CN107204299B - 半导体装置的制造方法及半导体装置 - Google Patents

半导体装置的制造方法及半导体装置 Download PDF

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Publication number
CN107204299B
CN107204299B CN201710133174.9A CN201710133174A CN107204299B CN 107204299 B CN107204299 B CN 107204299B CN 201710133174 A CN201710133174 A CN 201710133174A CN 107204299 B CN107204299 B CN 107204299B
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CN
China
Prior art keywords
lead
wiring part
recess portion
semiconductor device
electronic pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710133174.9A
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English (en)
Chinese (zh)
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CN107204299A (zh
Inventor
石井齐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
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Asahi Co Ltd
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Publication date
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Publication of CN107204299A publication Critical patent/CN107204299A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
CN201710133174.9A 2016-03-17 2017-03-08 半导体装置的制造方法及半导体装置 Active CN107204299B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016053321A JP2017168703A (ja) 2016-03-17 2016-03-17 半導体装置の製造方法および半導体装置
JP2016-053321 2016-03-17

Publications (2)

Publication Number Publication Date
CN107204299A CN107204299A (zh) 2017-09-26
CN107204299B true CN107204299B (zh) 2019-10-25

Family

ID=59904888

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710133174.9A Active CN107204299B (zh) 2016-03-17 2017-03-08 半导体装置的制造方法及半导体装置

Country Status (3)

Country Link
JP (1) JP2017168703A (ja)
CN (1) CN107204299B (ja)
TW (1) TWI646608B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109841590A (zh) * 2017-11-28 2019-06-04 恩智浦美国有限公司 用于具有j引线和鸥翼引线的集成电路装置的引线框
CN109904136A (zh) * 2017-12-07 2019-06-18 恩智浦美国有限公司 用于具有j引线和鸥翼引线的集成电路装置的引线框
US10566713B2 (en) * 2018-01-09 2020-02-18 Semiconductor Components Industries, Llc Press-fit power module and related methods
CN110707063A (zh) * 2018-07-10 2020-01-17 恩智浦美国有限公司 具有可弯曲引线的引线框架

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6867072B1 (en) * 2004-01-07 2005-03-15 Freescale Semiconductor, Inc. Flipchip QFN package and method therefor
CN201392831Y (zh) * 2009-04-03 2010-01-27 宁波康强电子股份有限公司 用于制造引线框架的铜带
CN201523004U (zh) * 2009-10-11 2010-07-07 天水华天科技股份有限公司 一种小载体四面扁平无引脚封装件

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
NL7018378A (ja) * 1970-12-17 1972-06-20
JPS5593245A (en) * 1979-01-05 1980-07-15 Nec Corp Lead frame
JP2670569B2 (ja) * 1992-07-27 1997-10-29 株式会社三井ハイテック 半導体装置及びそれに用いるリードフレームの製造方法
JPH11145365A (ja) * 1997-11-11 1999-05-28 Toppan Printing Co Ltd Ｉｃ用リードフレーム
JP4467195B2 (ja) * 2001-01-29 2010-05-26 京セラ株式会社 リードフレームおよびそれを用いた半導体素子収納用パッケージ
US6924548B2 (en) * 2001-01-31 2005-08-02 Hitachi, Ltd. Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like section
TW482335U (en) * 2001-05-07 2002-04-01 Siliconware Precision Industries Co Ltd Chip carrier to reduce the wear of pressing tool
JP3583403B2 (ja) * 2001-12-27 2004-11-04 日電精密工業株式会社 Ｌｏｃ用リードフレーム及びその製造方法
TW569414B (en) * 2002-12-19 2004-01-01 Chipmos Technologies Bermuda Method for manufacturing a leadframe with fine pitch inner leads and leadframe formed from the same
TWI419288B (zh) * 2009-01-23 2013-12-11 Advanced Semiconductor Eng 導線架條及其封膠方法與具有導線架之半導體封裝構造
JP6129645B2 (ja) * 2013-05-29 2017-05-17 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6867072B1 (en) * 2004-01-07 2005-03-15 Freescale Semiconductor, Inc. Flipchip QFN package and method therefor
CN201392831Y (zh) * 2009-04-03 2010-01-27 宁波康强电子股份有限公司 用于制造引线框架的铜带
CN201523004U (zh) * 2009-10-11 2010-07-07 天水华天科技股份有限公司 一种小载体四面扁平无引脚封装件

Also Published As

Publication number Publication date
TW201810461A (zh) 2018-03-16
CN107204299A (zh) 2017-09-26
JP2017168703A (ja) 2017-09-21
TWI646608B (zh) 2019-01-01

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Address after: Tokyo

Patentee after: TOSHIBA MEMORY Corp.

Address before: Tokyo

Patentee before: Pangea Co.,Ltd.

Address after: Tokyo

Patentee after: Kaixia Co.,Ltd.

Address before: Tokyo

Patentee before: TOSHIBA MEMORY Corp.

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Effective date of registration: 20220209

Address after: Tokyo

Patentee after: Pangea Co.,Ltd.

Address before: Tokyo

Patentee before: TOSHIBA MEMORY Corp.