CN107614641B - 半导体加工用带 - Google Patents

半导体加工用带 Download PDF

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Publication number
CN107614641B
CN107614641B CN201680032247.9A CN201680032247A CN107614641B CN 107614641 B CN107614641 B CN 107614641B CN 201680032247 A CN201680032247 A CN 201680032247A CN 107614641 B CN107614641 B CN 107614641B
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China
Prior art keywords
adhesive layer
metal layer
meth
acrylate
resin
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CN201680032247.9A
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English (en)
Chinese (zh)
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CN107614641A (zh
Inventor
青山真沙美
佐野透
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Publication of CN107614641A publication Critical patent/CN107614641A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
CN201680032247.9A 2015-12-25 2016-10-05 半导体加工用带 Active CN107614641B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015255312 2015-12-25
JP2015-255312 2015-12-25
PCT/JP2016/079626 WO2017110202A1 (fr) 2015-12-25 2016-10-05 Ruban pour usinage de semi-conducteur

Publications (2)

Publication Number Publication Date
CN107614641A CN107614641A (zh) 2018-01-19
CN107614641B true CN107614641B (zh) 2021-07-09

Family

ID=59089986

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680032247.9A Active CN107614641B (zh) 2015-12-25 2016-10-05 半导体加工用带

Country Status (8)

Country Link
JP (1) JP6757743B2 (fr)
KR (1) KR102580602B1 (fr)
CN (1) CN107614641B (fr)
MY (1) MY184346A (fr)
PH (1) PH12017502122B1 (fr)
SG (1) SG11201708850VA (fr)
TW (1) TWI636886B (fr)
WO (1) WO2017110202A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110446765A (zh) * 2017-07-25 2019-11-12 积水化学工业株式会社 半导体保护用粘合带和处理半导体的方法
CN109454955B (zh) * 2018-12-19 2021-07-06 广东生益科技股份有限公司 一种封装载带基材及其制备方法
CN115410927A (zh) * 2022-09-29 2022-11-29 北京超材信息科技有限公司 半导体器件的切割方法

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000071387A (ja) * 1998-08-31 2000-03-07 Kyocera Corp 金属箔付きフィルム及びそれを用いた配線基板の製造方法
JP2003298230A (ja) * 2002-03-28 2003-10-17 Tokai Rubber Ind Ltd フレキシブルプリント配線板用基材
CN1726259A (zh) * 2002-12-13 2006-01-25 株式会社钟化 热塑性聚酰亚胺树脂薄膜、叠层体及由其构成的印刷电路布线板的制法
JP2006103108A (ja) * 2004-10-04 2006-04-20 Sekisui Chem Co Ltd 金属箔付フィルム
CN101126001A (zh) * 2006-08-14 2008-02-20 日东电工株式会社 粘合片、其制备方法、以及切割多层陶瓷片材的方法
JP2010185013A (ja) * 2009-02-12 2010-08-26 Shin-Etsu Chemical Co Ltd 接着剤組成物およびそれを用いた半導体ウエハ用保護シート
JP2010225651A (ja) * 2009-03-19 2010-10-07 Sekisui Chem Co Ltd ダイシングテープ及び半導体チップの製造方法
CN102222634A (zh) * 2010-04-19 2011-10-19 日东电工株式会社 半导体背面用切割带集成膜
JP2012028397A (ja) * 2010-07-20 2012-02-09 Nitto Denko Corp フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
CN102382587A (zh) * 2010-07-29 2012-03-21 日东电工株式会社 倒装芯片型半导体背面用膜及其用途
JP2013235962A (ja) * 2012-05-09 2013-11-21 Hitachi Chemical Co Ltd 半導体装置の製造方法
JP2015043383A (ja) * 2013-08-26 2015-03-05 日立化成株式会社 ウェハ加工用テープ
JP2015185584A (ja) * 2014-03-20 2015-10-22 日立化成株式会社 ウエハ加工用テープ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167699A (ja) * 1997-08-13 1999-03-09 Texas Instr Japan Ltd 半導体装置の製造方法
JP4865312B2 (ja) 2005-12-05 2012-02-01 古河電気工業株式会社 チップ用保護膜形成用シート
JP2007235022A (ja) 2006-03-03 2007-09-13 Mitsui Chemicals Inc 接着フィルム
JP6144868B2 (ja) * 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法
JP2015129247A (ja) * 2014-01-09 2015-07-16 住友ベークライト株式会社 樹脂組成物、接着フィルム、接着シート、ダイシングテープ一体型接着シート、バックグラインドテープ一体型接着シート、ダイシングテープ兼バックグラインドテープ一体型接着シート、および、電子装置
JP6229528B2 (ja) * 2014-02-17 2017-11-15 日立化成株式会社 半導体装置の製造方法、半導体装置及び接着剤組成物
TWI653312B (zh) * 2014-03-11 2019-03-11 日商味之素股份有限公司 接著薄膜
JP6078578B2 (ja) * 2015-04-22 2017-02-08 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000071387A (ja) * 1998-08-31 2000-03-07 Kyocera Corp 金属箔付きフィルム及びそれを用いた配線基板の製造方法
JP2003298230A (ja) * 2002-03-28 2003-10-17 Tokai Rubber Ind Ltd フレキシブルプリント配線板用基材
CN1726259A (zh) * 2002-12-13 2006-01-25 株式会社钟化 热塑性聚酰亚胺树脂薄膜、叠层体及由其构成的印刷电路布线板的制法
JP2006103108A (ja) * 2004-10-04 2006-04-20 Sekisui Chem Co Ltd 金属箔付フィルム
CN101126001A (zh) * 2006-08-14 2008-02-20 日东电工株式会社 粘合片、其制备方法、以及切割多层陶瓷片材的方法
JP2010185013A (ja) * 2009-02-12 2010-08-26 Shin-Etsu Chemical Co Ltd 接着剤組成物およびそれを用いた半導体ウエハ用保護シート
JP2010225651A (ja) * 2009-03-19 2010-10-07 Sekisui Chem Co Ltd ダイシングテープ及び半導体チップの製造方法
CN102222634A (zh) * 2010-04-19 2011-10-19 日东电工株式会社 半导体背面用切割带集成膜
JP2012028397A (ja) * 2010-07-20 2012-02-09 Nitto Denko Corp フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
CN102382587A (zh) * 2010-07-29 2012-03-21 日东电工株式会社 倒装芯片型半导体背面用膜及其用途
JP2013235962A (ja) * 2012-05-09 2013-11-21 Hitachi Chemical Co Ltd 半導体装置の製造方法
JP2015043383A (ja) * 2013-08-26 2015-03-05 日立化成株式会社 ウェハ加工用テープ
JP2015185584A (ja) * 2014-03-20 2015-10-22 日立化成株式会社 ウエハ加工用テープ

Also Published As

Publication number Publication date
KR20180097445A (ko) 2018-08-31
JP6757743B2 (ja) 2020-09-23
KR102580602B1 (ko) 2023-09-20
JPWO2017110202A1 (ja) 2018-10-11
CN107614641A (zh) 2018-01-19
TWI636886B (zh) 2018-10-01
PH12017502122A1 (en) 2018-05-28
WO2017110202A1 (fr) 2017-06-29
MY184346A (en) 2021-04-01
SG11201708850VA (en) 2018-07-30
PH12017502122B1 (en) 2018-05-28
TW201728443A (zh) 2017-08-16

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