CN107207747B - 利用交联型水溶性热塑性聚酰胺酸的热熔接多层聚酰亚胺膜及其制备方法 - Google Patents

利用交联型水溶性热塑性聚酰胺酸的热熔接多层聚酰亚胺膜及其制备方法 Download PDF

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CN107207747B
CN107207747B CN201580072132.8A CN201580072132A CN107207747B CN 107207747 B CN107207747 B CN 107207747B CN 201580072132 A CN201580072132 A CN 201580072132A CN 107207747 B CN107207747 B CN 107207747B
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polyamic acid
polyimide film
heat
water
coating
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CN107207747A (zh
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金圣原
李吉男
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Polyimide Advanced Materials Co Ltd
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SKCKolon PI Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/052—Forming heat-sealable coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
CN201580072132.8A 2014-12-30 2015-12-22 利用交联型水溶性热塑性聚酰胺酸的热熔接多层聚酰亚胺膜及其制备方法 Active CN107207747B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2014-0194150 2014-12-30
KR1020140194150A KR101703804B1 (ko) 2014-12-30 2014-12-30 가교형 수용성 열가소성 폴리아믹산을 이용한 열융착 다층 폴리이미드 필름, 및 이의 제조방법
PCT/KR2015/014078 WO2016108491A1 (fr) 2014-12-30 2015-12-22 Film de polyimide multicouche de fusion thermique utilisant de l'acide de polyamide thermoplastique hydrosoluble réticulé, et son procédé de préparation

Publications (2)

Publication Number Publication Date
CN107207747A CN107207747A (zh) 2017-09-26
CN107207747B true CN107207747B (zh) 2020-06-02

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KR (1) KR101703804B1 (fr)
CN (1) CN107207747B (fr)
WO (1) WO2016108491A1 (fr)

Families Citing this family (11)

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Publication number Priority date Publication date Assignee Title
JP6988094B2 (ja) * 2017-01-27 2022-01-05 富士フイルムビジネスイノベーション株式会社 ポリイミド前駆体組成物、及びポリイミド成形体の製造方法
CN109511211A (zh) * 2017-09-14 2019-03-22 深圳市博敏电子有限公司 防止板边爆板的防爆结构及其制作工艺
CN107936275B (zh) * 2017-12-13 2021-02-26 长春聚明光电材料有限公司 一种柔性无色透明的聚酰亚胺薄膜及其制备方法
KR101920631B1 (ko) * 2018-08-22 2019-02-13 국도화학 주식회사 응력상쇄 수지층을 포함하는 저광택 블랙 폴리이미드 필름 및 그 제조방법
KR102004660B1 (ko) * 2018-11-14 2019-07-26 에스케이씨코오롱피아이 주식회사 가교성 디안하이드라이드계 화합물 및 산화방지제를 포함하는 폴리이미드 전구체 조성물, 이로부터 제조된 폴리이미드 필름
JP7189347B2 (ja) * 2018-11-30 2022-12-13 ピーアイ・アドバンスド・マテリアルズ・カンパニー・リミテッド 配向性に優れたポリイミドフィルムから製造されるグラファイトシートおよびその製造方法
KR102172561B1 (ko) * 2018-11-30 2020-11-03 피아이첨단소재 주식회사 배향성이 우수한 폴리이미드 필름의 제조방법, 이로부터 제조되는 폴리이미드 필름 및 이를 이용하여 제조된 그라파이트 시트
JP6799633B2 (ja) * 2019-04-24 2020-12-16 三菱瓦斯化学株式会社 （メタ）アクリル系組成物、それを含む塗料および硬化体
CN110744764B (zh) * 2019-10-15 2021-11-16 苏州工业职业技术学院 一种耐电晕聚酰亚胺薄膜制备方法、耐电晕聚酰亚胺薄膜及其制备系统
KR20230154332A (ko) 2022-04-29 2023-11-08 고의석 수용성 폴리이미드 복합물이 표면 코팅된 기능성 플라스틱 필름
CN114920932B (zh) * 2022-06-06 2023-08-22 黑龙江省科学院石油化学研究院 一种稳定性良好、耐高温热固性聚酰亚胺前驱体溶液及制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101454378A (zh) * 2006-07-07 2009-06-10 三菱瓦斯化学株式会社 聚酰亚胺树脂
WO2012081763A1 (fr) * 2010-12-16 2012-06-21 에스케이씨코오롱피아이주식회사 Film en polyimide
WO2013003397A2 (fr) * 2011-06-28 2013-01-03 E. I. Du Pont De Nemours And Company Charges enrobées de polyimide

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US5567800A (en) * 1994-10-28 1996-10-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Imide oligomers endcapped with phenylethynyl phthalic anhydrides and polymers therefrom
KR20070112970A (ko) * 2006-05-24 2007-11-28 주식회사 엘지화학 폴리이미드 필름의 제조방법 및 이에 의해 제조된폴리이미드 필름
KR101706402B1 (ko) * 2012-04-03 2017-02-14 삼성에스디아이 주식회사 수용성 바인더 조성물, 및 이를 이용한 이차전지용 전극
KR20140127377A (ko) * 2013-02-13 2014-11-04 에스케이씨코오롱피아이 주식회사 다층 폴리이미드 필름 제조방법 및 이로부터 제조된 다층 폴리이미드 필름

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101454378A (zh) * 2006-07-07 2009-06-10 三菱瓦斯化学株式会社 聚酰亚胺树脂
WO2012081763A1 (fr) * 2010-12-16 2012-06-21 에스케이씨코오롱피아이주식회사 Film en polyimide
WO2013003397A2 (fr) * 2011-06-28 2013-01-03 E. I. Du Pont De Nemours And Company Charges enrobées de polyimide

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KR101703804B1 (ko) 2017-02-07
WO2016108491A1 (fr) 2016-07-07
CN107207747A (zh) 2017-09-26
KR20160081033A (ko) 2016-07-08

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