升溫速度升溫至200℃,以200℃進行10分鐘保持之後,以20℃/分之降溫速度冷卻至50℃,以50℃進行10分鐘保持之後,出現在以20℃/分之升溫速度加熱至200℃之溫度程式之二度融解曲線(在最後之升溫過程中加以測定之曲線)之最高溫度側之峰值之峰頂溫度。另外,二度融解曲線之融解熱量則將10J/g以下之聚酯定義為非結晶性,而將超過10J/g之聚酯定義為結晶性。
形成上述熱熔接著劑的層之方法係無特別加以限制。例如,可舉使用具備押出機,T模頭,及拉捲引機之裝置,進行熔融押出之方法;溶解熱熔接著劑,例如,溶解於1-甲氧基-2-丙醇,乙酸乙酯,乙酸n丁酯,甲苯,丁酮,甲基異丁基酮,二丙酮醇,及丙酮等,再經由公知之網塗布方法,例如,滾輪塗層,凹版印刷塗層,反向塗層,滾動刷,噴霧塗層,氣刀塗層,及模塗層等,作為塗膜而形成於所期望之網基材上之方法等。
上述熱熔接著劑的層之厚度係從導體接著性
之觀點,為10~30μm、而理想為15~20μm。
本發明之補強帶係從導體接著性的觀點,軟化溫度則理想為95℃以上、而更理想為100℃以上。
在本說明書中,上述軟化溫度係在使用熱機械測定裝置,從補強帶之上述層(C)側,使壓頭侵入時之溫度-侵入深度曲線中,侵入深度變化率之絕對值則成為最大的溫度。作為壓頭而使用日本Rigaku股份有限公司之侵入用圓錐銷(PN/P1X07R)以外,係依照JIS K7196-1991,而使用日本Rigaku股份有限公司之熱機械測定裝置「TMA8310(商品名)」,將裁斷為直徑5mm之圓形的樣品,負荷491mN、及從溫度30℃至150℃為止,以升溫速度20℃/分進行升溫的條件所得到之溫度-侵入深度曲線,作為以溫度微分算出之曲線的峰頂溫度而求得。將測定例示於圖2。
雖未限制於理論,但經由作為本發明之構成之時,可抑制補強帶自導體剝離等之損壞之情況係在成形加工時,因厚度之中介塗層則成為緩衝,認為熱熔接著劑則成為呈未從導體之周圍流出之故。
得到本發明之可撓性平面纜線之方法係並無特別加以限制,而可以公知的方法而得到。作為上述方法係例如,可舉出如以下的方法者。利用2捲設置難燃性熱熔接著劑的層於絕緣薄膜之單面的公知之可撓性平面纜線用難燃絕緣薄膜,使用公知之可撓性平面纜線製造裝置,將上述難燃絕緣薄膜,上述熱熔接著劑的層則呈對向地加
以送出,於其間平行地夾入拉對齊之導電體的平角線,以上述裝置之熱壓輥而進行熱壓,使上述熱熔接著劑的層彼此相互熔著。對於上述難燃絕緣薄膜,係在夾入導電體的平角線之前,貫穿孔之同時,於貫穿孔處,自上述絕緣薄膜的層側,貼著本發明之補強帶。接著,將兩側端作為縫隙而作成特定之完成寬度,在孔與本發明之補強帶的部分進行切斷,可作為本發明之可撓性平面纜線而完成者。圖1係顯示可撓性平面纜線之一例的部分斜視圖。
作為上述導電體的平角線係並無特別加以限制,但從纜線之摺動性的觀點,可為厚度12~50μm、寬度0.2~2mm之軟銅線、硬銅線、及此等錫鍍敷線或鎳鍍敷線。
以下,經由實施例而說明本發明,但本發明係並非限定於此等者。
使用可撓性平面纜線裝置,使用2捲日本RIKEN TECHNOS股份有限公司之可撓性平面纜線用難燃絕緣薄膜「NC5224(商品名)」,以一方之上述難燃絕緣薄膜的熱熔接著劑層與另一方之上述難燃絕緣薄膜的熱熔接著
劑層而夾持配列12條導體寬度1.4mm、厚度0.035mm之硬銅線之構成,由加以預熱為溫度180℃之按壓滾輪與加以預熱為溫度180℃之承受滾輪,以線速度0.5m/分、壓力3MPa之條件進行按壓,而使其融著之後,將兩側端作為縫隙而作成寬度24mm之完成寬度,在孔與補強帶之部分的機器方向之中央的線進行切斷,得到長度100mm、寬度24mm之可撓性平面纜線。此時,對於上述難燃絕緣薄膜係將機器方向20mm×橫方向24mm的孔,於機器方向,以100mm間隔加以貫穿,於此,將裁斷為長度150mm之補強帶,自絕緣薄膜的層側加以貼著。
將上述所得到之可撓性平面纜線之補強帶與銅線之接著力,以試驗速度50mm/分之條件,自補強帶進行180度剝離而測定銅線。
將在上述(I-1)所得到之可撓性平面纜線之補強帶部分,以溫度60℃浸漬2小時於5質量%鹽酸水溶液後,與上述(I-2)同樣作為而進行測定。
將在上述(I-1)所得到之可撓性平面纜線之補強帶部分,以溫度60℃浸漬2小時於5質量%氫氧化鈉酸水溶
液後,與上述(I-2)同樣作為而進行測定。
將在上述(I-1)所得到之可撓性平面纜線之補強帶部分,以溫度60℃浸漬2小時於5質量%氯化鈉水溶液後,與上述(I-2)同樣作為而進行測定。
將在上述(I-1)所得到之可撓性平面纜線之補強帶部分,以溫度60℃浸漬2小時於可撓性平面纜線之終端金鍍敷用之金鍍敷處理液(氰化金鉀,氰化鉀,磷酸氫鉀,及碳化鉀之混合水溶液,pH11)後,與上述(I-2)同樣作為而進行測定。
與上述(HO)完全同樣作為,將金鍍敷處理液浸漬後之導體接著力,對於100條之纜線,對於各2條的銅線進行測定(合計參數200個),接著力則計算1.5N/14mm以下之參數,由以下的基準進行評估。
◎:0個
○:1~4個
△:5~10個
×:11個以上
(A-1)厚度188μm之單面易接著處理雙軸延伸聚乙烯對苯二甲酸酯系樹脂薄膜。
(B-1)由混合攪拌下述(b1)100質量份、下述(b2)17質量份、下述(b3)33質量份、及下述(b4)230質量份而得到之塗料。
(B-2)由混合攪拌下述(b1)100質量份、下述(b2)12質量份、下述(b3)33質量份、及下述(b4)230質量份而得到之塗料。
(b1)日本東洋紡股份有限公司之非結晶性的熱可塑性飽和共聚合聚酯系樹脂「Byron500(商品名)」,分子量23000,玻璃轉移溫度4℃。
(b2)日本TOSOH股份有限公司之聚異氰脲酸酯「CoronateHX(商品名)」。
(b3)日本大日精化工業股份有限公司之油墨「NB500 739藍(商品名)」。
(b4)甲苯。
(C-1)日本東亞合成股份有限公司之結晶性的熱可塑性飽和共聚合聚酯系樹脂「Aron Melt PES-111EE(商品名)」。
(D-1)厚度12μm之雙軸延伸聚丙烯系樹脂薄膜。
於上述(A-1)之易接着面上,使用滾輪塗料器,利用上述(B-1),乾燥後厚度則呈成為15μm地形成中介塗層的層。將上述(C-1),於下述(D-1)上,押出層疊而得到厚度15μm之薄膜狀熱熔接著劑。於在上述所得到之上述(A-1)與上述(B-1)之層積體的上述(B-1)側的面上,重疊在上述所得到之上述(C-1)與上述(D-1)之層積體的上述(C-1)側的面而熱層疊。將如此作為所得到之層積體作為縫隙為寬度25mm,而得到補強帶。進行上述試驗(I)~(HO)。將結果示於表1。
將上述(B)層之厚度,及上述(C)層之厚度,呈示於表1地進行變更以外,係完全與例1同樣地進行。將結果示於表1。
取代上述(B-1),而使用上述(B-2)以外係完全與例1同樣地進行。將結果示於表1。
本發明之補強帶係與導體之接著力為良好,在對於導體終端進行金鍍敷等之處理時,可抑止補強帶自導體剝離等之損壞。
Claims (11)
- 一種補強帶,係可撓性平面纜線之導體終端之補強用補強帶,其特徵為於絕緣薄膜(A)之單面上,依序具有:厚度5~50μm之中介塗層的層(B);及厚度10~30μm之熱熔接著劑的層(C)者。
- 如申請專利範圍第1項所記載之補強帶,其中,前述中介塗層的層(B)之厚度為10~50μm。
- 如申請專利範圍第1項所記載之補強帶,其中,前述中介塗層的層(B)之厚度為15~50μm。
- 如申請專利範圍第1項所記載之補強帶,其中,前述中介塗層的層(B)則由包含:(b1)熱可塑性飽和共聚合聚酯系樹脂100質量份;和(b2)於1分子中具有2以上之異氰酸酯基之化合物3~25質量份之塗料所成。
- 如申請專利範圍第4項所記載之補強帶,其中,於前述成分(b2)1分子中,具有2以上之異氰酸酯基之化合物之配合量為10~25質量份。
- 如申請專利範圍第4項所記載之補強帶,其中,於前述成分(b2)1分子中,具有2以上之異氰酸酯基之化合物之配合量為14~25質量份。
- 如申請專利範圍第4項所記載之補強帶,其中,前述成分(b1)熱可塑性飽和共聚合聚酯系樹脂為非結晶性者。
- 如申請專利範圍第1項所記載之補強帶,其中,軟化溫度則為95℃以上。
- 如申請專利範圍第1項至第8項之任一項所記載之補強帶,其中,前述熱熔接著劑則為熱可塑性飽和共聚合聚酯系之接著劑。
- 一種可撓性平面纜線,其特徵為使用如申請專利範圍第1項至第8項任一項所記載之補強帶,補強導體終端之可撓性平面纜線。
- 一種補強可撓性平面纜線之導體終端之方法,其特徵為使用如申請專利範圍第1項至第9項任一項所記載之補強帶。
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CN (1) | CN107960129B (zh) |
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CN109628012B (zh) * | 2018-12-19 | 2021-11-09 | 广东莱尔新材料科技股份有限公司 | 一种耐湿、耐高温、低介电常数的热熔胶膜及其制备方法 |
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- 2016-05-16 WO PCT/JP2016/064455 patent/WO2016186073A1/ja active Application Filing
- 2016-05-16 PL PL16796466T patent/PL3300085T3/pl unknown
- 2016-05-16 HU HUE16796466A patent/HUE054210T2/hu unknown
- 2016-05-16 CN CN201680027901.7A patent/CN107960129B/zh active Active
- 2016-05-16 EP EP16796466.7A patent/EP3300085B1/en active Active
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EP3300085B1 (en) | 2021-03-31 |
PL3300085T3 (pl) | 2021-10-04 |
TW201707011A (zh) | 2017-02-16 |
HUE054210T2 (hu) | 2021-08-30 |
WO2016186073A1 (ja) | 2016-11-24 |
JP6457078B2 (ja) | 2019-01-23 |
CN107960129A (zh) | 2018-04-24 |
JPWO2016186073A1 (ja) | 2018-03-15 |
KR20180008537A (ko) | 2018-01-24 |
CN107960129B (zh) | 2020-09-22 |
US20180147822A1 (en) | 2018-05-31 |
EP3300085A1 (en) | 2018-03-28 |
EP3300085A4 (en) | 2018-12-26 |
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