SG11201708850VA - Tape for semiconductor processing - Google Patents
Tape for semiconductor processingInfo
- Publication number
- SG11201708850VA SG11201708850VA SG11201708850VA SG11201708850VA SG11201708850VA SG 11201708850V A SG11201708850V A SG 11201708850VA SG 11201708850V A SG11201708850V A SG 11201708850VA SG 11201708850V A SG11201708850V A SG 11201708850VA SG 11201708850V A SG11201708850V A SG 11201708850VA
- Authority
- SG
- Singapore
- Prior art keywords
- tape
- metal layer
- semiconductor processing
- adhesive layer
- semiconductor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C09J171/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Abstract
Provided is a tape for semiconductor processing, with which a semiconductor wafer can be satisfactorily divided into individual chips at the time of dicing, and the occurrence of package cracks can be prevented at the time of packaging. The tape for semiconductor processing of the invention includes a dicing tape 13 having a base film 11 and a pressure-sensitive adhesive layer 12; a metal layer 14 provided on the pressure-sensitive adhesive layer 12 for protecting the back surface of a semiconductor chip; and an adhesive layer 15 provided on the metal layer 14 for adhering the metal layer 14 to the back surface of a semiconductor chip, in which the surface roughness RzJIS of the metal layer 14 based on the 10-point average roughness is 0.5 j^m or more and less than 10.0 pm. 56
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015255312 | 2015-12-25 | ||
PCT/JP2016/079626 WO2017110202A1 (en) | 2015-12-25 | 2016-10-05 | Tape for semiconductor processing |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201708850VA true SG11201708850VA (en) | 2018-07-30 |
Family
ID=59089986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201708850VA SG11201708850VA (en) | 2015-12-25 | 2016-10-05 | Tape for semiconductor processing |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP6757743B2 (en) |
KR (1) | KR102580602B1 (en) |
CN (1) | CN107614641B (en) |
MY (1) | MY184346A (en) |
PH (1) | PH12017502122B1 (en) |
SG (1) | SG11201708850VA (en) |
TW (1) | TWI636886B (en) |
WO (1) | WO2017110202A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019022050A1 (en) * | 2017-07-25 | 2019-01-31 | 積水化学工業株式会社 | Adhesive tape for semiconductor protection and method for processing semiconductor |
CN109454955B (en) * | 2018-12-19 | 2021-07-06 | 广东生益科技股份有限公司 | Packaging carrier tape base material and preparation method thereof |
CN115410927A (en) * | 2022-09-29 | 2022-11-29 | 北京超材信息科技有限公司 | Cutting method of semiconductor device |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1167699A (en) * | 1997-08-13 | 1999-03-09 | Texas Instr Japan Ltd | Manufacture of semiconductor device |
JP3071764B2 (en) * | 1998-08-31 | 2000-07-31 | 京セラ株式会社 | Film with metal foil and method of manufacturing wiring board using the same |
JP2003298230A (en) * | 2002-03-28 | 2003-10-17 | Tokai Rubber Ind Ltd | Substrate for flexible printed wiring board |
JP2004189981A (en) * | 2002-12-13 | 2004-07-08 | Kanegafuchi Chem Ind Co Ltd | Thermoplastic polyimide resin material and laminated body, and manufacturing method of printed wiring board |
JP2006103108A (en) * | 2004-10-04 | 2006-04-20 | Sekisui Chem Co Ltd | Film with metal foil |
JP4865312B2 (en) | 2005-12-05 | 2012-02-01 | 古河電気工業株式会社 | Chip protection film forming sheet |
JP2007235022A (en) | 2006-03-03 | 2007-09-13 | Mitsui Chemicals Inc | Adhesive film |
JP4849993B2 (en) * | 2006-08-14 | 2012-01-11 | 日東電工株式会社 | Adhesive sheet, method for producing the same, and method for cutting laminated ceramic sheet |
JP5298913B2 (en) * | 2009-02-12 | 2013-09-25 | 信越化学工業株式会社 | Adhesive composition and protective sheet for semiconductor wafer using the same |
JP5486831B2 (en) * | 2009-03-19 | 2014-05-07 | 積水化学工業株式会社 | Dicing tape and semiconductor chip manufacturing method |
JP5681374B2 (en) * | 2010-04-19 | 2015-03-04 | 日東電工株式会社 | Dicing tape integrated semiconductor backside film |
JP5356326B2 (en) * | 2010-07-20 | 2013-12-04 | 日東電工株式会社 | Manufacturing method of semiconductor device |
JP5419226B2 (en) * | 2010-07-29 | 2014-02-19 | 日東電工株式会社 | Flip chip type film for semiconductor back surface and use thereof |
JP6144868B2 (en) * | 2010-11-18 | 2017-06-07 | 日東電工株式会社 | Flip chip type semiconductor back film, dicing tape integrated semiconductor back film, and flip chip semiconductor back film manufacturing method |
JP6007576B2 (en) * | 2012-05-09 | 2016-10-12 | 日立化成株式会社 | Manufacturing method of semiconductor device |
JP6213055B2 (en) * | 2013-08-26 | 2017-10-18 | 日立化成株式会社 | Wafer processing tape |
JP2015129247A (en) * | 2014-01-09 | 2015-07-16 | 住友ベークライト株式会社 | Resin composition, adhesive film, adhesive sheet, dicing tape integrated adhesive sheet, back grind tape integrated adhesive sheet, dicing tape and back grind tape integrated adhesive sheet, and electronic device |
JP6229528B2 (en) * | 2014-02-17 | 2017-11-15 | 日立化成株式会社 | Semiconductor device manufacturing method, semiconductor device, and adhesive composition |
TWI653312B (en) * | 2014-03-11 | 2019-03-11 | 日商味之素股份有限公司 | Film |
JP6299315B2 (en) * | 2014-03-20 | 2018-03-28 | 日立化成株式会社 | Wafer processing tape |
JP6078578B2 (en) * | 2015-04-22 | 2017-02-08 | 日東電工株式会社 | Flip chip type film for semiconductor back surface and use thereof |
-
2016
- 2016-10-05 JP JP2017557750A patent/JP6757743B2/en active Active
- 2016-10-05 CN CN201680032247.9A patent/CN107614641B/en active Active
- 2016-10-05 KR KR1020177034527A patent/KR102580602B1/en active IP Right Grant
- 2016-10-05 SG SG11201708850VA patent/SG11201708850VA/en unknown
- 2016-10-05 MY MYPI2017001618A patent/MY184346A/en unknown
- 2016-10-05 WO PCT/JP2016/079626 patent/WO2017110202A1/en active Application Filing
- 2016-12-22 TW TW105142784A patent/TWI636886B/en active
-
2017
- 2017-11-21 PH PH12017502122A patent/PH12017502122B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20180097445A (en) | 2018-08-31 |
JP6757743B2 (en) | 2020-09-23 |
PH12017502122A1 (en) | 2018-05-28 |
KR102580602B1 (en) | 2023-09-20 |
TWI636886B (en) | 2018-10-01 |
CN107614641A (en) | 2018-01-19 |
WO2017110202A1 (en) | 2017-06-29 |
PH12017502122B1 (en) | 2018-05-28 |
CN107614641B (en) | 2021-07-09 |
MY184346A (en) | 2021-04-01 |
TW201728443A (en) | 2017-08-16 |
JPWO2017110202A1 (en) | 2018-10-11 |
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