201243868 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種扁平電纜用被覆材料，更詳而言之 ，係關於即使未含有鹵素系難燃劑及銻系難燃助劑，難燃 性、耐熱性、耐久性、耐黏連性、加工適性亦優異之扁平 電纜用被覆材料。 【先前技術】 以往，於電腦、液晶顯示裝置、行動電話、印表機、 汽車、汽車導航、家電製品、影印機、其他電子機器，爲 了電子零件彼此等之電氣連接、或各種配線而使用扁平電 纜。扁平電纜，係遍布於電子機器之狹窄殼體內、並伴隨 電子零件的移動而滑動，並且，係使用於伴隨電子零件之 發熱的高溫環境下。因此，被覆有扁平電纜之扁平電纜用 被覆材料’係被要求對於滑動之柔軟性、對於高溫之耐熱 性、及難燃性。又，當於使用後之廢棄處理時，亦要求不 含有破壞環境之原兇的成分。 如此之扁平電纜用被覆材料，於日本特開平8-60108 號公報（專利文獻1)，提出一種聚醯亞胺薄膜與磷變性 飽和聚酯共聚物所構成之接著層所成之非鹵素系之難燃性 扁平電纜。又，於日本特開平9-221642號公報（專利文獻 2)或特開平9-279101號公報（專利文獻3)，提出一種含 有熱可塑性聚酯樹脂與磷系難燃劑之黏著層所致之非鹵素 • 之難燃性扁平電纜。再者，於日本特開2001-89736號公報 201243868 (專利文獻4) ’提出~種使用由聚酯系樹脂、聚磷酸系 難'燃劑與非聚磷酸系之含氮有機難燃劑所構成之非鹵素系 之難燃性熱接著劑的被覆材料。 專利文獻1:日本特開平8-60108號公報 專利文獻2:日本特開平9-22 1 642號公報 專利文獻3:日本特開平9 — 279 1 0 1號公報 專利文獻4:日本特開200 1 -89736號公報 【發明內容】 〔發明欲解決之課題〕 然而，上述扁平電纜，皆使用聚酯系薄膜或聚醯亞胺 系薄膜作爲薄膜狀基材，而聚酯系薄膜單獨使用則難燃性 不足，而聚醯亞胺系薄膜則有價格爲高價的問題。又，於 接著層（黏著層）中含有銻系之難燃劑之扁平電纜用被覆 材料，當使用扁平電纜用被覆材料之扁平電纜與電子機器 一同使用後廢棄後，會因某些原因使難燃劑逸漏於環境， 被人體吸收而有損害健康之虞，是其缺點。 近年來，爲了以地球層級保護環境，有限制使用有害 物質的傾向，而對使用於扁平電纜的材料，亦極力避免有 害物質的使用。例如，鹵素系難燃劑之十溴二苯醚（ DBDPO)，隨燃燒條件不同，亦有生成戴奧辛相關物質之 虞，而期盼其之限制使用。又，難燃助劑之三氧化銻，亦 指定爲對皮膚或黏膜具刺激性之有毒物質。 本發明人等，此次著眼於磷系難燃劑之膦酸金屬鹽之 -6- 201243868 ' 難燃性，發現藉由以指定比例含有聚酯系樹脂與膦酸金屬 鹽，則可於不使用鹵素系難燃劑及銻系難燃助劑之下，實 現難燃性、耐熱性、耐久性、耐黏連性、加工適性等優異 、且對自然環境亦佳之扁平電纜用被覆材料。本發明係基 於該發現而完成者。 因此，本發明之目的在於提供一種扁平電纜用被覆材 料，其不使用鹵素系難燃劑及銻系難燃助劑，而難燃性、 耐熱性、耐久性、耐黏連性、加工適性等優異、且對自然 環境亦佳。 〔解決課題之手段〕 本發明之扁平電纜用被覆材料，係薄膜狀基材、基礎 塗裝層及熱封層以該順序層合所成之扁平電纜用被覆材料 > 該熱封層，係由至少含有以難燃劑爲主成分之塡料成 分70〜30質量％、以聚酯系樹脂爲主成分之樹脂成分30〜 70質量％所成之樹脂組成物而成之被膜所構成， 作爲該難燃劑，相對於該樹脂組成物整體，含有5〜 40質量％之膦酸金屬鹽所構成之非鹵素系難燃劑。 又，於本發明之樣態中，該膦酸金屬鹽，以膦酸鋁鹽 爲佳。 又’於本發明之樣態中，該聚酯系樹脂，較佳爲含有 相對於樹脂成分之總質量爲80〜99質量％之玻璃轉移點爲 —20 °C〜30 °C之聚酯系樹脂組成物、與相對於樹脂成分之 201243868 總質量爲1〜20質量％之玻璃轉移點爲30°C〜120°C之聚酯 系樹脂組成物。 又，於本發明之樣態中，該聚酯系樹脂，較佳爲相對 於樹脂成分之總質量，含有未達5質量％之平均分子量2500 〜1 0000之聚酯系高分子可塑劑所成。 又，於本發明之樣態中，該聚酯系樹脂，較佳爲，相 對於樹脂成分之總質量，含有未達5質量％之具有選自異氰 酸酯基、封端異氰酸酯基及碳二醯亞胺基所構成群中之至 少1種以上之官能基的多官能性化合物所成。 又，於本發明之樣態中，該薄膜狀基材，較佳爲由聚 對苯二甲酸乙二酯膜、聚萘二甲酸乙二酯膜、聚對苯二甲 酸丁二酯膜、聚醯胺膜、聚苯硫膜、聚芳醯胺膜、及聚醯 亞胺膜所構成群中所選出。 又，於本發明之樣態中，該基礎塗裝層，較佳爲由含 有該多官能性化合物、聚酯系樹脂、與聚胺基甲酸酯樹脂 所成之基礎塗裝劑而成之被膜所構成。 又，本發明之另一樣態之扁平電纜，係以一對被覆材 料夾持將複數之導電體配置排列於同一平面內之導電體列 之扁平電纜，其特徵係： 該被覆材料，係如請求項第1至7項中任一項之扁平電 纜用被覆材料，而係以使該扁平電纜被覆材料之熱封層彼 此相對向的方式，將該導電體列以一對之該扁平電纜被覆 材料夾持。 201243868 〔發明的效果〕 藉由本發明，著眼於磷系難燃劑之膦酸金屬鹽之難燃 性，藉由以指定之比例含有聚酯系樹脂與膦酸金屬鹽，可 於不使用鹵素系難燃劑及銻系難燃助劑之下，實現難燃性 、耐熱性'耐久性、耐黏連性、加工適性等優異、且對自 然環境亦佳之扁平電纜用被覆材料。 【實施方式】 <扁平電纜用被覆材料> 以下，本發明之扁平電纜用被覆材料，係具有依序層 合薄膜狀基材、基礎塗裝層及熱封層之層構成。以下，參 照圖式詳細說明本發明之扁平電纜用被覆材料。 圖1，係顯示本發明之扁平電纜用被覆材料之一實施 形態之層構成之示意截面圖。本發明之扁平電纜用被覆材 料10，如圖1所示，係具備薄膜狀基材11、形成於薄膜狀 基材11上之基礎塗裝層12'與形成於該基礎塗裝層上之熱 封層1 3之構成。 薄膜狀基材11，只要爲機械強度優異、耐熱性、耐藥 品性、耐溶劑性、彎曲性、絕緣性等優異之薄膜狀之材料 即可，可無特殊限制地來使用，例如，可使用聚對苯二甲 酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯等聚 酯系薄膜、耐綸6、耐綸66、耐綸610等聚醯胺系薄膜、聚 醯亞胺、聚醯胺醯亞胺、聚醚醯亞胺等聚醯亞胺系薄膜、 氟系薄膜' 聚醚颯、聚醚酮、聚醚硫、聚芳基酸酯、聚酯 -9 - 201243868 醚、全芳香族聚醯胺、聚芳醯胺、聚丙烯膜、聚碳酸酯膜 等。通常較佳爲使用聚對苯二甲酸乙二酯、聚萘二甲酸乙 二酯等聚對苯二甲酸伸烷酯。 薄膜狀基材，可使用未拉伸薄膜或拉伸薄膜之任一者 ，而於提升扁平電纜用被覆材料之強度的目的下，以使用 拉伸薄膜爲佳。如此之拉伸薄膜，爲朝單軸方向或雙軸方 向拉伸之薄膜，特別以雙軸拉伸薄膜爲佳。 又，基材薄膜之表面，視需要亦可施以例如電暈處理 、電漿處理、臭氧處理、其他之前處理。基材薄膜之厚度 ，通常爲5μηι〜200μηι左右，而以ΙΟμηι〜ΙΟΟμηι爲佳。當 厚度未達5μιη時機械強度不足，且，形成後述之底塗層或 熱封層等之適性減低。另一方面，當厚度爲200μιη以上時 可撓性不足，且滑動性會惡化。本發明中，藉由使基材薄 膜之厚度爲上述範圍，可對扁平電纜用被覆材料賦予所必 須之強度，並且可賦予良好之可撓性。 形成於薄膜狀基材11上之基礎塗裝層12，係用以使後 述之熱封層13強固地接著於基材薄膜11，使其可承受使用 於電子機器時之滑動、抑制層間之剝離等、並提升絕緣性 、耐久性者。基礎塗裝層12，可藉由將後述之基礎塗裝劑 塗佈於薄膜狀基材11以形成被膜而設置。如此之基礎塗裝 劑’較佳可使用含有具有異氰酸酯基、封端異氰酸酯基、 碳二醯亞胺基等官能基的多官能性化合物（硬化劑）、聚 酯系樹脂、與聚胺基甲酸系樹脂者。聚酯系樹脂較佳爲使 用玻璃轉移點爲2〇。(：〜l2〇°C、較佳爲30°C〜l〇〇°C之聚酯 -10- 201243868 系樹脂。 玻璃轉移點爲20°C〜120°C、較佳爲30°C〜100°C之聚 酯系樹脂，例如，較佳可使用將對苯二甲酸等芳香族飽和 二羧酸之一種或複數種、與飽和2元醇之一種或複數種縮 聚合所生成之熱可塑性之聚酯系樹脂。又，聚胺基甲酸系 樹脂，例如，較佳可使用多官能異氰酸酯、與含羥基之化 合物之反應所生成之聚胺基甲酸系樹脂。 基礎塗裝劑所含之多官能性化合物（硬化劑），較佳 爲使用具有異氰酸酯基、封端異氰酸酯基、及/或碳二醯 亞胺基之化合物，可舉例如2,4_甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、二苯甲烷—4，4’ 一二異氰酸酯、二甲苯 二異氰酸酯、異佛嗣二異氰酸酯、聚亞甲基聚苯基二異氰 酸酯及六亞甲基二異氰酸酯等多官能異氰酸酯、該等異氰 酸酯之聚醇變性物、碳二醯亞胺變性物、將該等異氰酸醋 以醇、苯酚、內醯胺、胺等遮罩之封端型異氰酸酯等。 又，亦可倂用以聚乙烯亞胺系化合物、有機鈦系化合 物、異氰酸酯系化合物、胺基甲酸酯系化合物、聚丁二嫌 系化合物等爲主成分之基礎塗裝劑來使用。 基礎塗裝劑所含之聚酯系樹脂與聚胺基甲酸酯系樹脂 之摻合比，以質量基準計，聚酯系樹脂/聚胺基甲酸醋系 樹脂之比，以0.7/0.3〜0.3/0.7的程度爲佳。又，上述 多官能性化合物（硬化劑）之添加量，相對於聚酯系及聚 胺基甲酸酯系樹脂之反應基，較佳爲相當於1〜1〇倍之反 應基的量。塗布於薄膜狀基材之基礎塗裝劑，係以上述各 -11 - 201243868 成分含有2〜60質量％之固體含量的方式’以有機 來使用。 基礎塗裝層，可藉由將上述之基礎塗裝劑之 布於薄膜狀基材表面以形成被膜’且乾燥以除去稀 形成。塗布基礎塗裝劑之稀釋液之方法，可採用輥 輥塗、凹版印刷、反向式凹版印刷、棒塗、桿塗、 布、刮刀塗布（knife coating)、模口塗布、刮刀 (comma coating)、流塗、噴塗等方法。稀釋劑之 係藉由以3 0 °C〜7 0 °C之溫度進行劣化來進行。基礎 12之厚度，通常爲〇·〇5μπι〜ΙΟμπι左右、較佳爲0 5 μιπ左右。 熱封層13，係設置於上述基礎塗裝層12上者’ 富有柔軟性、且具有基礎塗裝層12與後述之導電體 封性》如此之熱封層13，當於一對扁平電纜用被覆 間夾持金屬等導電體21時，可將導電體21暫時固定 層1 3上，且，必須具有藉由加熱輥或加熱板等之加 而軟化熔融、使導電體21與熱封層互相強固地熱熔 導電體21之優異的密合性，同時，當扁平電纜用被 之熱封層13彼此熱熔接後，於熱封層中亦必須可不 隙地埋入導電體2 1。 本發明中，熱封層1 3，係由以難燃劑爲主成分 成分70〜3 0質量％、及以聚酯系樹脂成分爲主成分 成分30〜70質量％之比例含有之樹脂組成物所成之 構成。由難燃性的性能考量，塡料成分愈多愈佳， 劑稀釋 釋液塗 釋劑來 塗、反 輕觸塗 式塗布 除去， 塗裝層 .1 μ m 〜 其必須 21之熱 材料之 於熱封 熱加壓 接之與 覆材料 產生空 之塡料 之樹脂 被膜所 但若塡 -12- 201243868 料成分超過70質量％，則於加工形成爲熱封層之際無法成 膜，且無法得到所必須之接著性能。另一方面，若塡料成 分未達30質量％，則不僅難燃性不足，扁平電纜用被覆材 料之耐熱性亦不足。 本發明中，塡料成分中，係含有膦酸金屬鹽所構成之 非鹵素系難燃劑而成，膦酸金屬鹽所構成之非鹵素系難燃 劑，係相對於樹脂組成物整體含有5〜40質量％而成。由難 燃性的性能考量，難燃劑成分愈多愈佳，但難燃劑若多則 合成樹脂成分變少，於加工形成爲熱封層之際無法成膜， 且無法得到所必須之接著性能。又，若難燃劑成分過少， 則難燃效果小，於著火時會被燒盡。難燃劑的添加量以5 〜4 0質量％爲宜。 本發明中，膦酸金屬鹽所構成之非鹵素系難燃劑，較 佳可使用下述之化學結構者。 [化1] Ο201243868 6. TECHNOLOGICAL FIELD OF THE INVENTION The present invention relates to a covering material for a flat cable, and more particularly to a flame retardant even if it does not contain a halogen-based flame retardant and a lanthanum-based flame retardant. A coating material for flat cables excellent in properties, heat resistance, durability, blocking resistance, and processability. [Prior Art] In the past, computers, liquid crystal display devices, mobile phones, printers, automobiles, car navigation, home appliances, photocopiers, and other electronic devices have been used for electrical connection or various wiring for electronic components. cable. The flat cable is spread over a narrow casing of an electronic device and slides with the movement of electronic components, and is used in a high-temperature environment accompanied by heat generation of electronic components. Therefore, the covering material for a flat cable covered with a flat cable is required to have flexibility for sliding, heat resistance against high temperature, and flame retardancy. In addition, when it is disposed of after use, it is also required to contain no ingredients that damage the environment. In the above-mentioned Japanese Patent Application Laid-Open No. Hei 8-60108 (Patent Document 1), a non-halogen type formed by an adhesive layer composed of a polyimide film and a phosphorus-denatured saturated polyester copolymer is proposed. Flame retardant flat cable. In addition, an adhesive layer containing a thermoplastic polyester resin and a phosphorus-based flame retardant is proposed in Japanese Laid-Open Patent Publication No. Hei 9-221642 (Patent Document 2) or JP-A-9-279101 (Patent Document 3). Non-halogen • Flame retardant flat cable. In addition, Japanese Laid-Open Patent Publication No. 2001-89736, No. 201243868 (Patent Document 4) is proposed to use a polyester-based resin, a polyphosphoric acid-based flammable agent, and a non-polyphosphate-based nitrogen-containing organic flame retardant. A coating material of a non-halogen-based flame retardant thermal adhesive. Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. In the case of the flat cable, a polyester film or a polyimide film is used as the film substrate, and the polyester film is flame retardant when used alone. Insufficient sex, and polyimide film has the problem of high price. In addition, when a flat cable for a flat cable coated material is used together with an electronic device and discarded after being used as a coating material for a flat cable containing a lanthanide-based flame retardant in the adhesive layer (adhesive layer), it may be difficult for some reasons. The shortcomings of the fuel in the environment, absorbed by the body and harmful to health, are its shortcomings. In recent years, in order to protect the environment at the earth level, there is a tendency to restrict the use of harmful substances, and materials used for flat cables are also used to avoid the use of harmful substances. For example, the halogen-based flame retardant decabromodiphenyl ether (DBDPO), which has different enthalpy of dioxin-related substances depending on the combustion conditions, is expected to be used. Further, the trisulfuric acid, a flame retardant additive, is also designated as a toxic substance irritating to the skin or mucous membranes. The inventors of the present invention have focused on the flame retardancy of the phosphonic acid metal salt of phosphorus-based flame retardant -6-201243868, and found that it is possible to contain a polyester resin and a phosphonic acid metal salt in a specified ratio. A coating material for flat cables that is excellent in flame retardancy, heat resistance, durability, blocking resistance, and processability, and which is excellent in the natural environment, using a halogen-based flame retardant and a lanthanum-based flame retardant. The present invention has been completed based on this finding. Accordingly, an object of the present invention is to provide a coating material for a flat cable which does not use a halogen-based flame retardant and a lanthanum-based flame retardant, and which is resistant to flame retardancy, heat resistance, durability, blocking resistance, workability, and the like. Excellent and good for the natural environment. [Means for Solving the Problem] The coating material for a flat cable according to the present invention is a coating material for a flat cable formed by laminating a film-form substrate, a base coating layer, and a heat-sealing layer in this order. It is composed of a film composed of a resin composition containing at least 70% by mass of a binder component containing a flame retardant as a main component and 30 to 70% by mass of a resin component containing a polyester resin as a main component. The flame retardant contains a non-halogen flame retardant composed of a metal phosphonic acid salt of 5 to 40% by mass based on the entire resin composition. Further, in the aspect of the invention, the phosphonic acid metal salt is preferably an aluminum phosphonate salt. Further, in the aspect of the invention, the polyester resin preferably contains a polyester having a glass transition point of from -20 ° C to 30 ° C in an amount of from 80 to 99% by mass based on the total mass of the resin component. The resin composition and the polyester resin composition having a glass transition point of from 1 to 20% by mass based on the total mass of the resin component of 201243868 are from 30 ° C to 120 ° C. Further, in the aspect of the invention, the polyester resin preferably contains a polyester-based polymer plasticizer having an average molecular weight of 2,500 to 1,000,000, which is less than 5% by mass based on the total mass of the resin component. . Further, in the aspect of the invention, the polyester resin preferably contains not less than 5% by mass, based on the total mass of the resin component, and is selected from the group consisting of isocyanate groups, blocked isocyanate groups, and carbon dioxides. A polyfunctional compound having at least one functional group of at least one of the groups of the amine groups. Further, in the aspect of the invention, the film-form substrate is preferably a polyethylene terephthalate film, a polyethylene naphthalate film, a polybutylene terephthalate film, or a poly It is selected from the group consisting of a guanamine film, a polyphenylene sulfide film, a polyarylamine film, and a polyimide film. Further, in the aspect of the invention, the base coating layer is preferably a base coating agent comprising the polyfunctional compound, a polyester resin, and a polyurethane resin. The capsule is composed of a film. Further, a flat cable according to another aspect of the present invention is a flat cable in which a plurality of covering materials are arranged to arrange a plurality of conductors in a conductor row arranged in the same plane, and the coating material is as requested. The coating material for a flat cable according to any one of the items 1 to 7, wherein the heat conductor layer of the flat cable coating material is opposed to each other, and the conductor is a pair of the flat cable coating material. Clamping. 201243868 [Effects of the Invention] According to the present invention, attention is paid to the flame retardancy of the phosphonic acid metal salt of the phosphorus-based flame retardant, and the halogen-based system can be used without containing the polyester resin and the phosphonic acid metal salt in a predetermined ratio. A coating material for flat cables that is excellent in flame retardancy and heat resistance, durability, adhesion resistance, and processability, and which is excellent in the natural environment. [Embodiment] <Cladding material for flat cable> The coating material for a flat cable of the present invention has a layer structure in which a film-form substrate, a base coating layer and a heat seal layer are laminated in this order. Hereinafter, the covering material for a flat cable of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic cross-sectional view showing a layer constitution of an embodiment of a covering material for a flat cable of the present invention. As shown in FIG. 1, the covering material 10 for a flat cable of the present invention includes a film-form substrate 11 and a base coating layer 12' formed on the film-form substrate 11 and heat formed on the base coating layer. The composition of the sealing layer 13. The film-form substrate 11 may be any film-like material which is excellent in mechanical strength, heat resistance, chemical resistance, solvent resistance, flexibility, insulation, and the like, and can be used without particular limitation. For example, it can be used. A polyester film such as polyethylene terephthalate, polyethylene naphthalate or polybutylene terephthalate, a polyamide film such as nylon 6, nylon 66 or nylon 610, and a poly Polyimine film such as quinone imine, polyamidimide, polyether phthalimide, fluorine film 'polyether oxime, polyether ketone, polyether sulfur, polyarylate, polyester-9 - 201243868 Ether, wholly aromatic polyamine, polyarylamine, polypropylene film, polycarbonate film, etc. It is generally preferred to use a polyalkylene terephthalate such as polyethylene terephthalate or polyethylene naphthalate. As the film-form substrate, either an unstretched film or a stretched film can be used, and it is preferable to use a stretched film for the purpose of improving the strength of the coated material for a flat cable. Such a stretched film is a film which is stretched in a uniaxial direction or a biaxial direction, and is particularly preferably a biaxially stretched film. Further, the surface of the base film may be subjected to, for example, corona treatment, plasma treatment, ozone treatment, or other prior treatment. The thickness of the base film is usually about 5 μm to 200 μm, and ΙΟμηι to ΙΟΟμηι is preferred. When the thickness is less than 5 μm, the mechanical strength is insufficient, and the suitability for forming an undercoat layer or a heat seal layer to be described later is reduced. On the other hand, when the thickness is 200 μm or more, the flexibility is insufficient and the slidability is deteriorated. In the present invention, by setting the thickness of the base film to the above range, it is possible to impart a necessary strength to the covering material for a flat cable and to impart good flexibility. The base coating layer 12 formed on the film-form substrate 11 is used to strongly adhere the heat seal layer 13 to be described later to the base film 11, so that it can withstand sliding during use in an electronic device and suppress peeling between layers. And improve the insulation and durability. The base coating layer 12 can be provided by applying a base coating agent described later to the film-form substrate 11 to form a film. Such a base coating agent 'preferably, a polyfunctional compound (hardener) containing a functional group having an isocyanate group, a blocked isocyanate group, a carbodiimide group, a polyester resin, and a polyaminocarboxylic acid can be used. Resin. The polyester resin preferably has a glass transition point of 2 Å. (: ~l2 〇 ° C, preferably 30 ° C ~ l 〇〇 ° C of polyester -10- 201243868 resin. Glass transfer point is 20 ° C ~ 120 ° C, preferably 30 ° C ~ 100 For the polyester resin of °C, for example, one or a plurality of aromatic saturated dicarboxylic acids such as terephthalic acid, and one or a plurality of saturated two-alcohols, which are formed by polycondensation polymerization, are preferably used. Further, as the polyester resin, for example, a polyfunctional isocyanate or a polyaminocarboxylic acid resin produced by a reaction with a hydroxyl group-containing compound can be preferably used. The polyfunctional compound contained in the base coating agent a compound (hardener), preferably a compound having an isocyanate group, a blocked isocyanate group, and/or a carbodiimide group, and examples thereof include 2,4-toluene diisocyanate and 2,6-toluene diisocyanate. Polyfunctional isocyanate such as diphenylmethane-4,4'-diisocyanate, xylene diisocyanate, isophora diisocyanate, polymethylene polyphenyl diisocyanate and hexamethylene diisocyanate, and the aggregation of such isocyanates Alcohol denatured substance, carbodiimide denature The blocked isocyanate in which the isocyanic acid vinegar is covered with an alcohol, a phenol, an indoleamine, an amine, or the like. Further, a polyethyleneimine compound, an organic titanium compound, an isocyanate compound, or the like may be used. A base coating agent containing a urethane-based compound or a polybutylene-based compound as a main component. The blend ratio of the polyester-based resin and the polyurethane-based resin contained in the base coating agent The ratio of the polyester resin/polyurethane vinegar resin is preferably from 0.7/0.3 to 0.3/0.7, based on the mass, and the addition amount of the above polyfunctional compound (hardener) is relatively The reaction group of the polyester-based and the polyurethane-based resin is preferably an amount corresponding to 1 to 1 times the number of the reactive groups. The base coating agent applied to the film-form substrate is the above- 11 - 201243868 The composition contains a solid content of 2 to 60% by mass in the form of 'organic use. The base coating layer can be formed by coating the above-mentioned base coating agent on the surface of the film-like substrate to form a film' and drying. To remove the thinning formation. Diluting the base coating agent The method can be applied by roll coating, gravure printing, reverse gravure printing, bar coating, rod coating, cloth, knife coating, die coating, comma coating, flow coating, spraying, etc. The agent is formed by degrading at a temperature of from 30 ° C to 70 ° C. The thickness of the base 12 is usually about μ·〇5 μπι to ΙΟμπι, preferably about 0.5 μππ. The heat seal layer 13, A heat seal layer 13 which is provided on the base coat layer 12 and which has a softness and a base coat layer 12 and a conductor sealability described later, and holds the metal between the pair of flat cable covers. When the conductor 21 is equal to the conductor 21, the conductor 21 can be temporarily fixed to the layer 13 and must be softened and melted by the addition of a heating roller or a heating plate or the like, and the conductor 21 and the heat seal layer are strongly fused to each other. The excellent adhesion of 21, and at the same time, after the flat cable is thermally welded to each other by the heat seal layer 13, the conductor 21 must be buried in the heat seal layer without gaps. In the present invention, the heat seal layer 13 is a resin composition containing 70% to 30% by mass of the flame retardant as a main component and 30 to 70% by mass of the polyester resin component as a main component. The composition of the formation. From the performance of flame retardant properties, the more the ingredients are better, the agent diluted solution release agent is applied, and the anti-light touch coating is applied to remove the coating layer. 1 μ m ~ it must be 21 thermal material The heat-sealed heat-pressing material and the coating material produce an empty resin film. However, if the material content exceeds 70% by mass, the film cannot be formed when the film is formed into a heat-sealing layer, and the film cannot be obtained. The necessary performance. On the other hand, if the content of the coating is less than 30% by mass, not only the flame retardancy is insufficient, but also the heat resistance of the coated material for a flat cable is insufficient. In the present invention, the non-halogen-based flame retardant composed of a metal phosphonium salt is contained in the dip component, and the non-halogen flame retardant composed of the phosphonic acid metal salt is contained in the entire resin composition. ~40% by mass. From the viewpoint of the flame retardancy, the more the flame retardant component, the better, but if the flame retardant is too large, the synthetic resin component is reduced, and the film cannot be formed when the heat seal layer is formed, and the necessary film cannot be obtained. performance. Moreover, if the amount of the flame retardant component is too small, the flame retarding effect is small, and it is burned out when it is on fire. The amount of the flame retardant added is preferably from 5 to 40% by mass. In the present invention, as the non-halogen-based flame retardant composed of the phosphonic acid metal salt, the following chemical structure can be preferably used. [Chemical 1] Ο
匕 J m (式中，Ri及r2，分別獨立地表示線狀或分支狀之C1 〜C6之烷基或苯基，Μ表示鈣、鋁、或鋅離子，m表示2或 3 ° ) 上述之難燃劑，可使用日本專利第3044209號公報所 -13- 201243868 記載之膦酸金屬鹽，於鋁鹽、鈣鹽、及鋅鹽之中’ 性的觀點考量’以鋁鹽最佳。 又，本發明中，發現藉由組合上述之難燃劑、 要之難燃助劑’可更達到效果。難燃助劑’可使用 屬化合物，可單獨使用、亦可組合兩種以上使用。 劑之摻合量若少，則無法得到難燃性之提升效果， 則熱封層1 3之形成加工性降低。因此，以適當、適 式決定熱封層13所使用之難燃助劑的種類及組合、 合比係極爲重要。 作爲難燃助劑所使用之水合金屬化合物，可舉 氧化鋁、氫氧化鎂、氫氧化銷、氫氧化鈣、氫氧化 氧化鋅等，而以難燃性優異、成本上亦有利之氫氧 氫氧化鎂爲佳。又，水合金屬化合物，可單獨使用 組合複數種使用。 熱封層之樹脂成分，由與導電體21之熱封性、 難燃劑的容易度考量，係含有聚酯系樹脂作爲主成 酯系樹脂，較佳之構成爲以玻璃轉移點爲較低之-30 °C之富有柔軟性之聚酯樹脂爲主成分，並摻合玻 點爲較高之30t〜120 °C之富有耐熱性之聚酯樹脂 倂用如此之兩種聚酯樹脂，可得柔軟且耐熱性優異 電纜用被覆材料。如此兩種聚酯樹脂之摻合比例， ，含有相對於樹脂成分之總質量爲80〜99質量。/。之 移點爲一2 0 °C〜3 0 °C之聚酯系樹脂組成物、與相對 成分之總質量爲1〜20質量％之玻璃轉移點爲30 °C -匕J m (wherein Ri and r2 each independently represent a linear or branched C1 to C6 alkyl group or a phenyl group, Μ represents a calcium, aluminum, or zinc ion, and m represents 2 or 3 °) As the flame retardant, the metal phosphonic acid salt described in Japanese Patent No. 3044209-2013-201243868 can be used as the aluminum salt, the calcium salt, and the zinc salt. Further, in the present invention, it has been found that the effect can be further attained by combining the above-mentioned flame retardant and the flame retardant auxiliary. The flame retardant auxiliary can be used alone or in combination of two or more. If the blending amount of the agent is small, the effect of improving the flame retardancy cannot be obtained, and the formability of the heat seal layer 13 is lowered. Therefore, it is extremely important to appropriately and appropriately determine the type, combination, and ratio of the flame retardant auxiliary used in the heat seal layer 13. Examples of the hydrated metal compound used as the flame retardant auxiliary agent include aluminum hydroxide, magnesium hydroxide, hydroxide pin, calcium hydroxide, and zinc hydroxide hydroxide, and hydrogen hydroxide having excellent flame retardancy and cost is also advantageous. Magnesium oxide is preferred. Further, the hydrated metal compound can be used alone or in combination of plural kinds. The resin component of the heat seal layer contains a polyester resin as a main ester-forming resin in consideration of heat sealability with the conductor 21 and ease of flame retardant, and is preferably configured such that the glass transition point is lower. -30 °C soft polyester resin as the main component, and blended with high-temperature 30t~120 °C heat-resistant polyester resin, using these two polyester resins, can be obtained A coating material for cables that is excellent in softness and heat resistance. The blending ratio of the two polyester resins is 80 to 99 by mass based on the total mass of the resin component. /. The polyester resin composition having a shift point of from 20 ° C to 30 ° C and a glass transition point of from 1 to 20% by mass based on the total mass of the relative components is 30 ° C -
由難燃 與視需 水合金 難燃助 若過多 性的方 及其摻 例如氫 欽、氣 化鋁、 、亦可 及混合 分。聚 2 0。。〜 璃轉移 。藉由 之扁平 較佳爲 玻璃轉 於樹脂 ^ 120°C -14- 201243868 之聚酯系樹脂組成物而成。又，亦可適當地摻合使用非晶 性之聚酯系樹脂與結晶性聚酯系樹脂。 本發明中，熱封層之樹脂成分，除上述之聚酯系樹脂 以外亦可含有其他樹脂，例如，亦可含有離子聚合物樹脂 、酸變性聚烯烴系樹脂、乙烯-（甲基）丙烯酸共聚物、 乙烯一（甲基）丙烯酸酯共聚物、聚醯胺系樹脂、聚胺基 甲酸酯系樹脂、（甲基）丙烯酸系樹脂、聚乙烯醚樹脂、 聚矽氧樹脂、橡膠系樹脂等。 又’本發明中，較佳爲，相對於樹脂成分之總質量含 有未達5質量％之平均分子量2500〜10000之聚酯系高分子 可塑劑。藉由含有該可塑劑，可提升熱封層對導電體之密 接著性或導電體對熱封層中之埋入性等。當含5質量％以上 之可塑劑時，可塑劑之一部分會析出（bleed out)至熱封 層之表面等，而可能成爲密封不良的產生原因。 上述之聚酯系高分子可塑劑，可舉例如，己二酸、壬 二酸、癸二酸、鄰苯二甲酸等二羧酸類；與乙二醇、二乙 二醇、丙二醇、二丙二醇、1，3 — 丁二醇、新戊二醇、甘 油、及其他二元或三元醇類：與一元酸等之組合所構成之 於常溫下爲液體之聚酯系可塑劑，更佳可使用平均分子量 爲2500〜1 00 00左右者。平均分子量未達2500之聚酯系樹 脂，雖可維持密接著性等，但於可塑性之移行性及萃取性 等可能會有問題，且，於扁平電纜之耐久安定性（經時變 化）亦可能會有問題。另一方面，平均分子量超過1 0000 之聚酯系樹脂，會失去作爲可塑劑原本之功能。 -15- 201243868 又，本發明中，於熱封層中，亦可添加上述之由多官 能性化合物所構成之硬化劑。藉由添加硬化劑，可作成接 著性及密合性更優異、且機械強度優異之扁平電纜用被覆 材料。如此之硬化劑，較佳爲，相對於樹脂組成物添加未 達5質量％。 於不影響本發明效果的範圍內，亦可再適當地添加各 種添加劑於熱封層，例如，抗氧化劑、抗金屬腐蝕劑、著 色劑（顏料、染料）、抗黏連劑、提升樹脂與難燃劑之間 之凝集力的各種耦合劑、交聯劑、交聯助劑、塡充劑、抗 靜電劑、難燃觸媒。例如，可使用碳酸鈣、硫酸鋇、碳酸 鎂、氧化鋁、氧化鈦、氧化鋅等體質顏料或白色顏料、其 他無機化合物之粉末、玻璃熔塊、氟系樹脂粉末、聚烯烴 系樹脂粉末、其他等。氧化鈦或氧化鋅等，與碳酸鎂、氧 化鋁等相比，由於其之粒徑小，故於將扁平電纜用被覆材 料作爲滾筒狀之製品形態下，亦具有作爲於庫存中之抗黏 連劑之功能的優點。上述之無機系塡料之粒子的大小，一 次粒子爲約Ο.ΟΙμ〜15μ左右。 熱封層，可藉由使將含有上述各成分之樹脂組成物塗 布於基礎塗裝層上之被膜乾燥而形成。如此之樹脂組成物 ，較佳可使用將上述各成分、與甲苯、乙酸乙酯、醇類、 甲乙酮等溶劑、稀釋劑等混練而可溶化或分散化者。樹脂 組成物之塗布，例如可採用輥塗、反輥塗、凹版印刷、反 向式凹版印刷、棒塗、桿塗、輕觸塗布、刮刀塗布、模口 塗布、刮刀式塗布、流塗、噴塗等塗敷方式。 -16- 201243868 熱封層，可藉由將塗布上述樹脂組成物後、乾燥作成 被膜來形成。熱封層13之厚度，爲15〜150μιη (乾燥時） 左右》 <扁平電纜> 圖2係顯示本發明之扁平電纜之一例之構成之示意槪 略圖。圖3係圖2之ΑΑ截面圖。本發明之扁平電纜1’係將 複數之導電體21配置排列於同一平面內之導電體列，以一 對之扁平電纜用被覆材料10夾持而由兩面予以被覆者。本 發明中，扁平電纜用被覆材料10，可使用上述之扁平電纜 用被覆材料。 具有上述構造之扁平電纜，可藉由下述方式製造：準 備一對之扁平電纜用被覆材料10，於其中一個被覆材料之 熱封層上，暫時固定將複數之導電體配置排列於同一平面 內之導電體列，以使暫時固定有前述導電體列之熱封層與 另一熱封層相對向的方式，將被覆材料彼此疊合形成層合 體，且加熱上述層合體。藉由該加熱，熱封層會熱溶接， 導電體列會埋入熱封層中一體化而製成扁平電纜。 於將熱封層熱熔接之際，可在加熱的同時亦進行加壓 。又，加熱溫度爲100〜300 °c左右、較佳爲150〜250。(：。 加熱時間爲1〜240分鐘、較佳爲10〜60分鐘。加熱步驟亦 可將被覆材料彼此疊合作成層合體者暫時捲繞成滾筒狀後 ’以滾筒狀的形態加熱，又，亦可將長條狀之層合體切割 爲期望之長度而以片狀之形態加熱。 -17- 201243868 實施例 以下，說明本發明之實施例，但本發明並不限於該等 實施例。 實施例1 <基礎塗裝劑之調製> 將玻璃轉移點4(TC之聚酯樹脂與多元醇系聚胺基甲酸 酯樹脂（固體含量質量比1: 1、羥基價=10mgKOH/g) 溶解於甲乙酮一甲苯=1/1所構成之混合溶劑中調製爲A 液’將甲苯二異氰酸酯與六亞甲基二異氰酸酯溶解於溶解 於甲乙酮一甲苯=1/1所構成之混合溶劑中調製爲B液。 接著’將上述所調製之A液與B液於塗布於薄膜狀基材之前 混合’而調製成基礎塗裝劑（OH基/ NCO基=1/3)。 <熱封層形成用樹脂組成物之調製> 作爲樹脂成分，使用玻璃轉移點5 t之聚酯樹脂40質 量％與玻璃轉移點70 °C之聚酯樹脂4.5質量％，又，作爲難 燃劑成分，使用微粒化後之平均粒徑爲2〜3 μπ1之膦酸鋁粉 末1 5質量％與其他塡料成分（氫氧化鋁、氧化鈦與氧化矽 )40質量％ ’再者，使用異氰酸酯系加成物體〇5質量％作 爲多官能性化合物（硬化劑），將該等溶解分散於甲乙酮 一甲苯=1/1所構成之混合溶劑中，調製成形成熱封層用 樹脂組成物。 -18- 201243868 <扁平電纜用被覆材料之製作〉 作爲薄膜狀基材，係使用厚度25 μηι之雙軸拉伸聚對苯 二甲酸乙二酯膜，首先，於該雙軸拉伸聚對苯二甲酸乙二 酯膜之表面，將上述所得之基礎塗裝劑以凹版輥塗方式， 以使膜厚爲〇.5g/ m2 (乾燥狀態）之方式塗布，接著，乾 燥以形成基礎塗裝層。接著，於所形成之基礎塗裝層上， 將上述所得之熱封層形成用樹脂組成物以模口塗布器，以 使膜厚爲30.0g/ m2 (乾燥狀態）之方式塗布，接著，乾 燥以形成熱封層，而製作成本發明之扁平電纜用被覆材料 <扁平電纜之製造> 使用如上述所製得之扁平電纜用被覆材料，首先，將 寬度60cm、長度1 00cm的2片扁平電纜用被覆材料，以使 其之熱封層之面相對向的方式疊合，接著，於其層間，胃 間隔地夾入複數條之寬x厚爲〇_8mm><5〇pm之導電體，而製 成作爲導電體列的層合體。將該層合體，以3m/min2速 度通過加熱至1 50 °C之金屬輥與橡膠輥之間，藉由加熱加 壓使熱封層熱熔接，製造成扁平電纜。 實施例2〜8、及比較例1 4 關於形成熱封層用樹脂組成物，除了以表所示之數^ 所成之使用量（質量％ )來使用下述表1及表2所示材料以 19- 201243868 外，係與實施例1相同的方式製作扁平電纜用被覆材料， 與實施例1问樣地製造扁平電纜。又，欲使用比較例3之熱 封層形成用樹脂組成物製作扁平電纜用被覆材料時，難以 進行熱封層之成膜。 [表1] 表1實施例1〜8之熱封層形成用樹脂組成物之摻合 實施例 1 實施例 2 實施例 3 實施例 4 實施例 5 實施例 6 實施例 7 實施例 8 Tg=5°C 之 PES 35.0 40.0 36.0 35.5 39.0 27.0 31.0 36.0 Tg=70°C 之 PES 4.0 4.5 4.0 4.0 0·0 12.0 3.5 4.0 高肝可塑劑 1.0 0.0 0.0 1.0 1.0 1.0 5.0 0.0 膦酸鋁 15.0 15.0 15.0 15.0 15.0 15.0 15.0 15.0 其他_ 44.5 40.0 44.5 44.5 44.5 44.5 45.0 40.0 硬化劑 0.5 0.5 0.5 0.0 0.5 0.5 0.5 5.0 [表2] 表2比較例1〜4之熱封層形成用樹脂組成物之摻合 比較例 1 比較例 2 比較例 3 比較例 4 Tgp50C 之 PES 36.0 35.0 25.1 62.0 Tg=70oC 之 PES 4.0 4.0 Z9 7.0 高肝可塑劑 0.0 1.0 1.0 1.0 膦酸鋁 4.5 45.0 15.0 15.0 其他塡料 55.0 14.5 55.5 14.5 硬化劑 0.5 0.5 0.5 0.5 上述之表1及表2中，Tg係表示玻璃轉移點之意，PES 爲聚酯樹脂之意。高分子可塑劑係使用聚酯系可塑劑，其 他塡料係表示氫氧化鋁、氧化鈦、氧化矽之合計，多官能 性化合物（硬化劑）係使用異氰酸酯系加成體。 對於上述之實施例1〜8、及比較例1〜4之扁平電纜用 被覆材料及扁平電纜，針對下述所示之項目進行試驗、評 價。又，比較例3之扁平電纜用被覆材料，如上述由於難 -20- 201243868 以進行熱封層之成膜，故無法進行下述之各評價。 (1 )難燃性 以UL規格VW — 1燃燒試驗評價扁平電纜1之難燃性。 合格時以「◎」表示 '不合格時以「X」表示。 (2 )導電體密封性 將扁平電纜用被覆材料10之熱封層〗3之面、與厚度 ΙΟΟμιη之銅箔以熱封劑接著後（溫度、壓力3kg/cm2 、時間3秒鐘）’以拉伸試驗機測定剝離強度（N /寬度 10mm ) 。：5N以上且材料破裂評價爲「◎」，5N以上且熱 封層13凝集剝離評價爲「〇」，5N以下評價爲「X」。 (3)耐熱性 放置於136°C之烘箱168hr，測定耐熱試驗前後之拉伸 斷裂拉伸度。與耐熱試驗前相比保持90%以上之拉伸斷裂 拉伸度時評價爲「©j ，保持80 %以上之拉伸斷裂拉伸度 時評價爲「〇」，拉伸斷裂強度伸度降低至80%以下時評 價爲「X」。 (4 )傳導體埋入性 對扁平電纜1，以切割器與寬度方向平行地切割，以 光學顯微鏡觀察其之切面，調査導體周圍是否有氣泡等的 存在、是否有導體埋入不充分的地方來進行評價。將完全 埋入之狀態評價爲「◎」，導體周圍未埋入之部分未達 50μιη之等級評價爲「〇」，導體周圍存在有5〇μπι以上之 未埋入部分的狀態評價爲「X」。 評價結果，係如下述之表3及表4所示。 -21 - 201243868 [表3] 表3實施例1〜8之評價結果 實施例 1 實施例 2 實施例 3 實施例 4 實施例 5 實施例 6 實施例 7 實施例 8 _燃怖ΟΛΗ) ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 導電體密封性 ◎ ◎ 〇 ◎ @ ◎ 〇 ◎ 耐熱性 ◎ ◎ ◎ 0 〇 ◎ ◎ ◎ 導體埋入性 ◎ ◎ ◎ ◎ ◎ 〇 ◎ 0 [表4] 表4比較例1〜4之評價結果 比較例 1 比較例 2 比較例 3 比較例 4 —難燃性（WH) X ◎ 一 X 導電體密封性 ◎ X 一 ◎ 耐熱性 ◎ ◎ 一 X 導體埋入性 ◎ ◎ 一 ◎ 由上述表3亦可明白’實施例1於所有項目皆良好。實 施例2，雖未添加高分子可塑劑’但藉由增加聚醋樹脂的 量而所有項目皆良好。實施例3 ’與實施例2同樣地未添加 可塑劑、亦未增加聚酯樹脂之量的結果’密封強度雖顯示 爲5N以上，但熱封層1 3凝集剝離。實施例4 ’未添加多官 能性化合物（硬化劑）的結果’耐熱性有若干降低。又’ 實施例5，未添加T g高之聚酯樹脂’與實施例1相比耐熱性 差。實施例6，T g高之聚酯樹脂加入過多’與實施例1相比 膜變得過碛而導電體之埋入性不足。又’實施例7’與實 施例1相比可塑劑之添加量過多’故可塑劑的一部分析出 (bleed out )至表面，密封性不足。實施例8，與實施例1 相比，由於硬化劑之添加量過多故膜變硬’導電體之埋入 性不足。 -22- 201243868 之添加 入過多 料成分 ，故成 未達30 另一方面，比較例1，如上述表4所示，難燃劑 量減少過多’難燃性不合格。比較例2，難燃劑加 而引起密封阻害，密封強度不合格。比較例3，塡 之膦酸鋁與其他塡料成分之合計含量超過70質量。/。 膜困難。又，比較例4，由於塡料成分之合計含量 質量％，故不僅難燃性不足，耐熱性亦不足。 【圖式簡單說明】 一實施 料之扁 圖1 ’係顯示本發明之扁平電纜用被覆材料之 形態之層構成之模式截面圖。 圖2’係顯示使用本發明之扁平電纜用被覆材 平電纜之一實施形態之構成之模式示意圖。 圖3 ’係圖2之AA截面圖。 【主要元件符號說明】 I :扁平電纜 10:扁平電纜用被覆材料 II :薄膜狀基材 12 :基礎塗裝層 1 3 :熱封層 21 :導電體 -23-The flame retardant and on-demand water-based alloys are difficult to fuel. If they are excessive, they can be blended with, for example, hydrogen, vaporized aluminum, and mixed components. Poly 2 0. . ~ Glass transfer. The flat resin is preferably a glass-based resin composition having a resin of 120 ° C -14 to 201243868. Further, an amorphous polyester resin and a crystalline polyester resin may be blended as appropriate. In the present invention, the resin component of the heat seal layer may contain other resins in addition to the above-mentioned polyester resin, and may contain, for example, an ionic polymer resin, an acid-denatured polyolefin resin, or an ethylene-(meth)acrylic acid copolymer. , ethylene-(meth)acrylate copolymer, polyamine-based resin, polyurethane resin, (meth)acrylic resin, polyvinyl ether resin, polyoxyn resin, rubber resin, etc. . In the present invention, it is preferred to contain a polyester-based polymer plasticizer having an average molecular weight of 2,500 to 10,000, which is less than 5% by mass, based on the total mass of the resin component. By containing the plasticizer, the adhesion of the heat seal layer to the conductor or the embedding property of the conductor to the heat seal layer can be improved. When the plasticizer is contained in an amount of 5% by mass or more, a part of the plasticizer may be bleed out to the surface of the heat seal layer or the like, which may cause a poor sealing. Examples of the polyester-based polymer plasticizer described above include dicarboxylic acids such as adipic acid, sebacic acid, sebacic acid, and phthalic acid; and ethylene glycol, diethylene glycol, propylene glycol, and dipropylene glycol; 1,3 - Butanediol, neopentyl glycol, glycerin, and other binary or trihydric alcohols: a polyester-based plasticizer which is a liquid at room temperature in combination with a monobasic acid or the like, preferably used The average molecular weight is about 2500~1 00 00. A polyester-based resin having an average molecular weight of less than 2,500 may maintain adhesion, etc., but may have problems in plasticity, extractability, and the like, and may have durability (change over time) in a flat cable. There will be problems. On the other hand, a polyester resin having an average molecular weight of more than 1,000,000 loses its original function as a plasticizer. Further, in the present invention, in the heat seal layer, the above-mentioned hardener composed of a multi-functional compound may be added. By adding a curing agent, it is possible to provide a coating material for a flat cable which is excellent in adhesion and adhesion and excellent in mechanical strength. Such a hardener is preferably added in an amount of less than 5% by mass based on the resin composition. Within the scope that does not affect the effects of the present invention, various additives may be appropriately added to the heat seal layer, for example, an antioxidant, a metal corrosion inhibitor, a colorant (pigment, dye), an anti-blocking agent, a lift resin, and a flame retardant. Various coupling agents, crosslinking agents, crosslinking assistants, chelating agents, antistatic agents, and flame retardant catalysts for the cohesive force between the agents. For example, an extender pigment such as calcium carbonate, barium sulfate, magnesium carbonate, aluminum oxide, titanium oxide or zinc oxide, a white pigment, a powder of another inorganic compound, a glass frit, a fluorine resin powder, a polyolefin resin powder, or the like can be used. Wait. Titanium oxide, zinc oxide, etc., compared with magnesium carbonate, aluminum oxide, etc., because of the small particle size, the flat cable coated material is also used as a roll-shaped product, and also has anti-adhesion as an inventory. The advantages of the function of the agent. The size of the particles of the above inorganic mash is about ΟΙμ~15μ. The heat seal layer can be formed by drying a film obtained by coating a resin composition containing the above components on the base coat layer. As such a resin composition, it is preferred to use a mixture of the above components, a solvent such as toluene, ethyl acetate, an alcohol or methyl ethyl ketone, a diluent, or the like to be melted or dispersed. The coating of the resin composition can be, for example, roll coating, reverse roll coating, gravure printing, reverse gravure printing, bar coating, rod coating, light touch coating, blade coating, die coating, blade coating, flow coating, spray coating. And other coating methods. -16- 201243868 The heat seal layer can be formed by applying the above resin composition and drying it to form a film. The thickness of the heat seal layer 13 is 15 to 150 μm (at the time of drying) <flat cable> Fig. 2 is a schematic view showing the configuration of an example of the flat cable of the present invention. Figure 3 is a cross-sectional view taken along line 2 of Figure 2. In the flat cable 1' of the present invention, a plurality of conductors 21 are arranged in a row of conductors arranged in the same plane, and are sandwiched by a pair of flat cable covering materials 10 and covered by both sides. In the present invention, as the covering material 10 for a flat cable, the above-mentioned covering material for a flat cable can be used. The flat cable having the above structure can be manufactured by preparing a pair of flat cable covering materials 10, and temporarily fixing the plurality of conductors in the same plane on the heat seal layer of one of the covering materials. The conductor row is formed such that the heat seal layer temporarily fixing the conductor row and the other heat seal layer face each other to form a laminate, and the laminate is heated. By this heating, the heat seal layer is thermally melted, and the conductor row is buried in the heat seal layer to be integrated to form a flat cable. When the heat seal layer is thermally welded, it can be pressurized while being heated. Further, the heating temperature is about 100 to 300 ° C, preferably 150 to 250. (: The heating time is 1 to 240 minutes, preferably 10 to 60 minutes. In the heating step, the coating materials may be stacked on each other to form a laminate, and then temporarily wound into a roll shape, and then heated in a roll form, and also The long laminated body can be cut into a desired length and heated in a sheet form. -17- 201243868 EXAMPLES Hereinafter, examples of the present invention will be described, but the present invention is not limited to the examples. <Preparation of base coating agent> A glass transition point 4 (a polyester resin of TC and a polyol-based polyurethane resin (solid content mass ratio: 1:1, hydroxyl value = 10 mgKOH/g) was dissolved in A mixed solvent composed of methyl ethyl ketone-toluene = 1/1 is prepared as a liquid A. Toluene diisocyanate and hexamethylene diisocyanate are dissolved in a mixed solvent composed of methyl ethyl ketone-toluene = 1/1 to prepare a liquid B. Then, 'the above-prepared A liquid and B liquid are mixed before being applied to the film-form substrate' to prepare a base coating agent (OH group / NCO group = 1/3). <Heat seal layer forming resin Modulation of composition > As a resin component, use glass transfer 40% by mass of the polyester resin and 4.5% by mass of the polyester resin having a glass transition point of 70 ° C. Further, as the flame retardant component, an aluminum phosphonate having an average particle diameter of 2 to 3 μπ 1 after the atomization is used. 15% by mass of the powder and 40% by mass of other dip components (aluminum hydroxide, titanium oxide and cerium oxide). Further, 5% by mass of the isocyanate-based addition object is used as a polyfunctional compound (curing agent). The resin composition for forming a heat seal layer is prepared by dissolving and dissolving in a mixed solvent of methyl ethyl ketone-toluene = 1/1. -18- 201243868 <Production of coating material for flat cable> As a film-form substrate Using a biaxially stretched polyethylene terephthalate film having a thickness of 25 μm, first, on the surface of the biaxially stretched polyethylene terephthalate film, the base coating agent obtained above is a gravure roll The coating method is applied in such a manner that the film thickness is 〇5g/m2 (dry state), and then dried to form a base coating layer. Then, the heat sealing layer obtained above is formed on the formed base coating layer. Forming resin composition coated with a die It is applied so as to have a film thickness of 30.0 g/m 2 (dry state), followed by drying to form a heat seal layer, and a cover material for a flat cable according to the invention is produced. <Production of a flat cable> Using the above-described method In the coated material for a flat cable, first, a cover material of two flat cables having a width of 60 cm and a length of 100 cm is superimposed so that the faces of the heat seal layer face each other, and then, between the layers, the stomach is spaced. A plurality of conductors having a width x thickness of 〇8 mm><5 pm are sandwiched between the plurality of strips to form a laminate as a conductor row. The laminate is heated to 1 50 ° at a speed of 3 m/min2. The heat seal layer is thermally welded between the metal roll of C and the rubber roll by heat and pressure to produce a flat cable. Examples 2 to 8 and Comparative Example 1 4 For the resin composition for forming a heat seal layer, the materials shown in Tables 1 and 2 below were used in addition to the amount (% by mass) used in the table. A coating material for a flat cable was produced in the same manner as in Example 1 except for 19 to 201243868, and a flat cable was produced in the same manner as in Example 1. Further, when a coating material for a flat cable is produced by using the resin composition for forming a heat seal layer of Comparative Example 3, it is difficult to form a film of the heat seal layer. [Table 1] Table 1 Examples of the resin composition for heat seal layer formation of Examples 1 to 8 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Tg=5 °C PES 35.0 40.0 36.0 35.5 39.0 27.0 31.0 36.0 Tg=70°C PES 4.0 4.5 4.0 4.0 0·0 12.0 3.5 4.0 High Liver Plasticizer 1.0 0.0 0.0 1.0 1.0 1.0 5.0 5.0 Aluminium Phosphate 15.0 15.0 15.0 15.0 15.0 15.0 15.0 15.0 Others _ 44.5 40.0 44.5 44.5 44.5 44.5 45.0 40.0 Hardener 0.5 0.5 0.5 0.0 0.5 0.5 0.5 5.0 [Table 2] Table 2 Comparison of the resin compositions for forming a heat seal layer of Comparative Examples 1 to 4 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 PES of Tgp50C 36.0 35.0 25.1 62.0 Tg=70oC of PES 4.0 4.0 Z9 7.0 High Liver Plasticizer 0.0 1.0 1.0 1.0 Aluminum Phosphate 4.5 45.0 15.0 15.0 Other Dip 55.0 14.5 55.5 14.5 Hardener 0.5 0.5 0.5 0.5 In Tables 1 and 2 above, Tg means the meaning of the glass transition point, and PES is the meaning of the polyester resin. The polymer plasticizer is a polyester plasticizer, the other is a total of aluminum hydroxide, titanium oxide, and cerium oxide, and the polyfunctional compound (hardener) is an isocyanate-based addition. The coated materials for flat cables and the flat cables of Examples 1 to 8 and Comparative Examples 1 to 4 described above were tested and evaluated for the items shown below. Further, in the coating material for a flat cable of Comparative Example 3, since the film formation of the heat seal layer was carried out as described above, it was difficult to perform the following evaluation. (1) Flame retardancy The flame retardancy of the flat cable 1 was evaluated by the UL specification VW-1 combustion test. When it is qualified, it is indicated by "◎". When it is not qualified, it is indicated by "X". (2) Conductive sealability The surface of the heat seal layer of the cover material 10 for a flat cable and the copper foil of the thickness ΙΟΟμη are followed by a heat sealant (temperature, pressure: 3 kg/cm 2 , time: 3 seconds) The peel strength (N / width 10 mm) was measured by a tensile tester. : 5 N or more and the material rupture evaluation was " ◎", 5 N or more, and the heat seal layer 13 was evaluated as "〇", and 5 N or less was evaluated as "X". (3) Heat resistance The film was placed in an oven at 136 ° C for 168 hr, and the tensile elongation at break before and after the heat resistance test was measured. When the tensile elongation at break of 90% or more was maintained as compared with that before the heat resistance test, it was evaluated as "©j. When the tensile elongation at break of 80% or more was maintained, the tensile strength was evaluated as "〇", and the tensile strength at break was lowered to When it is 80% or less, it is evaluated as "X". (4) Conductor embedding property The flat cable 1 is cut parallel to the width direction by a cutter, and the cut surface is observed by an optical microscope, and it is investigated whether or not there is a bubble or the like around the conductor, and whether or not the conductor is buried in an insufficient place. To evaluate. The state in which the state was completely buried was evaluated as "◎", and the portion where the conductor was not buried was less than 50 μm, and the grade was evaluated as "〇", and the state in which the unembedded portion of 5 μm or more was present around the conductor was evaluated as "X". . The evaluation results are shown in Tables 3 and 4 below. -21 - 201243868 [Table 3] Table 3 Evaluation results of Examples 1 to 8 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 _ 燃 ΟΛΗ ΟΛΗ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ Conductive sealability ◎ ◎ 〇 ◎ @ ◎ 〇 ◎ heat resistance ◎ ◎ ◎ 0 〇 ◎ ◎ ◎ Conductor embedding ◎ ◎ ◎ ◎ ◎ 〇 ◎ 0 [Table 4] Table 4 Comparative Examples 1 to 4 Evaluation result Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 - Flame retardancy (WH) X ◎ One X conductor sealing property ◎ X ◎ Heat resistance ◎ ◎ One X conductor embedding ◎ ◎ One ◎ Table 3 also shows that 'Example 1 is good for all items. In Example 2, although the polymer plasticizer was not added, all the items were good by increasing the amount of the polyester resin. Example 3 In the same manner as in Example 2, the amount of the plasticizer was not added and the amount of the polyester resin was not increased. The sealing strength was 5 N or more, but the heat seal layer 13 was agglomerated and peeled off. Example 4 'Results of not adding a multi-functional compound (hardener) 'The heat resistance was somewhat lowered. Further, in Example 5, the polyester resin having a high Tg was not added, and the heat resistance was inferior to that of Example 1. In Example 6, the polyester resin having a high T g was excessively added. The film became excessively entangled and the embedding property of the conductor was insufficient as compared with Example 1. Further, in Example 7, the amount of the plasticizer added was too large as in Example 1. Therefore, a part of the plasticizer was bleed out to the surface, and the sealing property was insufficient. In Example 8, as compared with Example 1, the film was hardened due to the excessive addition amount of the curing agent, and the embedding property of the conductor was insufficient. -22- 201243868 added too much ingredient, so it did not reach 30. On the other hand, in Comparative Example 1, as shown in Table 4 above, the amount of flame retardant was excessively reduced, and the flame retardancy was unacceptable. In Comparative Example 2, the flame retardant was added to cause sealing failure, and the sealing strength was unacceptable. In Comparative Example 3, the total content of aluminum phosphinate and other tanning components exceeded 70 mass. /. The membrane is difficult. Further, in Comparative Example 4, since the total content of the dip components was % by mass, not only the flame retardancy was insufficient, but also the heat resistance was insufficient. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a layer configuration of a form of a covering material for a flat cable of the present invention. Fig. 2' is a schematic view showing the configuration of an embodiment of a coated flat cable for a flat cable according to the present invention. Figure 3 is a cross-sectional view taken along line AA of Figure 2. [Description of main component symbols] I : Flat cable 10: Covering material for flat cable II : Film-like substrate 12 : Base coating layer 1 3 : Heat seal layer 21 : Conductor -23-